Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105701
Yanting Zhou, D. Ding, Bai-Feng Han, Yunhong Yu, Xulin Sun, H. Chevrel, Hua Ying, Ming Li, D. Mao
Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge to present electronic assembly technologies. Inert nitrogen atmosphere can both widen the process window of reflow and improve the mechanical reliability of solder joints. The focus of this study is to investigate the effect of reflow atmosphere on the reflow process and solder joint reliability of lead-free solders (SAC305). Board level reflow in various kinds of atmospheres and microstructural characterization of the solder joint were carried out to demonstrate the influence of controllable atmosphere on the reflow quality of the lead-free solder joints. The SAC305 solder joint fabricated in 1000 ppm O2 exhibited a good surface morphology and an interface with very small pores. Surface finish of the solder pad was found to have a great influence on the as-reflowed solder joints.
{"title":"Influence of reflow atmosphere on SAC305 solder joints","authors":"Yanting Zhou, D. Ding, Bai-Feng Han, Yunhong Yu, Xulin Sun, H. Chevrel, Hua Ying, Ming Li, D. Mao","doi":"10.1109/ISAPM.2011.6105701","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105701","url":null,"abstract":"Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge to present electronic assembly technologies. Inert nitrogen atmosphere can both widen the process window of reflow and improve the mechanical reliability of solder joints. The focus of this study is to investigate the effect of reflow atmosphere on the reflow process and solder joint reliability of lead-free solders (SAC305). Board level reflow in various kinds of atmospheres and microstructural characterization of the solder joint were carried out to demonstrate the influence of controllable atmosphere on the reflow quality of the lead-free solder joints. The SAC305 solder joint fabricated in 1000 ppm O2 exhibited a good surface morphology and an interface with very small pores. Surface finish of the solder pad was found to have a great influence on the as-reflowed solder joints.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87553513","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105733
Jarmo Kemppainen, T. Mattila, M. Paulasto-Krockel
Due to the requirement of high throughput, functional testing of MEMS gyroscopes should be performed on wafer level while the wafers are still on the carrier tape. In addition, it is often required that the functional characterization is carried out also at elevated temperatures, up to 150°C. The fact that comprehensive characterization of gyroscopes can take tens of minutes sets stringent requirements for the tapes where they are mounted. In this work the applicability of five different commercial back-grinding tapes of Si wafers were evaluated based on the following criteria: thermal stability, change in adhesion with increase in temperature, and the amount of residues on peeled surfaces. The adhesion on three surfaces (polished silicon, polymer, and brushed steel) was measured and evaluated in terms of adhesion strength and adhesion work. The adhesive polymer on all five base films was modified acrylic with different compositions of additives and the base film was ethylene vinyl acetate, polyethylene terephthalate, or polyolefin. Two of the tapes were UV curable. Four of five tapes passed the thermal stability test without noticeable changes in appearance. The adhesion strength was measured by employing the tensile test (T: 80, 100, 125 and 150°C; t: 0.5, 1, and 1.5 h) and the adhesion work was determined based on the stress-strain measurements. The results were analysed by the Analysis of Variance and Bonferroni all-pairwise mean comparison test. The following conclusions were made: i) the surface material affects adhesion significantly, ii) the non-UV tapes can sustain elevated temperatures better than the UV tapes, iii) as the temperature was increased the adhesion of all tapes increased until about 100 °C, after which it decreased notably with further increase in temperature, iv) the adhesion remained stable for about 60 minutes after which a decrease in adhesion was recorded. The detachment work and the amount of residue showed strong correlation as they are both dependent on the amount of adhesive fibrillations formed during detachment.
{"title":"Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing","authors":"Jarmo Kemppainen, T. Mattila, M. Paulasto-Krockel","doi":"10.1109/ISAPM.2011.6105733","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105733","url":null,"abstract":"Due to the requirement of high throughput, functional testing of MEMS gyroscopes should be performed on wafer level while the wafers are still on the carrier tape. In addition, it is often required that the functional characterization is carried out also at elevated temperatures, up to 150°C. The fact that comprehensive characterization of gyroscopes can take tens of minutes sets stringent requirements for the tapes where they are mounted. In this work the applicability of five different commercial back-grinding tapes of Si wafers were evaluated based on the following criteria: thermal stability, change in adhesion with increase in temperature, and the amount of residues on peeled surfaces. The adhesion on three surfaces (polished silicon, polymer, and brushed steel) was measured and evaluated in terms of adhesion strength and adhesion work. The adhesive polymer on all five base films was modified acrylic with different compositions of additives and the base film was ethylene vinyl acetate, polyethylene terephthalate, or polyolefin. Two of the tapes were UV curable. Four of five tapes passed the thermal stability test without noticeable changes in appearance. The adhesion strength was measured by employing the tensile test (T: 80, 100, 125 and 150°C; t: 0.5, 1, and 1.5 h) and the adhesion work was determined based on the stress-strain measurements. The results were analysed by the Analysis of Variance and Bonferroni all-pairwise mean comparison test. The following conclusions were made: i) the surface material affects adhesion significantly, ii) the non-UV tapes can sustain elevated temperatures better than the UV tapes, iii) as the temperature was increased the adhesion of all tapes increased until about 100 °C, after which it decreased notably with further increase in temperature, iv) the adhesion remained stable for about 60 minutes after which a decrease in adhesion was recorded. The detachment work and the amount of residue showed strong correlation as they are both dependent on the amount of adhesive fibrillations formed during detachment.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79781128","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105756
Yujuan He, Y. En, Hongwei Luo, Qingzhong Xiao
Oxide trapped charges which were produced in oxide area of MOSFET in the process of using can cause ESD characteristic changed. So the gate forced given bias to Simulate oxide trapped charges. In this paper, TLP test method was used to study the ESD parameters of NMOSFET with various gate biases. It was indicated that the threshold voltage Vt1 and secondary breakdown current It2 first increased and then decreased with the gate voltage increasing, but the maintained Voltage Vsp essentially unchanged.
{"title":"Effect of gate bias on ESD characteristics in NMOS device","authors":"Yujuan He, Y. En, Hongwei Luo, Qingzhong Xiao","doi":"10.1109/ISAPM.2011.6105756","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105756","url":null,"abstract":"Oxide trapped charges which were produced in oxide area of MOSFET in the process of using can cause ESD characteristic changed. So the gate forced given bias to Simulate oxide trapped charges. In this paper, TLP test method was used to study the ESD parameters of NMOSFET with various gate biases. It was indicated that the threshold voltage Vt1 and secondary breakdown current It2 first increased and then decreased with the gate voltage increasing, but the maintained Voltage Vsp essentially unchanged.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78559925","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105672
Yixiang Cai, Z. Xiong, G. Zhang, B. You
A new kind of machinable composite plate was developed for microwave antenna in this paper, in which ceramic powder of CaO-Li2O-Ln2O3-TiO2 was mixed with PTFE polymer in different proportions. It was showed that the permittivity of the composite plate was enhanced from 4 to 15 with the increasing content of ceramic powder; meanwhile, the quality factor was maintained at 1000GHz. The antenna was obtained with the composite plate which was machined to suitable size and covered with copper electrodes. The antenna's bandwidth was about 60MHz and standing wave ratio was near 1.12.
{"title":"Development of composite plate for microwave antenna","authors":"Yixiang Cai, Z. Xiong, G. Zhang, B. You","doi":"10.1109/ISAPM.2011.6105672","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105672","url":null,"abstract":"A new kind of machinable composite plate was developed for microwave antenna in this paper, in which ceramic powder of CaO-Li2O-Ln2O3-TiO2 was mixed with PTFE polymer in different proportions. It was showed that the permittivity of the composite plate was enhanced from 4 to 15 with the increasing content of ceramic powder; meanwhile, the quality factor was maintained at 1000GHz. The antenna was obtained with the composite plate which was machined to suitable size and covered with copper electrodes. The antenna's bandwidth was about 60MHz and standing wave ratio was near 1.12.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76091657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105690
Bin Yao, Yu-dong Lu, M. Wan
The trend of many types of electronic products is toward higher operating frequencies. At high frequencies, the signal propagation is concentrated at the surface of interconnects, which is known as the skin effect. Therefore, even a samll crack at the surface of a solder joint may directly influence the performance of high speed electronic assemblies. Degradation of solder joints, such as cracking due to fatigue or stress, generally initiates at the surface where the strain range is maximized, and propagates inward. Traditional DC resistance measurements are not able to sense partial cracks in solder joints. RF impedance analysis, which is capable of detecting small cracks, offers an improved means of monitoring the degradation of solder joints of high speed electronic products. In this study, RF impedance changes are used as an early indicator of degradation of solder joints, due to the skin effect, compared with DC resistance measurements. Impedance-controlled circuit boards on which surface mount components were soldered have been developed. Partially and entirely cracked solder joints were produced for test in advance. The RF impedance was observed to increase in response to partial cracking of the solder joint, while the DC resistance did not indicate any anomalies. The technique of RF impedance analysis shows potential as a prognostic tool that can provide advanced warning of impending failures of solder joint. At last future research work in this field is suggested.
{"title":"A study of solder joint degradation and detection using RF impedance analysis","authors":"Bin Yao, Yu-dong Lu, M. Wan","doi":"10.1109/ISAPM.2011.6105690","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105690","url":null,"abstract":"The trend of many types of electronic products is toward higher operating frequencies. At high frequencies, the signal propagation is concentrated at the surface of interconnects, which is known as the skin effect. Therefore, even a samll crack at the surface of a solder joint may directly influence the performance of high speed electronic assemblies. Degradation of solder joints, such as cracking due to fatigue or stress, generally initiates at the surface where the strain range is maximized, and propagates inward. Traditional DC resistance measurements are not able to sense partial cracks in solder joints. RF impedance analysis, which is capable of detecting small cracks, offers an improved means of monitoring the degradation of solder joints of high speed electronic products. In this study, RF impedance changes are used as an early indicator of degradation of solder joints, due to the skin effect, compared with DC resistance measurements. Impedance-controlled circuit boards on which surface mount components were soldered have been developed. Partially and entirely cracked solder joints were produced for test in advance. The RF impedance was observed to increase in response to partial cracking of the solder joint, while the DC resistance did not indicate any anomalies. The technique of RF impedance analysis shows potential as a prognostic tool that can provide advanced warning of impending failures of solder joint. At last future research work in this field is suggested.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74651885","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105685
Yanmin Wu, Pengli Zhu, R. Sun
Ni0.4Zn0.6Fe2O4 powders were prepared via a polyol method with diethylene glycol (DEG) as reaction medium. After synthesis, the particles were characterized by the X-ray diffraction (XRD), the thermogravimetric analysis (TGA), Fourier transform infrared (FT-IR) spectrophotometer and vibrating sample magnetometer (VSM). The XRD curve indicates that the ferrite has smaller grain size (∼5 nm) and typical spinel structure. The TGA and FT-IR results confirm the polyol molecules are adsorbed on the surface of the ferrites. The VSM result shows that the ferrite has superior saturation magnetization (−58.29 emu/g) and minor remnant magnetization (2.52 emu/g). Then, the magnetic epoxy composites were fabricated by mixing this ferrite and epoxy resin in acetone and using tetraethylene pentamine (TEPA) as a hardener. The complex permeability (μ', μ") in the frequency of rang from 10 MHz to 1 GHz of this composites were studied by an impedance analyser (Agilent E 4991A). The measure results reveal that the real part (μ') are rising from 1.06 to 1.89 at a frequency of 100MHz with the mass fraction of the ferrite in the composite increasing from 10%–65%, and the imaginary part (μ") rising from 0.006 to 0.221, while magnetic loss tangent (tan5) rise from 0.005 to 0.117.
{"title":"Magnetic properties of Ni0.4Zn0.6Fe2O4 synthesized by the polyol method and its epoxy composites","authors":"Yanmin Wu, Pengli Zhu, R. Sun","doi":"10.1109/ISAPM.2011.6105685","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105685","url":null,"abstract":"Ni0.4Zn0.6Fe2O4 powders were prepared via a polyol method with diethylene glycol (DEG) as reaction medium. After synthesis, the particles were characterized by the X-ray diffraction (XRD), the thermogravimetric analysis (TGA), Fourier transform infrared (FT-IR) spectrophotometer and vibrating sample magnetometer (VSM). The XRD curve indicates that the ferrite has smaller grain size (∼5 nm) and typical spinel structure. The TGA and FT-IR results confirm the polyol molecules are adsorbed on the surface of the ferrites. The VSM result shows that the ferrite has superior saturation magnetization (−58.29 emu/g) and minor remnant magnetization (2.52 emu/g). Then, the magnetic epoxy composites were fabricated by mixing this ferrite and epoxy resin in acetone and using tetraethylene pentamine (TEPA) as a hardener. The complex permeability (μ', μ\") in the frequency of rang from 10 MHz to 1 GHz of this composites were studied by an impedance analyser (Agilent E 4991A). The measure results reveal that the real part (μ') are rising from 1.06 to 1.89 at a frequency of 100MHz with the mass fraction of the ferrite in the composite increasing from 10%–65%, and the imaginary part (μ\") rising from 0.006 to 0.221, while magnetic loss tangent (tan5) rise from 0.005 to 0.117.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74827251","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105746
Qinwei Peng, X. Gu, Pinghua Bao, Dali Huang, Jianchao Zhang, Lingwen Kong, Jian Cai
The reliability of the MLCC embedded PCB with Cu-filled via method was investigated and the finite element method (FEM) was conducted to simulate the stress distribution in the PCB. Due to the non-symmetrical of the MLCC embedded PCB and the CTE mismatch between the materials for the embedded PCB, all samples are non-flatness after test. For the PCB tested at Pb-free reflow, no failure could be observed until it was tested for 9 cycles, voids at the interface between the MLCC and the adhesive were observed. Failures were detected by the LCR tester when the PCB tested at thermal stress condition for 6 cycles and big delamination occurred between the component and the BT material. For the PCB tested at thermal cycling condition, no failure was observed even the samples tested for 1000 cycles. The FEM simulation results showed that the stress accumulated at the interface between the component and the BT material. When the ambient temperature reached 288 °C, it is as high as 0.610 Gpa which leads to the delamination of the MLCC embedded PCB.
{"title":"The reliability investigation of capacitors embedded PCB","authors":"Qinwei Peng, X. Gu, Pinghua Bao, Dali Huang, Jianchao Zhang, Lingwen Kong, Jian Cai","doi":"10.1109/ISAPM.2011.6105746","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105746","url":null,"abstract":"The reliability of the MLCC embedded PCB with Cu-filled via method was investigated and the finite element method (FEM) was conducted to simulate the stress distribution in the PCB. Due to the non-symmetrical of the MLCC embedded PCB and the CTE mismatch between the materials for the embedded PCB, all samples are non-flatness after test. For the PCB tested at Pb-free reflow, no failure could be observed until it was tested for 9 cycles, voids at the interface between the MLCC and the adhesive were observed. Failures were detected by the LCR tester when the PCB tested at thermal stress condition for 6 cycles and big delamination occurred between the component and the BT material. For the PCB tested at thermal cycling condition, no failure was observed even the samples tested for 1000 cycles. The FEM simulation results showed that the stress accumulated at the interface between the component and the BT material. When the ambient temperature reached 288 °C, it is as high as 0.610 Gpa which leads to the delamination of the MLCC embedded PCB.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76057938","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105732
Zhili Hu, Wenhui Du, Cong Yue, L. Ye, Zhichao Yuan, Johan Liu
Isotropic conductive adhesive (ICA) is widely used with different kinds of substrates in electronics packaging applications. Therefore it is necessary to understand the influence of electrical conductivity of ICA from substrate. In this work, we investigated the electrical resistivity of ICA on quartz, PCB and glass substrate. The experimental data showed that the in-plane electrical conductivity of ICA on PCB is almost twice that of the glass substrate, while the conductivity of ICA on quartz is also significantly greater than that of glass, under the same curing temperature and with the same bond line thickness (BLT) of ICA. This paper later concludes that thermal conductive adhesive (TCA) on substrate with higher thermal expansion coefficient (CTE) is likely to give better performance. Finally, Finite Element Modeling (FEM) and analysis shows that this phenomenon could be universal to ICA and TCA.
{"title":"Influence of substrate on electrical conductivity of isotropic conductive adhesive","authors":"Zhili Hu, Wenhui Du, Cong Yue, L. Ye, Zhichao Yuan, Johan Liu","doi":"10.1109/ISAPM.2011.6105732","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105732","url":null,"abstract":"Isotropic conductive adhesive (ICA) is widely used with different kinds of substrates in electronics packaging applications. Therefore it is necessary to understand the influence of electrical conductivity of ICA from substrate. In this work, we investigated the electrical resistivity of ICA on quartz, PCB and glass substrate. The experimental data showed that the in-plane electrical conductivity of ICA on PCB is almost twice that of the glass substrate, while the conductivity of ICA on quartz is also significantly greater than that of glass, under the same curing temperature and with the same bond line thickness (BLT) of ICA. This paper later concludes that thermal conductive adhesive (TCA) on substrate with higher thermal expansion coefficient (CTE) is likely to give better performance. Finally, Finite Element Modeling (FEM) and analysis shows that this phenomenon could be universal to ICA and TCA.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83847308","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A thermal reliability model is proposed for board level package-on-package (POP) assembling in this work, Design analysis is performed to study the effect of key package parameters such as die size, substrate size, solder ball size, etc. According to the finite elements analysis on the thermal reliability model, thermal distribution and thermal gratitude of the 3-dimension package is obtained within ±10% error limit. Therefore, the live of working chip can be predicted by the thermal distribution, and the thermal stress of key point can be concluded by the thermal gratitude. The valid model is implemented in a 3-package stacked structure, by comparing the influence of the different stacked sequence of the stacked package, an optimized process plan of the package-on-package assembling can be given at last.
{"title":"Board level thermal reliability modeling of POP assembling","authors":"Chen Liu, Yuanming Xiao, Mingchun Zhang, Lingfeng Shi, Zhanwu Huang","doi":"10.1109/ISAPM.2011.6105716","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105716","url":null,"abstract":"A thermal reliability model is proposed for board level package-on-package (POP) assembling in this work, Design analysis is performed to study the effect of key package parameters such as die size, substrate size, solder ball size, etc. According to the finite elements analysis on the thermal reliability model, thermal distribution and thermal gratitude of the 3-dimension package is obtained within ±10% error limit. Therefore, the live of working chip can be predicted by the thermal distribution, and the thermal stress of key point can be concluded by the thermal gratitude. The valid model is implemented in a 3-package stacked structure, by comparing the influence of the different stacked sequence of the stacked package, an optimized process plan of the package-on-package assembling can be given at last.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90094266","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-12-19DOI: 10.1109/ISAPM.2011.6105684
Zhu Pengli, Wu Yanmin, Sun Rong
The development of the electronic industry and electronic technology is proceeding in the direction of miniaturization and high frequency. The embedded passives technology, as a key technology in system-in-package mode, throws new light on improving the package of the passives. Much works have been done to develop embedded passives. For inductors, Ni-Zn ferrites with soft magnetic are ideal materials for preparing the magnetic composite materials. In this study, Ni-Zn ferrite was prepared by a chemical coprecipitation method, then was oxidative polymerization of aniline in aqueous solution and made the Ni0.5Zn0.5Fe2O4@polyaniline (NZF@PANi) core-shell particles. The obtained particles were characterized by X-ray diffraction (XRD). The magnetic epoxy composites were fabricated by mixing the core-shell particles and epoxy resin matrix. The dielectric and magnetic properties of the composites were measured by impedance analyzer (Agilent E 4991 A: 1 MHz to 1 GHz). The initial complex permeability value obtained from the toroidal sample exhibit good frequency stability and the permeability loss was low. The permeability of the epoxy composite was rising from 1.4 to 2.2 with the mass fraction of the ferrite increasing in the composite from 3%–70%.
电子工业和电子技术的发展正朝着小型化和高频化的方向发展。嵌入式无源技术作为系统级封装模式的关键技术，为改进无源封装提供了新的思路。嵌入式被动器的开发已经做了大量的工作。对于电感来说，具有软磁性的镍锌铁氧体是制备磁性复合材料的理想材料。本研究采用化学共沉淀法制备了Ni-Zn铁氧体，然后在水溶液中对苯胺进行氧化聚合，得到Ni0.5Zn0.5Fe2O4@polyaniline (NZF@PANi)核壳粒子。用x射线衍射(XRD)对所得颗粒进行了表征。将核壳颗粒与环氧树脂基体混合制备磁性环氧复合材料。采用阻抗分析仪(Agilent E 4991 A: 1 MHz ~ 1 GHz)测量复合材料的介电性能和磁性能。从环形样品中获得的初始复渗透率值具有良好的频率稳定性和低的渗透率损失。环氧复合材料的磁导率由1.4提高到2.2，铁素体的质量分数由3%提高到70%。
{"title":"Synthesis and magnetic properties of Ni-Zn ferrite @polyaniline/epoxy composites for embedded inductor applications","authors":"Zhu Pengli, Wu Yanmin, Sun Rong","doi":"10.1109/ISAPM.2011.6105684","DOIUrl":"https://doi.org/10.1109/ISAPM.2011.6105684","url":null,"abstract":"The development of the electronic industry and electronic technology is proceeding in the direction of miniaturization and high frequency. The embedded passives technology, as a key technology in system-in-package mode, throws new light on improving the package of the passives. Much works have been done to develop embedded passives. For inductors, Ni-Zn ferrites with soft magnetic are ideal materials for preparing the magnetic composite materials. In this study, Ni-Zn ferrite was prepared by a chemical coprecipitation method, then was oxidative polymerization of aniline in aqueous solution and made the Ni0.5Zn0.5Fe2O4@polyaniline (NZF@PANi) core-shell particles. The obtained particles were characterized by X-ray diffraction (XRD). The magnetic epoxy composites were fabricated by mixing the core-shell particles and epoxy resin matrix. The dielectric and magnetic properties of the composites were measured by impedance analyzer (Agilent E 4991 A: 1 MHz to 1 GHz). The initial complex permeability value obtained from the toroidal sample exhibit good frequency stability and the permeability loss was low. The permeability of the epoxy composite was rising from 1.4 to 2.2 with the mass fraction of the ferrite increasing in the composite from 3%–70%.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84203499","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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