Pub Date : 2018-08-01DOI: 10.1109/3M-NANO.2018.8552165
A. Orlov, A. Smolovich, N. Barinov, A. Frolov, Peter V. Lega Kotelnikov, D. Klinov, V. Koledov
The article demonstrates a technique for fabricating a structure with the inclusion of suspended DNA threads and manipulating them using composite nanotweezers with shape memory effect. This technique could be suitable for stretching of nanothin DNA-like conductive threads and for measuring their electrical conductivity, including the I-V characteristic directly in the electron microscope chamber, where the nanotweezers provide a two-sided clamping of the DNA tip, giving a stable nanocontact to the DNA bundle. Such contact, as a part of 1D nanostructure, is more reliable during manipulations with nanothreads than traditional measurements when a nanothread is touched by a thin needle, for example, in a scanning tunnel microscope.
{"title":"Assembling Nanostructures from DNA Using a Composite Nanotweezers with a Shape Memory Effect","authors":"A. Orlov, A. Smolovich, N. Barinov, A. Frolov, Peter V. Lega Kotelnikov, D. Klinov, V. Koledov","doi":"10.1109/3M-NANO.2018.8552165","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552165","url":null,"abstract":"The article demonstrates a technique for fabricating a structure with the inclusion of suspended DNA threads and manipulating them using composite nanotweezers with shape memory effect. This technique could be suitable for stretching of nanothin DNA-like conductive threads and for measuring their electrical conductivity, including the I-V characteristic directly in the electron microscope chamber, where the nanotweezers provide a two-sided clamping of the DNA tip, giving a stable nanocontact to the DNA bundle. Such contact, as a part of 1D nanostructure, is more reliable during manipulations with nanothreads than traditional measurements when a nanothread is touched by a thin needle, for example, in a scanning tunnel microscope.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"82 1","pages":"118-121"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91040258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In order to study the regulation of the roughness and micro-morphology of the machined surface with cutting parameters changing, a single factor experiment of micro milling groove was carried out on Si Cp/Al using a 2 edges hard alloy end mill with a diameter of 1 mm (4HCE010025S04). The following conclusions are obtained through the experiment and detection analysis: With the spindle speed n increasing, the roughness of the milling groove surface gradually decreases, the quality of the machined surface becomes better, and the contour of the bottom of the groove is flatter; with the feed rate f increasing, the roughness of the milling groove surface gradually increases, the quality of the machined surface gets worse, and the contour of the bottom of the groove is worse; with the cutting depth ap increasing, the roughness of the milling groove surface is reduced and the quality of the machined surface improved, and the contour of the bottom of the groove becomes more flatter, although the depth does not change obviously.
{"title":"Experimental Study on Surface Roughness and Surface Micro-morphology of SiCp/Al","authors":"Xu Wang, Yiquan Li, Jinkai Xu, Huadong Yu, Qimeng Liu, Q. Du","doi":"10.1109/3M-NANO.2018.8552241","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552241","url":null,"abstract":"In order to study the regulation of the roughness and micro-morphology of the machined surface with cutting parameters changing, a single factor experiment of micro milling groove was carried out on Si Cp/Al using a 2 edges hard alloy end mill with a diameter of 1 mm (4HCE010025S04). The following conclusions are obtained through the experiment and detection analysis: With the spindle speed n increasing, the roughness of the milling groove surface gradually decreases, the quality of the machined surface becomes better, and the contour of the bottom of the groove is flatter; with the feed rate f increasing, the roughness of the milling groove surface gradually increases, the quality of the machined surface gets worse, and the contour of the bottom of the groove is worse; with the cutting depth ap increasing, the roughness of the milling groove surface is reduced and the quality of the machined surface improved, and the contour of the bottom of the groove becomes more flatter, although the depth does not change obviously.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"42 11 1","pages":"201-204"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82855356","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/3M-NANO.2018.8552177
Jiedong Li, Hui Tang, Boyu Zhan, Guixin Zhang, Zelong Wu, Jian Gao, Xin Chen, Zhijun Yang
A modified auto-regressive moving average (MARMA) model is proposed in this paper, which can be used to describe the dynamic hysteresis nonlinearity accurately. First, combined with the stability condition of auto-regressive moving average (ARMA) model, the Least Square approximation and the Lagrange Multiplier method (LSLM) are used to improve the traditional ARMA model. And then, according to the collected voltage-displacement data set, the parameters of the MARMA model are identified by LMLS method. Meanwhile, aiming at the difficulty of real-time displacement detection in the process of fast tool servo (FTS), a direct feedforward open-loop control (DFOC) strategy is designed based on the identified model. Finally, in order to verify the effectiveness and superiority of the method, a series of high frequency trajectory tracking and contrast experiments have been carried out successfully with the traditional PI and MARMA models. It shows that the MARMA model is nearly 20 times higher than the traditional PI model in terms of control accuracy and linearity, while the control bandwidth is achieved up to 200Hz.
{"title":"A Novel Modified Auto-regressive Moving Average Hysteresis Model","authors":"Jiedong Li, Hui Tang, Boyu Zhan, Guixin Zhang, Zelong Wu, Jian Gao, Xin Chen, Zhijun Yang","doi":"10.1109/3M-NANO.2018.8552177","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552177","url":null,"abstract":"A modified auto-regressive moving average (MARMA) model is proposed in this paper, which can be used to describe the dynamic hysteresis nonlinearity accurately. First, combined with the stability condition of auto-regressive moving average (ARMA) model, the Least Square approximation and the Lagrange Multiplier method (LSLM) are used to improve the traditional ARMA model. And then, according to the collected voltage-displacement data set, the parameters of the MARMA model are identified by LMLS method. Meanwhile, aiming at the difficulty of real-time displacement detection in the process of fast tool servo (FTS), a direct feedforward open-loop control (DFOC) strategy is designed based on the identified model. Finally, in order to verify the effectiveness and superiority of the method, a series of high frequency trajectory tracking and contrast experiments have been carried out successfully with the traditional PI and MARMA models. It shows that the MARMA model is nearly 20 times higher than the traditional PI model in terms of control accuracy and linearity, while the control bandwidth is achieved up to 200Hz.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"18 1","pages":"278-282"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82490642","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/3M-NANO.2018.8552230
Qilong Deng, Yang Su, Siyi Hu, Xiao Xiong, Ruoyu Juan, Yan Zhang, Hanbin Ma
In this paper, we introduce the design, development and implementation of a parallel architecture impedance measurement system for electrical impedance tomography. The system achieves a balance between speed, cost and system size. A 16-electrodes parallel impedance measurement system is designed around a phantom tank. We use an AD9834-based direct digital synthesizer module and improved Howland voltage controlled current source circuit to generate a 50 kHz constant sinusoidal current with a peak-peak amplitude up to 1 mA. The root-mean- square (RMS) potential on all the adjacent pairs of electrodes is measured directly by the analog-to-digital converter of the STM32 microcontroller unit (MCU). In order to enhance the system operation speed, a multi-MCU architecture is proposed here. 16 MCUs are connected in parallel to measure the voltage of each electrode and execute the fast Fourier transform operation at the same time, which guarantees a data collection rate of over 30 frames/s. The 16 slave MCUs use the InterIntegrated Circuit bus to communicate with the master MCU. The RMS data is then executed to obtain the impedance based on the acquired data.
{"title":"A Parallel Impedance Measurement System for Electrical Impedance Tomography System with Multi - Microcontroller - Unit Architecture","authors":"Qilong Deng, Yang Su, Siyi Hu, Xiao Xiong, Ruoyu Juan, Yan Zhang, Hanbin Ma","doi":"10.1109/3M-NANO.2018.8552230","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552230","url":null,"abstract":"In this paper, we introduce the design, development and implementation of a parallel architecture impedance measurement system for electrical impedance tomography. The system achieves a balance between speed, cost and system size. A 16-electrodes parallel impedance measurement system is designed around a phantom tank. We use an AD9834-based direct digital synthesizer module and improved Howland voltage controlled current source circuit to generate a 50 kHz constant sinusoidal current with a peak-peak amplitude up to 1 mA. The root-mean- square (RMS) potential on all the adjacent pairs of electrodes is measured directly by the analog-to-digital converter of the STM32 microcontroller unit (MCU). In order to enhance the system operation speed, a multi-MCU architecture is proposed here. 16 MCUs are connected in parallel to measure the voltage of each electrode and execute the fast Fourier transform operation at the same time, which guarantees a data collection rate of over 30 frames/s. The 16 slave MCUs use the InterIntegrated Circuit bus to communicate with the master MCU. The RMS data is then executed to obtain the impedance based on the acquired data.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"3 1","pages":"397-401"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82638517","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/3M-NANO.2018.8552239
Qingyu Sun, DeGui Sun
Silica-waveguide based planar lightwave circuit (PLC) technology is driving the applications of functional components for the increasing demands from industry due to its advanced properties in the wafer mass products. In this work, the thermal and mechanical fields are introduced to define the thermal conduction properties of thick SiO2 films and waveguide optical switch. Then, the influences of these two physical fields on the stress and thermal conduction of SiO2 waveguide optical switch are numerically calculated with theoretical model and then testified with the finite element method (FEM) function of COMSOL. Consequently, the agreeable results of about 300mW thermo-optic switching power and about 1.0ms switching time are reached among the numerical calculations, COMSOL simulations and experimental measurements. In coating processes, a reasonable control of heat is beneficial to thermal conduction and stress, so the simulations with the model and COMSOL software, and the measured results can all be employed to improve the design and fabrication performances of waveguide devices cross the wafer.
{"title":"Investigation for the Thermal Conduction of Silicon Oxide Waveguide Optical Switch","authors":"Qingyu Sun, DeGui Sun","doi":"10.1109/3M-NANO.2018.8552239","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552239","url":null,"abstract":"Silica-waveguide based planar lightwave circuit (PLC) technology is driving the applications of functional components for the increasing demands from industry due to its advanced properties in the wafer mass products. In this work, the thermal and mechanical fields are introduced to define the thermal conduction properties of thick SiO2 films and waveguide optical switch. Then, the influences of these two physical fields on the stress and thermal conduction of SiO2 waveguide optical switch are numerically calculated with theoretical model and then testified with the finite element method (FEM) function of COMSOL. Consequently, the agreeable results of about 300mW thermo-optic switching power and about 1.0ms switching time are reached among the numerical calculations, COMSOL simulations and experimental measurements. In coating processes, a reasonable control of heat is beneficial to thermal conduction and stress, so the simulations with the model and COMSOL software, and the measured results can all be employed to improve the design and fabrication performances of waveguide devices cross the wafer.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"16 1","pages":"159-162"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81545733","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/3M-NANO.2018.8552198
Yanling Tian, Yuechao Zhao, Zhen Yang, Chengjuan Yang
In this paper, carbon ion implantation was performed on the surface of modified nitinol alloy (NiTi) wafers. NiTi wafers are modified by nanosecond laser followed with or without fluoroalkylsilane (FAS) modification process. The influences of carbon ion implantation on surface morphology, surface wettability and chemical compositions were assessed by scanning electronic microscope (SEM), goniometer and energy dispersive spectrometer (EDS) respectively. The results show that the effects of carbon implantation on modified NiTi surface have a strong relationship with FAS modification process. After the FAS modification, carbon ion implantation will change surface visually images by chemical influence but surface morphology didn’t change. The water contact angles (WCAs) will decrease by carbon ion implantation for all FAS modified surfaces in contrary to a magnification influence for wafers without FAS modification process. In addition, it turns out to be faint for carbon ion implantation to increase surface carbon content.
{"title":"Effects of Carbon Ion Implantation on Surface Performance of Modified NiTi Shape Memory Alloy","authors":"Yanling Tian, Yuechao Zhao, Zhen Yang, Chengjuan Yang","doi":"10.1109/3M-NANO.2018.8552198","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552198","url":null,"abstract":"In this paper, carbon ion implantation was performed on the surface of modified nitinol alloy (NiTi) wafers. NiTi wafers are modified by nanosecond laser followed with or without fluoroalkylsilane (FAS) modification process. The influences of carbon ion implantation on surface morphology, surface wettability and chemical compositions were assessed by scanning electronic microscope (SEM), goniometer and energy dispersive spectrometer (EDS) respectively. The results show that the effects of carbon implantation on modified NiTi surface have a strong relationship with FAS modification process. After the FAS modification, carbon ion implantation will change surface visually images by chemical influence but surface morphology didn’t change. The water contact angles (WCAs) will decrease by carbon ion implantation for all FAS modified surfaces in contrary to a magnification influence for wafers without FAS modification process. In addition, it turns out to be faint for carbon ion implantation to increase surface carbon content.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"251 1","pages":"14-17"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83354935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/3M-NANO.2018.8552251
Songlin Yang, W. H. Tse, Jin Zhang
In this study, up-conversion nanoparticles (NaGdF4: Yb3+, Er3+) with/without Immunoglobulin G (IgG) modification were produced by a one-pot synthesis method. The average size of the UCNPs is 50 ± 5 nm. Following that, the up-conversion nanoparticles with/without IgG modification were deposited on the culture dish with glass bottom Matrix assisted pulsed laser evaporation (MAPLE) technique. Nd:YAG laser (Ȝ = 532 nm, IJfwhm § 200μs, Ȟ = 10 Hz) was applied in this deposition. The antibody-modified nanoparticles deposited on the bottom of culture dish by MAPLE process are characterized by energy-dispersive X-ray spectroscopy (SEMEDS) and Fourier transform infrared spectroscopy (FT-IR). In addition, human umbilical vein endothelial cells (HUVECs) are cultured on the culture dish with the deposition of up-conversion nanoparticles with/without antibody, IgG. No toxic effect is imposed on cells. The results of this work indicate the deposition of antibody-modified nanoparticles on the bottom of culture dish by MAPLE could provide more possibilities for cell culture.
{"title":"Biocompatible Protein (IgG) Modified Up-conversion Nanoparticles (NaGdF4: Yb3+, Er3+) Deposited by Matrix Assisted Pulsed Laser Evaporation (MAPLE)","authors":"Songlin Yang, W. H. Tse, Jin Zhang","doi":"10.1109/3M-NANO.2018.8552251","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552251","url":null,"abstract":"In this study, up-conversion nanoparticles (NaGdF4: Yb3+, Er3+) with/without Immunoglobulin G (IgG) modification were produced by a one-pot synthesis method. The average size of the UCNPs is 50 ± 5 nm. Following that, the up-conversion nanoparticles with/without IgG modification were deposited on the culture dish with glass bottom Matrix assisted pulsed laser evaporation (MAPLE) technique. Nd:YAG laser (Ȝ = 532 nm, IJfwhm § 200μs, Ȟ = 10 Hz) was applied in this deposition. The antibody-modified nanoparticles deposited on the bottom of culture dish by MAPLE process are characterized by energy-dispersive X-ray spectroscopy (SEMEDS) and Fourier transform infrared spectroscopy (FT-IR). In addition, human umbilical vein endothelial cells (HUVECs) are cultured on the culture dish with the deposition of up-conversion nanoparticles with/without antibody, IgG. No toxic effect is imposed on cells. The results of this work indicate the deposition of antibody-modified nanoparticles on the bottom of culture dish by MAPLE could provide more possibilities for cell culture.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"1 1","pages":"345-349"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88137303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-01DOI: 10.1109/3M-NANO.2018.8552212
Jing Li, Yingluo Zhou, L. Pan, Yijie Zhou, Xudong Wu, Nan Guo
A sandblasting-electroplating method was used to prepare the microstructure with hydrophobic properties on the surface of carbon steel. Under the optimum process parameters, a hydrophobic surface with a contact angle of 149.3°±2.5° was obtained. The results showed that, the surface composite structure constructed with the sandblasting-electroplating bonding process has excellent hydrophobic properties.
{"title":"The Hydrophobic Surface Prepared by Sandblasting-Electroplating on Carbon Steel","authors":"Jing Li, Yingluo Zhou, L. Pan, Yijie Zhou, Xudong Wu, Nan Guo","doi":"10.1109/3M-NANO.2018.8552212","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552212","url":null,"abstract":"A sandblasting-electroplating method was used to prepare the microstructure with hydrophobic properties on the surface of carbon steel. Under the optimum process parameters, a hydrophobic surface with a contact angle of 149.3°±2.5° was obtained. The results showed that, the surface composite structure constructed with the sandblasting-electroplating bonding process has excellent hydrophobic properties.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"24 1","pages":"294-297"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90797257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
To study the temperature of the cylinder block and cylinder head, temperature analysis was carried out for the engine based on FEM. The temperature and convection heat transfer coefficient boundary were obtained by CFD analysis. Then the engine temperature analysis was carried out by the software ANSYS and the accurate temperature field distribution is obtained which provides technical guidance for the performance improvement of each part of the engine.
{"title":"Analysis of Temperature Field in Cylinder Head and Cylinder Block of Engine","authors":"Haiquan Wu, Yonghua Wang, Zheming Liu, Jinkai Xu, Huadong Yu","doi":"10.1109/3M-NANO.2018.8552206","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552206","url":null,"abstract":"To study the temperature of the cylinder block and cylinder head, temperature analysis was carried out for the engine based on FEM. The temperature and convection heat transfer coefficient boundary were obtained by CFD analysis. Then the engine temperature analysis was carried out by the software ANSYS and the accurate temperature field distribution is obtained which provides technical guidance for the performance improvement of each part of the engine.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"3 1","pages":"223-227"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86496973","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Jiwen Zheng, Zhaogui Wang, Changdong Chen, Minmin Li, Chuan Liu
is well known that amorphous oxide semiconductors (AOS) are of high mobility and reliable stability, especially indium-gallium-zinc oxide (IGZO). It is the most promising material applied in the manufacture of both displays and integrated circuits in the near future. Taking the advantages of electrical and flexible properties, in particular, IGZO TFT has drawn a great amount of attention. In our work, IGZO TFTs are fabricated on the hydroxylated polyethylene terephthalate (PET) substrate at the temperature of 180°C, which is apparently lower than that in the conventional process. The experimental performance of the IGZO TFTs show that the mobility and onoff ration are up to 8 cm2V−1s−1 and 105 respectively. In addition, an inverter based on IGZO TFTs has been achieved on the PET substrate, and its gain reaches the value of −20, showing its potential for flexible logic circuits based on oxide TFTs.
{"title":"A Full-swing Inverter Based on IGZO TFTs for Flexible Circuits","authors":"Jiwen Zheng, Zhaogui Wang, Changdong Chen, Minmin Li, Chuan Liu","doi":"10.1002/sdtp.12822","DOIUrl":"https://doi.org/10.1002/sdtp.12822","url":null,"abstract":"is well known that amorphous oxide semiconductors (AOS) are of high mobility and reliable stability, especially indium-gallium-zinc oxide (IGZO). It is the most promising material applied in the manufacture of both displays and integrated circuits in the near future. Taking the advantages of electrical and flexible properties, in particular, IGZO TFT has drawn a great amount of attention. In our work, IGZO TFTs are fabricated on the hydroxylated polyethylene terephthalate (PET) substrate at the temperature of 180°C, which is apparently lower than that in the conventional process. The experimental performance of the IGZO TFTs show that the mobility and onoff ration are up to 8 cm2V−1s−1 and 105 respectively. In addition, an inverter based on IGZO TFTs has been achieved on the PET substrate, and its gain reaches the value of −20, showing its potential for flexible logic circuits based on oxide TFTs.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"20 1","pages":"373-376"},"PeriodicalIF":0.0,"publicationDate":"2018-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89301363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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