首页 > 最新文献

2015 IEEE Custom Integrated Circuits Conference (CICC)最新文献

英文 中文
A 5.4-mW 4-Gb/s 5-band QPSK transceiver for frequency-division multiplexing memory interface 一种5.4 mw 4gb /s 5波段QPSK收发器,用于频分复用存储接口
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338373
Wei-Han Cho, Yilei Li, Yanghyo Kim, Po-Tsang Huang, Yuan Du, S. Lee, Mau-Chung Frank Chang
This paper presents a novel self-equalized and skewless frequency-division multiplexing memory interface. To prove its feasibility, we have realized a 5-band QPSK transceiver in 40 nm CMOS to transmit up to 4 Gb/s through 10 orthogonal communication channels (each with 400 Mb/s) via on-chip TSV emulator with effective loading of 1 pF or 5-cm FR-4 PCB trace. With differential current-mode signaling, the transceiver consumes only 5.4 mW and takes only 80×100 μm2. A real-time flexible BER testing platform is established to prove that the BER of the transceiver is less than 1012.
提出了一种新的自均衡无偏频分复用存储接口。为了证明其可行性,我们在40 nm CMOS中实现了一个5波段QPSK收发器,通过片上TSV仿真器通过10个正交通信通道(每个通道400 Mb/s)传输高达4 Gb/s,有效负载为1 pF或5 cm FR-4 PCB走线。采用差分电流模式信号,收发器功耗仅为5.4 mW,占用面积仅为80×100 μm2。建立了实时灵活误码率测试平台,验证了收发器的误码率小于1012。
{"title":"A 5.4-mW 4-Gb/s 5-band QPSK transceiver for frequency-division multiplexing memory interface","authors":"Wei-Han Cho, Yilei Li, Yanghyo Kim, Po-Tsang Huang, Yuan Du, S. Lee, Mau-Chung Frank Chang","doi":"10.1109/CICC.2015.7338373","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338373","url":null,"abstract":"This paper presents a novel self-equalized and skewless frequency-division multiplexing memory interface. To prove its feasibility, we have realized a 5-band QPSK transceiver in 40 nm CMOS to transmit up to 4 Gb/s through 10 orthogonal communication channels (each with 400 Mb/s) via on-chip TSV emulator with effective loading of 1 pF or 5-cm FR-4 PCB trace. With differential current-mode signaling, the transceiver consumes only 5.4 mW and takes only 80×100 μm2. A real-time flexible BER testing platform is established to prove that the BER of the transceiver is less than 1012.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"33 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79546641","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 26
A system-verilog behavioral model for PLLs for pre-silicon validation and top-down design methodology 用于预硅验证和自顶向下设计方法的锁相环的系统verilog行为模型
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338432
Amr Lotfy, Syed Feruz Syed Farooq, Qi Wang, Soner Yaldiz, P. Mosalikanti, N. Kurd
This paper presents a System-Verilog behavioral model for charge-pump PLLs based on piece-wise constant (PWC) real number modeling and table lookup. The proposed model exploits the sampled nature of the PLL where most of its analog behavior takes effect during the phase detection, and remains almost constant during the rest of the reference cycle. The PLL model simulation run time takes only 1 second, which makes it a perfect fit for pre-silicon digital validation as well as top-down design methodology. Compared to transistor-level Spice simulations, the proposed model shows a correlation of more than 97% for the PLL locking behavior, jitter, and phase noise. The PLL model is used to exercise critical features like spread-spectrum clocking (SSC) and adaptive frequency system (AFS). In addition, the model was integrated in a pre-silicon validation environment and enabled catching design bugs.
本文提出了一种基于分段常数(PWC)实数建模和表查找的电荷泵锁相环系统- verilog行为模型。所提出的模型利用了锁相环的采样特性,其中其大部分模拟行为在相位检测期间生效,并且在参考周期的其余部分几乎保持不变。锁相环模型仿真运行时间仅为1秒,这使得它非常适合预硅数字验证以及自上而下的设计方法。与晶体管级Spice模拟相比,所提出的模型显示锁相环锁定行为、抖动和相位噪声的相关性超过97%。锁相环模型用于实现扩频时钟(SSC)和自适应频率系统(AFS)等关键特性。此外,该模型集成在预硅验证环境中,并能够捕获设计错误。
{"title":"A system-verilog behavioral model for PLLs for pre-silicon validation and top-down design methodology","authors":"Amr Lotfy, Syed Feruz Syed Farooq, Qi Wang, Soner Yaldiz, P. Mosalikanti, N. Kurd","doi":"10.1109/CICC.2015.7338432","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338432","url":null,"abstract":"This paper presents a System-Verilog behavioral model for charge-pump PLLs based on piece-wise constant (PWC) real number modeling and table lookup. The proposed model exploits the sampled nature of the PLL where most of its analog behavior takes effect during the phase detection, and remains almost constant during the rest of the reference cycle. The PLL model simulation run time takes only 1 second, which makes it a perfect fit for pre-silicon digital validation as well as top-down design methodology. Compared to transistor-level Spice simulations, the proposed model shows a correlation of more than 97% for the PLL locking behavior, jitter, and phase noise. The PLL model is used to exercise critical features like spread-spectrum clocking (SSC) and adaptive frequency system (AFS). In addition, the model was integrated in a pre-silicon validation environment and enabled catching design bugs.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"28 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77973082","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
ADC trends and impact on SAR ADC architecture and analysis ADC趋势及其对SAR ADC架构和分析的影响
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338380
Jeffrey Fredenburg, M. Flynn
The performance of ADCs continues to improve with process scaling. For low to moderate resolutions, SAR ADCs deliver the best energy efficiency. Interleaved SAR converters have become popular for very high sampling speeds. The SAR assisted scheme has dramatically improved the energy efficiency of higher resolution pipeline ADCs. This paper reviews the fundamental limits of the energy efficiency of the SAR architecture, considering the energy consumption of the capacitor array and of the comparator. ADCs. ADC yield as a function of capacitor matching is also considered.
adc的性能随着工艺的扩展而不断提高。对于低到中等分辨率,SAR adc提供最佳的能源效率。交错SAR转换器因其极高的采样速度而广受欢迎。SAR辅助方案极大地提高了高分辨率流水线adc的能量效率。考虑到电容阵列和比较器的能量消耗,本文回顾了SAR架构能量效率的基本限制。adc。ADC良率作为电容匹配的函数也被考虑。
{"title":"ADC trends and impact on SAR ADC architecture and analysis","authors":"Jeffrey Fredenburg, M. Flynn","doi":"10.1109/CICC.2015.7338380","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338380","url":null,"abstract":"The performance of ADCs continues to improve with process scaling. For low to moderate resolutions, SAR ADCs deliver the best energy efficiency. Interleaved SAR converters have become popular for very high sampling speeds. The SAR assisted scheme has dramatically improved the energy efficiency of higher resolution pipeline ADCs. This paper reviews the fundamental limits of the energy efficiency of the SAR architecture, considering the energy consumption of the capacitor array and of the comparator. ADCs. ADC yield as a function of capacitor matching is also considered.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"118 1","pages":"1-8"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77993178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Materials challenges for III-V/Si co-integrated CMOS III-V/Si协积CMOS的材料挑战
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338398
D. Sadana, C. Cheng, B. Wacaser, W. Spratt, K. Shiu, S. Bedell
This review focuses on material challenges associated with III-V co-integration with Si for future CMOS. There is a huge volume of literature on this topic as implementation of III-V monolithic integration with Si has been the holy grail for last four decades; targeting a wide range of applications including RF devices, LEDs, lasers, photo-detectors and the like. The key drivers have been the cost reduction, scalability with Si wafer diameter, and accessibility to highly scaled integrated circuits next to III-V devices. With the current focus on CMOS the pace of progress on monolithic integration has accelerated by leaps and bounds partly because of its vast impact on CMOS scaling, and partly due to the aggressive CMOS roadmap requirements. The discussion below concentrates on In0.53Ga0.47As channel which is the dominant III-V material being pursued for future technology. Despite the narrow focus, fundamental and engineering challenges posed by this material encompass a broad range of material topics including epitaxial growth, crystallographic defects and their dynamics during growth and subsequent processing, clever device architecture to alleviate adverse impact of defects on device leakage, and innovative engineering for material improvement.
这篇综述的重点是与未来CMOS中III-V与Si协整相关的材料挑战。关于这个主题有大量的文献,因为与Si的III-V单片集成的实现在过去四十年中一直是圣杯;针对广泛的应用,包括射频器件,led,激光器,光电探测器等。关键的驱动因素是成本降低,硅晶圆直径的可扩展性,以及III-V器件旁边的高规模集成电路的可访问性。随着目前对CMOS的关注,单片集成的进展速度已经突飞猛进,部分原因是它对CMOS缩放的巨大影响,部分原因是CMOS路线图的激进要求。下面的讨论集中在In0.53Ga0.47As通道,这是未来技术所追求的主要III-V材料。尽管焦点狭窄,但这种材料带来的基础和工程挑战涵盖了广泛的材料主题,包括外延生长,晶体缺陷及其在生长和后续加工过程中的动力学,巧妙的器件结构以减轻缺陷对器件泄漏的不利影响,以及材料改进的创新工程。
{"title":"Materials challenges for III-V/Si co-integrated CMOS","authors":"D. Sadana, C. Cheng, B. Wacaser, W. Spratt, K. Shiu, S. Bedell","doi":"10.1109/CICC.2015.7338398","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338398","url":null,"abstract":"This review focuses on material challenges associated with III-V co-integration with Si for future CMOS. There is a huge volume of literature on this topic as implementation of III-V monolithic integration with Si has been the holy grail for last four decades; targeting a wide range of applications including RF devices, LEDs, lasers, photo-detectors and the like. The key drivers have been the cost reduction, scalability with Si wafer diameter, and accessibility to highly scaled integrated circuits next to III-V devices. With the current focus on CMOS the pace of progress on monolithic integration has accelerated by leaps and bounds partly because of its vast impact on CMOS scaling, and partly due to the aggressive CMOS roadmap requirements. The discussion below concentrates on In0.53Ga0.47As channel which is the dominant III-V material being pursued for future technology. Despite the narrow focus, fundamental and engineering challenges posed by this material encompass a broad range of material topics including epitaxial growth, crystallographic defects and their dynamics during growth and subsequent processing, clever device architecture to alleviate adverse impact of defects on device leakage, and innovative engineering for material improvement.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"22 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73180986","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 2.2 GS/s 188mW spectrometer processor in 65nm CMOS for supporting low-power THz planetary instruments 一个2.2 GS/s 188mW的65纳米CMOS光谱仪处理器,支持低功耗太赫兹行星仪器
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338367
F. Hsiao, A. Tang, Y. Kim, B. Drouin, G. Chattopadhyay, Mau-Chung Frank Chang
The paper presents a 2.2 GS/s (1.1 GHz Nyquist bandwidth), 188 mW 512-channel spectrometer processor developed to support of future science observations on NASA planetary missions, where payload size, weight, and power consumption are extremely limited. The presented spectrometer processor chip contains a pair of 7 bit ADC IQ converters coupled with a 512 point PSD processor, and averaging accumulator, allowing it to be sensitive enough to detect trace gases like NH3, HCN, and CO2 when coupled to the appropriate band RF front-end receiver. The bandwidth and resolution of the presented processor make it suitable for exploring the composition of planets, moons and their atmospheres throughout our solar system.
本文介绍了一种2.2 GS/s (1.1 GHz奈奎斯特带宽)、188 mW 512通道光谱仪处理器,用于支持NASA行星任务中未来的科学观测,这些任务的有效载荷大小、重量和功耗都非常有限。所提出的光谱仪处理器芯片包含一对7位ADC IQ转换器和一个512点PSD处理器,以及平均累加器,当耦合到适当频段的射频前端接收器时,使其能够足够灵敏地检测微量气体,如NH3, HCN和CO2。所展示的处理器的带宽和分辨率使其适合探索整个太阳系的行星、卫星及其大气的组成。
{"title":"A 2.2 GS/s 188mW spectrometer processor in 65nm CMOS for supporting low-power THz planetary instruments","authors":"F. Hsiao, A. Tang, Y. Kim, B. Drouin, G. Chattopadhyay, Mau-Chung Frank Chang","doi":"10.1109/CICC.2015.7338367","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338367","url":null,"abstract":"The paper presents a 2.2 GS/s (1.1 GHz Nyquist bandwidth), 188 mW 512-channel spectrometer processor developed to support of future science observations on NASA planetary missions, where payload size, weight, and power consumption are extremely limited. The presented spectrometer processor chip contains a pair of 7 bit ADC IQ converters coupled with a 512 point PSD processor, and averaging accumulator, allowing it to be sensitive enough to detect trace gases like NH3, HCN, and CO2 when coupled to the appropriate band RF front-end receiver. The bandwidth and resolution of the presented processor make it suitable for exploring the composition of planets, moons and their atmospheres throughout our solar system.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"17 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86644229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
A 275 Gbps AES encryption accelerator using ROM-based S-boxes in 65nm 采用基于rom的s -box的275 Gbps AES加密加速器
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338448
B. Erbagci, N. E. C. Akkaya, Craig Teegarden, K. Mai
The implementation of the SubBytes (or S-Box) step of the AES algorithm significantly contributes to the area, delay, and power of AES accelerators. Unlike typical logic gate S-Box implementations, we use full-custom 256×8-bit ROMs, which significantly improve performance and efficiency. We implemented a fully-unrolled, pipelined AES-128 encryption accelerator using ROM-based S-Boxes in 65nm bulk CMOS which operates at 2.2GHz and consumes 523mW at 1.0V, 27°C. In counter-mode operation (CTR), the throughput is 275.2Gbps, which is 5.2x higher than the highest ever reported in the literature to our knowledge.
AES算法的SubBytes(或S-Box)步的实现对AES加速器的面积、延迟和功率有很大的影响。与典型的逻辑门S-Box实现不同,我们使用全定制256×8-bit rom,这大大提高了性能和效率。我们使用基于rom的s - box实现了一个完全展开的流水线AES-128加密加速器,该加速器在65nm块体CMOS中工作在2.2GHz,在1.0V, 27°C下消耗523mW。在反模式操作(CTR)中,吞吐量为275.2Gbps,比我们所知的文献中最高的报道高出5.2倍。
{"title":"A 275 Gbps AES encryption accelerator using ROM-based S-boxes in 65nm","authors":"B. Erbagci, N. E. C. Akkaya, Craig Teegarden, K. Mai","doi":"10.1109/CICC.2015.7338448","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338448","url":null,"abstract":"The implementation of the SubBytes (or S-Box) step of the AES algorithm significantly contributes to the area, delay, and power of AES accelerators. Unlike typical logic gate S-Box implementations, we use full-custom 256×8-bit ROMs, which significantly improve performance and efficiency. We implemented a fully-unrolled, pipelined AES-128 encryption accelerator using ROM-based S-Boxes in 65nm bulk CMOS which operates at 2.2GHz and consumes 523mW at 1.0V, 27°C. In counter-mode operation (CTR), the throughput is 275.2Gbps, which is 5.2x higher than the highest ever reported in the literature to our knowledge.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"1 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89731089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
A linear transconductance amplifier with differential-mode bandwidth extension and common-mode compensation 一种具有差模带宽扩展和共模补偿的线性跨导放大器
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338443
Derui Kong, Sang Min Lee, S. M. Taleie, M. J. McGowan, Dongwon Seo
A transconductance amplifier with extended bandwidth, which is a critical block in various applications including amplifiers, filters and DACs, is presented. The presented technique introduces a differential-mode negative capacitance while introduces the common-mode positive capacitance such that it extends the differential-mode bandwidth and compensates the common-mode stability. The proposed transconductance amplifier has been implemented for a DAC in CMOS 20nm to improve the distortion performance as a negative transconductance circuit, but the proposed technique is applicable to the wide range of circuits with a transconductor.
介绍了一种具有扩展带宽的跨导放大器,它是放大器、滤波器和dac等各种应用中的关键模块。该技术在引入共模正电容的同时引入差模负电容,从而扩展了差模带宽并补偿了共模稳定性。所提出的跨导放大器已应用于CMOS 20nm的DAC中,以改善负跨导电路的失真性能,但所提出的技术适用于广泛的具有跨导电路的电路。
{"title":"A linear transconductance amplifier with differential-mode bandwidth extension and common-mode compensation","authors":"Derui Kong, Sang Min Lee, S. M. Taleie, M. J. McGowan, Dongwon Seo","doi":"10.1109/CICC.2015.7338443","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338443","url":null,"abstract":"A transconductance amplifier with extended bandwidth, which is a critical block in various applications including amplifiers, filters and DACs, is presented. The presented technique introduces a differential-mode negative capacitance while introduces the common-mode positive capacitance such that it extends the differential-mode bandwidth and compensates the common-mode stability. The proposed transconductance amplifier has been implemented for a DAC in CMOS 20nm to improve the distortion performance as a negative transconductance circuit, but the proposed technique is applicable to the wide range of circuits with a transconductor.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"14 8","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91427268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Methods for finding globally maximum-efficiency impedance matching networks with lossy passives 具有损耗无源的全局最大效率阻抗匹配网络的求解方法
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338434
C. R. Chappidi, K. Sengupta
Impedance transformation using on-chip passive elements is ubiquitously used in RF and mm-Wave circuits and systems for optimal power matching, interstage and noise matching, and high-efficiency power delivery to the antenna by power amplifiers. While conjugate matching gives optimal efficiency for lossless passives, the results are markedly different when constituent passives have finite quality factors. Given the load and source impedances, there may be infinite ways to achieve the transformation, albeit each incurring different loss. In this paper, we investigate the methods to deduce the global maximum efficiency of power transfer between two arbitrary impedances with lossy passives. This paper also proposes methods to combine this with nonlinear load-pull simulations for optimal efficiency combiner and matching network for integrated PAs. To the best of the authors' knowledge, this is the first comprehensive analysis of globally optimal impedance transformation networks between arbitrary impedances with lossy passives.
采用片上无源元件的阻抗变换广泛应用于射频和毫米波电路和系统中,以实现最佳功率匹配、级间和噪声匹配,并通过功率放大器向天线高效供电。共轭匹配对无损无源的效率是最优的,但当组成无源的质量因子有限时,结果会有明显的不同。给定负载和源阻抗,可能有无限种方法来实现转换,尽管每种方法都会产生不同的损耗。本文研究了具有损耗无源的两个任意阻抗间的全局最大功率传输效率的推导方法。本文还提出了将该方法与最优效率组合器的非线性负载-拉仿真和集成PAs的匹配网络相结合的方法。据作者所知,这是第一次对任意阻抗之间的全局最优阻抗转换网络进行全面分析。
{"title":"Methods for finding globally maximum-efficiency impedance matching networks with lossy passives","authors":"C. R. Chappidi, K. Sengupta","doi":"10.1109/CICC.2015.7338434","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338434","url":null,"abstract":"Impedance transformation using on-chip passive elements is ubiquitously used in RF and mm-Wave circuits and systems for optimal power matching, interstage and noise matching, and high-efficiency power delivery to the antenna by power amplifiers. While conjugate matching gives optimal efficiency for lossless passives, the results are markedly different when constituent passives have finite quality factors. Given the load and source impedances, there may be infinite ways to achieve the transformation, albeit each incurring different loss. In this paper, we investigate the methods to deduce the global maximum efficiency of power transfer between two arbitrary impedances with lossy passives. This paper also proposes methods to combine this with nonlinear load-pull simulations for optimal efficiency combiner and matching network for integrated PAs. To the best of the authors' knowledge, this is the first comprehensive analysis of globally optimal impedance transformation networks between arbitrary impedances with lossy passives.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"85 3 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81349569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
An on-chip stochastic sigma-tracking eye-opening monitor for BER-optimal adaptive equalization 一种用于ber最优自适应均衡的片上随机sigma跟踪大眼监视器
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338374
Hyosup Won, Kwangseok Han, Sangeun Lee, Jinho Park, Hyeon-Min Bae
An on-chip stochastic sigma-tracking eye-opening monitor (SSEOM) for background adaptive equalization is presented. The proposed SSEOM detects the BER-related eye opening area accurately with a feasible degree of time/area efficiency without an external microcontroller. In addition, the SSEOM determines the BER-optimal equalization parameters for both CTLE and DFE by incorporating a pattern-dependent eye-tracking scheme. Auxiliary data samplers are employed in parallel with data samplers to track link variations and adjust the equalization parameters in the background. A 28-Gb/s CDR including a SSEOM-based adaptive equalizer is fabricated in 40nm CMOS for an evaluation.
提出了一种用于背景自适应均衡的片上随机西格玛跟踪开眼监测仪。所提出的SSEOM在没有外部微控制器的情况下,以可行的时间/面积效率精确地检测berr相关的睁眼面积。此外,SSEOM通过结合模式依赖的眼动追踪方案来确定CTLE和DFE的ber最优均衡参数。辅助数据采样器与数据采样器并行使用,跟踪链路变化并在后台调整均衡参数。采用40nm CMOS工艺制作了包含基于sseom的自适应均衡器的28gb /s CDR进行评估。
{"title":"An on-chip stochastic sigma-tracking eye-opening monitor for BER-optimal adaptive equalization","authors":"Hyosup Won, Kwangseok Han, Sangeun Lee, Jinho Park, Hyeon-Min Bae","doi":"10.1109/CICC.2015.7338374","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338374","url":null,"abstract":"An on-chip stochastic sigma-tracking eye-opening monitor (SSEOM) for background adaptive equalization is presented. The proposed SSEOM detects the BER-related eye opening area accurately with a feasible degree of time/area efficiency without an external microcontroller. In addition, the SSEOM determines the BER-optimal equalization parameters for both CTLE and DFE by incorporating a pattern-dependent eye-tracking scheme. Auxiliary data samplers are employed in parallel with data samplers to track link variations and adjust the equalization parameters in the background. A 28-Gb/s CDR including a SSEOM-based adaptive equalizer is fabricated in 40nm CMOS for an evaluation.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"194 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77942588","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Dynamic and leakage power reduction of ASICs using configurable threshold logic gates 采用可配置阈值逻辑门降低asic的动态和泄漏功率
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338369
Jinghua Yang, Joseph Davis, Niranjan S. Kulkarni, Jae-sun Seo, S. Vrudhula
This article demonstrates an unconventional approach to computing logic functions for use in ASICs, and a fully automated approach to technology mapping for standard cell ASICs using the new cells. The approach results in a significant reduction in power, leakage, area and wire-length, without sacrificing performance of the design. At the heart of this approach is a configurable threshold logic gate. Using a standard cell library of such gates, a new technology mapping algorithm is applied to automatically transform a given netlist into one with an optimal mixture of conventional logic gates and threshold gates. The mapping algorithm is based on logic decomposition of Boolean functions into specific threshold functions. This approach was used to fabricate a 32-bit signed 2-stage Wallace-Tree multiplier in a 65-nm LP technology. Simulation and chip measurement results of the multiplier show a 33% improvement in dynamic power at 30% switching activity, 24% lower core area, 45% lower wire-length and 50% lower leakage without any performance degradation, compared to a functionally equivalent, conventional standard cell implementation. Similar results are shown for a FIR filter, a 32-bit MIPS, a 128-bit AES encryption circuit and a floating-point multiplier.
本文演示了一种在asic中使用的计算逻辑功能的非常规方法,以及使用新单元对标准单元asic进行技术映射的全自动方法。该方法在不牺牲设计性能的情况下显著降低了功率、泄漏、面积和导线长度。这种方法的核心是一个可配置的阈值逻辑门。利用标准的逻辑门单元库,采用一种新的技术映射算法,将给定的网表自动转换为传统逻辑门与阈值门的最优混合网表。该映射算法基于将布尔函数逻辑分解为特定的阈值函数。该方法用于在65纳米LP技术中制造32位带符号的2级Wallace-Tree乘法器。仿真和芯片测量结果表明,与功能等效的传统标准电池相比,该倍增器在30%开关活度下的动态功率提高了33%,核心面积减少了24%,线长减少了45%,漏损减少了50%,而性能没有任何下降。对于FIR滤波器、32位MIPS、128位AES加密电路和浮点乘法器也显示了类似的结果。
{"title":"Dynamic and leakage power reduction of ASICs using configurable threshold logic gates","authors":"Jinghua Yang, Joseph Davis, Niranjan S. Kulkarni, Jae-sun Seo, S. Vrudhula","doi":"10.1109/CICC.2015.7338369","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338369","url":null,"abstract":"This article demonstrates an unconventional approach to computing logic functions for use in ASICs, and a fully automated approach to technology mapping for standard cell ASICs using the new cells. The approach results in a significant reduction in power, leakage, area and wire-length, without sacrificing performance of the design. At the heart of this approach is a configurable threshold logic gate. Using a standard cell library of such gates, a new technology mapping algorithm is applied to automatically transform a given netlist into one with an optimal mixture of conventional logic gates and threshold gates. The mapping algorithm is based on logic decomposition of Boolean functions into specific threshold functions. This approach was used to fabricate a 32-bit signed 2-stage Wallace-Tree multiplier in a 65-nm LP technology. Simulation and chip measurement results of the multiplier show a 33% improvement in dynamic power at 30% switching activity, 24% lower core area, 45% lower wire-length and 50% lower leakage without any performance degradation, compared to a functionally equivalent, conventional standard cell implementation. Similar results are shown for a FIR filter, a 32-bit MIPS, a 128-bit AES encryption circuit and a floating-point multiplier.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"6 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88807993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
期刊
2015 IEEE Custom Integrated Circuits Conference (CICC)
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1