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2015 IEEE Custom Integrated Circuits Conference (CICC)最新文献

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A 10 mW 60GHz 65nm CMOS DCO with 24% tuning range and 40 kHz frequency granularity 10mw 60GHz 65nm CMOS DCO, 24%调谐范围和40khz频率粒度
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338482
A. Hussein, Shadi Saberi, J. Paramesh
This paper presents a wide tuning range mm-wave digitally controlled oscillator (DCO) with very fine frequency tuning granularity. Switched coupled-inductor and switched-capacitor banks provide the coarse tuning to achieve 24% tuning range from 48.1 GHz to 61.3 GHz. A fine frequency tuning resolution of 39 kHz is achieved using capacitive degeneration. The 65 nm CMOS DCO consumes 10mA from 1V supply voltage, and the DCO with output shunt-peaking buffer occupy an active area of 0.0322mm2. The measured max/average/min phase noise at 1 MHz and 10MHz offset are -88.8/-91.9/-95.1dBc/Hz and -114/-116.8/-119.5dBc/Hz respectively. The figure-of-merit varies from -186.4dB to -182.2dB which is better than figure-of-merit of recent mm-wave DCO benchmarks.
本文提出了一种宽调谐范围的毫米波数字控制振荡器(DCO),具有非常精细的频率调谐粒度。开关耦合电感和开关电容组提供粗调谐,以实现24%的调谐范围从48.1 GHz到61.3 GHz。利用电容性退化实现了39 kHz的精细频率调谐分辨率。65 nm CMOS DCO从1V电源电压消耗10mA,带输出分流峰值缓冲器的DCO占据0.0322mm2的有源面积。在1mhz和10MHz偏置时测得的最大/平均/最小相位噪声分别为-88.8/-91.9/-95.1dBc/Hz和-114/-116.8/-119.5dBc/Hz。性能值在-186.4dB到-182.2dB之间变化,优于最近的毫米波DCO基准测试的性能值。
{"title":"A 10 mW 60GHz 65nm CMOS DCO with 24% tuning range and 40 kHz frequency granularity","authors":"A. Hussein, Shadi Saberi, J. Paramesh","doi":"10.1109/CICC.2015.7338482","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338482","url":null,"abstract":"This paper presents a wide tuning range mm-wave digitally controlled oscillator (DCO) with very fine frequency tuning granularity. Switched coupled-inductor and switched-capacitor banks provide the coarse tuning to achieve 24% tuning range from 48.1 GHz to 61.3 GHz. A fine frequency tuning resolution of 39 kHz is achieved using capacitive degeneration. The 65 nm CMOS DCO consumes 10mA from 1V supply voltage, and the DCO with output shunt-peaking buffer occupy an active area of 0.0322mm2. The measured max/average/min phase noise at 1 MHz and 10MHz offset are -88.8/-91.9/-95.1dBc/Hz and -114/-116.8/-119.5dBc/Hz respectively. The figure-of-merit varies from -186.4dB to -182.2dB which is better than figure-of-merit of recent mm-wave DCO benchmarks.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"32 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73122963","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Characterization and simulation methodology for time-dependent variability in advanced technologies 先进技术中时变率的表征和仿真方法
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338379
P. Weckx, B. Kaczer, P. Raghavan, J. Franco, Marko Simicic, P. Roussel, D. Linten, A. Thean, D. Verkest, F. Catthoor, G. Groeseneken
This paper describes the implications of Bias Temperature Instability (BTI) related time-dependent threshold voltage distributions on the performance and yield of devices and SRAM cells. We show that nFET and pFET time-dependent variability, in addition to the standard time-zero variability, can be fully characterized and projected using a series of measurements on a large test element group (TEG) fabricated in an advanced technology. The statistical distributions encompassing both time-zero and time-dependent variability and their correlations are discussed. The assumption of Normally distributed threshold voltages, imposed by State-of-the-Art design approaches, is shown to induce inaccuracy which is readily solved by adopting our defect-centric statistical approach.
本文描述了与偏置温度不稳定性(BTI)相关的时间依赖性阈值电压分布对器件和SRAM电池的性能和产量的影响。我们表明,除了标准的时间零变异性之外,nFET和pFET的时间相关变异性可以通过在先进技术制造的大型测试元件组(TEG)上进行一系列测量来充分表征和预测。讨论了时间零变率和时间相关变率的统计分布及其相关性。采用最先进的设计方法所施加的正态分布阈值电压假设会导致不准确,而采用我们的以缺陷为中心的统计方法可以很容易地解决这一问题。
{"title":"Characterization and simulation methodology for time-dependent variability in advanced technologies","authors":"P. Weckx, B. Kaczer, P. Raghavan, J. Franco, Marko Simicic, P. Roussel, D. Linten, A. Thean, D. Verkest, F. Catthoor, G. Groeseneken","doi":"10.1109/CICC.2015.7338379","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338379","url":null,"abstract":"This paper describes the implications of Bias Temperature Instability (BTI) related time-dependent threshold voltage distributions on the performance and yield of devices and SRAM cells. We show that nFET and pFET time-dependent variability, in addition to the standard time-zero variability, can be fully characterized and projected using a series of measurements on a large test element group (TEG) fabricated in an advanced technology. The statistical distributions encompassing both time-zero and time-dependent variability and their correlations are discussed. The assumption of Normally distributed threshold voltages, imposed by State-of-the-Art design approaches, is shown to induce inaccuracy which is readily solved by adopting our defect-centric statistical approach.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"22 1","pages":"1-8"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74917488","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A 5–115V efficiency-enhanced synchronous LED driver with adaptive resonant timing control 一种具有自适应谐振时序控制的5-115V效率增强同步LED驱动器
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338387
Zhidong Liu, Hoi Lee
A wide-input-range (5-115V) DC-DC based synchronous LED driver is presented in this paper. The proposed LED driver can automatically operate in the soft-switching mode to minimize the converter's switching loss in the HV condition. An adaptive resonate timing control (ARTC) is developed to generate optimal dead-time for establishing zero-voltage switching of both high- and low-side power FETs under different input and output voltages. Two high-speed HV body-diode-based zero-voltage detectors are also proposed to realize high-frequency soft switching. Implemented in a 0.5μm 120V CMOS process, the proposed LED driver can support up to 25 series-connected high-brightness LEDs. The LED driver can operate up to 1.6MHz and achieve a peak power efficiency of 94.4% in the soft-switching mode. Compared to the prior arts, the proposed LED driver is the first to demonstrate auto-configurable hard-and soft-switching capability by the ARTC to achieve high power efficiency and current accuracy over both widest ranges of the input voltage and the number of output LEDs.
本文提出了一种宽输入范围(5-115V) DC-DC同步LED驱动器。所提出的LED驱动器可以自动工作在软开关模式下,以尽量减少变换器在高压条件下的开关损耗。为实现高、低侧功率场效应管在不同输入输出电压下的零电压切换,提出了一种自适应谐振时序控制方法(ARTC)。为实现高频软开关,提出了两种高速高压体二极管零电压检测器。该LED驱动器采用0.5μm 120V CMOS工艺,最多可支持25个串联的高亮度LED。在软开关模式下,LED驱动器的工作频率可达1.6MHz,峰值功率效率为94.4%。与现有技术相比,所提出的LED驱动器首次展示了ARTC的自动配置硬开关和软开关能力,从而在最宽的输入电压和输出LED数量范围内实现高功率效率和电流精度。
{"title":"A 5–115V efficiency-enhanced synchronous LED driver with adaptive resonant timing control","authors":"Zhidong Liu, Hoi Lee","doi":"10.1109/CICC.2015.7338387","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338387","url":null,"abstract":"A wide-input-range (5-115V) DC-DC based synchronous LED driver is presented in this paper. The proposed LED driver can automatically operate in the soft-switching mode to minimize the converter's switching loss in the HV condition. An adaptive resonate timing control (ARTC) is developed to generate optimal dead-time for establishing zero-voltage switching of both high- and low-side power FETs under different input and output voltages. Two high-speed HV body-diode-based zero-voltage detectors are also proposed to realize high-frequency soft switching. Implemented in a 0.5μm 120V CMOS process, the proposed LED driver can support up to 25 series-connected high-brightness LEDs. The LED driver can operate up to 1.6MHz and achieve a peak power efficiency of 94.4% in the soft-switching mode. Compared to the prior arts, the proposed LED driver is the first to demonstrate auto-configurable hard-and soft-switching capability by the ARTC to achieve high power efficiency and current accuracy over both widest ranges of the input voltage and the number of output LEDs.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"7 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75020666","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A field-programmable noise-canceling wideband receiver with high-linearity hybrid class-AB-C LNTAs 一种现场可编程ab -c类混合线性线性宽带消噪接收机
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338453
Jianxun Zhu, P. Kinget
A field-programmable noise-canceling wide-band receiver front end with high performance LNTAs is presented. The common-source (CS) and common-gate (CG) LNTAs are split into several cells whose bias point can be individually programmed in class AB or C yielding a highly linear hybrid class-AB-C LNTA. The 40nm LP CMOS receiver prototype can be programmed on the fly to adapt to different RF environments; it was tested in a low noise mode, a high linearity mode and a low power mode. Across these modes, the receiver has maximum gain of 53dB, a minimum NF of 2.2dB, a maximum B1 dB of +11dBm, and a maximum OB-IIP3 of +21dBm; the signal path consumes between 15 and 40mA from a 2.5V supply and the LO current varies from 2.2 to 20mA from a 1.1V supply across operating frequencies. The measured LO emission at the antenna port is <;-84dBm.
提出了一种具有高性能LNTAs的现场可编程消噪宽带接收机前端。共源(CS)和共门(CG) LNTA被分成几个单元,其偏置点可以单独编程为AB类或C类,从而产生高度线性混合的AB-C类LNTA。40nm LP CMOS接收器原型可以动态编程,以适应不同的射频环境;在低噪声模式、高线性模式和低功耗模式下进行了测试。在这些模式下,接收机的最大增益为53dB,最小NF为2.2dB,最大B1 dB为+11dBm,最大OB-IIP3为+21dBm;信号路径从2.5V电源消耗15到40mA,从1.1V电源工作频率的LO电流从2.2到20mA变化。在天线口测得的LO发射<;-84dBm。
{"title":"A field-programmable noise-canceling wideband receiver with high-linearity hybrid class-AB-C LNTAs","authors":"Jianxun Zhu, P. Kinget","doi":"10.1109/CICC.2015.7338453","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338453","url":null,"abstract":"A field-programmable noise-canceling wide-band receiver front end with high performance LNTAs is presented. The common-source (CS) and common-gate (CG) LNTAs are split into several cells whose bias point can be individually programmed in class AB or C yielding a highly linear hybrid class-AB-C LNTA. The 40nm LP CMOS receiver prototype can be programmed on the fly to adapt to different RF environments; it was tested in a low noise mode, a high linearity mode and a low power mode. Across these modes, the receiver has maximum gain of 53dB, a minimum NF of 2.2dB, a maximum B1 dB of +11dBm, and a maximum OB-IIP3 of +21dBm; the signal path consumes between 15 and 40mA from a 2.5V supply and the LO current varies from 2.2 to 20mA from a 1.1V supply across operating frequencies. The measured LO emission at the antenna port is <;-84dBm.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"24 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75283865","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A 28-GHz inverse class-F power amplifier with coupled-inductor based harmonic impedance modulator 一种基于耦合电感谐波阻抗调制器的28 ghz反f类功率放大器
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338364
S. Y. Mortazavi, Kwang-Jin Koh
This paper presents a 28 GHz class-F1 power amplifier in 0.13-μm SiGe BiCMOS technology. The PA adopts a coupled-inductor based harmonic impedance modulator in order to terminate 2nd and 3rd harmonic load impedances appropriately for class-F1 operation. The coupled coils essentially provide frequency-dependent inductance that is optimal to resonate out 2nd and 3rd harmonic reactive impedance. The PA achieve 40-42% PAE over 27.5 GHz to 29 GHz, peak 42% PAE at 28 GHz with 50 mW OP-1db power, one of the highest PAEs ever reported in silicon-based PAs. At 6-dB backoff output power, the PAE is as high as 20% Psat is 16.6 dBm. The PA occupies 0.55×0.96 mm2.
提出了一种采用0.13 μm SiGe BiCMOS技术的28 GHz f1类功率放大器。该放大器采用了基于耦合电感的谐波阻抗调制器,以适当地终止f1类工作的二阶和三次谐波负载阻抗。耦合线圈本质上提供了频率相关的电感,最适合谐振出二次和三次谐波无功阻抗。该放大器在27.5 GHz至29 GHz范围内实现了40-42%的PAE,在28 GHz时达到峰值42%的PAE,功率为50 mW OP-1db,是硅基放大器中报道的最高PAE之一。在6db的回退输出功率下,PAE高达20%,Psat为16.6 dBm。PA占用0.55×0.96 mm2。
{"title":"A 28-GHz inverse class-F power amplifier with coupled-inductor based harmonic impedance modulator","authors":"S. Y. Mortazavi, Kwang-Jin Koh","doi":"10.1109/CICC.2015.7338364","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338364","url":null,"abstract":"This paper presents a 28 GHz class-F<sup>1</sup> power amplifier in 0.13-μm SiGe BiCMOS technology. The PA adopts a coupled-inductor based harmonic impedance modulator in order to terminate 2<sup>nd</sup> and 3<sup>rd</sup> harmonic load impedances appropriately for class-F<sup>1</sup> operation. The coupled coils essentially provide frequency-dependent inductance that is optimal to resonate out 2<sup>nd</sup> and 3<sup>rd</sup> harmonic reactive impedance. The PA achieve 40-42% PAE over 27.5 GHz to 29 GHz, peak 42% PAE at 28 GHz with 50 mW OP-1db power, one of the highest PAEs ever reported in silicon-based PAs. At 6-dB backoff output power, the PAE is as high as 20% Psat is 16.6 dBm. The PA occupies 0.55×0.96 mm<sup>2</sup>.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"75 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79198823","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 21
Design considerations of HBM stacked DRAM and the memory architecture extension HBM堆叠DRAM的设计考虑及内存架构扩展
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338357
Dong-Uk Lee, Kangseol Lee, Yong-jun Lee, Kyung Whan Kim, Jong Kang, Jaejin Lee, J. Chun
Recently, the 3D stacked memory, which is known as HBM (high bandwidth memory), using TSV process has been developed. The stacked memory structure provides increased bandwidth, low power consumption, as well as small form factor. There are many design challenges, such as multi-channel operation, microbump test and TSV connection scan. Various design methodology make it possible to overcome the difficulties in the development of TSV technology. Vertical stacking enables more diverse memory architecture than the flat architecture. The next generation of HBM focuses on not only the bandwidth but also the system performance enhancement by adopting pseudo channel and 8-Hi stacking. The architecture applied to the second generation HBM are introduced in this paper.
近年来,采用TSV工艺的3D堆叠存储器被称为HBM(高带宽存储器)。堆叠式内存结构提供了更高的带宽、低功耗和小尺寸。多通道操作、微碰撞测试、TSV连接扫描等设计难题。各种设计方法使得克服TSV技术发展中的困难成为可能。垂直堆叠可以实现比平面架构更多样化的内存架构。下一代HBM不仅关注带宽,而且通过采用伪信道和8-Hi堆叠来提高系统性能。本文介绍了应用于第二代HBM的体系结构。
{"title":"Design considerations of HBM stacked DRAM and the memory architecture extension","authors":"Dong-Uk Lee, Kangseol Lee, Yong-jun Lee, Kyung Whan Kim, Jong Kang, Jaejin Lee, J. Chun","doi":"10.1109/CICC.2015.7338357","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338357","url":null,"abstract":"Recently, the 3D stacked memory, which is known as HBM (high bandwidth memory), using TSV process has been developed. The stacked memory structure provides increased bandwidth, low power consumption, as well as small form factor. There are many design challenges, such as multi-channel operation, microbump test and TSV connection scan. Various design methodology make it possible to overcome the difficulties in the development of TSV technology. Vertical stacking enables more diverse memory architecture than the flat architecture. The next generation of HBM focuses on not only the bandwidth but also the system performance enhancement by adopting pseudo channel and 8-Hi stacking. The architecture applied to the second generation HBM are introduced in this paper.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"58 1","pages":"1-8"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85818301","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Session 20 — Manufacturing beyond moore's law 第20部分-超越摩尔定律的制造业
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338473
P. Jansen, R. Venkatraman
This session presents state-of-the-art manufacturing processes beyond “Moore's Law”.
本课程将介绍超越“摩尔定律”的先进制造工艺。
{"title":"Session 20 — Manufacturing beyond moore's law","authors":"P. Jansen, R. Venkatraman","doi":"10.1109/CICC.2015.7338473","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338473","url":null,"abstract":"This session presents state-of-the-art manufacturing processes beyond “Moore's Law”.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"40 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75746402","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Ultra-low power multi-channel data conversion with a single SAR ADC for mobile sensing applications 超低功耗多通道数据转换与一个单一的SAR ADC移动传感应用
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338492
Wenjuan Guo, Youngchun Kim, A. Tewfik, Nan Sun
Based on the recently emerging compressive sensing theory, the paper proposes an ultra-low power multichannel data conversion system whose architecture is almost as simple as a single SAR ADC. The proposed architecture is capable of simultaneously converting multi-channel sparse signals while running at the Nyquist rate of only one channel. A chip is fabricated in a 0.13μm CMOS process. Operating at 1MS/s, the SAR ADC itself achieves a 66dB SNDR and a 25fJ/step FoM at 0.8V. Using convex optimization methods, 4-channel 500kHz-bandwidth signals can be reconstructed with a 66dB peak SNDR and a 41% max occupancy, leading to an effective FoM per channel of 6.25 fJ/step.
基于近年来新兴的压缩感知理论,提出了一种超低功耗多通道数据转换系统,其结构几乎与单个SAR ADC一样简单。该架构能够在仅以一个信道的奈奎斯特速率运行的情况下同时转换多信道稀疏信号。该芯片采用0.13μm CMOS工艺制备。工作速度为1MS/s, SAR ADC本身在0.8V下实现66dB SNDR和25fJ/step FoM。采用凸优化方法,重构4通道500khz带宽信号,峰值SNDR为66dB,最大占用率为41%,每通道有效FoM为6.25 fJ/步。
{"title":"Ultra-low power multi-channel data conversion with a single SAR ADC for mobile sensing applications","authors":"Wenjuan Guo, Youngchun Kim, A. Tewfik, Nan Sun","doi":"10.1109/CICC.2015.7338492","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338492","url":null,"abstract":"Based on the recently emerging compressive sensing theory, the paper proposes an ultra-low power multichannel data conversion system whose architecture is almost as simple as a single SAR ADC. The proposed architecture is capable of simultaneously converting multi-channel sparse signals while running at the Nyquist rate of only one channel. A chip is fabricated in a 0.13μm CMOS process. Operating at 1MS/s, the SAR ADC itself achieves a 66dB SNDR and a 25fJ/step FoM at 0.8V. Using convex optimization methods, 4-channel 500kHz-bandwidth signals can be reconstructed with a 66dB peak SNDR and a 41% max occupancy, leading to an effective FoM per channel of 6.25 fJ/step.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"26 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82452969","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A 72μW, 2.4GHz, 11.7% tuning range, 212dBc/Hz FoM LC-VCO in 65nm CMOS 一个72μW, 2.4GHz, 11.7%调谐范围,212dBc/Hz的65纳米CMOS FoM LC-VCO
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338489
Joo-Myoung Kim, Jae-Seung Lee, Sun-a Kim, Taeik Kim, Hojin Park, Sang-Gug Lee
An ultra-low power and wide tuning range LC-VCO is presented, where the performances are improved by identifying and avoiding the Q-factor degradation factors in the LC-tank. By the positioning analysis and adoption of MIM capacitor arrays along with minimum size varactors, the proposed VCO with a high-Q inductor, implemented in a 65-nm CMOS technology, operates from 2.35GHz to 2.64GHz (11.7% tuning) with phase noise of -132.92 dBc/Hz at 1MHz offset while dissipating only 72μW from a 0.6-V supply. The FoM of the proposed VCO is 212dBc/Hz and the widest tuning range is shown in the high-Q oscillators.
提出了一种超低功耗、宽调谐范围的LC-VCO,通过识别和避免LC-tank中的q因子退化因素,提高了LC-VCO的性能。通过定位分析和采用MIM电容阵列和最小尺寸变容管,采用65纳米CMOS技术实现的带高q电感的压控振荡器工作频率为2.35GHz至2.64GHz(11.7%调谐),在1MHz偏移时相位噪声为-132.92 dBc/Hz,而在0.6 v电源下功耗仅为72μW。所提出的压控振荡器的频率为212dBc/Hz,最宽的调谐范围显示在高q振荡器中。
{"title":"A 72μW, 2.4GHz, 11.7% tuning range, 212dBc/Hz FoM LC-VCO in 65nm CMOS","authors":"Joo-Myoung Kim, Jae-Seung Lee, Sun-a Kim, Taeik Kim, Hojin Park, Sang-Gug Lee","doi":"10.1109/CICC.2015.7338489","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338489","url":null,"abstract":"An ultra-low power and wide tuning range LC-VCO is presented, where the performances are improved by identifying and avoiding the Q-factor degradation factors in the LC-tank. By the positioning analysis and adoption of MIM capacitor arrays along with minimum size varactors, the proposed VCO with a high-Q inductor, implemented in a 65-nm CMOS technology, operates from 2.35GHz to 2.64GHz (11.7% tuning) with phase noise of -132.92 dBc/Hz at 1MHz offset while dissipating only 72μW from a 0.6-V supply. The FoM of the proposed VCO is 212dBc/Hz and the widest tuning range is shown in the high-Q oscillators.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"21 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87023164","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A compressed-sensing sensor-on-chip incorporating statistics collection to improve reconstruction performance 一种压缩传感传感器芯片结合统计数据收集,以提高重建性能
Pub Date : 2015-11-30 DOI: 10.1109/CICC.2015.7338429
Vahid Behravan, S. Li, Neil E. Glover, Chia-Hung Chen, M. Shoaib, G. Temes, P. Chiang
Reconstructing signals accurately is a critical aspect of compressed sensing. We propose a compressed-sensing sensor-on-chip that compresses and also extracts key statistics of the input signal at sampling time. These statistics can be used at the receiver to significantly improve the accuracy of reconstruction. When compared against a conventional compressed-sensing system, our experimental measured results demonstrate an improvement of as much as 9-18 dB in the signal-to-error (SER) of the reconstructed signal, depending on input data type and compression factor.
准确地重建信号是压缩感知的一个关键方面。我们提出了一种压缩传感传感器芯片,它可以在采样时压缩和提取输入信号的关键统计信息。这些统计数据可以在接收机上使用,以显着提高重建的准确性。与传统的压缩传感系统相比,我们的实验测量结果表明,根据输入数据类型和压缩因子的不同,重构信号的信错比(SER)提高了9-18 dB。
{"title":"A compressed-sensing sensor-on-chip incorporating statistics collection to improve reconstruction performance","authors":"Vahid Behravan, S. Li, Neil E. Glover, Chia-Hung Chen, M. Shoaib, G. Temes, P. Chiang","doi":"10.1109/CICC.2015.7338429","DOIUrl":"https://doi.org/10.1109/CICC.2015.7338429","url":null,"abstract":"Reconstructing signals accurately is a critical aspect of compressed sensing. We propose a compressed-sensing sensor-on-chip that compresses and also extracts key statistics of the input signal at sampling time. These statistics can be used at the receiver to significantly improve the accuracy of reconstruction. When compared against a conventional compressed-sensing system, our experimental measured results demonstrate an improvement of as much as 9-18 dB in the signal-to-error (SER) of the reconstructed signal, depending on input data type and compression factor.","PeriodicalId":6665,"journal":{"name":"2015 IEEE Custom Integrated Circuits Conference (CICC)","volume":"35 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2015-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86271469","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
期刊
2015 IEEE Custom Integrated Circuits Conference (CICC)
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