Silicon radiation detectors, a special type of microelectronic sensor which plays a crucial role in many applications, are reviewed in this paper, focusing on fabrication aspects. After addressing the basic concepts and the main requirements, the evolution of detector technologies is discussed, which has been mainly driven by the ever-increasing demands for frontier scientific experiments.
{"title":"Silicon Radiation Detector Technologies: From Planar to 3D","authors":"G. Dalla Betta, Jixing Ye","doi":"10.3390/chips2020006","DOIUrl":"https://doi.org/10.3390/chips2020006","url":null,"abstract":"Silicon radiation detectors, a special type of microelectronic sensor which plays a crucial role in many applications, are reviewed in this paper, focusing on fabrication aspects. After addressing the basic concepts and the main requirements, the evolution of detector technologies is discussed, which has been mainly driven by the ever-increasing demands for frontier scientific experiments.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"45 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81785774","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Content-addressable memory (CAM) has been part of the memory market for more than five decades. CAM can carry out a single clock cycle lookup based on the content rather than an address. Thanks to this attractive feature, CAM is utilized in memory systems where a high-speed content lookup technique is required. However, typical CAM applications only support exact matching, as opposed to approximate matching, where a certain Hamming distance (several mismatching characters between a query pattern and the dataset stored in CAM) needs to be tolerated. Recent interest in approximate search has led to the development of new CAM-based alternatives, accelerating the processing of large data workloads in the realm of big data, genomics, and other data-intensive applications. In this review, we provide an overview of approximate CAM and describe its current and potential applications that would benefit from approximate search computing.
{"title":"Approximate Content-Addressable Memories: A Review","authors":"Esteban Garzón, L. Yavits, A. Teman, M. Lanuzza","doi":"10.3390/chips2020005","DOIUrl":"https://doi.org/10.3390/chips2020005","url":null,"abstract":"Content-addressable memory (CAM) has been part of the memory market for more than five decades. CAM can carry out a single clock cycle lookup based on the content rather than an address. Thanks to this attractive feature, CAM is utilized in memory systems where a high-speed content lookup technique is required. However, typical CAM applications only support exact matching, as opposed to approximate matching, where a certain Hamming distance (several mismatching characters between a query pattern and the dataset stored in CAM) needs to be tolerated. Recent interest in approximate search has led to the development of new CAM-based alternatives, accelerating the processing of large data workloads in the realm of big data, genomics, and other data-intensive applications. In this review, we provide an overview of approximate CAM and describe its current and potential applications that would benefit from approximate search computing.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"40 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-03-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90251456","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper reviews the state of the art on bandpass ΣΔ modulators (BP-ΣΔMs) intended to digitize radio frequency (RF) signals. A priori, this is the most direct way to implement software-defined radio (SDR) systems since the analog/digital interface is placed closer to the antenna, thus reducing the analog circuitry and doing most of the signal processing in the digital domain. In spite of their higher programmability and scalability, RF BP-ΣΔM analog-to-digital converters (ADCs) require more energy to operate in the GHz range as compared with their low-pass (LP) counterparts. This makes conventional direct conversion receivers (DCRs) the commonplace approach due to their overall smaller energy consumption. This paper surveys some circuits and systems techniques which can make RF ADCs and SDR-based transceivers more efficient and feasible to be embedded in mobile terminals.
{"title":"Bandpass Sigma–Delta Modulation: The Path toward RF-to-Digital Conversion in Software-Defined Radio","authors":"J. M. de la Rosa","doi":"10.3390/chips2010004","DOIUrl":"https://doi.org/10.3390/chips2010004","url":null,"abstract":"This paper reviews the state of the art on bandpass ΣΔ modulators (BP-ΣΔMs) intended to digitize radio frequency (RF) signals. A priori, this is the most direct way to implement software-defined radio (SDR) systems since the analog/digital interface is placed closer to the antenna, thus reducing the analog circuitry and doing most of the signal processing in the digital domain. In spite of their higher programmability and scalability, RF BP-ΣΔM analog-to-digital converters (ADCs) require more energy to operate in the GHz range as compared with their low-pass (LP) counterparts. This makes conventional direct conversion receivers (DCRs) the commonplace approach due to their overall smaller energy consumption. This paper surveys some circuits and systems techniques which can make RF ADCs and SDR-based transceivers more efficient and feasible to be embedded in mobile terminals.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"10 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88761842","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper presents a design methodology for a low-power, low-chip-area, and high-resolution successive approximations register (SAR) analog-to-digital converter (ADC). The proposed method includes a segmented capacitive DAC (C-DAC) to reduce the power consumption and the total area. An embedded self-calibration algorithm based on a set of trimming capacitors was applied alongside a dynamic element matching (DEM) procedure to control the inherent linearity issues caused by the process mismatch. The SAR ADC and each additional algorithm were modeled in MATLAB to show their efficiency. Finally, a simple methodology was developed to allow for the fast estimation of signal-to-noise ratios (SNRs) without any FFT calculation.
{"title":"Methodology for a Low-Power and Low-Circuit-Area 15-Bit SAR ADC Using Split-Capacitor Mismatch Compensation and a Dynamic Element Matching Algorithm","authors":"William Bontems, D. Dzahini","doi":"10.3390/chips2010003","DOIUrl":"https://doi.org/10.3390/chips2010003","url":null,"abstract":"This paper presents a design methodology for a low-power, low-chip-area, and high-resolution successive approximations register (SAR) analog-to-digital converter (ADC). The proposed method includes a segmented capacitive DAC (C-DAC) to reduce the power consumption and the total area. An embedded self-calibration algorithm based on a set of trimming capacitors was applied alongside a dynamic element matching (DEM) procedure to control the inherent linearity issues caused by the process mismatch. The SAR ADC and each additional algorithm were modeled in MATLAB to show their efficiency. Finally, a simple methodology was developed to allow for the fast estimation of signal-to-noise ratios (SNRs) without any FFT calculation.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"34 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-02-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82717447","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Nicola Russo, Haochun Huang, E. Donati, Thomas Madsen, K. Nikolic
Neuromorphic computing is promising to become a future standard in low-power AI applications. The integration between new neuromorphic hardware and traditional microcontrollers is an open challenge. In this paper, we present an interface board and a communication protocol that allows communication between different devices, using a microcontroller unit (Arduino Due) in the middle. Our compact printed circuit board (PCB) links different devices as a whole system and provides a power supply for the entire system using batteries as the power supply. Concretely, we have connected a Dynamic Vision Sensor (DVS128), SpiNNaker board and a servo motor, creating a platform for a neuromorphic robotic system controlled by a Spiking Neural Network, which is demonstrated on the task of intercepting incoming objects. The data rate of the implemented interface board is 24.64 k symbols/s and the latency for generating commands is about 11ms. The complete system is run only by batteries, making it very suitable for robotic applications.
神经形态计算有望成为低功耗人工智能应用的未来标准。新的神经形态硬件和传统微控制器之间的集成是一个开放的挑战。在本文中，我们提出了一个接口板和一个通信协议，允许不同设备之间的通信，中间使用微控制器单元(Arduino Due)。我们的紧凑型印刷电路板(PCB)将不同的设备连接成一个整体系统，并使用电池作为电源为整个系统提供电源。具体而言，我们将动态视觉传感器(DVS128)， SpiNNaker板和伺服电机连接在一起，创建了一个由spike神经网络控制的神经形态机器人系统平台，并在拦截传入物体的任务中进行了演示。实现的接口板的数据速率为24.64 k symbols/s，生成命令的延迟约为11ms。整个系统仅由电池驱动，因此非常适合机器人应用。
{"title":"An Interface Platform for Robotic Neuromorphic Systems","authors":"Nicola Russo, Haochun Huang, E. Donati, Thomas Madsen, K. Nikolic","doi":"10.3390/chips2010002","DOIUrl":"https://doi.org/10.3390/chips2010002","url":null,"abstract":"Neuromorphic computing is promising to become a future standard in low-power AI applications. The integration between new neuromorphic hardware and traditional microcontrollers is an open challenge. In this paper, we present an interface board and a communication protocol that allows communication between different devices, using a microcontroller unit (Arduino Due) in the middle. Our compact printed circuit board (PCB) links different devices as a whole system and provides a power supply for the entire system using batteries as the power supply. Concretely, we have connected a Dynamic Vision Sensor (DVS128), SpiNNaker board and a servo motor, creating a platform for a neuromorphic robotic system controlled by a Spiking Neural Network, which is demonstrated on the task of intercepting incoming objects. The data rate of the implemented interface board is 24.64 k symbols/s and the latency for generating commands is about 11ms. The complete system is run only by batteries, making it very suitable for robotic applications.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"53 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79407054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Luís Henrique Rodovalho, P. Toledo, F. Mir, Farshad Ebrahimi
Inverter-based Operational Transconductance Amplifiers (OTAs) are versatile and friendly scalable analog circuit blocks. Especially for the new CMOS technological nodes, several recent applications have been extensively using them, ranging from Analog Front End (AFE) to analog-to-digital converters (ADC). This work tracks down the current advances in inverter-based OTAs design, comparing their basic fully differential structures, such as Nauta (N), Barthelemy (B), Vieru (V) and Mafredini (M) ones, and, in addition, mixing them up to propose new fully differential single-ended and two-stage hybrid versions. The new herein-proposed fully differential hybrid OTAs are the composition of Barthelemy/Nauta (B/N), Barthelemy/Manfredini (B/M), Nauta/Vieru (N/V), and Manfredini/Vieru (M/V) OTAs. All OTAs were designed using the same Global Foundries 180 nm open-source PDK and their performances are compared for post-layout simulations.
{"title":"Hybrid Inverter-Based Fully Differential Operational Transconductance Amplifiers","authors":"Luís Henrique Rodovalho, P. Toledo, F. Mir, Farshad Ebrahimi","doi":"10.3390/chips2010001","DOIUrl":"https://doi.org/10.3390/chips2010001","url":null,"abstract":"Inverter-based Operational Transconductance Amplifiers (OTAs) are versatile and friendly scalable analog circuit blocks. Especially for the new CMOS technological nodes, several recent applications have been extensively using them, ranging from Analog Front End (AFE) to analog-to-digital converters (ADC). This work tracks down the current advances in inverter-based OTAs design, comparing their basic fully differential structures, such as Nauta (N), Barthelemy (B), Vieru (V) and Mafredini (M) ones, and, in addition, mixing them up to propose new fully differential single-ended and two-stage hybrid versions. The new herein-proposed fully differential hybrid OTAs are the composition of Barthelemy/Nauta (B/N), Barthelemy/Manfredini (B/M), Nauta/Vieru (N/V), and Manfredini/Vieru (M/V) OTAs. All OTAs were designed using the same Global Foundries 180 nm open-source PDK and their performances are compared for post-layout simulations.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"68 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84172903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper presents an ultra-low power CMOS voltage reference which operates in the subthreshold region. Modified from the conventional 2T circuit, the proposed circuit is capable of generating higher output voltage by using the resistor subdivision. The design comprises a negative-threshold native NMOS transistor as the current generator, a high-threshold PMOS transistor as the active load and an active voltage doubling network to generate the reference voltage. Implemented in TSMC 40 nm CMOS technology, the proposed circuit operates at a minimum supply of 0.65 V and consumes 5.5 nA. Under one sample simulation, the obtained T.C. is 16.64 ppm/°C and the nominal Vref is 489.6 mV (75.3% of Vddmin) for the temperature range from −20 °C to 80 °C. For Monte-Carlo simulation of 200 samples at room temperature, the average output voltage is 488 mV and the average T.C. is 29.6 ppm/°C whilst with the standard deviation of 13.26 ppm/°C. Finally, at room temperature, the proposed voltage reference has achieved a process sensitivity (σ/μ) of 3.9%, a line sensitivity of 0.51%/V and a power supply rejection of −45.5 dB and −76.3 dB at 100 kHz and 100 MHz. Compared to the representative prior-art works realized in the same technology and a similar supply current, the proposed circuit has offered the best 1-sampe T.C., the best average T.C. in multiple samples, the highest output voltage, the maximum output voltage per minimum supply voltage and the lowest process sensitivity in the output, Vref.
{"title":"A CMOS Voltage Reference with Output Voltage Doubling Using Modified 2T Topology","authors":"Junyao Li, P. K. Chan","doi":"10.3390/chips1030015","DOIUrl":"https://doi.org/10.3390/chips1030015","url":null,"abstract":"This paper presents an ultra-low power CMOS voltage reference which operates in the subthreshold region. Modified from the conventional 2T circuit, the proposed circuit is capable of generating higher output voltage by using the resistor subdivision. The design comprises a negative-threshold native NMOS transistor as the current generator, a high-threshold PMOS transistor as the active load and an active voltage doubling network to generate the reference voltage. Implemented in TSMC 40 nm CMOS technology, the proposed circuit operates at a minimum supply of 0.65 V and consumes 5.5 nA. Under one sample simulation, the obtained T.C. is 16.64 ppm/°C and the nominal Vref is 489.6 mV (75.3% of Vddmin) for the temperature range from −20 °C to 80 °C. For Monte-Carlo simulation of 200 samples at room temperature, the average output voltage is 488 mV and the average T.C. is 29.6 ppm/°C whilst with the standard deviation of 13.26 ppm/°C. Finally, at room temperature, the proposed voltage reference has achieved a process sensitivity (σ/μ) of 3.9%, a line sensitivity of 0.51%/V and a power supply rejection of −45.5 dB and −76.3 dB at 100 kHz and 100 MHz. Compared to the representative prior-art works realized in the same technology and a similar supply current, the proposed circuit has offered the best 1-sampe T.C., the best average T.C. in multiple samples, the highest output voltage, the maximum output voltage per minimum supply voltage and the lowest process sensitivity in the output, Vref.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"13 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76078073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This Communication reports on FPGA prototyping of an embedded web service that sends XML messages under two different packages, namely Simple Object Access Protocol (SOAP) and Representational State Transfer (REST). The request and response messages are communicated through a 100 Mbps local area network between a Spartan-3E FPGA board and washing machine simulator. The performances of REST-based and SOAP-based web services implemented on reconfigurable hardware are then compared. In general, the former performs better than the latter in terms of FPGA resource utilization (~12% less), message length (~57% shorter), and processing time (~4.5 μs faster). This work confirms the superiority of REST over SOAP for data transmission using reconfigurable computing, which paves the way for adoption of these low-cost systems for web services of consumer electronics such as home appliances.
{"title":"FPGA Prototyping of Web Service Using REST and SOAP Packages","authors":"Chee Er Chang, A. K. Mustapha, F. Mohd-Yasin","doi":"10.3390/chips1030014","DOIUrl":"https://doi.org/10.3390/chips1030014","url":null,"abstract":"This Communication reports on FPGA prototyping of an embedded web service that sends XML messages under two different packages, namely Simple Object Access Protocol (SOAP) and Representational State Transfer (REST). The request and response messages are communicated through a 100 Mbps local area network between a Spartan-3E FPGA board and washing machine simulator. The performances of REST-based and SOAP-based web services implemented on reconfigurable hardware are then compared. In general, the former performs better than the latter in terms of FPGA resource utilization (~12% less), message length (~57% shorter), and processing time (~4.5 μs faster). This work confirms the superiority of REST over SOAP for data transmission using reconfigurable computing, which paves the way for adoption of these low-cost systems for web services of consumer electronics such as home appliances.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"56 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73412749","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The endurability of solder joints in the ball-grid array (BGA) packaging is crucial to the functioning of the microelectronic system. To improve electronic packaging reliability, this paper is dedicated to numerically optimize solder joint array configuration and study the influence of multi-physical fields on solder joint reliability. The uniqueness of this study is that on the basis of temperature field and stress field, the electric field is added to realize the coupling simulation of three physical fields. In addition, the “Open Angle” is mathematically defined to describe the array configuration, and it was used to reveal the influence factors of solder joint fatigue, including stress, temperature, and current density. In the single solder joint model, the impacts of geometric shape and working conditions on the maximum value and distribution of these evaluation factors (stress, temperature, and current density) were investigated. Overall, the numerical investigation gives the optimal configuration, geometric shape, and working condition of solder joints, which benefits the design of endurable and efficient BGA packaging.
{"title":"Multi-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging","authors":"Boyan Yu, Yi Gao","doi":"10.3390/chips1030013","DOIUrl":"https://doi.org/10.3390/chips1030013","url":null,"abstract":"The endurability of solder joints in the ball-grid array (BGA) packaging is crucial to the functioning of the microelectronic system. To improve electronic packaging reliability, this paper is dedicated to numerically optimize solder joint array configuration and study the influence of multi-physical fields on solder joint reliability. The uniqueness of this study is that on the basis of temperature field and stress field, the electric field is added to realize the coupling simulation of three physical fields. In addition, the “Open Angle” is mathematically defined to describe the array configuration, and it was used to reveal the influence factors of solder joint fatigue, including stress, temperature, and current density. In the single solder joint model, the impacts of geometric shape and working conditions on the maximum value and distribution of these evaluation factors (stress, temperature, and current density) were investigated. Overall, the numerical investigation gives the optimal configuration, geometric shape, and working condition of solder joints, which benefits the design of endurable and efficient BGA packaging.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74609586","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this work, we present a compact “adaptive downsampling” method that mitigates the nonlinearity problems associated with FPGA-based TDCs that utilize delay lines. Additionally, this generic method allows for trade-offs between resolution, linearity, and resource utilization. Since nonlinearity is one of the predominant issues regarding delay lines in FPGA-based TDCs, combined with the fact that delay lines are utilized for a wide range of TDC architectures (not limited to the delay-line TDC), other implementations (e.g., Vernier or wave union TDCs), also in different FPGA devices, can directly benefit from the proposed adaptive method, with no need for either custom routing or complex tuning of the converter. Furthermore, implementation-related challenges regarding clock skew, measurement uncertainty, and the placement of the TDC are discussed and we also propose an experimental setup that utilizes only FPGA resources in order to characterize the converter. Although the TDC in this work was implemented in a Xilinx Virtex-6 device and was characterized under different operational modes, we successfully optimized the converter’s nonlinearity and resource utilization while retaining single-shot precision. The best performing (in terms of linearity) implementation reached DNLrms and INLrms values of 0.30 LSB and 0.45 LSB, respectively, and the single-shot precision (σ) was 9.0 ps.
{"title":"An Adaptive Downsampling FPGA-Based TDC Implementation for Time Measurement Improvement","authors":"Evangelos Dikopoulos, M. Birbas, A. Birbas","doi":"10.3390/chips1030012","DOIUrl":"https://doi.org/10.3390/chips1030012","url":null,"abstract":"In this work, we present a compact “adaptive downsampling” method that mitigates the nonlinearity problems associated with FPGA-based TDCs that utilize delay lines. Additionally, this generic method allows for trade-offs between resolution, linearity, and resource utilization. Since nonlinearity is one of the predominant issues regarding delay lines in FPGA-based TDCs, combined with the fact that delay lines are utilized for a wide range of TDC architectures (not limited to the delay-line TDC), other implementations (e.g., Vernier or wave union TDCs), also in different FPGA devices, can directly benefit from the proposed adaptive method, with no need for either custom routing or complex tuning of the converter. Furthermore, implementation-related challenges regarding clock skew, measurement uncertainty, and the placement of the TDC are discussed and we also propose an experimental setup that utilizes only FPGA resources in order to characterize the converter. Although the TDC in this work was implemented in a Xilinx Virtex-6 device and was characterized under different operational modes, we successfully optimized the converter’s nonlinearity and resource utilization while retaining single-shot precision. The best performing (in terms of linearity) implementation reached DNLrms and INLrms values of 0.30 LSB and 0.45 LSB, respectively, and the single-shot precision (σ) was 9.0 ps.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"41 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90495860","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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