Pub Date : 2015-08-01DOI: 10.1109/HOTCHIPS.2015.7477466
R. Shirani, R. Farjad-Rad
This article consists of a collection of slides from the authors' conference presentation. The ever growing data requirements in the cloud and mobility are creating a bandwidth constraint in global IT infrastructure. In 2012, Aquantia focused on adding 2.5G/5G speeds on Cat5e/Cat6 Links to address the next generation wireless access bottleneck. Aquantia's five speed ICs (single, dual, and quad) are the only commercially available NBASE-T compliant ICs since 2013. Five speed ICs from Aquantia has been shipping in large volumes in all major switch and AP platforms since 2014.
{"title":"10G | 5G | 2.5G | 1G | 100M physical layer PHY: HOT CHIPS 2015 conference","authors":"R. Shirani, R. Farjad-Rad","doi":"10.1109/HOTCHIPS.2015.7477466","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477466","url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. The ever growing data requirements in the cloud and mobility are creating a bandwidth constraint in global IT infrastructure. In 2012, Aquantia focused on adding 2.5G/5G speeds on Cat5e/Cat6 Links to address the next generation wireless access bottleneck. Aquantia's five speed ICs (single, dual, and quad) are the only commercially available NBASE-T compliant ICs since 2013. Five speed ICs from Aquantia has been shipping in large volumes in all major switch and AP platforms since 2014.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"34 1","pages":"1-27"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85045484","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-08-01DOI: 10.1109/HOTCHIPS.2015.7477326
May Wu, R. Iyer, Y. Hoskote, Steven Zhang, J. Zamora-Esquivel, German Fabila Garcia, Ilya V. Klotchkov, Mukesh Bhartiya
{"title":"Design of a low power SoC testchip for wearables and IoTs","authors":"May Wu, R. Iyer, Y. Hoskote, Steven Zhang, J. Zamora-Esquivel, German Fabila Garcia, Ilya V. Klotchkov, Mukesh Bhartiya","doi":"10.1109/HOTCHIPS.2015.7477326","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477326","url":null,"abstract":"","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"30 1","pages":"1-27"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90920183","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-08-01DOI: 10.1109/HOTCHIPS.2015.7477323
A. Olofsson
This article consists of a collection of slides from the author's conference presentation. What is Software Defined Radio? (SDR) "Radio in which some or all of the physical layer functions are software defined" -- Wireless Innovation Forum.
{"title":"Implementing software defined radio on the paralella","authors":"A. Olofsson","doi":"10.1109/HOTCHIPS.2015.7477323","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477323","url":null,"abstract":"This article consists of a collection of slides from the author's conference presentation. What is Software Defined Radio? (SDR) \"Radio in which some or all of the physical layer functions are software defined\" -- Wireless Innovation Forum.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"36 1","pages":"1-32"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86788562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-08-01DOI: 10.1109/HOTCHIPS.2015.7477469
Yunsup Lee, B. Zimmer, Andrew Waterman, A. Puggelli, Jaehwa Kwak, R. Jevtic, Ben Keller, Stevo Bailey, Milovan Blagojevic, P. Chiu, Henry Cook, Rimas Avizienis, B. Richards, E. Alon, B. Nikolić, K. Asanović
This article consists of a collection of slides from the authors' conference presentation. The topics discussed included: Motivation/Raven Project Goals; On-Chip Switched Capacitor DC-DC Converters; Raven3 Chip Architecture; Raven3 Implementation; Raven3 Evaluation; and RISC-V Chip Building at UC Berkeley.
{"title":"Raven: A 28nm RISC-V vector processor with integrated switched-capacitor DC-DC converters and adaptive clocking","authors":"Yunsup Lee, B. Zimmer, Andrew Waterman, A. Puggelli, Jaehwa Kwak, R. Jevtic, Ben Keller, Stevo Bailey, Milovan Blagojevic, P. Chiu, Henry Cook, Rimas Avizienis, B. Richards, E. Alon, B. Nikolić, K. Asanović","doi":"10.1109/HOTCHIPS.2015.7477469","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477469","url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. The topics discussed included: Motivation/Raven Project Goals; On-Chip Switched Capacitor DC-DC Converters; Raven3 Chip Architecture; Raven3 Implementation; Raven3 Evaluation; and RISC-V Chip Building at UC Berkeley.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"27 1","pages":"1-45"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85342540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-08-01DOI: 10.1109/HOTCHIPS.2015.7477327
B. Calhoun, D. Wentzloff
This article consists of a collection of slides from the authors' conference presentation. One Trillion IoT devices can ONLY happen WITHOUT batteries.
本文由作者在会议上演讲的幻灯片集合组成。一万亿物联网设备只有在没有电池的情况下才能运行。
{"title":"Ultra-low power wireless SoCs enabling a batteryless IoT","authors":"B. Calhoun, D. Wentzloff","doi":"10.1109/HOTCHIPS.2015.7477327","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477327","url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. One Trillion IoT devices can ONLY happen WITHOUT batteries.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"57 1","pages":"1-45"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77905139","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-08-01DOI: 10.1109/HOTCHIPS.2015.7477476
Gyeonghoon Kim, H. Yoo
This article consists of a single slide from the authors' conference presentation. Topics covered include: hardware requirements of augmented reality in smart glasses systems; algorithm-hardware mapping and network congestion problem; neural network scheduler for 2-D-mesh network-on-chip; and chip and smart glass system implementation.
{"title":"A low-power and real-time augmented reality processor for the next generation smart glasses","authors":"Gyeonghoon Kim, H. Yoo","doi":"10.1109/HOTCHIPS.2015.7477476","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477476","url":null,"abstract":"This article consists of a single slide from the authors' conference presentation. Topics covered include: hardware requirements of augmented reality in smart glasses systems; algorithm-hardware mapping and network congestion problem; neural network scheduler for 2-D-mesh network-on-chip; and chip and smart glass system implementation.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"1 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84053351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-08-01DOI: 10.1109/HOTCHIPS.2015.7477465
Zhimin Ding
This article consists of a collection of slides from the author's conference presentation. Summary: Ultra-low-light CMOS biosensor enables compact and low-cost instrumentation for point-of-care molecular diagnostics. Future plan: 1. Further miniaturization of opto system - Smaller camera system for mobile integration - Direct coating and patterning of thin film filters on chip to achieve truly single chip multi-channel fluorescent imaging; 2. Create high speed variation of the chip - Targeting cell sorting and cancer screening application; 3. Further refinement of integrated opto-thermal-fluidic system platform - For handheld sample-to-answer MDx system.
{"title":"Ultra-low-light CMOS biosensor helps tackle infectious diseases","authors":"Zhimin Ding","doi":"10.1109/HOTCHIPS.2015.7477465","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477465","url":null,"abstract":"This article consists of a collection of slides from the author's conference presentation. Summary: Ultra-low-light CMOS biosensor enables compact and low-cost instrumentation for point-of-care molecular diagnostics. Future plan: 1. Further miniaturization of opto system - Smaller camera system for mobile integration - Direct coating and patterning of thin film filters on chip to achieve truly single chip multi-channel fluorescent imaging; 2. Create high speed variation of the chip - Targeting cell sorting and cancer screening application; 3. Further refinement of integrated opto-thermal-fluidic system platform - For handheld sample-to-answer MDx system.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"64 1","pages":"1-23"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74321008","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-08-01DOI: 10.1109/HOTCHIPS.2015.7477475
Suk-Jeong Kim, Young-Hwan Park, Jaehyun Kim, Minsoo Kim, Wonchang Lee, Shihwa Lee
This article consists of one slide from the authors' conference presentation. The Samsung Reconfigurable Processor is Samsung's proprietary DSP processor since 2005.
本文由作者会议演讲中的一张幻灯片组成。三星可重构处理器是三星自2005年以来的专有DSP处理器。
{"title":"Flexible video processing platform for 8K UHD TV","authors":"Suk-Jeong Kim, Young-Hwan Park, Jaehyun Kim, Minsoo Kim, Wonchang Lee, Shihwa Lee","doi":"10.1109/HOTCHIPS.2015.7477475","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477475","url":null,"abstract":"This article consists of one slide from the authors' conference presentation. The Samsung Reconfigurable Processor is Samsung's proprietary DSP processor since 2005.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"46 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79504203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-08-01DOI: 10.1109/HOTCHIPS.2015.7477461
Joe Macri
This article consists of a collection of slides from the authors' conference presentation. Some of the topics discussed include: Overview of AMD Radeon R9 Fury; Why HBM and Die Stacking; The Journey to Fury; Performance; Form Factor Innovation.
{"title":"AMD's next generation GPU and high bandwidth memory architecture: FURY","authors":"Joe Macri","doi":"10.1109/HOTCHIPS.2015.7477461","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2015.7477461","url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. Some of the topics discussed include: Overview of AMD Radeon R9 Fury; Why HBM and Die Stacking; The Journey to Fury; Performance; Form Factor Innovation.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"15 1","pages":"1-26"},"PeriodicalIF":0.0,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72897475","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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