Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810154
M. Kisić, N. Blaz, L. Zivanov, M. Damnjanović
In this paper a simple capacitive sensor for measuring force is presented. The sensor consists of three parts: the casing with the bottom electrode, the flexible central part and the upper plate with the electrode. An additive 3D printing technology with PLA and silver conductive ink are used for the fabrication of sensor. In order to provide a good sensitivity of the sensor to the applied force a silicone rubber is used as the central part between the electrodes. Dielectric properties of used silicone rubber are determined; the designed sensor is fabricated, and testing of the sensor is performed. The measurement results are shown and confirmed that designed sensor is suitable for the force measurements up to 4 N The measured sensitivity of the sensor is 0.3 pFIN in the measurement range from 0.5 N up to 3.5 N
{"title":"Capacitive Force Sensor Fabricated in Additive Technology","authors":"M. Kisić, N. Blaz, L. Zivanov, M. Damnjanović","doi":"10.1109/ISSE.2019.8810154","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810154","url":null,"abstract":"In this paper a simple capacitive sensor for measuring force is presented. The sensor consists of three parts: the casing with the bottom electrode, the flexible central part and the upper plate with the electrode. An additive 3D printing technology with PLA and silver conductive ink are used for the fabrication of sensor. In order to provide a good sensitivity of the sensor to the applied force a silicone rubber is used as the central part between the electrodes. Dielectric properties of used silicone rubber are determined; the designed sensor is fabricated, and testing of the sensor is performed. The measurement results are shown and confirmed that designed sensor is suitable for the force measurements up to 4 N The measured sensitivity of the sensor is 0.3 pFIN in the measurement range from 0.5 N up to 3.5 N","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"30 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73377057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810277
J. Hlina, J. Řeboun, A. Hamácek
This paper is focused on the properties of Thick Printed Copper (TPC)films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The thickness of TPC films has a significant influence on the electrical, mechanical and thermal properties of these films. The changes in these properties depending on the thickness of TPC films are described in this paper.
{"title":"Properties of Thick Printed Copper Films on Alumina Substrates","authors":"J. Hlina, J. Řeboun, A. Hamácek","doi":"10.1109/ISSE.2019.8810277","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810277","url":null,"abstract":"This paper is focused on the properties of Thick Printed Copper (TPC)films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The thickness of TPC films has a significant influence on the electrical, mechanical and thermal properties of these films. The changes in these properties depending on the thickness of TPC films are described in this paper.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"54 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78851361","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810306
P. Veselý, K. Dušek, A. Stankova
The intermetallic compounds growth at the interface between the eutectic solder Bi58Sn42 and the copper soldering pad was examined in dependence on the temperature profile selection that was expressed by a heating factor (combined influence of time and temperature above the melting point of the solder alloy). Eight temperature profiles were used for reflow soldering. In contrast to other studies, almost the identical value of the heating factor was achieved by the different shapes of the profiles in order to evaluate the effect of the whole profile shape. Consequently, the metallographic cross-sections of the solder joints were analyzed by scanning electron microscopy. Additionally, the shear strength test of solder joints and the transition resistance measurement were conducted. As expected, the intermetallic layer thickness increased with an increasing heating factor, but a different thickness was observed for the identical heating factor when the whole shape of temperature profile including the preheating phase was changed. On the other hand, the prediction of IMC growth based on heating factor can be used in situations, where only the melting phase varies and the preheating remains constant - but the influence of the heating factor on intermetallic layer thickness cannot be generally formulated for a specific solder alloy due to a strong dependence on the flux.
{"title":"Evaluation of Bismuth/Tin Solder Intermetallic Layers Based on Heating Factor","authors":"P. Veselý, K. Dušek, A. Stankova","doi":"10.1109/ISSE.2019.8810306","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810306","url":null,"abstract":"The intermetallic compounds growth at the interface between the eutectic solder Bi58Sn42 and the copper soldering pad was examined in dependence on the temperature profile selection that was expressed by a heating factor (combined influence of time and temperature above the melting point of the solder alloy). Eight temperature profiles were used for reflow soldering. In contrast to other studies, almost the identical value of the heating factor was achieved by the different shapes of the profiles in order to evaluate the effect of the whole profile shape. Consequently, the metallographic cross-sections of the solder joints were analyzed by scanning electron microscopy. Additionally, the shear strength test of solder joints and the transition resistance measurement were conducted. As expected, the intermetallic layer thickness increased with an increasing heating factor, but a different thickness was observed for the identical heating factor when the whole shape of temperature profile including the preheating phase was changed. On the other hand, the prediction of IMC growth based on heating factor can be used in situations, where only the melting phase varies and the preheating remains constant - but the influence of the heating factor on intermetallic layer thickness cannot be generally formulated for a specific solder alloy due to a strong dependence on the flux.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"26 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72727423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810205
Thomas Ackstaller, L. Lorenz, K. Nieweglowski, K. Bock
In order to build high performance 3D-Opto-mechatronic integrated device packages, we demonstrate the direct stereolithographic printing of polymeric resins onto ceramic substrate. The effects of adhesion are examined, the lower size limit for structures is found and the adhesion strength is measured. With the results a suitable combination of materials can be chosen for creating a hybrid package for a 3D-Opto-mechatronic integrated device. A prototype of an optical coupler is printed successfully and shows one possible application.
{"title":"Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices","authors":"Thomas Ackstaller, L. Lorenz, K. Nieweglowski, K. Bock","doi":"10.1109/ISSE.2019.8810205","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810205","url":null,"abstract":"In order to build high performance 3D-Opto-mechatronic integrated device packages, we demonstrate the direct stereolithographic printing of polymeric resins onto ceramic substrate. The effects of adhesion are examined, the lower size limit for structures is found and the adhesion strength is measured. With the results a suitable combination of materials can be chosen for creating a hybrid package for a 3D-Opto-mechatronic integrated device. A prototype of an optical coupler is printed successfully and shows one possible application.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"50 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74639969","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810179
S. Aleksic, N. Mitrović, M. Lukovic, N. Blaz, Snezana G. Lukovic, L. Zivanov
A new uniaxial heat loss anemometer was formed using the NTC thick film segmented thermistors with reduced dimensions. The thermistors where printed of modified nickel-manganite paste and sintered at 850 °C/10 min in the conveyor furnace. The uniaxial anemometer was formed using segmented thermistor as a heater/sensor and the housing made of thermo-insulating material; the thermistor was placed in the cylindrical cavity of the housing along the main axis. After that, segmented thermistor was self-heated at constant DC voltages in power save regime. The thermistor power save regime was introduced using duty cycle ratio 30 s/300 s (thermistor self-heating/cooling period). The constant DC voltages were changed in steps related to the air temperature sub-ranges. The thermistor self-heating current I30 in 30th second of the cycle was measured as a response to wind velocity at different angles of wind blowing and at different air temperatures (calibration curves). The use of reductors enabled moderate slope of calibration curves and extended measuring range. The properties of the new anemometer were compared with the other heat loss anemometers and digital vane-type anemometers.
{"title":"Uniaxial Heat Loss Anemometer in Power Save Regime","authors":"S. Aleksic, N. Mitrović, M. Lukovic, N. Blaz, Snezana G. Lukovic, L. Zivanov","doi":"10.1109/ISSE.2019.8810179","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810179","url":null,"abstract":"A new uniaxial heat loss anemometer was formed using the NTC thick film segmented thermistors with reduced dimensions. The thermistors where printed of modified nickel-manganite paste and sintered at 850 °C/10 min in the conveyor furnace. The uniaxial anemometer was formed using segmented thermistor as a heater/sensor and the housing made of thermo-insulating material; the thermistor was placed in the cylindrical cavity of the housing along the main axis. After that, segmented thermistor was self-heated at constant DC voltages in power save regime. The thermistor power save regime was introduced using duty cycle ratio 30 s/300 s (thermistor self-heating/cooling period). The constant DC voltages were changed in steps related to the air temperature sub-ranges. The thermistor self-heating current I30 in 30th second of the cycle was measured as a response to wind velocity at different angles of wind blowing and at different air temperatures (calibration curves). The use of reductors enabled moderate slope of calibration curves and extended measuring range. The properties of the new anemometer were compared with the other heat loss anemometers and digital vane-type anemometers.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"66 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73967502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810305
Steffen Bickel, K. Meier, M. Roellig, K. Bock
The demand for power electronic packages is constantly growing. With an increasing power loss of electrical components, the thermal performance of is gaining more attention on the PCB-level. The application of relatively thick Cu cores in PCB modules is beneficial with respect to high levels of ampacity and heat dissipation. Applicable PCB designs require a more or less complex structure and/or arrangement of several cores. For instance, gaps between several Cu cores are demanded for highvoltage applications, while cavities may be of a certain advantage when additional components need to be integrated on a high level. In our work, we investigated the reliability using repeated thermal shocks of PCB test vehicles featuring cavities within Cu cores of 2 mm thickness. After 1000 cycles the specimens do not show any significant damage which may result in an operational failure. Additionally, we investigated deliberately introduced defects at the Cu-resin interface by means of thermography.
{"title":"Manufacturing and Reliability Issues of Highly Integrated Packages for Power Electronic Applications","authors":"Steffen Bickel, K. Meier, M. Roellig, K. Bock","doi":"10.1109/ISSE.2019.8810305","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810305","url":null,"abstract":"The demand for power electronic packages is constantly growing. With an increasing power loss of electrical components, the thermal performance of is gaining more attention on the PCB-level. The application of relatively thick Cu cores in PCB modules is beneficial with respect to high levels of ampacity and heat dissipation. Applicable PCB designs require a more or less complex structure and/or arrangement of several cores. For instance, gaps between several Cu cores are demanded for highvoltage applications, while cavities may be of a certain advantage when additional components need to be integrated on a high level. In our work, we investigated the reliability using repeated thermal shocks of PCB test vehicles featuring cavities within Cu cores of 2 mm thickness. After 1000 cycles the specimens do not show any significant damage which may result in an operational failure. Additionally, we investigated deliberately introduced defects at the Cu-resin interface by means of thermography.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"14 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77542553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810300
T. Tichý, O. Šefl, P. Veselý, Tomáš Cápal
The aim of this work was to evaluate the use of FFF (Fused Filament Fabrication) technology in high and medium voltage applications. The research is based on previous work, where the dependence of dielectric strength of 3D printed objects on printing resolution (the thickness of one layer) was examined. Four polymer materials designated for FFF were chosen for the experiments - ABS (acrylonitrile butadiene styrene), PET-G (polyethylene terephthalate - glycol modified), ASA (acrilonitrile styren acrylate) and PP (polypropylene). The following tests of the printed samples from such materials were conducted - atmospheric impulse test with positive polarity, short-term AC and DC breakdown strength tests and measurement of partial discharges. Based on acquired results, the optimal material for unipolar stresses (DC and impulse) is PP, whereas for bipolar stresses it is a close match between ABS and PET-G. For systems in which all three types of stresses occur, ASA seems to be the best compromise. Although the dielectric strength of the examined 3D structures is sufficient, an improvement of these materials would be proper, for example by adding admixtures to the base materials or better printing quality.
{"title":"Application Possibilities of Fused Filament Fabrication Technology for High-Voltage and Medium-Voltage Insulation Systems","authors":"T. Tichý, O. Šefl, P. Veselý, Tomáš Cápal","doi":"10.1109/ISSE.2019.8810300","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810300","url":null,"abstract":"The aim of this work was to evaluate the use of FFF (Fused Filament Fabrication) technology in high and medium voltage applications. The research is based on previous work, where the dependence of dielectric strength of 3D printed objects on printing resolution (the thickness of one layer) was examined. Four polymer materials designated for FFF were chosen for the experiments - ABS (acrylonitrile butadiene styrene), PET-G (polyethylene terephthalate - glycol modified), ASA (acrilonitrile styren acrylate) and PP (polypropylene). The following tests of the printed samples from such materials were conducted - atmospheric impulse test with positive polarity, short-term AC and DC breakdown strength tests and measurement of partial discharges. Based on acquired results, the optimal material for unipolar stresses (DC and impulse) is PP, whereas for bipolar stresses it is a close match between ABS and PET-G. For systems in which all three types of stresses occur, ASA seems to be the best compromise. Although the dielectric strength of the examined 3D structures is sufficient, an improvement of these materials would be proper, for example by adding admixtures to the base materials or better printing quality.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"19 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81487088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810258
Matvieieva Nataliia, M. Schulze, Lili Chen, I. Patsora, H. Heuer
The carbon fiber reinforced polymers are widely used in the different branches of industry, which requires reliable, non-destructive and fast quality control method. Among existed non-destructive methods, the high-frequency eddy current method satisfies these requirements and widely used for quality control of the carbon fiber composites. Here, we propose a novel method for depth detection, which is based on utilization of multi-sensor techniques. The last based on the combination of the different electromagnetic sensors penetrating different depth in composite with the next signals processing and evaluation. Based on this technique, we preform both experimental and numerical study of the proposed concept.
{"title":"Multi-Sensor High-Frequency Eddy Current Depth Detection in Carbon Fiber Reinforced Polymers","authors":"Matvieieva Nataliia, M. Schulze, Lili Chen, I. Patsora, H. Heuer","doi":"10.1109/ISSE.2019.8810258","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810258","url":null,"abstract":"The carbon fiber reinforced polymers are widely used in the different branches of industry, which requires reliable, non-destructive and fast quality control method. Among existed non-destructive methods, the high-frequency eddy current method satisfies these requirements and widely used for quality control of the carbon fiber composites. Here, we propose a novel method for depth detection, which is based on utilization of multi-sensor techniques. The last based on the combination of the different electromagnetic sensors penetrating different depth in composite with the next signals processing and evaluation. Based on this technique, we preform both experimental and numerical study of the proposed concept.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"25 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89591723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810149
Elie Badine, M. Bardoux, N. Abboud, A. H. Sahraoui, Z. Herro
A three-dimensional heat conduction model is presented, coupled with a frequency-domain thermoreflectance measuring bench. The combination of these tools makes it possible to determine the thermal properties of thin film materials deposited on thick substrates, for a wide range of thermal conductivity and diffusivity. We give an example of experimental determination of the properties of a gold layer, the results of which are compared to the literature. We then present a sensitivity study using simulations for a 200 nm thin layer of polylactic acid, deposited on a silicone substrate and covered by 100 nm of gold.
{"title":"Measurement of Thermal Properties and Interface Thermal Resistance of Thin Films by Thermoreflectance","authors":"Elie Badine, M. Bardoux, N. Abboud, A. H. Sahraoui, Z. Herro","doi":"10.1109/ISSE.2019.8810149","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810149","url":null,"abstract":"A three-dimensional heat conduction model is presented, coupled with a frequency-domain thermoreflectance measuring bench. The combination of these tools makes it possible to determine the thermal properties of thin film materials deposited on thick substrates, for a wide range of thermal conductivity and diffusivity. We give an example of experimental determination of the properties of a gold layer, the results of which are compared to the literature. We then present a sensitivity study using simulations for a 200 nm thin layer of polylactic acid, deposited on a silicone substrate and covered by 100 nm of gold.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"24 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74034178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810232
A. Pietrikova, S. Žuk, I. Vehec
In this paper, characterization of sensitive contact-less coplanar capacitive liquid level sensors realized by polymer thick film technology is presented. It was found out that polymer thick film coplanar capacitive sensors are suitable for use in liquid level sensing application realized by contactless sensing method. Principle of measurement by using contact-less capacitive sensing method and performance of realized liquid level sensors are described in this paper. Design optimization of various geometric dimension of comb sensor structures was compared and analyzed for easy construction of very sensitive contact-less coplanar capacitive liquid level sensor. Thick film coplanar capacitive sensor is suitable, cost effective and reusable alternative for contact-less level measurement of various liquids with different dielectric constant.
{"title":"Coplanar Capacitive Liquid Level Sensor","authors":"A. Pietrikova, S. Žuk, I. Vehec","doi":"10.1109/ISSE.2019.8810232","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810232","url":null,"abstract":"In this paper, characterization of sensitive contact-less coplanar capacitive liquid level sensors realized by polymer thick film technology is presented. It was found out that polymer thick film coplanar capacitive sensors are suitable for use in liquid level sensing application realized by contactless sensing method. Principle of measurement by using contact-less capacitive sensing method and performance of realized liquid level sensors are described in this paper. Design optimization of various geometric dimension of comb sensor structures was compared and analyzed for easy construction of very sensitive contact-less coplanar capacitive liquid level sensor. Thick film coplanar capacitive sensor is suitable, cost effective and reusable alternative for contact-less level measurement of various liquids with different dielectric constant.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"23 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73270830","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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