Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810308
J. Skácel, A. Otáhal, I. Szendiuch
This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscophy.
{"title":"Influence of Electric Current at Solidification of Solder","authors":"J. Skácel, A. Otáhal, I. Szendiuch","doi":"10.1109/ISSE.2019.8810308","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810308","url":null,"abstract":"This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscophy.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"68 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72583975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810309
D. Michal, Stanislav Suchý, Josef Slauf, J. Řeboun, R. Soukup
With the growing Smart Textile industry, there is currently increasing interest in mapping the possibilities and quality of contacting embroidered conductive patterns. This paper deals with one of the contacting options currently in use, the method of resistance welding. Furthermore, the paper deals with the testing of these realized samples. All created specimens went through a dry heat test, thermal cycling test and washing test. Tests were designed to determine the resistivity of each pattern against both thermal and mechanical stresses.
{"title":"Resistance Welding in Smart Textile","authors":"D. Michal, Stanislav Suchý, Josef Slauf, J. Řeboun, R. Soukup","doi":"10.1109/ISSE.2019.8810309","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810309","url":null,"abstract":"With the growing Smart Textile industry, there is currently increasing interest in mapping the possibilities and quality of contacting embroidered conductive patterns. This paper deals with one of the contacting options currently in use, the method of resistance welding. Furthermore, the paper deals with the testing of these realized samples. All created specimens went through a dry heat test, thermal cycling test and washing test. Tests were designed to determine the resistivity of each pattern against both thermal and mechanical stresses.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"12 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84194571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810156
R. Hrdy, J. Prásek, Patrik Fillner, Silvestr Vančík, M. Schneider, J. Hubálek, U. Schmid
We presented the development and characterization of high-k stack HfO2/Al2O3 capacitor, fabricated directly on chip. The capacitor is based on nanolaminate material directly grown by plasma-assisted Atomic Layer Deposition (ALD)in a single reactor chamber. The deposition process was performed at a single temperature (250°C). We tested the various numbers of layers in the stack, compared the electrical and material characterizations. Using the optimal deposition conditions, we obtained a structure with nanolaminates of single thickens 5 Å, capacitance density of 1.10−12 F.μm−2 and leakage current density of $1.10^{-9}$ A.cm−2.
介绍了直接在芯片上制备的高k堆叠HfO2/Al2O3电容器的开发和表征。该电容器采用等离子体辅助原子层沉积(ALD)技术在单个反应器室中直接生长的纳米层合材料。沉积过程在单一温度(250°C)下进行。我们测试了堆叠中的不同层数，比较了电学和材料特性。在最佳的沉积条件下，我们得到了单层纳米层5 Å的结构，电容密度为1.10 ~ 12 F.μm−2，漏电流密度为1.10^{-9}$ a .cm−2。
{"title":"Development of HfO2/Al2O3 Stack for On-Chip Capacitor Applications","authors":"R. Hrdy, J. Prásek, Patrik Fillner, Silvestr Vančík, M. Schneider, J. Hubálek, U. Schmid","doi":"10.1109/ISSE.2019.8810156","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810156","url":null,"abstract":"We presented the development and characterization of high-k stack HfO<inf>2</inf>/Al<inf>2</inf>O<inf>3</inf> capacitor, fabricated directly on chip. The capacitor is based on nanolaminate material directly grown by plasma-assisted Atomic Layer Deposition (ALD)in a single reactor chamber. The deposition process was performed at a single temperature (250°C). We tested the various numbers of layers in the stack, compared the electrical and material characterizations. Using the optimal deposition conditions, we obtained a structure with nanolaminates of single thickens 5 Å, capacitance density of 1.10<sup>−12</sup> F.μm<sup>−2</sup> and leakage current density of <tex>$1.10^{-9}$</tex> A.cm<sup>−2</sup>.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"1 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89655851","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810285
David Kalaš, Karel Šíma, S. Pretl, J. Řeboun, R. Soukup, A. Hamácek
This paper deals with temperature distribution optimization in flexible printed circuit boards (FPCBs) with assembled temperature sensors. They are a part of a testing system, which is intended to be used for testing of the thermal protection level of protective gloves. In total 28 individual FPCBs with totally 272 temperature sensors TMP-05 will be integrated into a grooves on the human hand model and attached in the grooves by UV-curable adhesive. The main goal is heat localization in the area of the temperature sensor and thus increasing reliability in identifying critical areas of the glove. The FPCBs with different types of ground pours were locally exposed to the radiant heat source and results of the measurements were compared to the temperature distribution simulations.
{"title":"Temperature Distribution Optimization for Multichannel Sensor System for Thermal Testing of Protective Gloves","authors":"David Kalaš, Karel Šíma, S. Pretl, J. Řeboun, R. Soukup, A. Hamácek","doi":"10.1109/ISSE.2019.8810285","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810285","url":null,"abstract":"This paper deals with temperature distribution optimization in flexible printed circuit boards (FPCBs) with assembled temperature sensors. They are a part of a testing system, which is intended to be used for testing of the thermal protection level of protective gloves. In total 28 individual FPCBs with totally 272 temperature sensors TMP-05 will be integrated into a grooves on the human hand model and attached in the grooves by UV-curable adhesive. The main goal is heat localization in the area of the temperature sensor and thus increasing reliability in identifying critical areas of the glove. The FPCBs with different types of ground pours were locally exposed to the radiant heat source and results of the measurements were compared to the temperature distribution simulations.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"50 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90661561","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810265
J. Navrátil, Tomas Rericha, Vaclav Smitka, A. Hamácek
This paper presents interconnecting of printed electronics patterns by printing technologies or non-conductive adhesives (NCA). DuPont Kapton and glass substrate, Aerosol Jet nanoparticle silver ink and UV curable NCA were used. The aim of the research is to create a reliable interconnection for double sided printed electronics attached to rigid substrate while using printing technologies and adhesives. The printing technology is used for printing on 3D structure and also for printing micro 3D structures due to lowering the contact resistance of NCA attached side.
{"title":"Double Sided Printed Pattern Interconnected by Aerosol Jet and NCA Technologies","authors":"J. Navrátil, Tomas Rericha, Vaclav Smitka, A. Hamácek","doi":"10.1109/ISSE.2019.8810265","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810265","url":null,"abstract":"This paper presents interconnecting of printed electronics patterns by printing technologies or non-conductive adhesives (NCA). DuPont Kapton and glass substrate, Aerosol Jet nanoparticle silver ink and UV curable NCA were used. The aim of the research is to create a reliable interconnection for double sided printed electronics attached to rigid substrate while using printing technologies and adhesives. The printing technology is used for printing on 3D structure and also for printing micro 3D structures due to lowering the contact resistance of NCA attached side.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"4 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77480791","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810295
M. Feißt, Jan Kustermann, A. Schumacher, Irina Spies, J. Wilde
In this work investigations on TLP-bonding with a binary alloy consisting of Ag and Sn are presented. This joining technology allows stress-reduced mounting with a temperature-stable metallic interconnection. To analyze the influence of the process parameters a bonding-press that is capable of high heating rates up to 25 K/s was built and methods of DoE were used. The bonding pressure showed the most significant impact, while heating rate, time and temperature had a minor influence. The influence on the microporosity is demonstrated by SEM micrographs of ion-milled cross sections.
{"title":"Process Optimization of Foil-Based Transient Liquid Phase Bonding for Die Attachment","authors":"M. Feißt, Jan Kustermann, A. Schumacher, Irina Spies, J. Wilde","doi":"10.1109/ISSE.2019.8810295","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810295","url":null,"abstract":"In this work investigations on TLP-bonding with a binary alloy consisting of Ag and Sn are presented. This joining technology allows stress-reduced mounting with a temperature-stable metallic interconnection. To analyze the influence of the process parameters a bonding-press that is capable of high heating rates up to 25 K/s was built and methods of DoE were used. The bonding pressure showed the most significant impact, while heating rate, time and temperature had a minor influence. The influence on the microporosity is demonstrated by SEM micrographs of ion-milled cross sections.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"22 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74623228","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810297
Marta Turkiewicz, M. Gierczak, Damian Nowak, P. Markowski, E. Prociów, A. Dziedzic
Thermoelectricity (TE) is defined as the science concentrating on technology of thermoelectric generation and refrigeration, and it is seen as one of the easiest and most promising technique for direct converting of heat into electricity. Thermocouples, thermopiles and thermoelectric generators are the basic modules used for thermoelectric energy harvesting. The purpose of this work is to carry out a comprehensive review of thermoelectric technology - both regarding classic generators fabricated on rigid substrates, as well as the developing technology of elastic thermoelectricity, and its possibilities and applications. In addition, the work presents current research about new promising thermoelectric materials - thin films of semiconductive germanium-antimony alloy and constantan thin film, both obtained by magnetron sputtering.
{"title":"Thermocouples, Thermopiles and Thermoelectric Generators on Rigid and Flexible Substrates","authors":"Marta Turkiewicz, M. Gierczak, Damian Nowak, P. Markowski, E. Prociów, A. Dziedzic","doi":"10.1109/ISSE.2019.8810297","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810297","url":null,"abstract":"Thermoelectricity (TE) is defined as the science concentrating on technology of thermoelectric generation and refrigeration, and it is seen as one of the easiest and most promising technique for direct converting of heat into electricity. Thermocouples, thermopiles and thermoelectric generators are the basic modules used for thermoelectric energy harvesting. The purpose of this work is to carry out a comprehensive review of thermoelectric technology - both regarding classic generators fabricated on rigid substrates, as well as the developing technology of elastic thermoelectricity, and its possibilities and applications. In addition, the work presents current research about new promising thermoelectric materials - thin films of semiconductive germanium-antimony alloy and constantan thin film, both obtained by magnetron sputtering.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"1 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80128839","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810298
C. Ionescu, M. Branzei, N. Codreanu, G. Vărzaru
This work continues our investigation regarding the philosophy and the implementation of a new technology entitled Solderless Assembly for Electronics Technology (SAFE) or Occam [1]. Are presented the results of thermal analysis and measurements of electronic circuits, realized in Occam technology, compared to “classical” electronic modules realized on FR4. In the first case the convection from the top of component is blocked by the molding process. In the second case, free convection from top of component is considered. In both cases, the interconnection of components should be realized using printed conductive paste, as in the modified variant proposed in [1]. In this way, the heat generation in electronic components, in our case mid power LEDs, will be added with the supplemental dissipation caused by the current flow. For comparison purposes, there were investigated structures containing fixed linear resistors and/or structures printed on flat substrates.
{"title":"Thermal Investigations on Modules Realized Using Solderless Assembly for Electronics Technology","authors":"C. Ionescu, M. Branzei, N. Codreanu, G. Vărzaru","doi":"10.1109/ISSE.2019.8810298","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810298","url":null,"abstract":"This work continues our investigation regarding the philosophy and the implementation of a new technology entitled Solderless Assembly for Electronics Technology (SAFE) or Occam [1]. Are presented the results of thermal analysis and measurements of electronic circuits, realized in Occam technology, compared to “classical” electronic modules realized on FR4. In the first case the convection from the top of component is blocked by the molding process. In the second case, free convection from top of component is considered. In both cases, the interconnection of components should be realized using printed conductive paste, as in the modified variant proposed in [1]. In this way, the heat generation in electronic components, in our case mid power LEDs, will be added with the supplemental dissipation caused by the current flow. For comparison purposes, there were investigated structures containing fixed linear resistors and/or structures printed on flat substrates.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"33 1","pages":"1-7"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91284862","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810261
M. Myśliwiec, R. Kisiel
This paper covers the main aspects of applying SLID (Solid Liquid InterDiffusion bonding) for assembly of GaN structures to DBC (Direct Bonded Copper) substrates with Sn metallization. The influence of GaN ohmic contact metallization, Sn thickness on DBC as well as bonding parameters (pressure, temperature, time) on adhesion of GaN structures to DBC substrate were investigated. It was found that the weakest points of adhesion are the interfaces between micro-Ag sintered layer and surfaces of GaN or DBC metallization. The cohesion of micro-Ag layer sintered at ${8} MPa/280^{mathrm{o}}C$ exceeds ${20} MPa$.
{"title":"Development of SLID Bonding Technology for GaN Assembly Based on Ag Microflakes","authors":"M. Myśliwiec, R. Kisiel","doi":"10.1109/ISSE.2019.8810261","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810261","url":null,"abstract":"This paper covers the main aspects of applying SLID (Solid Liquid InterDiffusion bonding) for assembly of GaN structures to DBC (Direct Bonded Copper) substrates with Sn metallization. The influence of GaN ohmic contact metallization, Sn thickness on DBC as well as bonding parameters (pressure, temperature, time) on adhesion of GaN structures to DBC substrate were investigated. It was found that the weakest points of adhesion are the interfaces between micro-Ag sintered layer and surfaces of GaN or DBC metallization. The cohesion of micro-Ag layer sintered at ${8} MPa/280^{mathrm{o}}C$ exceeds ${20} MPa$.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"3 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76237127","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810257
C. Henning, A. Schmid, Sophia Hecht, Cindy Rückmar, K. Harre, R. Bauer
The need for alternatives for petrochemical circuit board materials is increasing annually. This paper deals with the study of ternary PLA composites, containing cellulose acetate (CA) and zinc pyrophosphate (ZnPP), the comparison to previous binary PLA composites and their usability as wiring substrates. For this purpose, principles of assembly and connection technologies are applied to the PLA composite and evaluated. The polymer thick-film technology and the printed circuit technology are used as principles of the assembly and connection technology for the realization of conductive structures. Furthermore, the assembly of components on copper conductive bonding and the mechanical strength of the joints was tested. Thus, an overview of the applicability of PLA composites as alternative circuit board materials as well as the advantages and disadvantages can be shown.
{"title":"Usability of Bio-based Polymers for PCB","authors":"C. Henning, A. Schmid, Sophia Hecht, Cindy Rückmar, K. Harre, R. Bauer","doi":"10.1109/ISSE.2019.8810257","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810257","url":null,"abstract":"The need for alternatives for petrochemical circuit board materials is increasing annually. This paper deals with the study of ternary PLA composites, containing cellulose acetate (CA) and zinc pyrophosphate (ZnPP), the comparison to previous binary PLA composites and their usability as wiring substrates. For this purpose, principles of assembly and connection technologies are applied to the PLA composite and evaluated. The polymer thick-film technology and the printed circuit technology are used as principles of the assembly and connection technology for the realization of conductive structures. Furthermore, the assembly of components on copper conductive bonding and the mechanical strength of the joints was tested. Thus, an overview of the applicability of PLA composites as alternative circuit board materials as well as the advantages and disadvantages can be shown.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"5 1","pages":"1-7"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74701102","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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