Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810268
U. Schumann, A. Jöstingmeier, A. Omar
In this paper, the suitability of the TRL calibration procedure as a technique for general de-embedding, i.e. in measurements and simulations, is examined. For the confirmation of the portability, simple test structures are examined purely analytically. Due to the character of this investigation, the behavior of the overall structure and the substructures is completely known and its applicability to general problems can be demonstrated.
{"title":"Analytical Considerations of the TRL Calibration Procedure for General De-Embedding Purposes","authors":"U. Schumann, A. Jöstingmeier, A. Omar","doi":"10.1109/ISSE.2019.8810268","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810268","url":null,"abstract":"In this paper, the suitability of the TRL calibration procedure as a technique for general de-embedding, i.e. in measurements and simulations, is examined. For the confirmation of the portability, simple test structures are examined purely analytically. Due to the character of this investigation, the behavior of the overall structure and the substructures is completely known and its applicability to general problems can be demonstrated.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"42 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83480015","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810195
T. Blecha, J. Cengery, S. Pretl, Vaclav Smitka
This paper deals with the design and realization of planar resonance circuits, which are part of a system designed to verify the authenticity of identity documents or banknotes. Validation or authentication is performed based on the evaluation of resonance frequency changes due to the size and location of security protection elements in the form of holographic or other metallic security structures located on identity documents or banknotes. Different types of planar resonance circuits have been designed for this system, and suitable placement of safety elements has been proposed with regard to the evaluable changes in resonance frequencies.
{"title":"Planar Resonance Circuits for Identity Documents or Banknotes Authentication","authors":"T. Blecha, J. Cengery, S. Pretl, Vaclav Smitka","doi":"10.1109/ISSE.2019.8810195","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810195","url":null,"abstract":"This paper deals with the design and realization of planar resonance circuits, which are part of a system designed to verify the authenticity of identity documents or banknotes. Validation or authentication is performed based on the evaluation of resonance frequency changes due to the size and location of security protection elements in the form of holographic or other metallic security structures located on identity documents or banknotes. Different types of planar resonance circuits have been designed for this system, and suitable placement of safety elements has been proposed with regard to the evaluable changes in resonance frequencies.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"73 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84254533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810282
Martin Pavec, M. Hirman, R. Soukup, A. Hamácek
This paper presents a research focused on testing of brass solderability for hybrid sewing thread. The hybrid sewing thread is composed of two strands each containing 48 polyester (PES)fibers and 4 brass micro wires. As main investigative method was chosen spread test. Due to composition of hybrid sewing thread, was used brass plate as testing substrate. Two different solder alloys (SAC and SnPb)and two different fluxes (SMNA and Actiec 5)were placed on the testing substrate. The solder balls were remelted by using vapor phase soldering. The contact angle of reflowed solder ball was calculated from surface and height of remelted ball.
{"title":"The Testing of Brass Solderability for Hybrid Sewing Thread","authors":"Martin Pavec, M. Hirman, R. Soukup, A. Hamácek","doi":"10.1109/ISSE.2019.8810282","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810282","url":null,"abstract":"This paper presents a research focused on testing of brass solderability for hybrid sewing thread. The hybrid sewing thread is composed of two strands each containing 48 polyester (PES)fibers and 4 brass micro wires. As main investigative method was chosen spread test. Due to composition of hybrid sewing thread, was used brass plate as testing substrate. Two different solder alloys (SAC and SnPb)and two different fluxes (SMNA and Actiec 5)were placed on the testing substrate. The solder balls were remelted by using vapor phase soldering. The contact angle of reflowed solder ball was calculated from surface and height of remelted ball.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"IA-13 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84591212","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810287
Laura Jasińska, K. Malecha, W. Wróblewski
This paper presents the LTCC (Low-Temperature Cofired Ceramic)microfluidic-microwave module. The designed and developed device allows determining the heat dissipated power in the microchannel, as well as the detection of the liquid. Due to that, the testing of the fabricated module was divided into two parts. The first assumed the determination of power loss. In turn, the second was the detection of the ethanol concentration in deionized water. The results indicate, that the proposed device can act as a detector of concentrations of liquid solutions, as well as a tool for determining the power dissipated in a microchannel.
{"title":"LTCC-based Microfluidic Module for Heating and Detection of Fluids Using Microwaves","authors":"Laura Jasińska, K. Malecha, W. Wróblewski","doi":"10.1109/ISSE.2019.8810287","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810287","url":null,"abstract":"This paper presents the LTCC (Low-Temperature Cofired Ceramic)microfluidic-microwave module. The designed and developed device allows determining the heat dissipated power in the microchannel, as well as the detection of the liquid. Due to that, the testing of the fabricated module was divided into two parts. The first assumed the determination of power loss. In turn, the second was the detection of the ethanol concentration in deionized water. The results indicate, that the proposed device can act as a detector of concentrations of liquid solutions, as well as a tool for determining the power dissipated in a microchannel.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"42 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80612663","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810204
Mohamed Amine Alaya, L. Gál, T. Hurtony, B. Medgyes, Dániel Straubinger, Al-Maaiteh Tareq I, B. Illés, A. Géczy
In this paper the wetting properties of lead free solder alloys were investigated on different printed circuit boards (PCB) during Vapour Phase Soldering (VPS), which is an alternative reflow method with non-conventional heat-transfer mechanism. Our motivation was to investigate the phenomenon on PCBs with different thermal capacities, with different heating power and with different solder alloys. The aim of the research is to clear the relations between the thermal capacities of the) PCBs and the spreading of the solder on it, and to investigate the effect of the change of heating power on the solder spreading during VPS. In addition, the impact of the VPS on different solder alloys and the performance of the VPS machine in the wake of the contact angle quality was investigated. Findings show that the thickness of the PCB is not affecting significantly the spread and the wetting. The composition of the alloy, the paste, and the heating power points to observable differences in the final results.
{"title":"Wetting of Different Lead Free Solder Alloys During Vapour Phase Soldering","authors":"Mohamed Amine Alaya, L. Gál, T. Hurtony, B. Medgyes, Dániel Straubinger, Al-Maaiteh Tareq I, B. Illés, A. Géczy","doi":"10.1109/ISSE.2019.8810204","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810204","url":null,"abstract":"In this paper the wetting properties of lead free solder alloys were investigated on different printed circuit boards (PCB) during Vapour Phase Soldering (VPS), which is an alternative reflow method with non-conventional heat-transfer mechanism. Our motivation was to investigate the phenomenon on PCBs with different thermal capacities, with different heating power and with different solder alloys. The aim of the research is to clear the relations between the thermal capacities of the) PCBs and the spreading of the solder on it, and to investigate the effect of the change of heating power on the solder spreading during VPS. In addition, the impact of the VPS on different solder alloys and the performance of the VPS machine in the wake of the contact angle quality was investigated. Findings show that the thickness of the PCB is not affecting significantly the spread and the wetting. The composition of the alloy, the paste, and the heating power points to observable differences in the final results.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"11 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87459284","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810283
Gergana Vacheva, N. Hinov, V. Dimitrov
Nowadays, with the increasing of the pollution and global warming one of the solutions for the current problems could be resolved with the usage of electric vehicles. The development and research of the electric vehicles includes establishment of electrical and mechanical systems. The main objective is to develop a model and control system to study the energy flows in acceleration and braking modes. For the improvement of the process of design a different mathematical model is necessary to be used entire system consisting of electric motor, electronic converters, gearbox and differential. In the proposed model it is also taken into account a rolling resistance, aerodynamic drag and the force of the electric motor.
{"title":"Research of Acceleration and Braking Modes of Electric Vehicles in MATLAB/Simulink","authors":"Gergana Vacheva, N. Hinov, V. Dimitrov","doi":"10.1109/ISSE.2019.8810283","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810283","url":null,"abstract":"Nowadays, with the increasing of the pollution and global warming one of the solutions for the current problems could be resolved with the usage of electric vehicles. The development and research of the electric vehicles includes establishment of electrical and mechanical systems. The main objective is to develop a model and control system to study the energy flows in acceleration and braking modes. For the improvement of the process of design a different mathematical model is necessary to be used entire system consisting of electric motor, electronic converters, gearbox and differential. In the proposed model it is also taken into account a rolling resistance, aerodynamic drag and the force of the electric motor.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"28 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87661749","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810294
M. Branzei, P. Svasta, M. Vlădescu, I. Plotog, B. Mihailescu, G. Vărzaru
Solderless assembly for electronics is a subject approached ever since RoHS EU Directive enforced lead-free technology especially since this one has revealed its limits. Electrically Conductive Adhesives (ECA) actually with a large commercial offer but not very well characterized, became one of the alternatives to lead-free. The paper presents ECA qualification methods from mechanical and electrical properties point of view for usage as promising solution to build the electronic module, optimum on Surface Mount Technology processes or in the Occam concept using an additive process for interconnection structure. For a complete information about the bonds mechanical failure and their electrical resistance, shear tests, respectively four point electrical measurements were performed.
{"title":"Mechanical vs. Electrical Properties of Conductive Adhesive Bonds as Function of Operating Temperature","authors":"M. Branzei, P. Svasta, M. Vlădescu, I. Plotog, B. Mihailescu, G. Vărzaru","doi":"10.1109/ISSE.2019.8810294","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810294","url":null,"abstract":"Solderless assembly for electronics is a subject approached ever since RoHS EU Directive enforced lead-free technology especially since this one has revealed its limits. Electrically Conductive Adhesives (ECA) actually with a large commercial offer but not very well characterized, became one of the alternatives to lead-free. The paper presents ECA qualification methods from mechanical and electrical properties point of view for usage as promising solution to build the electronic module, optimum on Surface Mount Technology processes or in the Occam concept using an additive process for interconnection structure. For a complete information about the bonds mechanical failure and their electrical resistance, shear tests, respectively four point electrical measurements were performed.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"62 1","pages":"1-7"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84808201","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810198
A. Dąbrowski, Radosław Wilkosz
In this work the results of experimental results on measuring the current strength of thick-film metallization are described. The tests were performed for paths made of commercial thick film pastes based on silver, silver-palladium and copper. The layers were screen printed on Al2O3 and AlN ceramic substrates. Resistance changes were determined as function of current density through the paths and then the maximum current density at burnout was determined. The current density in the paths was limited by ability of heat carrying away from the layer through the substrate to a heatsink. The AlN based ceramic was expected to achieve much better critical values of the current density thanks to its better thermal conductivity than alumina substrates. However, higher thermal conductivity of the substrate has not always meant significantly higher maximum current density.
{"title":"Current-Carrying Capacity of Thick-Film Metallization Paths","authors":"A. Dąbrowski, Radosław Wilkosz","doi":"10.1109/ISSE.2019.8810198","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810198","url":null,"abstract":"In this work the results of experimental results on measuring the current strength of thick-film metallization are described. The tests were performed for paths made of commercial thick film pastes based on silver, silver-palladium and copper. The layers were screen printed on Al2O3 and AlN ceramic substrates. Resistance changes were determined as function of current density through the paths and then the maximum current density at burnout was determined. The current density in the paths was limited by ability of heat carrying away from the layer through the substrate to a heatsink. The AlN based ceramic was expected to achieve much better critical values of the current density thanks to its better thermal conductivity than alumina substrates. However, higher thermal conductivity of the substrate has not always meant significantly higher maximum current density.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"37 21","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91399133","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810200
A. Fodor, G. Chindris, R. Jano, D. Pitica
Power dissipation for processors used in portable devices evolved along the evolution of processor capabilities, translated also into a significant amount of heat that must be removed from the cores. The current research aims to correctly model and simulate the processor assembly, as a whole, and to be able to approximate the temperature levels on the processor chip for an accurate thermal design. The simulation scenarios developed for this study include analyzing the temperature levels on the processor in case a high load task runs on one of the cores, for two multicore processing units. The results can be successfully integrated into the very early stages of thermal design for portable devices.
{"title":"Thermal Modelling and Simulation Techniques for Multicore Processors","authors":"A. Fodor, G. Chindris, R. Jano, D. Pitica","doi":"10.1109/ISSE.2019.8810200","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810200","url":null,"abstract":"Power dissipation for processors used in portable devices evolved along the evolution of processor capabilities, translated also into a significant amount of heat that must be removed from the cores. The current research aims to correctly model and simulate the processor assembly, as a whole, and to be able to approximate the temperature levels on the processor chip for an accurate thermal design. The simulation scenarios developed for this study include analyzing the temperature levels on the processor in case a high load task runs on one of the cores, for two multicore processing units. The results can be successfully integrated into the very early stages of thermal design for portable devices.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"24 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77028323","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-01DOI: 10.1109/ISSE.2019.8810199
K. Dušek, V. Zahradník, P. Veselý, D. Bušek, M. Placek
The thermal behavior of solder alloys during melting and solidification is important from point of many aspects. It has influence on formation of joint structure together with intermetallic compounds, reliability issues like tombstoning effect or warpage effect, dimensional changes of components and printed circuit board etc. This article deals with influence of released latent heat from solder joints on the surrounding temperature. Printed circuit boards with soldering pads designed side by side in the matrix and solder paste based on SAC387 solder alloy particles was used in experimental study. The influence of increased number of solder joints in a defined area was examined. The temperature profiles were measured below soldering pads during reflow soldering to find the thermal influences. The results show that released latent heat from solder joint has influence on surrounding temperature and it can delay the solidification of neighbor joint.
{"title":"Released of Latent Heat from Solder Joints to Surrounding During Solidification of Solder Alloy - Experimental Study","authors":"K. Dušek, V. Zahradník, P. Veselý, D. Bušek, M. Placek","doi":"10.1109/ISSE.2019.8810199","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810199","url":null,"abstract":"The thermal behavior of solder alloys during melting and solidification is important from point of many aspects. It has influence on formation of joint structure together with intermetallic compounds, reliability issues like tombstoning effect or warpage effect, dimensional changes of components and printed circuit board etc. This article deals with influence of released latent heat from solder joints on the surrounding temperature. Printed circuit boards with soldering pads designed side by side in the matrix and solder paste based on SAC387 solder alloy particles was used in experimental study. The influence of increased number of solder joints in a defined area was examined. The temperature profiles were measured below soldering pads during reflow soldering to find the thermal influences. The results show that released latent heat from solder joint has influence on surrounding temperature and it can delay the solidification of neighbor joint.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"102 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75842819","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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