Pub Date : 2020-01-01DOI: 10.1109/MEMS46641.2020.9056113
M. Kumemura, L. Kudo, Zhongcai Ma, S. Karsten
We developed a MEMS based sensor, Nanopin, for mechanical characterization of individual adherent cells. Nanopin consists of sensing tip that forms a contact with a cell, a displacement sensor, and an actuator. The feasibility of sensing was evaluated using various concentrations of agarose gel, and then the stiffness measurements of human carcinoma cells were conducted on different surfaces. After the measurements of cells, we confirmed that cells grow normally in an incubator.
{"title":"Nanopin - A MEMS Based Sensor for the Analysis of Single Cell Mechanical Properties","authors":"M. Kumemura, L. Kudo, Zhongcai Ma, S. Karsten","doi":"10.1109/MEMS46641.2020.9056113","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056113","url":null,"abstract":"We developed a MEMS based sensor, Nanopin, for mechanical characterization of individual adherent cells. Nanopin consists of sensing tip that forms a contact with a cell, a displacement sensor, and an actuator. The feasibility of sensing was evaluated using various concentrations of agarose gel, and then the stiffness measurements of human carcinoma cells were conducted on different surfaces. After the measurements of cells, we confirmed that cells grow normally in an incubator.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"1 1","pages":"311-314"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75455890","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-01-01DOI: 10.1109/MEMS46641.2020.9056317
R. Gando, D. Ono, S. Kaji, H. Ota, T. Itakura, Y. Tomizawa
This paper presents the first microcontroller-based module-level MEMS rate integrating gyroscope (RIG) for direct angle measurement after automatic asymmetry calibration. The 5-cm prototype module integrates a vacuum-sealed donut-mass gyroscope device on analog and digital PCBs. In automatic calibration mode, the initial frequency and decay-time asymmetries are electrically tuned and reduced by >40 and >18 times, respectively. The sensing mode is enabled by built-in digital controls of vibration energy and frequency. Continuous angle measurement is confirmed with an angular random walk (ARW) of 0.6 deg/rt-h and a bias instability (BI) of 4.3 deg/h, proving comparable performances with previous FPGA-based large RIG systems. This module paves the way for RIG commercialization studies.
{"title":"A Compact Microcontroller-Based MEMS Rate Integrating Gyroscope Module with Automatic Asymmetry Calibration","authors":"R. Gando, D. Ono, S. Kaji, H. Ota, T. Itakura, Y. Tomizawa","doi":"10.1109/MEMS46641.2020.9056317","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056317","url":null,"abstract":"This paper presents the first microcontroller-based module-level MEMS rate integrating gyroscope (RIG) for direct angle measurement after automatic asymmetry calibration. The 5-cm prototype module integrates a vacuum-sealed donut-mass gyroscope device on analog and digital PCBs. In automatic calibration mode, the initial frequency and decay-time asymmetries are electrically tuned and reduced by >40 and >18 times, respectively. The sensing mode is enabled by built-in digital controls of vibration energy and frequency. Continuous angle measurement is confirmed with an angular random walk (ARW) of 0.6 deg/rt-h and a bias instability (BI) of 4.3 deg/h, proving comparable performances with previous FPGA-based large RIG systems. This module paves the way for RIG commercialization studies.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"10 1","pages":"1296-1299"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72602014","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-01-01DOI: 10.1109/MEMS46641.2020.9056110
H. Yasuga, Atsushi Eda, K. Suto, T. Tachi, E. Iwase
We propose a flexible electronic substrate structured by Origami folding of non-stretchable film with faces parallel to target-of-attachment surfaces. A folding (“Origami”) or cutting (“Kirigami”) of a thin film have opened up the application of non-stretchable materials to flexible electronic devices attached to a curved surface. In this paper, we propose origami-structured flexible electronic substrates which have faces parallel to the target-of-attachment surface. The parallel faces have engineering importance and usefulness for taking direct contact with target-of-attachment surfaces and mounting electronic elements, e.g. sensors or light emitters. These characteristics are expected to allow for the realization of flexible devices capable of sensing shear force or flow velocity parallel to object's surfaces.
{"title":"An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces","authors":"H. Yasuga, Atsushi Eda, K. Suto, T. Tachi, E. Iwase","doi":"10.1109/MEMS46641.2020.9056110","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056110","url":null,"abstract":"We propose a flexible electronic substrate structured by Origami folding of non-stretchable film with faces parallel to target-of-attachment surfaces. A folding (“Origami”) or cutting (“Kirigami”) of a thin film have opened up the application of non-stretchable materials to flexible electronic devices attached to a curved surface. In this paper, we propose origami-structured flexible electronic substrates which have faces parallel to the target-of-attachment surface. The parallel faces have engineering importance and usefulness for taking direct contact with target-of-attachment surfaces and mounting electronic elements, e.g. sensors or light emitters. These characteristics are expected to allow for the realization of flexible devices capable of sensing shear force or flow velocity parallel to object's surfaces.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"38 44","pages":"909-912"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91514377","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-01-01DOI: 10.1109/MEMS46641.2020.9056391
Sajal Singh, J. Woo, G. He, J. Cho, K. Najafi
This paper reports measured results for a fused-silica precision shell integrating (PSI) micro gyroscope employing out-of-plane drive/sense transduction mechanism. The PSI gyroscope is made with a 5 mm radius shell resonator operating in $n=2$ wine-glass mode at a frequency ($f_{n=2}$) of 5.803 kHz with as-fabricated frequency split ($Delta f$) of 2.1 Hz. Large and reasonably uniform capacitance (∼0.25 pF) is achieved with flat surface electrodes. The gyroscope is operated in the force-rebalance mode by interfacing with an ultra-low-noise transimpedance amplifier (TIA). Near-navigation grade angle random walk (ARW) of $0.0062 deg/sqrt{mathrm{h}}mathrm{r}$, in-run bias instability (BI) of 0.027 deg/hr and scale factor of 158 mV/deg/s without any temperature compensation are achieved.
{"title":"$0.0062 {}^{circ}/sqrt{hr}$ Angle Random Walk and $0.027 {}^{circ}/hr$ Bias Instability from a Micro-Shell Resonator Gyroscope with Surface Electrodes","authors":"Sajal Singh, J. Woo, G. He, J. Cho, K. Najafi","doi":"10.1109/MEMS46641.2020.9056391","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056391","url":null,"abstract":"This paper reports measured results for a fused-silica precision shell integrating (PSI) micro gyroscope employing out-of-plane drive/sense transduction mechanism. The PSI gyroscope is made with a 5 mm radius shell resonator operating in $n=2$ wine-glass mode at a frequency ($f_{n=2}$) of 5.803 kHz with as-fabricated frequency split ($Delta f$) of 2.1 Hz. Large and reasonably uniform capacitance (∼0.25 pF) is achieved with flat surface electrodes. The gyroscope is operated in the force-rebalance mode by interfacing with an ultra-low-noise transimpedance amplifier (TIA). Near-navigation grade angle random walk (ARW) of $0.0062 deg/sqrt{mathrm{h}}mathrm{r}$, in-run bias instability (BI) of 0.027 deg/hr and scale factor of 158 mV/deg/s without any temperature compensation are achieved.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"12 1","pages":"737-740"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82086317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-01-01DOI: 10.1109/MEMS46641.2020.9056434
Xianming He, Quan Wen, Z. Wen, X. Mu
This paper reports a novel MEMS piezoelectric vibration energy harvester based on trapezoidal cantilever beam array (TCBA-PVEH), which mainly composed of a piezoelectric array beam and a mass block. The open-circuit voltage ($V_{oc}$), the optimized load voltage ($V_{opt}$) and the optimized load output power ($P_{opt}$) of the TCBA-PVEH at 0.5g acceleration can reach 10.36 V, 6.68 V and $12.51 mu mathrm{W}$, respectively. The experimental results show that the TCBA-PVEH has smaller bending stiffness and larger piezoelectric strain energy per unit area than the rectangular cantilever beam array based PVEH (RCBA-PVEH), thus having lower resonance frequency and better electrical output. We also establish and analytically solve the electromechanical coupling dynamic model of PVEHs with variable cross-section cantilever beam. The proposed model lays an important theoretical foundation for structural optimization design, performance improvement and output prediction.
{"title":"A MEMS Piezoelectric Vibration Energy Harvester Based on Trapezoidal Cantilever Beam Array","authors":"Xianming He, Quan Wen, Z. Wen, X. Mu","doi":"10.1109/MEMS46641.2020.9056434","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056434","url":null,"abstract":"This paper reports a novel MEMS piezoelectric vibration energy harvester based on trapezoidal cantilever beam array (TCBA-PVEH), which mainly composed of a piezoelectric array beam and a mass block. The open-circuit voltage ($V_{oc}$), the optimized load voltage ($V_{opt}$) and the optimized load output power ($P_{opt}$) of the TCBA-PVEH at 0.5g acceleration can reach 10.36 V, 6.68 V and $12.51 mu mathrm{W}$, respectively. The experimental results show that the TCBA-PVEH has smaller bending stiffness and larger piezoelectric strain energy per unit area than the rectangular cantilever beam array based PVEH (RCBA-PVEH), thus having lower resonance frequency and better electrical output. We also establish and analytically solve the electromechanical coupling dynamic model of PVEHs with variable cross-section cantilever beam. The proposed model lays an important theoretical foundation for structural optimization design, performance improvement and output prediction.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"55 1","pages":"532-535"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78383377","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This study designs and realizes an improved piezoelectric MEMS microphone with four triangular-cantilevers (Fig. 1) on a commercial 8-inch wafer. As compared with the reference design [1], this study exhibits two merits: (1) special boundary and structure design of the triangular-cantilever for sensitivity enhancement (Fig. 1a); (2) two-stage etching to successively define PZT/electrode and device-Si layers to enable the fabrication of small gaps between triangular-cantilevers for low frequency acoustic sensing enhancement (Fig. 1b). Moreover, the bottom of MEMS microphone chip is bonded (surface mount) on LGA (land-grid-array) for better acoustic performance (Fig. 1c). Preliminary FEM evaluations show the enhancement of proposed type as compare with a reference type (Fig. 2). Measurements indicate the packaged microphone of $1080 mumathrm{m}$ cavity size: acoustic sensitivity is - 37.54dBV/Pa at 1kHz; ±3dB bandwidth ranges 150Hz to 9.5kHz; noise floor of 20Hz∼20kHz bandwidth and A-weighting is −86.4dBV(A); SNR is 48.9dB(A); measured capacitance of sensing electrode is 410pF at 1kHz; dielectric constant is 250; and loss tangent of PZT is 0.015.
本研究在商用8英寸晶圆上设计并实现了一种带有四个三角形悬臂的改进压电MEMS麦克风(图1)。与参考设计[1]相比，本研究有两个优点:(1)为了增强灵敏度，三角形悬臂梁的特殊边界和结构设计(图1a);(2)两阶段蚀刻，连续定义PZT/电极层和器件硅层，以便在三角形悬臂梁之间制造小间隙，用于低频声传感增强(图1b)。此外，MEMS麦克风芯片的底部被粘接(表面贴装)在LGA(陆网阵列)上，以获得更好的声学性能(图1c)。初步的有限元评估表明，与参考型相比，所提出的型号有所增强(图2)。测量表明，封装麦克风的腔尺寸为$1080 mu mathm {m}$:在1kHz时声灵敏度为- 37.54dBV/Pa;±3dB带宽范围150Hz至9.5kHz;20Hz ~ 20kHz带宽和A加权的本底噪声为−86.4dBV(A);信噪比为48.9dB(A);在1kHz时测得的感应电极电容为410pF;介电常数为250;PZT的损耗正切为0.015。
{"title":"Implementation of Piezoelectric MEMS Microphone for Sensitivity and Sensing Range Enhancement","authors":"Shih-Hsiung Tseng, Sung-Cheng Lo, Yu-Chen Chen, Ya-Chu Lee, Mingching Wu, W. Fang","doi":"10.1109/MEMS46641.2020.9056150","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056150","url":null,"abstract":"This study designs and realizes an improved piezoelectric MEMS microphone with four triangular-cantilevers (Fig. 1) on a commercial 8-inch wafer. As compared with the reference design [1], this study exhibits two merits: (1) special boundary and structure design of the triangular-cantilever for sensitivity enhancement (Fig. 1a); (2) two-stage etching to successively define PZT/electrode and device-Si layers to enable the fabrication of small gaps between triangular-cantilevers for low frequency acoustic sensing enhancement (Fig. 1b). Moreover, the bottom of MEMS microphone chip is bonded (surface mount) on LGA (land-grid-array) for better acoustic performance (Fig. 1c). Preliminary FEM evaluations show the enhancement of proposed type as compare with a reference type (Fig. 2). Measurements indicate the packaged microphone of $1080 mumathrm{m}$ cavity size: acoustic sensitivity is - 37.54dBV/Pa at 1kHz; ±3dB bandwidth ranges 150Hz to 9.5kHz; noise floor of 20Hz∼20kHz bandwidth and A-weighting is −86.4dBV(A); SNR is 48.9dB(A); measured capacitance of sensing electrode is 410pF at 1kHz; dielectric constant is 250; and loss tangent of PZT is 0.015.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"17 1","pages":"845-848"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78466060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-01-01DOI: 10.1109/MEMS46641.2020.9056380
Yong Wang, R. Tao, Qian Zhang, Dongyang Chen, Lei Yang, Wei Huang, Jin Xie, Yongqing Fu
In this paper, we report acoustofluidics based on zinc oxide (ZnO)/Al plate surface acoustic waves (SAWs) and compare their performances with those of ZnO/Si SAWs with the same electrode configurations. Results show that ZnO/Al (1.5 mm thick) SAWs achieve a lower threshold pumping power and have better pumping performances than those of ZnO/Si SAWs due to their larger Rayleigh angle and higher electromechanical coupling coefficients. Wavelength effects on pumping performances of ZnO/Al plate SAWs are also investigated and a larger wavelength leads to a lower threshold pumping power. Moreover, we also study effects of Al plate thickness on pumping performances and results show that ZnO/Al plate SAWs present better pumping performances than those of ZnO/Al foil SAWs.
{"title":"Acoustofluidics Based on ZnO/Al Plate Surface Acoustic Wave Devices with Enhanced Performances","authors":"Yong Wang, R. Tao, Qian Zhang, Dongyang Chen, Lei Yang, Wei Huang, Jin Xie, Yongqing Fu","doi":"10.1109/MEMS46641.2020.9056380","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056380","url":null,"abstract":"In this paper, we report acoustofluidics based on zinc oxide (ZnO)/Al plate surface acoustic waves (SAWs) and compare their performances with those of ZnO/Si SAWs with the same electrode configurations. Results show that ZnO/Al (1.5 mm thick) SAWs achieve a lower threshold pumping power and have better pumping performances than those of ZnO/Si SAWs due to their larger Rayleigh angle and higher electromechanical coupling coefficients. Wavelength effects on pumping performances of ZnO/Al plate SAWs are also investigated and a larger wavelength leads to a lower threshold pumping power. Moreover, we also study effects of Al plate thickness on pumping performances and results show that ZnO/Al plate SAWs present better pumping performances than those of ZnO/Al foil SAWs.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"2 1","pages":"38-41"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76641231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-01-01DOI: 10.1109/MEMS46641.2020.9056313
Yongkui Tang, Song Liu, E. S. Kim
We present a novel and easy fabrication method to manufacture Polydimethylsiloxane (PDMS) Fresnel air-cavity acoustic lens for focused ultrasonic transducers with long focal length. The process involves casting PDMS membrane with a silicon mold and bonding the PDMS membrane on a lead zirconate titanate (PZT) sheet with ultraviolet (UV)-curable adhesive. A 2.32-MHz focused ultrasonic transducer fabricated with the new method is capable of ejecting water droplets up to 1 mm in diameter (controlled by driving pulse width), from water surface 25 mm above the transducer.
{"title":"MEMS Focused Ultrasonic Transducer with Air-Cavity Lens Based on Polydimethylsiloxane (PDMS) Membrane","authors":"Yongkui Tang, Song Liu, E. S. Kim","doi":"10.1109/MEMS46641.2020.9056313","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056313","url":null,"abstract":"We present a novel and easy fabrication method to manufacture Polydimethylsiloxane (PDMS) Fresnel air-cavity acoustic lens for focused ultrasonic transducers with long focal length. The process involves casting PDMS membrane with a silicon mold and bonding the PDMS membrane on a lead zirconate titanate (PZT) sheet with ultraviolet (UV)-curable adhesive. A 2.32-MHz focused ultrasonic transducer fabricated with the new method is capable of ejecting water droplets up to 1 mm in diameter (controlled by driving pulse width), from water surface 25 mm above the transducer.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"42 1","pages":"58-61"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76803606","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-01-01DOI: 10.1109/MEMS46641.2020.9056451
Takashi Kozaki, Saito Satoshi, Yota Otsuki, R. Matsuda, Yutaka Isoda, Takuma Endo, Fumika Nakamura, T. Araki, Taichi Furukawa, S. Maruo, M. Watanabe, K. Ueno, H. Ota
The study proposes optoelectronics based on liquid metal and photo-switchable ionic liquid with liquid-liquid heterojunction technology. As a proof of concept, a liquid-state light sensor and an optical memory which is switched on and off by UV and blue light exposures were demonstrated. The ionic liquid named 1-butyl-3-(4-phenylazobenzyl)imidazolium bis(trifluoromethanesulfonyl)amide ([Azo][NTf2]) is used to realize functions as a light sensor or an optical memory. This ionic liquid is photoresponsive and can undergo a reversible isomerization controlled by light irradiation of UV or Blue; this property was used to realize the liquid-state optoelectronics in this study. In addition, a liquid-state heterojunction was taken advantage of in interconnects between sensing ionic liquid and liquid metal. The liquid-state heterojunction in the microchannels was critical to preventing intermixing of the two liquid components, especially, when the completed devices underwent mechanical deformation. These two important technologies, the photo-switchable ionic liquid and the heterojunction, achieved liquid-state optoelectronics based on liquid materials.
{"title":"Highly Deformable Optoelectronics Using Liquid Metal","authors":"Takashi Kozaki, Saito Satoshi, Yota Otsuki, R. Matsuda, Yutaka Isoda, Takuma Endo, Fumika Nakamura, T. Araki, Taichi Furukawa, S. Maruo, M. Watanabe, K. Ueno, H. Ota","doi":"10.1109/MEMS46641.2020.9056451","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056451","url":null,"abstract":"The study proposes optoelectronics based on liquid metal and photo-switchable ionic liquid with liquid-liquid heterojunction technology. As a proof of concept, a liquid-state light sensor and an optical memory which is switched on and off by UV and blue light exposures were demonstrated. The ionic liquid named 1-butyl-3-(4-phenylazobenzyl)imidazolium bis(trifluoromethanesulfonyl)amide ([Azo][NTf2]) is used to realize functions as a light sensor or an optical memory. This ionic liquid is photoresponsive and can undergo a reversible isomerization controlled by light irradiation of UV or Blue; this property was used to realize the liquid-state optoelectronics in this study. In addition, a liquid-state heterojunction was taken advantage of in interconnects between sensing ionic liquid and liquid metal. The liquid-state heterojunction in the microchannels was critical to preventing intermixing of the two liquid components, especially, when the completed devices underwent mechanical deformation. These two important technologies, the photo-switchable ionic liquid and the heterojunction, achieved liquid-state optoelectronics based on liquid materials.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"28 1","pages":"1230-1233"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76887663","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-01-01DOI: 10.1109/MEMS46641.2020.9056421
Zihao Song, R. Matsuda, Ken Matsubara, Fumika Nakamura, H. Ota
This paper reports caterpillar-inspired soft robot based on thermal expansion with stretchable bending and flexible temperature sensor. The movement of soft robot was based on thermal expansion with highly volatile liquid. On account of thermodynamic method, this soft robot must have a bending sensor for the movement and a temperature sensor to monitor the soft robot's state at that moment. The primary objective of this research is to resolve the integration between soft sensor and actuator. The actuator bends due to thermal expansion. The system could control the thermal expansion change from the resistance of the calculated bending sensor.
{"title":"A Caterpillar-Inspired Soft Robot Based on Thermal Expansion","authors":"Zihao Song, R. Matsuda, Ken Matsubara, Fumika Nakamura, H. Ota","doi":"10.1109/MEMS46641.2020.9056421","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056421","url":null,"abstract":"This paper reports caterpillar-inspired soft robot based on thermal expansion with stretchable bending and flexible temperature sensor. The movement of soft robot was based on thermal expansion with highly volatile liquid. On account of thermodynamic method, this soft robot must have a bending sensor for the movement and a temperature sensor to monitor the soft robot's state at that moment. The primary objective of this research is to resolve the integration between soft sensor and actuator. The actuator bends due to thermal expansion. The system could control the thermal expansion change from the resistance of the calculated bending sensor.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"43 1","pages":"489-492"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85459875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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