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2020 IEEE/MTT-S International Microwave Symposium (IMS)最新文献

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A W-Band Rectenna Using On-Chip CMOS Switching Rectifier and On-PCB Tapered Slot Antenna Achieving 25% Effective-Power-Conversion Efficiency for Wireless Power Transfer 采用片上CMOS开关整流器和pcb上锥形槽天线的w波段整流天线实现25%的有效功率转换效率,用于无线电力传输
Pub Date : 2020-08-01 DOI: 10.1109/IMS30576.2020.9223846
Pingyang He, Jie Xu, Dixian Zhao
This paper presents a W-band rectenna unit, which incorporates an optimized CMOS switching rectifier and a print tapered slot antenna. Based on the analysis of the operation principle of the switching rectifier, this paper proposes an optimized structure of the switching rectifier and the body-diode effect (BDE) to improve reliability and power conversion efficiency (PCE). Besides, a high-gain W-band antipodal linearly tapered slot antenna (ALTSA) is implemented on PCB to improve the overall efficiency. The switching rectifier achieves a peak PCE of 45.8% at 94 GHz with improved reliability. The overall PCE of the rectenna unit up to 25% is achieved with 5.6 mW output dc power under 90 mW/cm2 incident power density. The proposed rectifier and rectenna achieve the highest PCE among recently reported W-band rectifiers and rectennas with different technologies
本文提出了一种w波段整流单元,该单元集成了一个优化的CMOS开关整流器和一个打印锥形槽天线。在分析开关整流器工作原理的基础上,提出了开关整流器的优化结构和体二极管效应(BDE),以提高可靠性和功率转换效率(PCE)。此外,为了提高整体效率,还在PCB上实现了高增益w波段对端线性锥形槽天线(ALTSA)。开关整流器在94 GHz时的峰值PCE为45.8%,可靠性得到提高。在90mw /cm2入射功率密度下,5.6 mW直流输出功率可使整流单元的整体PCE达到25%。在最近报道的采用不同技术的w波段整流和整流天线中,所提出的整流和整流天线的PCE最高
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引用次数: 5
A 300-µW Cryogenic HEMT LNA for Quantum Computing 用于量子计算的300µW低温HEMT LNA
Pub Date : 2020-08-01 DOI: 10.1109/IMS30576.2020.9223865
E. Cha, N. Wadefalk, G. Moschetti, A. Pourkabirian, J. Stenarson, J. Grahn
This paper reports on ultra-low power 4–8 GHz (C-band) InP high-electron mobility transistor (HEMT) cryogenic low-noise amplifiers (LNAs) aimed for qubit amplification in quantum computing. We have investigated dc power dissipation in hybrid three-stage cryogenic LNAs using 100-nm gate length InP HEMTs with different indium content in the channel (65% and 80%). The noise performance at 300 K was found to be comparable for both channel structures. At 5 K, an LNA with 65% indium channel exhibited significantly lower noise temperature at any dc power dissipation compared to the LNA with 80% indium channel. The LNA with 65% indium channel achieved an average noise of 3.2 K with 23 dB gain at an ultra-low power consumption of 300 µW. To the best of authors' knowledge, the LNA exhibited the lowest noise temperature to date for sub-milliwatt power cryogenic C-band LNAs.
本文报道了用于量子计算中量子比特放大的超低功耗4-8 GHz (c波段)InP高电子迁移率晶体管(HEMT)低温低噪声放大器(LNAs)。我们研究了混合三段式低温LNAs的直流功耗,使用100 nm栅长InP HEMTs,通道中不同的铟含量(65%和80%)。发现两种通道结构在300k时的噪声性能是相当的。在5 K时,65%铟通道的LNA在任何直流功耗下都比80%铟通道的LNA表现出更低的噪声温度。具有65%铟通道的LNA平均噪声为3.2 K,增益为23 dB,超低功耗为300 μ W。据作者所知,该LNA表现出迄今为止亚毫瓦功率低温c波段LNA的最低噪声温度。
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引用次数: 26
A Wearable Throat Vibration Microwave Sensor Based on Split-Ring Resonator for Harmonics Detection 基于分环谐振腔的可穿戴喉部振动微波传感器谐波检测
Pub Date : 2020-08-01 DOI: 10.1109/IMS30576.2020.9223879
Yun-Rei Ho, Chin-Lung Yang
This paper proposed a wearable throat vibration system using a microwave sensor. Compared with millimeterwave measurement systems, a simple split-ring resonator can clearly detect and evaluate vocal fold vibration in the industrial, scientific and medical band. Higher harmonics can still be identified and quantified. A high-sensitivity microwave split-ring resonator has a sharp resonance response corresponding to the variation of the electrical fields timely in the near field to detect throat vibration. The use of amplitude modulation can be detected using an envelope detector at low cost and sensitively senses details of the vibration from vocal fold. Finally, the actual measurement results prove that the microwave sensor can measure approximately eleventh harmonics.
提出了一种采用微波传感器的可穿戴喉部振动系统。与毫米波测量系统相比,一个简单的分环谐振器可以清晰地检测和评估工业、科学和医疗波段的声带振动。高次谐波仍然可以被识别和量化。高灵敏度的微波劈裂环谐振器在近场中随电场的变化及时产生尖锐的共振响应,以检测喉部振动。利用低成本的包络检测器可以检测到调幅的使用,并且可以灵敏地感知声带振动的细节。最后,实际测量结果表明,微波传感器可以测量出近11次谐波。
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引用次数: 1
Polylithic Integration for RF/MM-Wave Chiplets using Stitch-Chips: Modeling, Fabrication, and Characterization 使用缝片的射频/毫米波小芯片的多片集成:建模、制造和表征
Pub Date : 2020-08-01 DOI: 10.1109/IMS30576.2020.9223887
Ting Zheng, Paul K. Jo, Sreejith Kochupurackal Rajan, M. Bakir
A polylithic integration technology is demonstrated for seamless stitching of RF and digital chiplets. In this technology, stitch-chips with compressible microinterconnects (CMIs) are used for low-loss and dense interconnection between chiplets. A testbed using fused-silica stitch-chips with integrated CMIs is demonstrated including modeling, fabrication, assembly, and characterization. A 500 µm-long stitch-chip signal link is measured to have less than 0.4 dB insertion loss up to 30 GHz. A simulated eye diagram for 1000 µm-long stitch-chip signal link has a clear opening at 50 Gbps data rate. Moreover, the S-parameters of the CMIs are extracted from this testbed and show less than 0.17 dB insertion loss up to 30 GHz. Benchmarking to silicon interposer based interconnection is also reported.
介绍了一种射频与数字芯片无缝拼接的多晶片集成技术。在该技术中,采用具有可压缩微互连(CMIs)的缝合芯片来实现小芯片之间的低损耗和密集互连。演示了一个使用集成cmi的熔融硅缝片的测试平台,包括建模、制造、组装和表征。在30ghz工作频率下,500微米长的缝片信号链路的插入损耗小于0.4 dB。模拟的1000微米缝片信号链路的眼图在50 Gbps数据速率下具有清晰的开口。此外,从该试验台提取了cmi的s参数,在30 GHz下插入损耗小于0.17 dB。对基于硅中间层的互连进行了基准测试。
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引用次数: 1
GaN and GaAs HEMT Channel Charge Model for Nonlinear Microwave and RF Applications 非线性微波和射频应用的GaN和GaAs HEMT通道电荷模型
Pub Date : 2020-08-01 DOI: 10.1109/IMS30576.2020.9223994
A. Parker
An explicit energy-based expression for HEMT channel charge is proposed. The expression is a compact formulation that is superior for design and simulation tools. As an advancement over existing approaches, the new expression offers the well-behaved high-order linearity that is critical for wireless applications.
提出了基于能量的HEMT通道电荷的显式表达式。表达式是一个紧凑的公式,是优越的设计和仿真工具。作为对现有方法的改进,新的表达式提供了对无线应用至关重要的高阶线性。
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引用次数: 1
A 125.5-157 GHz 8 dB NF and 16 dB of Gain D-band Low Noise Amplifier in CMOS SOI 45 nm 125.5 ~ 157 GHz 8 dB NF和16 dB增益的45 nm CMOS SOI d波段低噪声放大器
Pub Date : 2020-08-01 DOI: 10.1109/IMS30576.2020.9224114
A. Hamani, A. Siligaris, B. Blampey, C. Dehos, J. G. Gonzalez Jimenez
In this paper, a D-band millimeter-wave low noise amplifier circuit in CMOS SOI 45 nm technology is presented. It achieves 8 dB of noise figure and 16 dB of gain with a 3-dB bandwidth of 31.5 GHz (125.5-157 GHz). It is composed of four stages of capacitively neutralized differential common-source cells cascaded using integrated mm-wave transformers to achieve high gain and large bandwidth. It consumes 75 mW from a 1-V voltage supply, and occupies a compact active area of 0.07 mm2.
本文提出了一种45纳米CMOS SOI工艺的d波段毫米波低噪声放大电路。噪声系数为8db,增益为16db, 31.5 GHz (125.5-157 GHz)带宽为3db。它由四级电容中和差分共源单元组成,使用集成毫米波变压器级联,以实现高增益和大带宽。它从1 v电压电源消耗75 mW,并占用0.07 mm2的紧凑有效面积。
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引用次数: 17
A Novel 32-Gb/s 5.6-Vpp Digital-to-Analog Converter in 100 nm GaN Technology for 5G Signal Generation 基于100nm GaN技术的新型32gb /s 5.6 vpp数模转换器,用于5G信号生成
Pub Date : 2020-08-01 DOI: 10.1109/IMS30576.2020.9224080
M. Weiß, C. Friesicke, R. Quay, O. Ambacher
The RF-power digital-to-analog converter (DAC) presented here provides RF-signals in the gigabit regime with voltage swings up to 8.32 V, suitable to drive subsequent single-stage microwave gallium nitride (GaN) power amplifer for sub-six frequencies. A current-steering architecture is driven by a custom algorithm to provide a programmable high output current, up to 250 mA, to a capacitive load such as the capacitive input impedance of an single-stage GaN power amplifier. This architecture provides data rates up to 32 Gb/s with an custom encoding, while the output voltage swing at the load capacitance is higher than 5 Vpp. Therefore, slew rates of up to 76 V/ns can be established.
本文提出的射频功率数模转换器(DAC)提供千兆频段的射频信号,电压波动高达8.32 V,适用于驱动后续的六次频率单级微波氮化镓(GaN)功率放大器。电流转向架构由定制算法驱动,为容性负载(如单级GaN功率放大器的容性输入阻抗)提供高达250 mA的可编程高输出电流。该架构通过自定义编码提供高达32 Gb/s的数据速率,而负载电容下的输出电压摆幅高于5 Vpp。因此,可以建立高达76 V/ns的转换速率。
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引用次数: 1
Novel Non-Reciprocal Microwave Spin Wave and Magneto-Elastic Wave Devices for On-Chip Signal Processing 用于片上信号处理的新型非互易微波自旋波和磁弹性波器件
Pub Date : 2020-08-01 DOI: 10.1109/IMS30576.2020.9223956
I. Krivorotov, E. Montoya, Amanatullah Khan, A. Slavin, Mingzhong Wu
The discovery of interfacial Dzyaloshinskii-Moriya interaction (DMI) enables development of novel ultra-compact non-reciprocal devices for microwave signal processing. Such devices are based on control of spin waves and magneto-elastic waves by electric field and addition of ultra-thin layers of heavy metals to the devices. Here we discuss recent advances in the development of such systems, which can be used for implementation of on-chip non-reciprocal microwave devices.
界面Dzyaloshinskii-Moriya相互作用(DMI)的发现使微波信号处理的新型超紧凑非互易器件的发展成为可能。这种装置是基于电场控制自旋波和磁弹性波,并在装置上添加超薄的重金属层。在这里,我们讨论了该系统的最新进展,该系统可用于实现片上非互易微波器件。
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引用次数: 0
A Superharmonic Injection based G-band Quadrature VCO in CMOS 基于超谐波注入的g波段正交压控振荡器
Pub Date : 2020-08-01 DOI: 10.1109/IMS30576.2020.9223816
Xuan Ding, Hai-xia Yu, Bo Yu, Zhiwei Xu, Q. Gu
This paper presents a G-band quadrature voltage-controlled oscillator (QVCO) enabled by a superharmonic injection technique. This technique ensures differential phases at the common mode tail current source nodes of two differential oscillators, which are then enforced to generate quadrature outputs. It achieves a maximum output power of -1.54 dBm with the efficiency of 3.2% and the tuning range (TR) from 149.3 GHz to 152.4 GHz. The measured phase noise (PN) is -91.9 dBc/Hz at 1 MHz offset. The IQ outputs are down-converted by an on-chip mixer for phase and amplitude accuracy measurement. The measured I/Q phase mismatch is less than 1.5° and amplitude mismatch of less than 0.33 dB over the operating frequency range. The QVCO is implemented in a 28 nm CMOS process, occupying 0.028 mm2 chip area.
提出了一种利用超谐波注入技术实现的g波段正交压控振荡器(QVCO)。该技术确保了两个差分振荡器共模尾电流源节点的差分相位,然后强制产生正交输出。最大输出功率为-1.54 dBm,效率为3.2%,调谐范围为149.3 GHz ~ 152.4 GHz。测量的相位噪声(PN)在1mhz偏移时为-91.9 dBc/Hz。IQ输出由片上混频器进行相位和幅度精度测量。在工作频率范围内,测量到的I/Q相位失配小于1.5°,幅度失配小于0.33 dB。QVCO采用28纳米CMOS工艺实现,芯片面积为0.028 mm2。
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引用次数: 4
A 24 - 30 GHz Ultra-Compact Phase Shifter Using All-Pass Networks for 5G User Equipment 用于5G用户设备的全通网络24 - 30ghz超紧凑型移相器
Pub Date : 2020-08-01 DOI: 10.1109/IMS30576.2020.9223788
Eduardo V. P. Anjos, D. Schreurs, G. Vandenbosch, M. Geurts
This work presents a 24–30 GHz phase-shifter with 0.028 mm2 of area for 5G mobile applications. The small size is achieved by employing variable-phase all-pass networks, which enables the embedding of switches within all-pass networks when implementing switched-type phase-shifters. The proposed PS was implemented and manufactured using 0.25 µm BiCMOS. Measurements were performed, showing an insertion loss of 4.49 ± 0.27 dB at 27 GHz, an RMS gain error below 0.5 dB and an RMS phase error below 7° across the whole frequency band.
这项工作提出了一种面积为0.028 mm2的24-30 GHz移相器,用于5G移动应用。小尺寸是通过采用可变相位全通网络实现的,这使得在实现开关型移相器时可以在全通网络中嵌入开关。所提出的PS采用0.25µm BiCMOS实现和制造。测量结果表明,在27 GHz时的插入损耗为4.49±0.27 dB,整个频段的RMS增益误差小于0.5 dB, RMS相位误差小于7°。
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引用次数: 0
期刊
2020 IEEE/MTT-S International Microwave Symposium (IMS)
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