Accurate evaluation of thermal conductivity in polymeric materials is crucial for the development of advanced thermal management systems in electronics. In this study, a total of five epoxy resins imine-based epoxy (IEP), azine-based epoxy (AEP), ketone-based epoxy (KEP), double imine-based epoxy (DIEP), and acetylene-based epoxy (ACEP) were synthesized. The thermal conductivity of the cured materials under various conditions was then evaluated using the transient plane source (TPS) method. Their liquid crystalline (LC) behavior was confirmed by differential scanning calorimetry (DSC) and polarized optical microscopy (POM), revealing nematic and smectic phases for azine-based epoxies (AEP) and imine-based epoxies (IEP), respectively. Determination of the optimal curing agent and curing temperature was achieved by analyzing the exothermic peaks obtained from dynamic DSC scans of various epoxy resin–curing agent combinations. The curing agent whose exothermic behavior overlapped with the LC temperature range of the epoxy resin was selected to prepare the cured materials. To ensure reliability, the thermal conductivity value was determined using the stabilized region of the residual graph from the TPS measurement, where the deviation of the temperature difference was at a minimum. When cured in the LC state, the thermal conductivity values were 0.36 W/m·K for IEP/diaminodiphenylmethane (DDM) and 0.35 W/m·K for AEP/DDM.
Graphical Abstract
Accurate thermal conductivity of LC epoxy resins was achieved by excluding unstable data regions, highlighting the importance of accurate measurement for understanding molecular ordering effects.