Pub Date : 2023-01-01DOI: 10.1109/memc.2023.10201364
Daniel D. Hoolihan
The cover story of this issue was “Message from the President” by Joseph F. Fischer, Jr. - President - EMC-Group. His message was as follows: During the past year your Administrative Committee (ADCOM) carried out two distinctive actions which were paramount in sustaining our Group.
{"title":"50-25-10 Years Ago: A Review of EMC Society Newsletters","authors":"Daniel D. Hoolihan","doi":"10.1109/memc.2023.10201364","DOIUrl":"https://doi.org/10.1109/memc.2023.10201364","url":null,"abstract":"The cover story of this issue was “Message from the President” by Joseph F. Fischer, Jr. - President - EMC-Group. His message was as follows: During the past year your Administrative Committee (ADCOM) carried out two distinctive actions which were paramount in sustaining our Group.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135783386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/memc.2023.10136446
{"title":"ANSC 63® Workshops on C63.4 and NEW C63.25 Standard Series","authors":"","doi":"10.1109/memc.2023.10136446","DOIUrl":"https://doi.org/10.1109/memc.2023.10136446","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489777","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/MEMC.2023.10136454
C. Hwang, J. Fan
This article reviews the electromagnetic framework used to model radio frequency interference (RFI) and the resulting development of mitigation methods. With the rise of IoT devices, wireless devices in which RF antennas are integrated with high-performance digital systems in small form factors suffer from electromagnetic interference, known as RF interference or RF desensitization. The simple yet rigorous framework can be used for a systematic RFI-aware design, saving time and effort for trial-and-error troubleshooting.
{"title":"Modeling and Mitigation of Radio Frequency Interference for Wireless Devices","authors":"C. Hwang, J. Fan","doi":"10.1109/MEMC.2023.10136454","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10136454","url":null,"abstract":"This article reviews the electromagnetic framework used to model radio frequency interference (RFI) and the resulting development of mitigation methods. With the rise of IoT devices, wireless devices in which RF antennas are integrated with high-performance digital systems in small form factors suffer from electromagnetic interference, known as RF interference or RF desensitization. The simple yet rigorous framework can be used for a systematic RFI-aware design, saving time and effort for trial-and-error troubleshooting.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"12 1","pages":"87-92"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489860","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/memc.2023.10201901
Joana Mendes, S. Grivet-Talocia
{"title":"SPI 2023 Held in Aveiro, Portugal","authors":"Joana Mendes, S. Grivet-Talocia","doi":"10.1109/memc.2023.10201901","DOIUrl":"https://doi.org/10.1109/memc.2023.10201901","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489951","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/memc.2023.10201365
Nicolas Mora
LASCAS is the international symposium and flagship event of the IEEE Circuits and Systems (CAS) Society in IEEE Region 9 (Latin America). It started 14 years ago and took place for the first time in Ecuador developing activities in micro and nanoelectronics. The symposium, held from February 28 to March 3 at the Swiss Hotel in Quito, Ecuador, provided a high-quality exchange and networking forum for more than 100 researchers, professionals, and students, gathering an international audience with experts worldwide. The best paper of the conference will be published in the IEEE Transactions on Circuits and Systems. More information may be found on the conference website https://www.ieee-lascas.org/
{"title":"IEEE Latin American Symposium on Circuits and Systems (LASCAS)","authors":"Nicolas Mora","doi":"10.1109/memc.2023.10201365","DOIUrl":"https://doi.org/10.1109/memc.2023.10201365","url":null,"abstract":"LASCAS is the international symposium and flagship event of the IEEE Circuits and Systems (CAS) Society in IEEE Region 9 (Latin America). It started 14 years ago and took place for the first time in Ecuador developing activities in micro and nanoelectronics. The symposium, held from February 28 to March 3 at the Swiss Hotel in Quito, Ecuador, provided a high-quality exchange and networking forum for more than 100 researchers, professionals, and students, gathering an international audience with experts worldwide. The best paper of the conference will be published in the IEEE Transactions on Circuits and Systems. More information may be found on the conference website https://www.ieee-lascas.org/","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135784873","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/MEMC.2023.10201442
Emadodin Zia Khodadadian
This work aims to delve into the DC (Direct Current) block capacitor effect on the residual current in a system-level ESD (Electrostatic Discharge)-protected circuit. First, the relation between the residual current and DC block capacitor value has been introduced by applying two theoretical methods: circuit analysis and frequency response analysis. Then, a test circuit with 12 different DC block capacitors (0.5pF to 10nF) is employed to extract simulation and measurement results. Both SPICE (Simulation Program with Integrated Circuits Emphasis) transient analysis by simulating the IEC 61000-4-2 waveform and the measurement test setup by applying a system-level ESD simulator reveals that a test circuit with the lowest DC block capacitor is more unsusceptible than others. As a result, decreasing the value of the DC block capacitor can help reduce the destructive effect of ESD.
本研究旨在探讨直流块电容对系统级ESD保护电路中剩余电流的影响。首先，运用电路分析和频响分析两种理论方法，介绍了剩余电流与直流块电容值之间的关系。然后，采用12个不同直流块电容(0.5pF ~ 10nF)的测试电路提取仿真和测量结果。通过模拟IEC 61000-4-2波形的SPICE (Simulation Program with Integrated Circuits Emphasis)瞬态分析和应用系统级ESD模拟器的测量测试设置表明，使用最低直流块电容的测试电路比其他测试电路更不容易受到影响。因此，减小直流块电容的值有助于降低ESD的破坏性影响。
{"title":"Investigating the Effect of the DC Block Capacitor on Residual Current in a System-Level ESD-Protected Circuit","authors":"Emadodin Zia Khodadadian","doi":"10.1109/MEMC.2023.10201442","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10201442","url":null,"abstract":"This work aims to delve into the DC (Direct Current) block capacitor effect on the residual current in a system-level ESD (Electrostatic Discharge)-protected circuit. First, the relation between the residual current and DC block capacitor value has been introduced by applying two theoretical methods: circuit analysis and frequency response analysis. Then, a test circuit with 12 different DC block capacitors (0.5pF to 10nF) is employed to extract simulation and measurement results. Both SPICE (Simulation Program with Integrated Circuits Emphasis) transient analysis by simulating the IEC 61000-4-2 waveform and the measurement test setup by applying a system-level ESD simulator reveals that a test circuit with the lowest DC block capacitor is more unsusceptible than others. As a result, decreasing the value of the DC block capacitor can help reduce the destructive effect of ESD.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"12 1","pages":"39-45"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489815","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/memc.2023.10201366
J. N. Tripathi
When modeling differential signal propagation in a two-conductor transmission line over ground, it is convenient to express the propagation as the sum of two orthogonal modes, common-mode and differential mode. These TEM modes propagate independently as long as there is no change in the electrical balance of the three-conductor configuration. Any change in the electrical balance results in an exchange of power between the two modes at the point of the discontinuity. This effect can be precisely modeled using simple load resistances and dependent sources.
{"title":"Signal Integrity and Power Integrity","authors":"J. N. Tripathi","doi":"10.1109/memc.2023.10201366","DOIUrl":"https://doi.org/10.1109/memc.2023.10201366","url":null,"abstract":"When modeling differential signal propagation in a two-conductor transmission line over ground, it is convenient to express the propagation as the sum of two orthogonal modes, common-mode and differential mode. These TEM modes propagate independently as long as there is no change in the electrical balance of the three-conductor configuration. Any change in the electrical balance results in an exchange of power between the two modes at the point of the discontinuity. This effect can be precisely modeled using simple load resistances and dependent sources.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":"35-35"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62490021","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/memc.2023.10201430
D. Hoolihan
{"title":"Background Information on the Founders of the EMC Society Since the Society's Founding in 1957","authors":"D. Hoolihan","doi":"10.1109/memc.2023.10201430","DOIUrl":"https://doi.org/10.1109/memc.2023.10201430","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62490042","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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