Pub Date : 2023-01-01DOI: 10.1109/memc.2023.10201438
Vignesh Rajamani
Hello and welcome to Issue 2 of 2023! I want to keep you abreast on the developments in “Quarter 2” within our EMC Society.
大家好，欢迎来到2023年第2期!我想让你们了解EMC协会“第二季度”的最新进展。
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Pub Date : 2023-01-01DOI: 10.1109/MEMC.2023.10134760
E. Bogatin
Scattering or S-parameters, have been used in RF applications for more than 70 years [1]. However, it has only been in the last 30 years they have been used extensively in high-speed digital applications, such as signal integrity, power integrity and EMC, and then only slowly accepted by the general community.
{"title":"S-Parameters for High Speed Digital Engineers: A Beginner's Guide","authors":"E. Bogatin","doi":"10.1109/MEMC.2023.10134760","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10134760","url":null,"abstract":"Scattering or S-parameters, have been used in RF applications for more than 70 years [1]. However, it has only been in the last 30 years they have been used extensively in high-speed digital applications, such as signal integrity, power integrity and EMC, and then only slowly accepted by the general community.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/memc.2023.10136442
B. Archambeault, S. Scearce, J. Diepenbrock, Sam Wang
Typical university education focuses on ‘inductors’ not ‘inductance’. However, it is the inductance that determines the EMC and Power Integrity (PI) performance and to some degree, inductance affects signal integrity (SI). When inductance is discussed, there is usually a number of equations, equivalent circuits, and even simulations, etc. to try and help the student understand the concept of inductance.
{"title":"Seeing is Believing (Inductance in PCBs)","authors":"B. Archambeault, S. Scearce, J. Diepenbrock, Sam Wang","doi":"10.1109/memc.2023.10136442","DOIUrl":"https://doi.org/10.1109/memc.2023.10136442","url":null,"abstract":"Typical university education focuses on ‘inductors’ not ‘inductance’. However, it is the inductance that determines the EMC and Power Integrity (PI) performance and to some degree, inductance affects signal integrity (SI). When inductance is discussed, there is usually a number of equations, equivalent circuits, and even simulations, etc. to try and help the student understand the concept of inductance.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/MEMC.2023.10135170
K. See
Electrostatic discharge (ESD) can affect the performance of an electronic product and one of the ESD coupling paths to the electronic circuit is through the interfacing cables of the product. The first paper, “Extraction of a SPICE Model for Investigating the Cable Discharge Event in Flat Ribbon Cables Based on Transmission Line Theory,” develops a SPICE model for the cable discharge event (CDE) with specific focus on flat ribbon cables (FRCs), which are widely used in many electronic products. The proposed method can also be expanded to the other types of cables to evaluate CDE. With the equivalent circuit, it allows early evaluation of the product's ESD immunity before final design and compliance test.
{"title":"Practical Papers, Articles and Application Notes","authors":"K. See","doi":"10.1109/MEMC.2023.10135170","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10135170","url":null,"abstract":"Electrostatic discharge (ESD) can affect the performance of an electronic product and one of the ESD coupling paths to the electronic circuit is through the interfacing cables of the product. The first paper, “Extraction of a SPICE Model for Investigating the Cable Discharge Event in Flat Ribbon Cables Based on Transmission Line Theory,” develops a SPICE model for the cable discharge event (CDE) with specific focus on flat ribbon cables (FRCs), which are widely used in many electronic products. The proposed method can also be expanded to the other types of cables to evaluate CDE. With the equivalent circuit, it allows early evaluation of the product's ESD immunity before final design and compliance test.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/memc.2023.10136456
Patrick DeRoy
{"title":"Young Professional Activities at 2023 IEEE International Symposium on EMC+SIPI in Grand Rapids","authors":"Patrick DeRoy","doi":"10.1109/memc.2023.10136456","DOIUrl":"https://doi.org/10.1109/memc.2023.10136456","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489882","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/memc.2023.10201433
Tzong-Lin Wu
The IEEE Transactions on Electromagnetic Compatibility (EMC) established a program to recognize the voluntary work of our reviewers, which is fundamental to maintaining the highest standards of the Transactions on EMC.
{"title":"IEEE Transactions on Electromagnetic Compatibility: Reviewer Appreciation Program","authors":"Tzong-Lin Wu","doi":"10.1109/memc.2023.10201433","DOIUrl":"https://doi.org/10.1109/memc.2023.10201433","url":null,"abstract":"The IEEE Transactions on Electromagnetic Compatibility (EMC) established a program to recognize the voluntary work of our reviewers, which is fundamental to maintaining the highest standards of the Transactions on EMC.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135784650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-01-01DOI: 10.1109/memc.2023.10201902
{"title":"Letter from the Editor","authors":"","doi":"10.1109/memc.2023.10201902","DOIUrl":"https://doi.org/10.1109/memc.2023.10201902","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135829207","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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