首页 > 最新文献

IEEE electromagnetic compatibility magazine最新文献

英文 中文
Save the Date! 2023 IEEE EMC+SIPI Symposium 保存日期!2023 IEEE EMC+SIPI研讨会
Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9872435
{"title":"Save the Date! 2023 IEEE EMC+SIPI Symposium","authors":"","doi":"10.1109/memc.2022.9872435","DOIUrl":"https://doi.org/10.1109/memc.2022.9872435","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488824","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Student EMC Hardware Design Contest 2022 学生EMC硬件设计竞赛2022
Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9982537
Pavithrakrishnan Radhakrishnan
{"title":"Student EMC Hardware Design Contest 2022","authors":"Pavithrakrishnan Radhakrishnan","doi":"10.1109/memc.2022.9982537","DOIUrl":"https://doi.org/10.1109/memc.2022.9982537","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Industry Luminaries Presenting in Spokane 业界杰出人士在斯波坎发表演讲
Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780336
{"title":"Industry Luminaries Presenting in Spokane","authors":"","doi":"10.1109/memc.2022.9780336","DOIUrl":"https://doi.org/10.1109/memc.2022.9780336","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488931","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Wiley-IEEE Press: Call for Book Authors on EMC Theory and Practice Wiley-IEEE出版社:EMC理论与实践图书作者征集
Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780340
{"title":"Wiley-IEEE Press: Call for Book Authors on EMC Theory and Practice","authors":"","doi":"10.1109/memc.2022.9780340","DOIUrl":"https://doi.org/10.1109/memc.2022.9780340","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489022","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMC Compo 2021 - Online Edition Organized from KU Leuven Bruges Campus EMC Compo 2021-在线版由鲁汶大学布鲁日分校组织
Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9873831
D. Pissoort
{"title":"EMC Compo 2021 - Online Edition Organized from KU Leuven Bruges Campus","authors":"D. Pissoort","doi":"10.1109/memc.2022.9873831","DOIUrl":"https://doi.org/10.1109/memc.2022.9873831","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Homage to Heinrich Hertz 向海因里希·赫兹致敬
Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780287
D. Forfar
g “In his 1870 Presidential Address to the Mathematical and Physical Section of the British Association for the Advancement of Science, the great Clerk Maxwell spoke of, as an undecided question, whether electromagnetic phenomena are due to ‘direct action at a distance’ or ‘the action of an intervening medium’. The year, 1888, will ever be memorable as the year in which this great question has been experimentally decided by Hertz...” Professor G.F. Fitzgerald, President, in 1888, of the Mathematical and Physical Section of the British Association for the Advancement of Science
“在1870年对英国科学促进会数学和物理分会主席的演讲中,伟大的克拉克·麦克斯韦谈到了一个悬而未决的问题,即电磁现象是由于‘远距离的直接作用’还是‘中间介质的作用’。1888年将永远值得纪念,因为在这一年,赫兹通过实验解决了这个伟大的问题……”G.F. Fitzgerald教授,1888年英国科学促进会数学和物理分会主席
{"title":"Homage to Heinrich Hertz","authors":"D. Forfar","doi":"10.1109/memc.2022.9780287","DOIUrl":"https://doi.org/10.1109/memc.2022.9780287","url":null,"abstract":"g “In his 1870 Presidential Address to the Mathematical and Physical Section of the British Association for the Advancement of Science, the great Clerk Maxwell spoke of, as an undecided question, whether electromagnetic phenomena are due to ‘direct action at a distance’ or ‘the action of an intervening medium’. The year, 1888, will ever be memorable as the year in which this great question has been experimentally decided by Hertz...” Professor G.F. Fitzgerald, President, in 1888, of the Mathematical and Physical Section of the British Association for the Advancement of Science","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488334","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
You're Invited! Opportunities to Attend Standards and Technical Community Activities in August 2022 你邀请!2022年8月参加标准和技术社区活动的机会
Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780298
R. Carlton
{"title":"You're Invited! Opportunities to Attend Standards and Technical Community Activities in August 2022","authors":"R. Carlton","doi":"10.1109/memc.2022.9780298","DOIUrl":"https://doi.org/10.1109/memc.2022.9780298","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488340","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Numerical Evaluation of the HEMP Diffusion into Buried Infrastructures 埋地基础设施中HEMP扩散的数值评价
Pub Date : 2022-01-01 DOI: 10.1109/MEMC.2022.10058848
Nicolas Mora, A. Kaelin, Carlos Romero
The use of High Altitude Electromagnetic Pulses (HEMP) as a threat to society has prompted the scientific community to produce methodologies to address the electromagnetic compatibility (EMC) of installations against radiated and conducted interference with frequency and amplitude ranges that may differ from traditional sources of disturbance, such as lightning, industrial noise, or communications broadcasting. This has led to a trend toward providing more effective modeling strategies for studying the response of large complex systems. The main issues that arise when analyzing such systems are the significant amount of memory and CPU time required to process these simulations and the ability to include physical models of generally neglected components (materials, vents, slots) that are necessary to obtain an accurate description of current distributions [1].
使用高空电磁脉冲(HEMP)作为对社会的威胁,促使科学界制定方法来解决装置的电磁兼容性(EMC),以防止辐射和传导频率和幅度范围的干扰,这些干扰可能不同于传统的干扰源,如闪电、工业噪声或通信广播。这导致了一种趋势,即为研究大型复杂系统的响应提供更有效的建模策略。在分析这类系统时,出现的主要问题是处理这些模拟所需的大量内存和CPU时间,以及包含通常被忽略的组件(材料、通风口、插槽)的物理模型的能力,这些组件是获得当前分布[1]的准确描述所必需的。
{"title":"Numerical Evaluation of the HEMP Diffusion into Buried Infrastructures","authors":"Nicolas Mora, A. Kaelin, Carlos Romero","doi":"10.1109/MEMC.2022.10058848","DOIUrl":"https://doi.org/10.1109/MEMC.2022.10058848","url":null,"abstract":"The use of High Altitude Electromagnetic Pulses (HEMP) as a threat to society has prompted the scientific community to produce methodologies to address the electromagnetic compatibility (EMC) of installations against radiated and conducted interference with frequency and amplitude ranges that may differ from traditional sources of disturbance, such as lightning, industrial noise, or communications broadcasting. This has led to a trend toward providing more effective modeling strategies for studying the response of large complex systems. The main issues that arise when analyzing such systems are the significant amount of memory and CPU time required to process these simulations and the ability to include physical models of generally neglected components (materials, vents, slots) that are necessary to obtain an accurate description of current distributions [1].","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"11 1","pages":"85-93"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Young Professionals EMC — Get Ready to Meet In Person in Spokane! 年轻的专业人士EMC -准备在斯波坎亲自见面!
Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780283
Patrick DeRoy
{"title":"Young Professionals EMC — Get Ready to Meet In Person in Spokane!","authors":"Patrick DeRoy","doi":"10.1109/memc.2022.9780283","DOIUrl":"https://doi.org/10.1109/memc.2022.9780283","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Women in Engineering IEEE工程女性
Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9982539
Mariya Antyufeyeva
{"title":"IEEE Women in Engineering","authors":"Mariya Antyufeyeva","doi":"10.1109/memc.2022.9982539","DOIUrl":"https://doi.org/10.1109/memc.2022.9982539","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
IEEE electromagnetic compatibility magazine
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1