Twin-screw vacuum pumps (TSVPs) are key components in integrated circuit manufacturing processes that operate under high vacuum conditions. Accurately predicting the performance of TSVPs under rarefied gas and thermal deformation effects remains challenging. To address this challenge, this study proposes a coupled thermal-fluid-structure model that integrates a control chamber model, a rarefied gas leakage model, a thermal network model, and a variable thermal channel model. Unlike conventional approaches based on fixed channel dimensions or isothermal assumptions, the proposed model dynamically accounts for gas rarefaction, suction process, discharge backflow, heat transfer, and thermal deformation. This capability enables accurate performance prediction of TSVPs under both cold and thermal states. Temperature distributions and pumping characteristics of the TSVP were experimentally tested. Based on this model, influences of the inlet pressure, thermal and cold states, and channel dimensions on the thermodynamic characteristics and performance of TSVPs were systematically investigated. Results indicate that, as the inlet pressure decreases, an increasing number of chambers sequentially reach their specific ultimate pressure, from the discharge end to the suction end. Thermal deformation gradients, narrowing leakage channels and under-compression simultaneously occur after long-term operation. The leakage of the flat channel increases from 23% on the discharge side to 79% on the suction side. The leakage of the thin slit channel shows the opposite trend, dropping from 63% to 12%. Thin slit channel dimensions should be reduced in low pressure chambers, while flat plate channel dimensions should be reduced in high pressure chambers to optimize efficiency and power consumption.
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