Pub Date : 2025-09-17DOI: 10.1109/JMW.2025.3606534
Z. Cheng;R. Zhou;M. Wang;Y. Wang;T. Yu;J. Yao
In near-field millimeter-wave imaging, the phase processing is crucial. Target randomness challenges phase accuracy. Phase error analysis reveals its origin in inaccurate range parameters. This paper proposes a high-precision phase compensation algorithm to address low phase accuracy and enhance imaging quality of random targets. An imaging window containing a two-dimensional target plane is established using the synthetic aperture radar-range gate localization method. A phase extraction method is proposed to estimate range parameters within this window. Utilizing the initial range parameters of the imaging window, a self-correction function is derived. Subsequent coherent accumulation of this function separates nuisance parameters. The extracted phase factor is then integrated into the imaging algorithm for compensation. Simulation results show the range error within $pm$ 0.5 mm. These tolerances directly improve matched-filtering performance and suppress image artifacts. Experimental validation verifies the algorithm’s capability to achieve both subwavelength-resolution phase compensation and distortion-free imaging in the near-field.
{"title":"High-Precision Phase Compensation Algorithm for Millimeter Wave Radar Near-Field Imaging of Static Random Targets","authors":"Z. Cheng;R. Zhou;M. Wang;Y. Wang;T. Yu;J. Yao","doi":"10.1109/JMW.2025.3606534","DOIUrl":"https://doi.org/10.1109/JMW.2025.3606534","url":null,"abstract":"In near-field millimeter-wave imaging, the phase processing is crucial. Target randomness challenges phase accuracy. Phase error analysis reveals its origin in inaccurate range parameters. This paper proposes a high-precision phase compensation algorithm to address low phase accuracy and enhance imaging quality of random targets. An imaging window containing a two-dimensional target plane is established using the synthetic aperture radar-range gate localization method. A phase extraction method is proposed to estimate range parameters within this window. Utilizing the initial range parameters of the imaging window, a self-correction function is derived. Subsequent coherent accumulation of this function separates nuisance parameters. The extracted phase factor is then integrated into the imaging algorithm for compensation. Simulation results show the range error within <inline-formula><tex-math>$pm$</tex-math></inline-formula> 0.5 mm. These tolerances directly improve matched-filtering performance and suppress image artifacts. Experimental validation verifies the algorithm’s capability to achieve both subwavelength-resolution phase compensation and distortion-free imaging in the near-field.","PeriodicalId":93296,"journal":{"name":"IEEE journal of microwaves","volume":"5 6","pages":"1284-1292"},"PeriodicalIF":4.9,"publicationDate":"2025-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11168828","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145449363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-09DOI: 10.1109/JMW.2025.3595647
Pascal Stadler;Jan Schoepfel;Lars Kleditsch;Christian Geissler;Reinhold Herschel;Ram K. Arumugam;Patrick Wallrath;Klaus Aufinger;Steffen Paul;Nils Pohl;Tobias T. Braun
Dividing a System on Chip (SoC) into multiple smaller chiplets and embedding them into a single package has gained significant traction in recent years through more widespread adoption in digital circuitry. Despite benefits of reduced interference, protection against environmental influences and overcoming the “Interconnection Gap”, its usage in integrated analog circuits fails to match pace with digital designs. Adoption is likely impeded by an over-reliance on single-chip packages as they prioritize high-frequency performance over integration densities. We therefore demonstrate the first modular system approach with an embedded Wafer-Level Ball grid array (eWLB) package that does not compromise on either integration density nor performance. Restricted only by the maximum package dimensions, the number of channels can be adjusted application-specifically. This allows the system to scale down for low-cost, low-power applications while conversely facilitating massive MIMO. Exemplarily, a 4 × 4 radar System in Package (SiP) with five 130 nm B11HFC SiGe chiplets in a small form factor of 7.8 mm × 8.8 mm was manufactured for this work. It contains a central VCO that feeds four transceivers of identical design that can be configured as receivers or transceivers through the package’s layout. The configuration is solely package-based, enabling chip designs to be reused and thus drastically reducing development time. It also permits homogeneous or heterogeneous substitution of the chiplets based on available fabrication facilities and economic considerations. With its 15.6 dBi comb-line antennas, target detection within 76–77 GHz has been verified up to 36 m in range and $pm$30° in azimuth. Adverse to single-chip solutions, this novel chiplet approach splits up temperature hotspots into smaller, localized areas of elevated temperature. While advantageous for the dissipation of heat, it imposes additional challenges thermomechanically as well as electromagnetically. The compromise between performance and reliability is therefore addressed with a detailed examination of the solderball placement and package-to-PCB interfaces.
{"title":"Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package","authors":"Pascal Stadler;Jan Schoepfel;Lars Kleditsch;Christian Geissler;Reinhold Herschel;Ram K. Arumugam;Patrick Wallrath;Klaus Aufinger;Steffen Paul;Nils Pohl;Tobias T. Braun","doi":"10.1109/JMW.2025.3595647","DOIUrl":"https://doi.org/10.1109/JMW.2025.3595647","url":null,"abstract":"Dividing a System on Chip (SoC) into multiple smaller chiplets and embedding them into a single package has gained significant traction in recent years through more widespread adoption in digital circuitry. Despite benefits of reduced interference, protection against environmental influences and overcoming the “Interconnection Gap”, its usage in integrated analog circuits fails to match pace with digital designs. Adoption is likely impeded by an over-reliance on single-chip packages as they prioritize high-frequency performance over integration densities. We therefore demonstrate the first modular system approach with an embedded Wafer-Level Ball grid array (eWLB) package that does not compromise on either integration density nor performance. Restricted only by the maximum package dimensions, the number of channels can be adjusted application-specifically. This allows the system to scale down for low-cost, low-power applications while conversely facilitating massive MIMO. Exemplarily, a 4 × 4 radar System in Package (SiP) with five 130 nm B11HFC SiGe chiplets in a small form factor of 7.8 mm × 8.8 mm was manufactured for this work. It contains a central VCO that feeds four transceivers of identical design that can be configured as receivers or transceivers through the package’s layout. The configuration is solely package-based, enabling chip designs to be reused and thus drastically reducing development time. It also permits homogeneous or heterogeneous substitution of the chiplets based on available fabrication facilities and economic considerations. With its 15.6 dBi comb-line antennas, target detection within 76–77 GHz has been verified up to 36 m in range and <inline-formula><tex-math>$pm$</tex-math></inline-formula>30° in azimuth. Adverse to single-chip solutions, this novel chiplet approach splits up temperature hotspots into smaller, localized areas of elevated temperature. While advantageous for the dissipation of heat, it imposes additional challenges thermomechanically as well as electromagnetically. The compromise between performance and reliability is therefore addressed with a detailed examination of the solderball placement and package-to-PCB interfaces.","PeriodicalId":93296,"journal":{"name":"IEEE journal of microwaves","volume":"5 5","pages":"1071-1081"},"PeriodicalIF":4.9,"publicationDate":"2025-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11154102","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145021240","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-09DOI: 10.1109/JMW.2025.3600802
{"title":"IEEE Journal of Microwaves Information for Authors","authors":"","doi":"10.1109/JMW.2025.3600802","DOIUrl":"https://doi.org/10.1109/JMW.2025.3600802","url":null,"abstract":"","PeriodicalId":93296,"journal":{"name":"IEEE journal of microwaves","volume":"5 5","pages":"C3-C3"},"PeriodicalIF":4.9,"publicationDate":"2025-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11154096","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145021345","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-09DOI: 10.1109/JMW.2025.3600798
{"title":"IEEE Microwave Theory and Technology Society Publication Information","authors":"","doi":"10.1109/JMW.2025.3600798","DOIUrl":"https://doi.org/10.1109/JMW.2025.3600798","url":null,"abstract":"","PeriodicalId":93296,"journal":{"name":"IEEE journal of microwaves","volume":"5 5","pages":"C2-C2"},"PeriodicalIF":4.9,"publicationDate":"2025-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11153967","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145021346","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-09DOI: 10.1109/JMW.2025.3602452
Jiwon Kim;Changhyun Lee;Jinho Yoo;Changkun Park
In this study, we investigate linearity enhancement of a differential cascode CMOS power amplifier (PA). First, the variation of parasitic capacitance in the common-source (CS) transistor, which directly affects IMD3 and AM-PM distortion, is analyzed as a function of input power. Then, second-harmonic generation at the gate node of the common-gate (CG) transistors in the differential structure is examined. It is shown that these second-harmonic components alter the parasitic capacitance of the CS transistors, ultimately degrading the linearity of the PA. Based on this observation, a CMOS PA is proposed that improves linearity by incorporating a second-harmonic filter at the gate node of the CG transistors. The proposed PA is fabricated using a 180-nm RFCMOS process. Measurement results at 2.42 GHz with an 802.11n 64-QAM 20 MHz WLAN modulated signal demonstrate an output power of 21.4 dBm and a power-added efficiency (PAE) of 28.6% at an EVM level of 3.98% .
{"title":"Design of a CMOS Power Amplifier With Improved Linearity Through Second-Harmonic Filtering Based on Parasitic Capacitance Analysis","authors":"Jiwon Kim;Changhyun Lee;Jinho Yoo;Changkun Park","doi":"10.1109/JMW.2025.3602452","DOIUrl":"https://doi.org/10.1109/JMW.2025.3602452","url":null,"abstract":"In this study, we investigate linearity enhancement of a differential cascode CMOS power amplifier (PA). First, the variation of parasitic capacitance in the common-source (CS) transistor, which directly affects IMD3 and AM-PM distortion, is analyzed as a function of input power. Then, second-harmonic generation at the gate node of the common-gate (CG) transistors in the differential structure is examined. It is shown that these second-harmonic components alter the parasitic capacitance of the CS transistors, ultimately degrading the linearity of the PA. Based on this observation, a CMOS PA is proposed that improves linearity by incorporating a second-harmonic filter at the gate node of the CG transistors. The proposed PA is fabricated using a 180-nm RFCMOS process. Measurement results at 2.42 GHz with an 802.11n 64-QAM 20 MHz WLAN modulated signal demonstrate an output power of 21.4 dBm and a power-added efficiency (PAE) of 28.6% at an EVM level of 3.98% .","PeriodicalId":93296,"journal":{"name":"IEEE journal of microwaves","volume":"5 6","pages":"1308-1316"},"PeriodicalIF":4.9,"publicationDate":"2025-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11153789","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145449280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-09DOI: 10.1109/JMW.2025.3603114
Peter H. Siegel
Our September issue is a bit thinner than usual, mostly due to difficulties in getting back reviews over the summer months. We will make up the shortage in our November release. Our papers this month are also a bit more focused on analysis tools and computer learning algorithms than applications – luck of the draw. We hope you can find something interesting to look over and we promise a more balanced and applications-oriented content next issue.
{"title":"Introduction to the September 2025 Issue","authors":"Peter H. Siegel","doi":"10.1109/JMW.2025.3603114","DOIUrl":"https://doi.org/10.1109/JMW.2025.3603114","url":null,"abstract":"Our September issue is a bit thinner than usual, mostly due to difficulties in getting back reviews over the summer months. We will make up the shortage in our November release. Our papers this month are also a bit more focused on analysis tools and computer learning algorithms than applications – luck of the draw. We hope you can find something interesting to look over and we promise a more balanced and applications-oriented content next issue.","PeriodicalId":93296,"journal":{"name":"IEEE journal of microwaves","volume":"5 5","pages":"1028-1040"},"PeriodicalIF":4.9,"publicationDate":"2025-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11154104","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145021183","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-09DOI: 10.1109/JMW.2025.3600995
Azam Al-Rawachy;Alexander Baddeley;Abdalla Eblabla;Dragan Gecan;Aamir Sheikh;Aleksander Bogusz;Roberto Quaglia;Paul J. Tasker
This paper presents a novel experimental technique for automatically identifying the complexity and coefficients of a Cardiff behavioral model of a microwave transistor using a conventional, narrowband active load-pull system. The method ensures the accuracy of the extracted model while eliminating the need for expert human judgment/intervention. The paper details the solutions adopted to overcome the technical challenges of implementing A-pull using a narrowband vector network analyzer-based load-pull system. Specifically, to ensure that the A-pull grid is achieved quickly and accurately, and that it covers a meaningful and safe operating space for the device under test. A gallium nitride (GaN) microwave transistor is characterized and modeled to demonstrate the technique at 2.45 GHz. Results clearly show how the model complexity is automatically identified and accurate coefficients extracted. In addition, the paper demonstrates how to use this approach to allow for a systematic reduction in the number of measured load points without compromising model accuracy, further improving the process’s speed.
{"title":"Automated Cardiff Model Complexity Identification and Parameters Extraction From Measured Tailored A-Pull Data","authors":"Azam Al-Rawachy;Alexander Baddeley;Abdalla Eblabla;Dragan Gecan;Aamir Sheikh;Aleksander Bogusz;Roberto Quaglia;Paul J. Tasker","doi":"10.1109/JMW.2025.3600995","DOIUrl":"https://doi.org/10.1109/JMW.2025.3600995","url":null,"abstract":"This paper presents a novel experimental technique for automatically identifying the complexity and coefficients of a Cardiff behavioral model of a microwave transistor using a conventional, narrowband active load-pull system. The method ensures the accuracy of the extracted model while eliminating the need for expert human judgment/intervention. The paper details the solutions adopted to overcome the technical challenges of implementing A-pull using a narrowband vector network analyzer-based load-pull system. Specifically, to ensure that the A-pull grid is achieved quickly and accurately, and that it covers a meaningful and safe operating space for the device under test. A gallium nitride (GaN) microwave transistor is characterized and modeled to demonstrate the technique at 2.45 GHz. Results clearly show how the model complexity is automatically identified and accurate coefficients extracted. In addition, the paper demonstrates how to use this approach to allow for a systematic reduction in the number of measured load points without compromising model accuracy, further improving the process’s speed.","PeriodicalId":93296,"journal":{"name":"IEEE journal of microwaves","volume":"5 5","pages":"1150-1161"},"PeriodicalIF":4.9,"publicationDate":"2025-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11154107","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145021369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-09DOI: 10.1109/JMW.2025.3600804
{"title":"IEEE Journal of Microwaves Table of Contents","authors":"","doi":"10.1109/JMW.2025.3600804","DOIUrl":"https://doi.org/10.1109/JMW.2025.3600804","url":null,"abstract":"","PeriodicalId":93296,"journal":{"name":"IEEE journal of microwaves","volume":"5 5","pages":"C4-C4"},"PeriodicalIF":4.9,"publicationDate":"2025-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11153966","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145021399","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-09DOI: 10.1109/JMW.2025.3601036
Naim Shandi;Jason M. Merlo;Jeffrey A. Nanzer
We demonstrate distributed beamforming and beamsteering from a six-node distributed phased array using fully wireless coordination with decentralized time synchronization. In wireless applications such as distributed beamforming, high-accuracy time synchronization across the array is crucial for high coherent gain. The decentralized time synchronization method employed is based on the average consensus algorithm and the two-way time transfer method presented in our previous work, which achieved picosecond-level time synchronization with a cabled frequency reference. The system presented in this paper utilizes a centralized wireless frequency transfer method to achieve wireless frequency syntonization in a fully wireless coordination and a distributed computing system architecture. We experimentally evaluate system performance through beamforming and beamsteering to a receiver 16.3 m away from the six-node non-uniformly distributed antenna array, achieving an average coherent gain of 98% of the ideal gain at a carrier frequency of 1.05 GHz. The average time synchronization accuracy achieved was less than 36 ps.
{"title":"Distributed Beamforming Using Decentralized Time Synchronization in a Six-Element Array","authors":"Naim Shandi;Jason M. Merlo;Jeffrey A. Nanzer","doi":"10.1109/JMW.2025.3601036","DOIUrl":"https://doi.org/10.1109/JMW.2025.3601036","url":null,"abstract":"We demonstrate distributed beamforming and beamsteering from a six-node distributed phased array using fully wireless coordination with decentralized time synchronization. In wireless applications such as distributed beamforming, high-accuracy time synchronization across the array is crucial for high coherent gain. The decentralized time synchronization method employed is based on the average consensus algorithm and the two-way time transfer method presented in our previous work, which achieved picosecond-level time synchronization with a cabled frequency reference. The system presented in this paper utilizes a centralized wireless frequency transfer method to achieve wireless frequency syntonization in a fully wireless coordination and a distributed computing system architecture. We experimentally evaluate system performance through beamforming and beamsteering to a receiver 16.3 m away from the six-node non-uniformly distributed antenna array, achieving an average coherent gain of 98% of the ideal gain at a carrier frequency of 1.05 GHz. The average time synchronization accuracy achieved was less than 36 ps.","PeriodicalId":93296,"journal":{"name":"IEEE journal of microwaves","volume":"5 5","pages":"1094-1106"},"PeriodicalIF":4.9,"publicationDate":"2025-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11154106","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145021397","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-01DOI: 10.1109/JMW.2025.3598986
James C. Rautio
Given a measured frequency domain response, it is useful to determine the best fit rational polynomial transfer function and then synthesize a corresponding lumped network. Vector Fitting, an iterative algorithm, is often used for this purpose. Historically, certain avenues of vector fitting research have not been pursued due to numerical precision limitations. Here, we explore one such approach that is closed form, i.e., non-iterative, and is not limited by numerical precision. When a lumped model is desired, we synthesize the best fits of all networks possible that have up to five RLC elements. In the course of this work, a variety of previously unknown relationships between these networks was discovered, including 4651 transforms between these lumped networks. The entire library, closed-form model extraction, and all network-pair transforms have been implemented in MATLAB and is freely available. In conjunction with this work, RLC network transfer functions and networks are explored in terms of group theory.
{"title":"Direct Least-Squares Rational-Polynomial Lumped-Circuit Model Extraction and Group Theory","authors":"James C. Rautio","doi":"10.1109/JMW.2025.3598986","DOIUrl":"https://doi.org/10.1109/JMW.2025.3598986","url":null,"abstract":"Given a measured frequency domain response, it is useful to determine the best fit rational polynomial transfer function and then synthesize a corresponding lumped network. Vector Fitting, an iterative algorithm, is often used for this purpose. Historically, certain avenues of vector fitting research have not been pursued due to numerical precision limitations. Here, we explore one such approach that is closed form, i.e., non-iterative, and is not limited by numerical precision. When a lumped model is desired, we synthesize the best fits of all networks possible that have up to five RLC elements. In the course of this work, a variety of previously unknown relationships between these networks was discovered, including 4651 transforms between these lumped networks. The entire library, closed-form model extraction, and all network-pair transforms have been implemented in MATLAB and is freely available. In conjunction with this work, RLC network transfer functions and networks are explored in terms of group theory.","PeriodicalId":93296,"journal":{"name":"IEEE journal of microwaves","volume":"5 5","pages":"1162-1175"},"PeriodicalIF":4.9,"publicationDate":"2025-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11145767","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145021347","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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