Mobile industry processor interface (MIPI) C-PHY is a signal transmission interface with three-phase encoding technology on the three-wire high-speed channel. The traditional method of superposition to generate an eye diagram on this kind of channel is time-consuming. The novel eye estimation methods for the C-PHY protocol are proposed. A new greedy algorithm and dynamic programming method are proposed to predict the worst-case eye diagram, respectively. The accuracy and efficiency of these two methods are compared. In addition, the algorithms for estimating the statistical eye diagram of MIPI C-PHY with and without considering the driver nonlinearity are also proposed and compared respectively. All the proposed algorithms are validated by experimental measurement. The excellent agreement could be well seen.
{"title":"Eye Estimation Methods for MIPI C-PHY","authors":"Yu-Ying Cheng;Pei-Yang Weng;Suani-Kai Yang;Shih-Hsien Wu;Tzong-Lin Wu","doi":"10.1109/TSIPI.2024.3396436","DOIUrl":"https://doi.org/10.1109/TSIPI.2024.3396436","url":null,"abstract":"Mobile industry processor interface (MIPI) C-PHY is a signal transmission interface with three-phase encoding technology on the three-wire high-speed channel. The traditional method of superposition to generate an eye diagram on this kind of channel is time-consuming. The novel eye estimation methods for the C-PHY protocol are proposed. A new greedy algorithm and dynamic programming method are proposed to predict the worst-case eye diagram, respectively. The accuracy and efficiency of these two methods are compared. In addition, the algorithms for estimating the statistical eye diagram of MIPI C-PHY with and without considering the driver nonlinearity are also proposed and compared respectively. All the proposed algorithms are validated by experimental measurement. The excellent agreement could be well seen.","PeriodicalId":100646,"journal":{"name":"IEEE Transactions on Signal and Power Integrity","volume":"3 ","pages":"75-84"},"PeriodicalIF":0.0,"publicationDate":"2024-03-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140948956","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-02-16DOI: 10.1109/TSIPI.2024.3366499
Vinod Kumar Verma;Jai Narayan Tripathi
This work presents a comprehensive study on the impact of variability on jitter in CMOS integrated circuits. As a case study, an analytical model of a CMOS inverter has been developed, and the input–output relationship is derived considering the effect of power supply noise, variations in design parameters due to fabrication process inaccuracies, and temperature. These parameters are taken as random variables, and the timing deviation in the transition edges of the output response has been modeled analytically. The proposed approach has been validated using numerical examples by comparing results obtained from the proposed analysis with the results obtained from the SPICE-based simulator. A couple of measurement examples and an application case study are also presented to validate the state-of-the-art investigation. The considered examples and application case study suggest the importance of the current study to ensure the timing budget of a system. The proposed approach can be used to estimate critical variability issues affecting the timing budgets of the systems.
{"title":"Variability-Aware Modeling of Power Supply Induced Jitter","authors":"Vinod Kumar Verma;Jai Narayan Tripathi","doi":"10.1109/TSIPI.2024.3366499","DOIUrl":"https://doi.org/10.1109/TSIPI.2024.3366499","url":null,"abstract":"This work presents a comprehensive study on the impact of variability on jitter in CMOS integrated circuits. As a case study, an analytical model of a CMOS inverter has been developed, and the input–output relationship is derived considering the effect of power supply noise, variations in design parameters due to fabrication process inaccuracies, and temperature. These parameters are taken as random variables, and the timing deviation in the transition edges of the output response has been modeled analytically. The proposed approach has been validated using numerical examples by comparing results obtained from the proposed analysis with the results obtained from the SPICE-based simulator. A couple of measurement examples and an application case study are also presented to validate the state-of-the-art investigation. The considered examples and application case study suggest the importance of the current study to ensure the timing budget of a system. The proposed approach can be used to estimate critical variability issues affecting the timing budgets of the systems.","PeriodicalId":100646,"journal":{"name":"IEEE Transactions on Signal and Power Integrity","volume":"3 ","pages":"47-55"},"PeriodicalIF":0.0,"publicationDate":"2024-02-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140291213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-02-06DOI: 10.1109/TSIPI.2024.3362317
Quankun Chen;Hanzhi Ma;Da Li;Tuomin Tao;Shurun Tan;En-Xiao Liu;Jose Schutt-Aine;Er-Ping Li
This article introduces a comprehensive approach for designing and analyzing signal integrity in heterogeneous integrated systems that incorporate neuromorphic Darwin chips. The proposed integrated system architecture includes a neuromorphic Darwin chip, digital signal processing unit, microcontroller unit, field programmable gate arrays, and coding and decoding modules to encode and reconstruct analog spiking signals. The study evaluates the encoding module and the heterogeneous integration structure and conducts signal integrity analysis. To achieve optimal signal integrity performance, the article proposes a novel binocular eye diagram analysis technique. This innovative approach guides the encoding algorithm modification and improves the overall system performance. This research is the first to combine joint field-circuit simulation, heterogeneous integration modeling, and signal integrity analysis of the Darwin neuromorphic chip, and it is expected to serve as a valuable reference for future studies on similar systems.
{"title":"Hybrid Signal Integrity Modeling and Analysis of Heterogeneous Integrated System With Neuromorphic Darwin Chip","authors":"Quankun Chen;Hanzhi Ma;Da Li;Tuomin Tao;Shurun Tan;En-Xiao Liu;Jose Schutt-Aine;Er-Ping Li","doi":"10.1109/TSIPI.2024.3362317","DOIUrl":"https://doi.org/10.1109/TSIPI.2024.3362317","url":null,"abstract":"This article introduces a comprehensive approach for designing and analyzing signal integrity in heterogeneous integrated systems that incorporate neuromorphic Darwin chips. The proposed integrated system architecture includes a neuromorphic Darwin chip, digital signal processing unit, microcontroller unit, field programmable gate arrays, and coding and decoding modules to encode and reconstruct analog spiking signals. The study evaluates the encoding module and the heterogeneous integration structure and conducts signal integrity analysis. To achieve optimal signal integrity performance, the article proposes a novel binocular eye diagram analysis technique. This innovative approach guides the encoding algorithm modification and improves the overall system performance. This research is the first to combine joint field-circuit simulation, heterogeneous integration modeling, and signal integrity analysis of the Darwin neuromorphic chip, and it is expected to serve as a valuable reference for future studies on similar systems.","PeriodicalId":100646,"journal":{"name":"IEEE Transactions on Signal and Power Integrity","volume":"3 ","pages":"37-46"},"PeriodicalIF":0.0,"publicationDate":"2024-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139987179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-02-05DOI: 10.1109/TSIPI.2024.3361863
Ze Sun;Jian Liu;Xiaoyan Xiong;DongHyun Kim;Daryl Beetner;Victor Khilkevich
The intentional roughness created on conductor surfaces during the printed circuit board (PCB) manufacturing process leads to a substantial increase of conductor loss at frequencies in the order of tens of gigahertz. It is essential to know the roughness of PCB conductors to create adequate models of the high-speed channels. This article presents a novel method for extracting the roughness level of conductor foils using only measured S -parameters and cross-sectional information. The proposed technique is relatively easy to perform, cost-effective, and does not require the destruction of test boards, making it a promising alternative to existing methods that rely on optical or scanning electron microscope imaging. Besides, the proposed method can handle boards with nonequal roughness on different conductor surfaces, which is common in PCBs. The method is validated through both simulation and measurement, and a good correlation is achieved between the extracted roughness level and the values obtained by microscopic imaging.
在印刷电路板（PCB）制造过程中，导体表面有意产生的粗糙度导致导体损耗在数十兆赫兹的频率下大幅增加。了解印刷电路板导体的粗糙度对于建立适当的高速通道模型至关重要。本文介绍了一种仅使用测量的 S 参数和横截面信息来提取导体箔粗糙度的新方法。所提出的技术操作相对简单，成本效益高，而且不需要破坏测试电路板，因此有望替代依赖光学或扫描电子显微镜成像的现有方法。此外，所提出的方法还能处理不同导体表面粗糙度不均等的电路板，这在印刷电路板中很常见。该方法通过模拟和测量进行了验证，提取的粗糙度水平与显微镜成像获得的值之间具有良好的相关性。
{"title":"Extraction of Transmission Line Surface Roughness Using S-Parameter Measurements and Cross-Sectional Information","authors":"Ze Sun;Jian Liu;Xiaoyan Xiong;DongHyun Kim;Daryl Beetner;Victor Khilkevich","doi":"10.1109/TSIPI.2024.3361863","DOIUrl":"https://doi.org/10.1109/TSIPI.2024.3361863","url":null,"abstract":"The intentional roughness created on conductor surfaces during the printed circuit board (PCB) manufacturing process leads to a substantial increase of conductor loss at frequencies in the order of tens of gigahertz. It is essential to know the roughness of PCB conductors to create adequate models of the high-speed channels. This article presents a novel method for extracting the roughness level of conductor foils using only measured \u0000<italic>S</i>\u0000-parameters and cross-sectional information. The proposed technique is relatively easy to perform, cost-effective, and does not require the destruction of test boards, making it a promising alternative to existing methods that rely on optical or scanning electron microscope imaging. Besides, the proposed method can handle boards with nonequal roughness on different conductor surfaces, which is common in PCBs. The method is validated through both simulation and measurement, and a good correlation is achieved between the extracted roughness level and the values obtained by microscopic imaging.","PeriodicalId":100646,"journal":{"name":"IEEE Transactions on Signal and Power Integrity","volume":"3 ","pages":"30-36"},"PeriodicalIF":0.0,"publicationDate":"2024-02-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139916584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The power-aware input/output buffer information specification (IBIS) model does not correctly account for the delay change caused by supply-voltage noise. This article presents a new modification algorithm that improves the accuracy of the IBIS model by including the power-supply-induced jitter (PSIJ) sensitivity effect; more specifically, the dc-jitter-sensitivity effect. The procedure of extracting the key parameters and modifying the switching coefficients is presented and applied in a real design. The performance of the modified IBIS model is validated using two designs, and the simulation accuracy is improved significantly compared with that of the traditional IBIS model. The improved IBIS model is applicable to situations when there is dc or ac noise on the power rail. The predriver propagation delay can also be characterized in the simulation by including the predriver PSIJ effect. The algorithm is efficient while straightforward and easily implemented by introducing just one parameter to the IBIS model.
{"title":"IBIS Model Simulation Accuracy Improvement by Including Power-Supply-Induced Jitter Effect","authors":"Yifan Ding;Yin Sun;Randy Wolff;Zhiping Yang;Chulsoon Hwang","doi":"10.1109/TSIPI.2023.3349229","DOIUrl":"https://doi.org/10.1109/TSIPI.2023.3349229","url":null,"abstract":"The power-aware input/output buffer information specification (IBIS) model does not correctly account for the delay change caused by supply-voltage noise. This article presents a new modification algorithm that improves the accuracy of the IBIS model by including the power-supply-induced jitter (PSIJ) sensitivity effect; more specifically, the dc-jitter-sensitivity effect. The procedure of extracting the key parameters and modifying the switching coefficients is presented and applied in a real design. The performance of the modified IBIS model is validated using two designs, and the simulation accuracy is improved significantly compared with that of the traditional IBIS model. The improved IBIS model is applicable to situations when there is dc or ac noise on the power rail. The predriver propagation delay can also be characterized in the simulation by including the predriver PSIJ effect. The algorithm is efficient while straightforward and easily implemented by introducing just one parameter to the IBIS model.","PeriodicalId":100646,"journal":{"name":"IEEE Transactions on Signal and Power Integrity","volume":"3 ","pages":"21-29"},"PeriodicalIF":0.0,"publicationDate":"2024-01-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139710539","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-28DOI: 10.1109/TSIPI.2023.3348197
{"title":"2023 Index IEEE Transactions on Signal and Power Integrity Vol. 2","authors":"","doi":"10.1109/TSIPI.2023.3348197","DOIUrl":"https://doi.org/10.1109/TSIPI.2023.3348197","url":null,"abstract":"","PeriodicalId":100646,"journal":{"name":"IEEE Transactions on Signal and Power Integrity","volume":"2 ","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2023-12-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10375861","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139060271","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-21DOI: 10.1109/TSIPI.2023.3343021
{"title":"IEEE Electromagnetic Compatibility Society Information","authors":"","doi":"10.1109/TSIPI.2023.3343021","DOIUrl":"https://doi.org/10.1109/TSIPI.2023.3343021","url":null,"abstract":"","PeriodicalId":100646,"journal":{"name":"IEEE Transactions on Signal and Power Integrity","volume":"3 ","pages":"C2-C2"},"PeriodicalIF":0.0,"publicationDate":"2023-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10368591","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139034234","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-05DOI: 10.1109/TSIPI.2023.3339445
Ze Sun;Jian Liu;Xiaoyan Xiong;DongHyun Kim;Daryl Beetner;Victor Khilkevich
Transmission lines with meshed return planes offer enhanced flexibility but can introduce signal integrity challenges. Characterizing such transmission lines using full-wave simulation is accurate but time and resource intensive. In response, an efficient modeling method using 2-D analysis is proposed in this article. First, cross sections of the transmission line are taken at multiple locations to create a sampled representation of the changing geometry. The per-unit-length (PUL) RLGC parameters of each segment are obtained using 2-D analysis. The value of the inductance obtained from the 2-D analysis is then modified to account for the position-dependent current direction on the return plane. Finally, the segments are cascaded together to obtain the $S$ -parameters of the transmission line. The results obtained using this method closely align with those from 3-D full-wave simulations, demonstrating the effectiveness and efficiency of the proposed approach.
{"title":"Characterization of a Microstrip Line Referenced to a Meshed Return Plane Using 2-D Analysis","authors":"Ze Sun;Jian Liu;Xiaoyan Xiong;DongHyun Kim;Daryl Beetner;Victor Khilkevich","doi":"10.1109/TSIPI.2023.3339445","DOIUrl":"https://doi.org/10.1109/TSIPI.2023.3339445","url":null,"abstract":"Transmission lines with meshed return planes offer enhanced flexibility but can introduce signal integrity challenges. Characterizing such transmission lines using full-wave simulation is accurate but time and resource intensive. In response, an efficient modeling method using 2-D analysis is proposed in this article. First, cross sections of the transmission line are taken at multiple locations to create a sampled representation of the changing geometry. The per-unit-length (PUL) RLGC parameters of each segment are obtained using 2-D analysis. The value of the inductance obtained from the 2-D analysis is then modified to account for the position-dependent current direction on the return plane. Finally, the segments are cascaded together to obtain the \u0000<inline-formula><tex-math>$S$</tex-math></inline-formula>\u0000-parameters of the transmission line. The results obtained using this method closely align with those from 3-D full-wave simulations, demonstrating the effectiveness and efficiency of the proposed approach.","PeriodicalId":100646,"journal":{"name":"IEEE Transactions on Signal and Power Integrity","volume":"3 ","pages":"13-20"},"PeriodicalIF":0.0,"publicationDate":"2023-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139034232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-11-22DOI: 10.1109/TSIPI.2023.3335330
Joshua A. Rosenau;Aldo W. Morales;Sedig S. Agili;Truong X. Tran
Compared to differential signaling, single-ended signaling is significantly more susceptible to far-end crosstalk; however, single-ended communication is still the preferred data transfer method to use in high-density applications, such as in double data rate (DDR) systems. It has been shown that for loosely coupled single-ended transmission lines, far-end crosstalk (FEXT) on a victim line is proportional to a scaled negative derivative of the far-end signal on the aggressor line; thus, a variety of crosstalk derivative cancelation techniques have been developed. However, when channels are tightly coupled, the derivative cancelation method fails, thus preventing its use at higher data rates. In this article, we examine the derivative-based crosstalk-cancelation technique, and then provide reasons as to why it fails at higher data rates and develop a rule establishing when it can be used. We also propose the use of a time delay neural network crosstalk canceler (NNXC) to cancel FEXT. The proposed crosstalk canceler can operate at significantly higher data rates than cancelers using the derivative-based method. The NNXC can also be used in systems with multiple tightly spaced channels, which is not possible using the derivative method. Furthermore, when a clock signal is available, such as in DDR systems, it can be used as part of the network's training sequence–––significantly improving the performance of the NNXC in reducing far-end crosstalk. Several simulations are shown depicting the superior performance of the NNXC canceler, including in a realistic DDR5 channel with tightly coupled lines.
{"title":"Using Neural Networks for Far-End Crosstalk Compensation in High-Speed MIMO Channels","authors":"Joshua A. Rosenau;Aldo W. Morales;Sedig S. Agili;Truong X. Tran","doi":"10.1109/TSIPI.2023.3335330","DOIUrl":"https://doi.org/10.1109/TSIPI.2023.3335330","url":null,"abstract":"Compared to differential signaling, single-ended signaling is significantly more susceptible to far-end crosstalk; however, single-ended communication is still the preferred data transfer method to use in high-density applications, such as in double data rate (DDR) systems. It has been shown that for loosely coupled single-ended transmission lines, far-end crosstalk (FEXT) on a victim line is proportional to a scaled negative derivative of the far-end signal on the aggressor line; thus, a variety of crosstalk derivative cancelation techniques have been developed. However, when channels are tightly coupled, the derivative cancelation method fails, thus preventing its use at higher data rates. In this article, we examine the derivative-based crosstalk-cancelation technique, and then provide reasons as to why it fails at higher data rates and develop a rule establishing when it can be used. We also propose the use of a time delay neural network crosstalk canceler (NNXC) to cancel FEXT. The proposed crosstalk canceler can operate at significantly higher data rates than cancelers using the derivative-based method. The NNXC can also be used in systems with multiple tightly spaced channels, which is not possible using the derivative method. Furthermore, when a clock signal is available, such as in DDR systems, it can be used as part of the network's training sequence–––significantly improving the performance of the NNXC in reducing far-end crosstalk. Several simulations are shown depicting the superior performance of the NNXC canceler, including in a realistic DDR5 channel with tightly coupled lines.","PeriodicalId":100646,"journal":{"name":"IEEE Transactions on Signal and Power Integrity","volume":"3 ","pages":"1-12"},"PeriodicalIF":0.0,"publicationDate":"2023-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138633934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-10-25DOI: 10.1109/TSIPI.2023.3327228
Li-Ching Huang;Tzong-Lin Wu
Recently, a novel power delivery network (PDN) noise absorber with low | S 21 | is proposed to match the radial port impedance of the incident cylindrical wave, thus preventing high-frequency power noise transmission and further avoiding the cavity resonances at the noise source end. Despite the excellent performance, no analytical formulas can quantify the improvements, and an optimized solution derived more scientifically to minimize power noises is expected. Therefore, this article dives into the cylindrical wave theory and constructs a contour-plot-based methodology for designing the optimized PDN noise absorbers. To validate the proposed method, parallel plates with a ring of optimized PDN noise absorbers are implemented, leading to 6.2% lower self impedance and up to 45.6% lower transfer impedance at 5.5 GHz when compared with the previous fully-matched absorbers’ case. All the measured results agree well with the theory and full-wave simulated results.
{"title":"Theory-Based Contour Plot Analysis for Optimized Power Delivery Network Noise Absorber","authors":"Li-Ching Huang;Tzong-Lin Wu","doi":"10.1109/TSIPI.2023.3327228","DOIUrl":"https://doi.org/10.1109/TSIPI.2023.3327228","url":null,"abstract":"Recently, a novel power delivery network (PDN) noise absorber with low |\u0000<italic>S</i>\u0000<sub>21</sub>\u0000| is proposed to match the radial port impedance of the incident cylindrical wave, thus preventing high-frequency power noise transmission and further avoiding the cavity resonances at the noise source end. Despite the excellent performance, no analytical formulas can quantify the improvements, and an optimized solution derived more scientifically to minimize power noises is expected. Therefore, this article dives into the cylindrical wave theory and constructs a contour-plot-based methodology for designing the optimized PDN noise absorbers. To validate the proposed method, parallel plates with a ring of optimized PDN noise absorbers are implemented, leading to 6.2% lower self impedance and up to 45.6% lower transfer impedance at 5.5 GHz when compared with the previous fully-matched absorbers’ case. All the measured results agree well with the theory and full-wave simulated results.","PeriodicalId":100646,"journal":{"name":"IEEE Transactions on Signal and Power Integrity","volume":"2 ","pages":"134-144"},"PeriodicalIF":0.0,"publicationDate":"2023-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"109157517","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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