Precise and efficient plasma etching processes are key in fabricating next-generation semiconductor memory devices. However, further research is warranted on the selective etching of TiN and W electrode materials over the Hf0.5Zr0.5O2 (HZO) layer, particularly regarding the patterning of metal–ferroelectric–metal (MFM) device structures. This study aimed to improve the etch selectivity between TiN or W electrodes over HZO ferroelectric thin films for next-generation semiconductor memory device fabrication. To this end, we systematically analyzed dry etching characteristics by using Ar/CF4/O2/H2-based plasma. Specifically, we optimized process parameters, such as the RF power, process pressure, CF4/(Ar + CF4) gas mixing ratio, and addition ratios of O2 or H2, to achieve high etch selectivity between the TiN or W electrode films and HZO films. Under optimized conditions (an Ar:CF4 ratio of 7:3, RF power of 75 W, and process pressure of 120 mTorr), the etch selectivity for TiN/HZO and W/HZO reached maximum values of 142 and 332, respectively, demonstrating excellent performance. Furthermore, the addition of O2 enabled control over the etch rates of the TiN and W films and their selectivity over HZO films. Langmuir probe analysis and optical emission spectroscopy confirmed the enhancement in the chemical etching of the TiN and W electrodes due to the generation of F radicals. X-ray photoelectron spectroscopy analysis revealed the formation of fluorides on the etched film surfaces and an increase in the number of surface defects. The findings of this plasma etching study will potentially aid the advancement of fabrication technologies for ferroelectric memory devices.
扫码关注我们
求助内容:
应助结果提醒方式:
