Efficient thermal regulation of compact electronic devices remains a critical challenge as power densities continue to increase, necessitating effective passive cooling solutions. In PCM-based thermal management systems, the discharge cycle is just as important as the charging cycle, but it is often not studied enough. This work experimentally investigates in detail four different configurations of a heat sink (HS) with a phase change material (PCM): (i) a PCM-filled heat sink (PHS), (ii) a PCM-filled finned heat sink (PFHS), (iii) a PCM-filled finned heat sink integrated with a heat pipe (PFHSHP), and (iv) a PCM-filled finned heat sink coupled with a finned heat pipe (PFHSFHP). Docosane is the selected phase change material, and the tests are carried out at different power inputs (6, 8, 10, and 12 W) and controlled surrounding temperatures (24, 26, and 28 °C). The findings reveal that thermal performance depends to a large extent on the configuration and ambient conditions, and better performance is achieved at surrounding temperature of 24 °C. Among the investigated designs, the PFHSFHP configuration consistently exhibits the best charging and discharging performance across all operating conditions. For example, at an 8 W power level and ST = 28 °C, the percentage improvement in charging time in PFHSFHP compared to PHS, PFHS, and PFHSHP is 35.49 %, 34.06 %, and 27.54 % respectively. Under the same conditions, the percentage reduction in discharging time is 30.94 %, 18.78 %, and 11.99 % respectively. The performance increase is mainly due to better heat spreading and faster heat rejection, which were made possible by the finned condenser section of the heat pipe, which maintained a higher thermal driving potential during both the melting and solidification of the PCM. Energy-based thermodynamic analysis further confirms the dominant role of the heat pipe in heat transport, particularly during the discharging phase. In summary, the PFHSFHP setup is a powerful and reliable passive thermal management method that can be utilized for the next generation of miniaturized electronic devices, offering extended thermal buffering, accelerated heat dissipation, and enhanced operational stability.
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