H. Abusalma, A. Dasgupta, A. Bujanda, Jian Yu, H. Tsang
In this paper, the drop durability of printed hybrid electronic (PHE) assemblies of various form factors is studied under extreme drop conditions with accelerations up to 20,000 G. Test specimens considered here include: circular disk, cantilever beam, and hemispherical dome samples. The disk is made from a UV hardened resin material and mounted using a 3-point fixture. This specimen experienced overstress fracture at 20,000 G drops. Additionally, it was very susceptible to repetitive drop failure. The failure site was at the expected site of maximum flexure, as revealed by finite element modeling and by high-speed video recording. The cantilever beam is a standard 1.6 mm thick FR4 substrate with printed silver traces. The substrate was durable but suffered from high strains near the clamp which are expected to cause damage to the silver conductive traces printed on them. The beam specimen was instrumented with strain gages and was also subjected to high-speed video recording of the drop event. The beam was found to vibrate in its first two bending modes when dropped at 10,000 G. The hemispherical substrates for the dome specimens were made from several different polymeric materials and were mounted in a threaded fixture. Drop durability varied with choice of substrate material and fabrication method. Some showed catastrophic failures after 1–5 drops at 20,000 Gs while some survived more than 50 drops at 20,000 G. The failure site for all failed dome specimens was at the threads used for mounting to the fixture.
{"title":"Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level","authors":"H. Abusalma, A. Dasgupta, A. Bujanda, Jian Yu, H. Tsang","doi":"10.1115/ipack2022-97382","DOIUrl":"https://doi.org/10.1115/ipack2022-97382","url":null,"abstract":"\u0000 In this paper, the drop durability of printed hybrid electronic (PHE) assemblies of various form factors is studied under extreme drop conditions with accelerations up to 20,000 G. Test specimens considered here include: circular disk, cantilever beam, and hemispherical dome samples.\u0000 The disk is made from a UV hardened resin material and mounted using a 3-point fixture. This specimen experienced overstress fracture at 20,000 G drops. Additionally, it was very susceptible to repetitive drop failure. The failure site was at the expected site of maximum flexure, as revealed by finite element modeling and by high-speed video recording.\u0000 The cantilever beam is a standard 1.6 mm thick FR4 substrate with printed silver traces. The substrate was durable but suffered from high strains near the clamp which are expected to cause damage to the silver conductive traces printed on them. The beam specimen was instrumented with strain gages and was also subjected to high-speed video recording of the drop event. The beam was found to vibrate in its first two bending modes when dropped at 10,000 G.\u0000 The hemispherical substrates for the dome specimens were made from several different polymeric materials and were mounted in a threaded fixture. Drop durability varied with choice of substrate material and fabrication method. Some showed catastrophic failures after 1–5 drops at 20,000 Gs while some survived more than 50 drops at 20,000 G. The failure site for all failed dome specimens was at the threads used for mounting to the fixture.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126677077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Karthik Arun Deo, R. Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park
Estimation of the thermal fatigue life of solder joints and identification of parameters that enhance the fatigue life are important steps in the development stage of BGA packages. In this study, different parameters of Sn-Ag-Cu 305 BGA (Ball Grid Array) solder balls are investigated to understand their impact on the number of cycles to failure under thermal fatigue life tests. Initially, accelerated thermal cycling fatigue tests on two electronic packages were conducted by three different vendors and it was observed that the results were significantly different. The first part of this study dwells into understanding the influence of parameters such as the solder mask design; SMD and NSMD, the variation in the solder ball geometry, copper pad thickness and diameter and material properties of the PCB on the accelerated thermal cycling performance of the BGA packages. The later part deals with understanding the root cause for the variation in the estimated life of two BGA packages by the three different vendors.
{"title":"A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints","authors":"Karthik Arun Deo, R. Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park","doi":"10.1115/ipack2022-97253","DOIUrl":"https://doi.org/10.1115/ipack2022-97253","url":null,"abstract":"\u0000 Estimation of the thermal fatigue life of solder joints and identification of parameters that enhance the fatigue life are important steps in the development stage of BGA packages. In this study, different parameters of Sn-Ag-Cu 305 BGA (Ball Grid Array) solder balls are investigated to understand their impact on the number of cycles to failure under thermal fatigue life tests. Initially, accelerated thermal cycling fatigue tests on two electronic packages were conducted by three different vendors and it was observed that the results were significantly different. The first part of this study dwells into understanding the influence of parameters such as the solder mask design; SMD and NSMD, the variation in the solder ball geometry, copper pad thickness and diameter and material properties of the PCB on the accelerated thermal cycling performance of the BGA packages. The later part deals with understanding the root cause for the variation in the estimated life of two BGA packages by the three different vendors.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115005553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Beihan Zhao, Aniket Bharamgonda, E. Jennings, R. G. Utter, M. Osterman, M. Azarian, Siddhartha Das, A. Dasgupta, J. Fleischer, Edwin Quinn, D. Hines
In this study, temperature-humidity-bias (THB) testing and water droplet (WD) testing have been conducted to study electro-chemical migration (ECM) and dendrite formation across features in aerosol jet printed (AJP) conductor patterns. Test specimen design and testing conditions were guided by industrial standards and related research studies. Time-to-failure (TTF) for AJP printed silver patterns is found to be much smaller than that for conventional copper patterns in THB testing, under identical testing conditions. Furthermore, TTF for dendrite growth between neighboring biased conductors at constant temperature and humidity conditions was found to have a non-monotonic dependence on the electric potential gradient. The dendrite density was found to vary significantly with different applied voltage gradients in both THB testing and WD testing. Those observations can help to guide future investigation and life-prediction modeling of AJP printed electronics subjected to combined temperature, humidity, and voltage stresses.
{"title":"Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods","authors":"Beihan Zhao, Aniket Bharamgonda, E. Jennings, R. G. Utter, M. Osterman, M. Azarian, Siddhartha Das, A. Dasgupta, J. Fleischer, Edwin Quinn, D. Hines","doi":"10.1115/ipack2022-92306","DOIUrl":"https://doi.org/10.1115/ipack2022-92306","url":null,"abstract":"\u0000 In this study, temperature-humidity-bias (THB) testing and water droplet (WD) testing have been conducted to study electro-chemical migration (ECM) and dendrite formation across features in aerosol jet printed (AJP) conductor patterns. Test specimen design and testing conditions were guided by industrial standards and related research studies. Time-to-failure (TTF) for AJP printed silver patterns is found to be much smaller than that for conventional copper patterns in THB testing, under identical testing conditions. Furthermore, TTF for dendrite growth between neighboring biased conductors at constant temperature and humidity conditions was found to have a non-monotonic dependence on the electric potential gradient. The dendrite density was found to vary significantly with different applied voltage gradients in both THB testing and WD testing. Those observations can help to guide future investigation and life-prediction modeling of AJP printed electronics subjected to combined temperature, humidity, and voltage stresses.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115406720","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Mirza, Xiaoqiang Xu, A. Emon, F. Luo, Shikui Chen
This paper proposes a three-face utilized heat sink design for a 3-D integrated SiC-based 75 kVA Intelligent Power Stage (IPS). The structure enables maximum utilization of the heat sink where all three faces of the heat sink are utilized to hold the power devices. For loss estimation from power devices, Model Based Optimization (MBO), an efficiency calculation algorithm, is developed to estimate power loss at 75 kVA for the IPS, which needs to be dissipated efficiently by the heat sink. Further for simplified and cost-effective heat sink fabrication, cylindrical holes are considered to replace conventional fins. A parametric analysis is performed using SOLIDWORKS to determine optimum number of holes for efficient heat spreading and airflow. The simulation results show that heat sink based on cylindrical holes is effective in keeping the MOSFET die temperature under 120 °C in continuous operation, with 35% reduction heat sink volume compared with the conventional single-sided cooled design.
提出了一种基于sic的三维集成75 kVA智能电源级(IPS)的三面利用散热器设计方案。该结构能够最大限度地利用散热器，其中散热器的所有三个面都用于容纳功率器件。针对功率器件的损耗估算，提出了一种基于模型优化(Model Based Optimization, MBO)的效率计算算法，用于估算需由散热器有效散热的75 kVA时的IPS功耗。进一步简化和成本效益的散热器制造，圆柱孔被认为取代传统的翅片。利用SOLIDWORKS进行了参数分析，以确定有效散热和气流的最佳孔数。仿真结果表明，基于圆柱孔的散热片可以有效地将MOSFET芯片温度保持在120°C以下，与传统的单面散热设计相比，散热片体积减少35%。
{"title":"A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)","authors":"A. Mirza, Xiaoqiang Xu, A. Emon, F. Luo, Shikui Chen","doi":"10.1115/ipack2022-97886","DOIUrl":"https://doi.org/10.1115/ipack2022-97886","url":null,"abstract":"\u0000 This paper proposes a three-face utilized heat sink design for a 3-D integrated SiC-based 75 kVA Intelligent Power Stage (IPS). The structure enables maximum utilization of the heat sink where all three faces of the heat sink are utilized to hold the power devices. For loss estimation from power devices, Model Based Optimization (MBO), an efficiency calculation algorithm, is developed to estimate power loss at 75 kVA for the IPS, which needs to be dissipated efficiently by the heat sink. Further for simplified and cost-effective heat sink fabrication, cylindrical holes are considered to replace conventional fins. A parametric analysis is performed using SOLIDWORKS to determine optimum number of holes for efficient heat spreading and airflow. The simulation results show that heat sink based on cylindrical holes is effective in keeping the MOSFET die temperature under 120 °C in continuous operation, with 35% reduction heat sink volume compared with the conventional single-sided cooled design.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123160326","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yangyang Lai, Chongyang Cai, K. Pan, Junbo Yang, J. Ha, Pengcheng Yin, K. Deo, Seungbae Park
In this paper, an experimental approach is presented to investigate the influence of second level underfill on the thermomechanical behavior of two BGA packages during thermal cycles. Two different flip chip packages with two major underfill reinforcement methods (corner bonding and full bottom surface bonding) and no-underfill were studied. To quantitatively measure the deformation of solder balls, all the BGA packages were cross-sectioned before thermal cycles. The two-dimensional digital image correlation (DIC) technique was used to capture the in-plane deformation of the critical solder ball in thermal cycling intervals. The accumulated plastic strain of the BGA solder was calculated after every 10 thermal cycles. The temperature of each cycle was set from −40 to 100 °C at a 20°C/second rate. The experiment results showed that Package A with fully underfilled and corner underfilled both alleviated the averaged plastic strain on the critical solder ball in comparison with the no-underfilled Package A. However, Package B with corners underfilled had a larger plastic strain than the package without underfill. The material properties of underfill applied in the two reinforcement methods are identical. The results indicate that inappropriate underfilling methods can adversely affect the thermomechanical reliability of the packages. The underfill material and reinforcement methods are associated with the stiffness rigidity and the compact CTE of the package itself. In the respect of thermomechanical reliability, second level underfilling should be individually specified for varied packages.
{"title":"Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods","authors":"Yangyang Lai, Chongyang Cai, K. Pan, Junbo Yang, J. Ha, Pengcheng Yin, K. Deo, Seungbae Park","doi":"10.1115/ipack2022-97349","DOIUrl":"https://doi.org/10.1115/ipack2022-97349","url":null,"abstract":"\u0000 In this paper, an experimental approach is presented to investigate the influence of second level underfill on the thermomechanical behavior of two BGA packages during thermal cycles. Two different flip chip packages with two major underfill reinforcement methods (corner bonding and full bottom surface bonding) and no-underfill were studied. To quantitatively measure the deformation of solder balls, all the BGA packages were cross-sectioned before thermal cycles. The two-dimensional digital image correlation (DIC) technique was used to capture the in-plane deformation of the critical solder ball in thermal cycling intervals. The accumulated plastic strain of the BGA solder was calculated after every 10 thermal cycles. The temperature of each cycle was set from −40 to 100 °C at a 20°C/second rate. The experiment results showed that Package A with fully underfilled and corner underfilled both alleviated the averaged plastic strain on the critical solder ball in comparison with the no-underfilled Package A. However, Package B with corners underfilled had a larger plastic strain than the package without underfill. The material properties of underfill applied in the two reinforcement methods are identical. The results indicate that inappropriate underfilling methods can adversely affect the thermomechanical reliability of the packages. The underfill material and reinforcement methods are associated with the stiffness rigidity and the compact CTE of the package itself. In the respect of thermomechanical reliability, second level underfilling should be individually specified for varied packages.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127812695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, A. Lakshminarayana, Harold Miyamura, Gautam Gupta, D. Agonafer, Jeremy Rodriguez
Increasing demands for cloud-based computing and storage, Internet-of-Things, and machine learning-based applications have necessitated the utilization of more efficient cooling technologies. Direct-to-chip liquid cooling using cold plates has proven to be one of the most efficient methods to dissipate the high heat fluxes of modern high-power CPUs and GPUs. While the published literature has well-documented research on the thermal aspects of direct liquid cooling, a detailed account of transient hydraulic investigation is still missing. In this experiment, a total of four 52U racks with four high-power TTV-servers (Thermal Test Vehicles) in each rack were designed and deployed. Each server consists of eight GPU TTVs and six NV switch heaters. Each of the two racks has a different vendor rack manifold and cooling loop modules (CLM). A 450 kW coolant distribution unit (CDU) is used to supply 25% propylene glycol coolant to these racks. Each rack has its own rack-level flow control valve to maintain the same flow rate. The present study provides an in-depth analysis of hydraulic transients when rack-level flow control valves are used with and without flow control. The operating conditions of the CDU are varied for different parameters, such as a constant flow rate, constant differential pressure, and constant pump speed. Furthermore, hydraulic transient is examined when the cooling loop modules are decommissioned from the rack one by one. The effect of this step-by-step decommissioning is assessed on the CDU operation and other racks. The pressure drop-based control strategy has been developed to maintain the same flow rate in the remaining servers in the rack when some cooling loop modules are decommissioned.
{"title":"Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment","authors":"A. Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, A. Lakshminarayana, Harold Miyamura, Gautam Gupta, D. Agonafer, Jeremy Rodriguez","doi":"10.1115/ipack2022-97425","DOIUrl":"https://doi.org/10.1115/ipack2022-97425","url":null,"abstract":"\u0000 Increasing demands for cloud-based computing and storage, Internet-of-Things, and machine learning-based applications have necessitated the utilization of more efficient cooling technologies. Direct-to-chip liquid cooling using cold plates has proven to be one of the most efficient methods to dissipate the high heat fluxes of modern high-power CPUs and GPUs. While the published literature has well-documented research on the thermal aspects of direct liquid cooling, a detailed account of transient hydraulic investigation is still missing. In this experiment, a total of four 52U racks with four high-power TTV-servers (Thermal Test Vehicles) in each rack were designed and deployed. Each server consists of eight GPU TTVs and six NV switch heaters. Each of the two racks has a different vendor rack manifold and cooling loop modules (CLM). A 450 kW coolant distribution unit (CDU) is used to supply 25% propylene glycol coolant to these racks. Each rack has its own rack-level flow control valve to maintain the same flow rate. The present study provides an in-depth analysis of hydraulic transients when rack-level flow control valves are used with and without flow control. The operating conditions of the CDU are varied for different parameters, such as a constant flow rate, constant differential pressure, and constant pump speed. Furthermore, hydraulic transient is examined when the cooling loop modules are decommissioned from the rack one by one. The effect of this step-by-step decommissioning is assessed on the CDU operation and other racks. The pressure drop-based control strategy has been developed to maintain the same flow rate in the remaining servers in the rack when some cooling loop modules are decommissioned.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122757373","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
G. Moreno, J. Major, D. DeVoto, F. Khan, S. Narumanchi, Xuhui Feng, P. Paret
This project describes the modeling process to design the packaging and heat exchanger for a half-bridge wide-bandgap (WBG) power semiconductor module. The module uses two silicon carbide, metal-oxide-semiconductor field-effect transistor (MOSFET) devices per switch position that are soldered to an aluminum nitride, direct-bond copper (DBC) substrate. A baseplate cooling configuration (e.g., no thermal grease) is used along with a water-ethylene glycol, jet-impingement-style heat exchanger. The heat exchanger was designed to be fabricated using prototyping equipment from the National Renewable Energy Laboratory, complies with automotive standards (for minimal channel sizes, flow rates, and coolant), and considers reliability aspects (i.e., erosion/corrosion). Device-scale computational fluid dynamics (CFD) is used first to design the slot jet impingement cooling configuration and compute the effective heat transfer coefficient (HTC) of the concept. The computed HTCs are then used as boundary conditions for a finite element study to optimize the package geometry (e.g., device layout and baseplate thickness) to minimize thermal resistance and minimize temperature variation between the module’s four devices. Finally, a fluid manifold is designed to generate the slot jets and cool the devices. Module-scale CFD predicts a relatively low junction-to-fluid thermal resistance of 16.7 mm2·K/W, a 1.4°C temperature variation between devices, and a total pressure drop of 5,860 Pa (0.85 psi) for the design. The thermal resistance of the module design is about 67% lower than the 2015 BMW i3 power electronics/modules thermal resistance.
本课题描述了半桥宽带隙(WBG)功率半导体模块的封装和热交换器的建模过程。该模块在每个开关位置使用两个碳化硅，金属氧化物半导体场效应晶体管(MOSFET)器件，焊接到氮化铝，直接键合铜(DBC)衬底上。底板冷却配置(例如，无导热油脂)与水-乙二醇射流撞击式热交换器一起使用。热交换器的设计是使用国家可再生能源实验室的原型设备制造的，符合汽车标准(最小通道尺寸，流速和冷却剂)，并考虑可靠性方面(即侵蚀/腐蚀)。首先利用设备级计算流体力学(CFD)设计了槽射流冲击冷却构型，并计算了该概念的有效传热系数(HTC)。然后，计算出的htc用作有限元研究的边界条件，以优化封装几何形状(例如，器件布局和底板厚度)，以最小化热阻，并最小化模块四个器件之间的温度变化。最后，设计了一个流体歧管来产生槽射流并冷却设备。模块规模的CFD预测，该设计的结液热阻相对较低，为16.7 mm2·K/W，器件之间的温度变化为1.4°C，总压降为5,860 Pa (0.85 psi)。该模块设计的热阻比2015款BMW i3电力电子/模块热阻降低约67%。
{"title":"Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module","authors":"G. Moreno, J. Major, D. DeVoto, F. Khan, S. Narumanchi, Xuhui Feng, P. Paret","doi":"10.1115/ipack2022-97283","DOIUrl":"https://doi.org/10.1115/ipack2022-97283","url":null,"abstract":"\u0000 This project describes the modeling process to design the packaging and heat exchanger for a half-bridge wide-bandgap (WBG) power semiconductor module. The module uses two silicon carbide, metal-oxide-semiconductor field-effect transistor (MOSFET) devices per switch position that are soldered to an aluminum nitride, direct-bond copper (DBC) substrate. A baseplate cooling configuration (e.g., no thermal grease) is used along with a water-ethylene glycol, jet-impingement-style heat exchanger. The heat exchanger was designed to be fabricated using prototyping equipment from the National Renewable Energy Laboratory, complies with automotive standards (for minimal channel sizes, flow rates, and coolant), and considers reliability aspects (i.e., erosion/corrosion). Device-scale computational fluid dynamics (CFD) is used first to design the slot jet impingement cooling configuration and compute the effective heat transfer coefficient (HTC) of the concept. The computed HTCs are then used as boundary conditions for a finite element study to optimize the package geometry (e.g., device layout and baseplate thickness) to minimize thermal resistance and minimize temperature variation between the module’s four devices. Finally, a fluid manifold is designed to generate the slot jets and cool the devices. Module-scale CFD predicts a relatively low junction-to-fluid thermal resistance of 16.7 mm2·K/W, a 1.4°C temperature variation between devices, and a total pressure drop of 5,860 Pa (0.85 psi) for the design. The thermal resistance of the module design is about 67% lower than the 2015 BMW i3 power electronics/modules thermal resistance.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"685 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132584056","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this paper, predictive models are developed for inkjet printed features regarding their electrical and mechanical performance and to help reduce the initial process time in selecting print parameters. Printed electronics are continuously getting immense interest with a steady increase in its areas of end applications. The process generally involves controlled deposition of material on a substrate to additively build the required structure. Due to the nature of additive printing, benefits such as reduced time to manufacturing and the possibility of flexible and conformable electronics can be easily achievable. Under the umbrella term of additive printing, Inkjet printing is one technique that is sometimes known as the workforce of mass manufacturing due to the number of nozzles ranging in hundreds or even thousands, with which it can print the structures. The process, also known as drop-on-demand, involves the deposition of liquid ink droplets as per the required structure. However, for deposition, inkjet requires control of certain process parameters that impact the print resolution and, thus, the printed material properties. Thus, it is important to have a predictive framework that helps select those significant parameters. Silver Nanoparticle-based ink is utilized that is compatible with the viscosity range allowed in the printer. For the predictive framework development, a statistical approach is implemented that consists of a design-of-experiments (DOE) matrix with significant parameters that have a major impact on the resolution and properties of the material. The study’s response variables consist of the printed feature’s electrical and mechanical properties. The aim of this study is to provide statistical models that can be used with Inkjet process parameters as an input to predict the properties of the final printed feature.
{"title":"Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits","authors":"P. Lall, Kartik Goyal, Scott Miller","doi":"10.1115/ipack2022-97428","DOIUrl":"https://doi.org/10.1115/ipack2022-97428","url":null,"abstract":"\u0000 In this paper, predictive models are developed for inkjet printed features regarding their electrical and mechanical performance and to help reduce the initial process time in selecting print parameters. Printed electronics are continuously getting immense interest with a steady increase in its areas of end applications. The process generally involves controlled deposition of material on a substrate to additively build the required structure. Due to the nature of additive printing, benefits such as reduced time to manufacturing and the possibility of flexible and conformable electronics can be easily achievable. Under the umbrella term of additive printing, Inkjet printing is one technique that is sometimes known as the workforce of mass manufacturing due to the number of nozzles ranging in hundreds or even thousands, with which it can print the structures. The process, also known as drop-on-demand, involves the deposition of liquid ink droplets as per the required structure. However, for deposition, inkjet requires control of certain process parameters that impact the print resolution and, thus, the printed material properties. Thus, it is important to have a predictive framework that helps select those significant parameters. Silver Nanoparticle-based ink is utilized that is compatible with the viscosity range allowed in the printer. For the predictive framework development, a statistical approach is implemented that consists of a design-of-experiments (DOE) matrix with significant parameters that have a major impact on the resolution and properties of the material. The study’s response variables consist of the printed feature’s electrical and mechanical properties. The aim of this study is to provide statistical models that can be used with Inkjet process parameters as an input to predict the properties of the final printed feature.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129276966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
P. Lall, Shriram K. Kulkarni, Ved Soni, Kartik Goyal, Scott Miller
A closed-loop deep learning approach for correlating the print parameters with realized electrical performance and geometry estimations on an inkjet platform has been presented in this paper. An estimate of the changes in the print parameters and the recognized print dimension is necessary to print reliable and fine conductive traces. The inks used for this analysis are both particle and particle-free silver inks, and the comparison of the same is also studied. A closed-loop control algorithm is used to attain the desired electrical and geometrical values by changing the print parameters without any user intervention. Sensing is achieved by an automatic print parameter sensing system using a camera that captures the print to identify the geometry and dimension of the same. Once the realized print parameters are determined, a deep learning neural network regression model based on these parameters is used to predict the desired input print parameters, which are used to achieve the desired geometry and dimension of the print. These new parameter values are passed on to the printing software to optimize the print and attain the desired geometry and characteristics.
{"title":"Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform","authors":"P. Lall, Shriram K. Kulkarni, Ved Soni, Kartik Goyal, Scott Miller","doi":"10.1115/ipack2022-97437","DOIUrl":"https://doi.org/10.1115/ipack2022-97437","url":null,"abstract":"\u0000 A closed-loop deep learning approach for correlating the print parameters with realized electrical performance and geometry estimations on an inkjet platform has been presented in this paper. An estimate of the changes in the print parameters and the recognized print dimension is necessary to print reliable and fine conductive traces. The inks used for this analysis are both particle and particle-free silver inks, and the comparison of the same is also studied. A closed-loop control algorithm is used to attain the desired electrical and geometrical values by changing the print parameters without any user intervention. Sensing is achieved by an automatic print parameter sensing system using a camera that captures the print to identify the geometry and dimension of the same. Once the realized print parameters are determined, a deep learning neural network regression model based on these parameters is used to predict the desired input print parameters, which are used to achieve the desired geometry and dimension of the print. These new parameter values are passed on to the printing software to optimize the print and attain the desired geometry and characteristics.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122218807","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
F. Liu, S. Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang
The restriction of hazardous substances directive is an environmental directive being passed by the European Union in February 2003. It was scheduled to be effective from on July 1, 2006. It mainly aims at product ingredients and engineering process standards in manufacturing. Any electrical and electronic equipment contains hazardous substances over the regulated limitation will not be allowed to be offered on the market in European Union. Mar 31, 2015, European Union issued a directive to add four new restrictions on the concentration of phthalates that were Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP) and Diisobutyl phthalate (DIBP). The limitation of concentration by weight is 0.1% for each substance. The phthalates which are used as plasticizers to be used in indirectly material as dicing tape for the semiconductor industry. Many related researches mentioned that temperature and time effects on the migration of DEHP, which means the product existed the risk to be contaminated. Therefore, DEHP is phased out from indirectly material to evaluate DEHP-free indirectly material. The manufacture result is shown in this study to evaluate new indirectly material without DEHP.
{"title":"RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study","authors":"F. Liu, S. Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang","doi":"10.1115/ipack2022-97175","DOIUrl":"https://doi.org/10.1115/ipack2022-97175","url":null,"abstract":"\u0000 The restriction of hazardous substances directive is an environmental directive being passed by the European Union in February 2003. It was scheduled to be effective from on July 1, 2006. It mainly aims at product ingredients and engineering process standards in manufacturing. Any electrical and electronic equipment contains hazardous substances over the regulated limitation will not be allowed to be offered on the market in European Union. Mar 31, 2015, European Union issued a directive to add four new restrictions on the concentration of phthalates that were Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP) and Diisobutyl phthalate (DIBP). The limitation of concentration by weight is 0.1% for each substance.\u0000 The phthalates which are used as plasticizers to be used in indirectly material as dicing tape for the semiconductor industry. Many related researches mentioned that temperature and time effects on the migration of DEHP, which means the product existed the risk to be contaminated. Therefore, DEHP is phased out from indirectly material to evaluate DEHP-free indirectly material. The manufacture result is shown in this study to evaluate new indirectly material without DEHP.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116308158","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：