首页 > 最新文献

Third Annual IEEE Proceedings on ASIC Seminar and Exhibit最新文献

英文 中文
Elements of VHDL for description of hardware: a tutorial view 描述硬件的VHDL元素:教程视图
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186076
Z. Navabi
An introduction to hardware description languages, a discussion of the emergence of VHDL as the standard HDL, and an overview of the VHDL language are given. The constructs of VHDL for design and modeling of hardware are emphasized. An overview of VHDL is given by use of a simple example which is broken into subcomponents, each of which is described at various levels of abstraction. Advanced features of VHDL are discussed, and corresponding examples are presented. These examples are used in the bottom-up design of a complete circuit.<>
介绍了硬件描述语言,讨论了VHDL作为标准HDL的出现,并概述了VHDL语言。着重介绍了用于硬件设计和建模的VHDL语言的结构。通过使用一个简单的示例来概述VHDL,该示例被分解为子组件,每个子组件都在不同的抽象级别上进行描述。讨论了VHDL的高级特性,并给出了相应的实例。这些例子用于自底向上的完整电路设计。
{"title":"Elements of VHDL for description of hardware: a tutorial view","authors":"Z. Navabi","doi":"10.1109/ASIC.1990.186076","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186076","url":null,"abstract":"An introduction to hardware description languages, a discussion of the emergence of VHDL as the standard HDL, and an overview of the VHDL language are given. The constructs of VHDL for design and modeling of hardware are emphasized. An overview of VHDL is given by use of a simple example which is broken into subcomponents, each of which is described at various levels of abstraction. Advanced features of VHDL are discussed, and corresponding examples are presented. These examples are used in the bottom-up design of a complete circuit.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133125889","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Designing IEEE Std 1149.1 into your semiconductor products 在您的半导体产品中设计IEEE标准1149.1
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186184
A. Cron
A basic tutorial and design guide for ASIC designers building devices that conform to the IEEE Std 1149.1 architecture is presented. The circuits and concepts presented can be expanded upon for use in more complex implementations. This paper is intended to be used in conjunction with the IEEE 1149.1 specification. Implementation guidance and the specification provided rules governing proper design are presented.<>
为ASIC设计人员构建符合IEEE标准1149.1体系结构的器件提供了基本教程和设计指南。所提出的电路和概念可以扩展到更复杂的实现中。本文旨在与IEEE 1149.1规范一起使用。给出了实现指南和规范,提供了规范正确设计的规则
{"title":"Designing IEEE Std 1149.1 into your semiconductor products","authors":"A. Cron","doi":"10.1109/ASIC.1990.186184","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186184","url":null,"abstract":"A basic tutorial and design guide for ASIC designers building devices that conform to the IEEE Std 1149.1 architecture is presented. The circuits and concepts presented can be expanded upon for use in more complex implementations. This paper is intended to be used in conjunction with the IEEE 1149.1 specification. Implementation guidance and the specification provided rules governing proper design are presented.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"182 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128323749","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SPIL-a program to automatically create ASIC macro models for logic simulation 自动创建用于逻辑仿真的ASIC宏模型的程序
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186121
B. Harrington
A program that automatically created emitter-coupled logic ECL and current-mode logic (CML) gate array macro models for several logic simulators is described. The program extracts the logic netlist from SPICE ECL or CML netlists, assigns timing delays supplied from external flies, optimizes the netlist and creates logic simulation models for the DAZIX's DLS, Mentor Graphic's QuickSim, and Zycad's MACH 1000 logic simulators.<>
介绍了一种为几种逻辑模拟器自动创建发射体耦合逻辑ECL和电流模逻辑(CML)门阵列宏模型的程序。该程序从SPICE ECL或CML网络列表中提取逻辑网络列表,分配外部飞行提供的时序延迟,优化网络列表并为DAZIX的DLS, Mentor Graphic的QuickSim和Zycad的MACH 1000逻辑模拟器创建逻辑仿真模型
{"title":"SPIL-a program to automatically create ASIC macro models for logic simulation","authors":"B. Harrington","doi":"10.1109/ASIC.1990.186121","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186121","url":null,"abstract":"A program that automatically created emitter-coupled logic ECL and current-mode logic (CML) gate array macro models for several logic simulators is described. The program extracts the logic netlist from SPICE ECL or CML netlists, assigns timing delays supplied from external flies, optimizes the netlist and creates logic simulation models for the DAZIX's DLS, Mentor Graphic's QuickSim, and Zycad's MACH 1000 logic simulators.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126975458","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Autonomous test scheme for analog ASICs 模拟asic的自主测试方案
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186145
Nai-Chi Lee
Analog autonomous test (AAT) is a structured design-for-testability methodology for mixed analog/digital ICs. By using analog switches and test-bus to gain controllability and observability, a chip is partitioned into testable submodules for production testing. Therefore, both test vector development period and production test time can be reduced.<>
模拟自主测试(AAT)是一种用于混合模拟/数字集成电路的结构化可测试性设计方法。通过模拟开关和测试总线获得芯片的可控性和可观察性,将芯片划分为可测试子模块进行生产测试。因此,测试载体的开发周期和生产测试时间都可以缩短
{"title":"Autonomous test scheme for analog ASICs","authors":"Nai-Chi Lee","doi":"10.1109/ASIC.1990.186145","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186145","url":null,"abstract":"Analog autonomous test (AAT) is a structured design-for-testability methodology for mixed analog/digital ICs. By using analog switches and test-bus to gain controllability and observability, a chip is partitioned into testable submodules for production testing. Therefore, both test vector development period and production test time can be reduced.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126062289","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Direct access test scheme-implementation and verification in embedded ASIC designs 嵌入式ASIC设计中直接存取测试方案的实现与验证
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186177
V. Immaneni, D. Puffer, S. Raman
The direct access test scheme (DATS) that eliminates the designer's burden of embedded block cell test generation is discussed. This scheme provides for testing of embedded block cells using proven test vectors. The implementation and automatic verification of DATS in ASIC designs is discussed.<>
讨论了直接存取测试方案(DATS),该方案消除了设计者生成嵌入式块单元测试的负担。该方案提供了测试嵌入块细胞使用成熟的测试载体。讨论了DATS在ASIC设计中的实现和自动验证。
{"title":"Direct access test scheme-implementation and verification in embedded ASIC designs","authors":"V. Immaneni, D. Puffer, S. Raman","doi":"10.1109/ASIC.1990.186177","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186177","url":null,"abstract":"The direct access test scheme (DATS) that eliminates the designer's burden of embedded block cell test generation is discussed. This scheme provides for testing of embedded block cells using proven test vectors. The implementation and automatic verification of DATS in ASIC designs is discussed.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121854678","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Economic implications of logic synthesis 逻辑综合的经济含义
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186206
V. Grimblatt-Hinzpeter, C. Morrison, R. S. Finley
An overview of logic synthesis and the different methodologies used in the tools realizing synthesis is presented. The objective is to show the economic implications of synthesis (performance and area of the chip, design time, silicon costs, etc.). The mainstream methodology used in synthesis tools and the possible applications are presented. Future methodologies and some ideas for the reduction of chip costs using the existing tools and possible future tools are discussed.<>
概述了逻辑综合和在实现综合的工具中使用的不同方法。目的是显示合成的经济影响(芯片的性能和面积,设计时间,硅成本等)。介绍了合成工具中使用的主流方法及其可能的应用。讨论了利用现有工具和可能的未来工具降低芯片成本的未来方法和一些想法。
{"title":"Economic implications of logic synthesis","authors":"V. Grimblatt-Hinzpeter, C. Morrison, R. S. Finley","doi":"10.1109/ASIC.1990.186206","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186206","url":null,"abstract":"An overview of logic synthesis and the different methodologies used in the tools realizing synthesis is presented. The objective is to show the economic implications of synthesis (performance and area of the chip, design time, silicon costs, etc.). The mainstream methodology used in synthesis tools and the possible applications are presented. Future methodologies and some ideas for the reduction of chip costs using the existing tools and possible future tools are discussed.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122025916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An economic comparison of telecommunication system design costs utilizing a modular design approach 采用模块化设计方法的电信系统设计成本的经济比较
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186088
A. Kozak, V. Little, K. Huscroft
A modular ASIC system design approach for telecommunications equipment is compared with system design utilizing conventional ASIC design approaches and standard products. The modular design approach utilizes telecom system blocks (TSBs) which are predesigned and tested telecommunication functions contained in a megacell or netlist format which represent system functions as viewed by the systems designer and have proven compliance to industry standards. The economics of each methodology are analyzed with respect to three major phases of a product's life, which include design and development, production, and cost reduction and evolution to a new generation of product.<>
将模块化的电信设备专用集成电路系统设计方法与采用常规专用集成电路设计方法和标准产品的系统设计方法进行了比较。模块化设计方法利用电信系统模块(tsb),这些模块是预先设计和测试的电信功能,包含在一个megacell或网表格式中,代表系统设计者所看到的系统功能,并且已被证明符合行业标准。每种方法的经济学都是根据产品生命周期的三个主要阶段进行分析的,这三个阶段包括设计和开发、生产、成本降低和新一代产品的演变
{"title":"An economic comparison of telecommunication system design costs utilizing a modular design approach","authors":"A. Kozak, V. Little, K. Huscroft","doi":"10.1109/ASIC.1990.186088","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186088","url":null,"abstract":"A modular ASIC system design approach for telecommunications equipment is compared with system design utilizing conventional ASIC design approaches and standard products. The modular design approach utilizes telecom system blocks (TSBs) which are predesigned and tested telecommunication functions contained in a megacell or netlist format which represent system functions as viewed by the systems designer and have proven compliance to industry standards. The economics of each methodology are analyzed with respect to three major phases of a product's life, which include design and development, production, and cost reduction and evolution to a new generation of product.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127135413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
An automated, structured layout methodology for staggered pad, I/O-bound ASIC design 一种自动化的,结构化的布局方法,用于交错焊盘,I/ o绑定ASIC设计
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186167
L.Y. Lu, M. D. Alston
A design methodology developed and implemented for high-pin-count cell-based BiCMOS ASIC designs is discussed. Described is the orchestration of different vendors' CAD tools via tool-specific shell scripts, macros, file reformatting/conversion software and application software to methodically place and route I/O pad cells, I/O circuit cells, and core logic megacells, rapidly completing the correct-by-construction layout of a staggered-pad, I/O-bound ASIC.<>
讨论了基于高引脚计数单元的BiCMOS ASIC设计的设计方法。描述了通过特定于工具的shell脚本、宏、文件重新格式化/转换软件和应用软件对不同供应商的CAD工具进行编排,以系统地放置和路由I/O垫单元、I/O电路单元和核心逻辑单元,快速完成错开垫、I/O绑定ASIC的正确构造布局
{"title":"An automated, structured layout methodology for staggered pad, I/O-bound ASIC design","authors":"L.Y. Lu, M. D. Alston","doi":"10.1109/ASIC.1990.186167","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186167","url":null,"abstract":"A design methodology developed and implemented for high-pin-count cell-based BiCMOS ASIC designs is discussed. Described is the orchestration of different vendors' CAD tools via tool-specific shell scripts, macros, file reformatting/conversion software and application software to methodically place and route I/O pad cells, I/O circuit cells, and core logic megacells, rapidly completing the correct-by-construction layout of a staggered-pad, I/O-bound ASIC.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129450942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design trade-offs when implementing boundary scan in an application specific integrated circuit 在应用特定集成电路中实现边界扫描时设计权衡
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186153
T.W. Moxon
The design tradeoffs encountered when implementing a ASIC design that incorporates boundary scan logic are discussed. Boundary scan logic can improve both the device- and system-level testability. The designer, however, must weigh the impact on silicon area, performance, routability, and implementation time to achieve the optimum design solution.<>
讨论了在实现集成边界扫描逻辑的ASIC设计时所遇到的设计权衡。边界扫描逻辑可以提高设备级和系统级的可测试性。然而,设计人员必须权衡对硅面积、性能、可达性和实现时间的影响,以实现最佳设计解决方案。
{"title":"Design trade-offs when implementing boundary scan in an application specific integrated circuit","authors":"T.W. Moxon","doi":"10.1109/ASIC.1990.186153","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186153","url":null,"abstract":"The design tradeoffs encountered when implementing a ASIC design that incorporates boundary scan logic are discussed. Boundary scan logic can improve both the device- and system-level testability. The designer, however, must weigh the impact on silicon area, performance, routability, and implementation time to achieve the optimum design solution.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127885450","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Managing risk in ASIC design cycle 管理ASIC设计周期中的风险
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186093
N. Zafar
ASIC design validation, confirming that the chips work in the system, has been the major source of risk in any ASIC development cycle. The risk is that of missing the market window. The cause is the lack of technologies to assure, before fabrication, that ASIC designs will operate properly in the target system. Innovations in the area of field programmable gate arrays have enabled an ASIC system design tool technology called reprogrammable hardware emulation. The management of risk and the economic advantage of using this technology in the ASIC design cycle is studied.<>
ASIC设计验证,确认芯片在系统中工作,一直是任何ASIC开发周期的主要风险来源。风险在于错过了市场窗口期。其原因是缺乏技术来保证,在制造之前,ASIC设计将在目标系统中正常运行。现场可编程门阵列领域的创新使ASIC系统设计工具技术称为可编程硬件仿真。研究了在ASIC设计周期中使用该技术的风险管理和经济优势。
{"title":"Managing risk in ASIC design cycle","authors":"N. Zafar","doi":"10.1109/ASIC.1990.186093","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186093","url":null,"abstract":"ASIC design validation, confirming that the chips work in the system, has been the major source of risk in any ASIC development cycle. The risk is that of missing the market window. The cause is the lack of technologies to assure, before fabrication, that ASIC designs will operate properly in the target system. Innovations in the area of field programmable gate arrays have enabled an ASIC system design tool technology called reprogrammable hardware emulation. The management of risk and the economic advantage of using this technology in the ASIC design cycle is studied.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121039829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
期刊
Third Annual IEEE Proceedings on ASIC Seminar and Exhibit
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1