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Third-generation architecture boosts speed and density of field-programmable gate arrays 第三代架构提高了现场可编程门阵列的速度和密度
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186197
R. B. Ravel
A third-generation family of field-programmable gate arrays (FPGAs) that utilizes a combination of architectural and process improvements and features up to twice the density and speed of currently available FPGA devices is discussed. The architecture allows complete and efficient automated design implementation of FPGA-based designs, as well as maximum density and performance. User-configurable on-chip static memory resources further contribute to the high integration levels available to users of the third-generation devices.<>
讨论了第三代现场可编程门阵列(FPGA)家族,该家族利用了架构和工艺改进的组合,其密度和速度是目前可用FPGA器件的两倍。该架构允许基于fpga的设计的完整和高效的自动化设计实现,以及最大的密度和性能。用户可配置的片上静态内存资源进一步为第三代设备的用户提供了高集成度。
{"title":"Third-generation architecture boosts speed and density of field-programmable gate arrays","authors":"R. B. Ravel","doi":"10.1109/ASIC.1990.186197","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186197","url":null,"abstract":"A third-generation family of field-programmable gate arrays (FPGAs) that utilizes a combination of architectural and process improvements and features up to twice the density and speed of currently available FPGA devices is discussed. The architecture allows complete and efficient automated design implementation of FPGA-based designs, as well as maximum density and performance. User-configurable on-chip static memory resources further contribute to the high integration levels available to users of the third-generation devices.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123830817","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Simulation techniques for VLSI circuits VLSI电路的仿真技术
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186077
S.S. Chung
The current status of existing simulators and their implementation techniques for VLSI circuits are reviewed. The basic algorithms upon which simulators are built are reviewed and practical implementation adopting the existing simulation program are described. Particular emphasis is placed on introducing the basics of computational techniques required for implementing DC, AC, and transient analysis as well as novel techniques for improving simulation accuracy or speed-up techniques. One specific feature is the demonstration of several experimental simulators. Some important areas for future research are also identified.<>
综述了现有仿真器的现状及其在VLSI电路中的实现技术。回顾了构建仿真器的基本算法,并描述了采用现有仿真程序的实际实现。特别强调的是介绍实现直流,交流和瞬态分析所需的计算技术的基础知识,以及提高模拟精度或加速技术的新技术。一个特别的特点是几个实验模拟器的演示。文章还指出了未来研究的一些重要领域。
{"title":"Simulation techniques for VLSI circuits","authors":"S.S. Chung","doi":"10.1109/ASIC.1990.186077","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186077","url":null,"abstract":"The current status of existing simulators and their implementation techniques for VLSI circuits are reviewed. The basic algorithms upon which simulators are built are reviewed and practical implementation adopting the existing simulation program are described. Particular emphasis is placed on introducing the basics of computational techniques required for implementing DC, AC, and transient analysis as well as novel techniques for improving simulation accuracy or speed-up techniques. One specific feature is the demonstration of several experimental simulators. Some important areas for future research are also identified.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123985905","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
An efficient two-dimensional pipeline architecture for digital signal processing operation 一种高效的二维管道结构,用于数字信号处理操作
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186137
P. Mukherjee
An efficient two-dimensional pipelined systolic architecture which can perform convolution operations in 2n+b/2 time units as opposed to O(bn) time needed for the sequential algorithm on a single processor is discussed. A very efficient pipelined multiplier, which enjoys all the merits of a systolic scheme and can be made a part of an ASIC library of medium-scale integration (MSI) cells, is also briefly discussed.<>
讨论了一种有效的二维流水线收缩结构,它可以在2n+b/2时间单位内完成卷积运算,而不是在单处理器上顺序算法需要O(bn)时间。本文还简要讨论了一种非常高效的流水线乘法器,它具有收缩方案的所有优点,并且可以作为中等规模集成(MSI)单元的ASIC库的一部分。
{"title":"An efficient two-dimensional pipeline architecture for digital signal processing operation","authors":"P. Mukherjee","doi":"10.1109/ASIC.1990.186137","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186137","url":null,"abstract":"An efficient two-dimensional pipelined systolic architecture which can perform convolution operations in 2n+b/2 time units as opposed to O(bn) time needed for the sequential algorithm on a single processor is discussed. A very efficient pipelined multiplier, which enjoys all the merits of a systolic scheme and can be made a part of an ASIC library of medium-scale integration (MSI) cells, is also briefly discussed.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122153613","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mixed-level simulation with a Zycad simulation engine 混合级仿真与Zycad仿真引擎
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186117
A.T. Eiriksson
A mixed behavioral- and gate-level simulator is described. The unique feature is that the gate-level modules of a design are simulated using a simulation engine, while a host computer simulates the behavioral-level modules and enforces the synchronization between the host computer and engine. The behavioral models are described using a high-level process-oriented behavioral specification language BSL. Runtime experiments show that the simulator speeds-up the simulation of systems of size ( Hash gates, Hash lines BSL) in ((25 K, 2 K), (50 K, 10 K)) by a factor of 5-7 times, compared to the compatible software simulator.<>
描述了一种混合行为级和门级模拟器。其独特之处在于设计的门级模块使用仿真引擎进行模拟,而主机模拟行为级模块并强制主机与引擎之间的同步。行为模型使用高级面向过程的行为规范语言BSL进行描述。运行时实验表明,与兼容软件模拟器相比,该模拟器将((25 K, 2 K), (50 K, 10 K))大小的系统(哈希门,哈希线BSL)的仿真速度提高了5-7倍。
{"title":"Mixed-level simulation with a Zycad simulation engine","authors":"A.T. Eiriksson","doi":"10.1109/ASIC.1990.186117","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186117","url":null,"abstract":"A mixed behavioral- and gate-level simulator is described. The unique feature is that the gate-level modules of a design are simulated using a simulation engine, while a host computer simulates the behavioral-level modules and enforces the synchronization between the host computer and engine. The behavioral models are described using a high-level process-oriented behavioral specification language BSL. Runtime experiments show that the simulator speeds-up the simulation of systems of size ( Hash gates, Hash lines BSL) in ((25 K, 2 K), (50 K, 10 K)) by a factor of 5-7 times, compared to the compatible software simulator.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121033920","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Mixed-signal ASIC simulation via an analog modeling package 混合信号ASIC仿真通过模拟建模包
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186144
U. Ko, S. Schenck, B. Van Eerden, W. Locke, M. Rumsey, J. Sackett
Problems in designing mixed-signal ASICs come from different simulation accuracy requirements and, as a result, different modeling approaches for analog and digital circuits. The conventional design styles for mixed-signal ASICs use two separate simulators, such as a SPICE-like simulator for analog circuits and a logic simulation for digital circuits. This approach is engineering-intensive, time-consuming, and error-prone. To solve these problems, the analog modeling package (AMP) has been developed. The authors describe how the AMP presents a systematic solution to mixed-signal simulation on a pure digital-logic simulator. In the AMP, analog behavioral models are created by connecting parameterized building blocks in a schematic capture tool with SPICE-characterized data. Then a chip-level mixed-signal design verification is implemented on one simulator to eliminate errors. An analog-signal trace file is also created for automatic test program generation. This solution significantly enhances the competitiveness of mixed-signal design and development in cost, cycle-time, and first-pass success.<>
混合信号专用集成电路的设计问题来自于不同的仿真精度要求以及模拟电路和数字电路不同的建模方法。混合信号asic的传统设计风格使用两个独立的模拟器,例如用于模拟电路的类似spice的模拟器和用于数字电路的逻辑仿真。这种方法是工程密集型的,耗时的,并且容易出错。为了解决这些问题,开发了模拟建模包(AMP)。作者描述了AMP如何在纯数字逻辑模拟器上提供混合信号仿真的系统解决方案。在AMP中,通过将原理图捕获工具中的参数化构建块与spice特征数据连接起来,创建模拟行为模型。然后在一个模拟器上实现了芯片级混合信号设计验证,以消除误差。还为自动测试程序生成创建了模拟信号跟踪文件。该解决方案显著提高了混合信号设计和开发在成本、周期时间和首通成功率方面的竞争力。
{"title":"Mixed-signal ASIC simulation via an analog modeling package","authors":"U. Ko, S. Schenck, B. Van Eerden, W. Locke, M. Rumsey, J. Sackett","doi":"10.1109/ASIC.1990.186144","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186144","url":null,"abstract":"Problems in designing mixed-signal ASICs come from different simulation accuracy requirements and, as a result, different modeling approaches for analog and digital circuits. The conventional design styles for mixed-signal ASICs use two separate simulators, such as a SPICE-like simulator for analog circuits and a logic simulation for digital circuits. This approach is engineering-intensive, time-consuming, and error-prone. To solve these problems, the analog modeling package (AMP) has been developed. The authors describe how the AMP presents a systematic solution to mixed-signal simulation on a pure digital-logic simulator. In the AMP, analog behavioral models are created by connecting parameterized building blocks in a schematic capture tool with SPICE-characterized data. Then a chip-level mixed-signal design verification is implemented on one simulator to eliminate errors. An analog-signal trace file is also created for automatic test program generation. This solution significantly enhances the competitiveness of mixed-signal design and development in cost, cycle-time, and first-pass success.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117195532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Interfacing test equipment to high density chip-on-tape 将测试设备连接到高密度的磁带上芯片
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186178
R. Nelson, B. Williams, G. Westbrook
Test hardware interface requirements for testing high-pin-count ASIC TAB (tape automated bonding) products are discussed. Test solutions which have been proven in a production environment are described. Test-on-tape using the techniques illustrated has proven viable for high-speed bipolar gate arrays having 360 leads with 0.004 in lead width and 0.008 in lead pitch in the (outer lead bond) and test area. Successfully testing small pitch outer leads of TAB products requires the combination of electrical, mechanical, and thermal designs to be controlled within specific tolerances. The final testing of TAB ASICs is performed after all other value added processes have been completed. Therefore, an understanding of the factors which impact final test yield is essential.<>
讨论了测试高引脚数ASIC TAB(磁带自动粘合)产品的测试硬件接口要求。描述了在生产环境中经过验证的测试解决方案。使用所示技术的磁带测试已被证明适用于具有360个引线的高速双极栅极阵列,引线宽度为0.004,引线间距为0.008(外引线键)和测试区域。成功测试TAB产品的小间距外引线需要结合电气,机械和热设计,将其控制在特定的公差范围内。TAB asic的最终测试是在所有其他增值过程完成后进行的。因此,了解影响最终试验良率的因素是至关重要的。
{"title":"Interfacing test equipment to high density chip-on-tape","authors":"R. Nelson, B. Williams, G. Westbrook","doi":"10.1109/ASIC.1990.186178","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186178","url":null,"abstract":"Test hardware interface requirements for testing high-pin-count ASIC TAB (tape automated bonding) products are discussed. Test solutions which have been proven in a production environment are described. Test-on-tape using the techniques illustrated has proven viable for high-speed bipolar gate arrays having 360 leads with 0.004 in lead width and 0.008 in lead pitch in the (outer lead bond) and test area. Successfully testing small pitch outer leads of TAB products requires the combination of electrical, mechanical, and thermal designs to be controlled within specific tolerances. The final testing of TAB ASICs is performed after all other value added processes have been completed. Therefore, an understanding of the factors which impact final test yield is essential.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"950 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126997328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An ASIC digital motion control unit 一个ASIC数字运动控制单元
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186136
J. Pasanen, O. Vainio, H. Tenhunen, P. Jahkonen, S. Ovaska
A digital motion control system with primary applications in automatic elevator doors is presented. Digital signal processing methods are used for generating exponential waveforms for the drive motor. The unit keeps track of the actual speed of motion and the corresponding door position. Thus, the time consumed by door motion is minimized, and smooth acceleration and deceleration phases are achieved. The proposed algorithm results have been implemented in an efficient bit-serial ASIC implementation.<>
介绍了一种应用于电梯自动门的数字运动控制系统。采用数字信号处理方法生成驱动电机的指数波形。该装置跟踪实际的运动速度和相应的门位置。因此,门运动所消耗的时间被最小化,并实现平稳的加速和减速阶段。该算法的结果已在一个高效的位串行ASIC上实现
{"title":"An ASIC digital motion control unit","authors":"J. Pasanen, O. Vainio, H. Tenhunen, P. Jahkonen, S. Ovaska","doi":"10.1109/ASIC.1990.186136","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186136","url":null,"abstract":"A digital motion control system with primary applications in automatic elevator doors is presented. Digital signal processing methods are used for generating exponential waveforms for the drive motor. The unit keeps track of the actual speed of motion and the corresponding door position. Thus, the time consumed by door motion is minimized, and smooth acceleration and deceleration phases are achieved. The proposed algorithm results have been implemented in an efficient bit-serial ASIC implementation.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121740288","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
UNI-MOS: a unified SPICE built-in MOSFET model for circuit simulation and lifetime evaluation UNI-MOS:用于电路仿真和寿命评估的统一SPICE内置MOSFET模型
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186122
S. Chung, Jam-Wem Lee, Y. Chen, Po-Chin Hsu
A lightly doped drain (LDD) MOS device model for circuit simulation in SPICE is described. UNI-MOS includes a consistent set of DC (I-V), AC (C-V), and hot electron degradation effect models. For the I-V and C-V models, results for achieving accurate and computationally efficient models of both conventional and LDD MOSFETs with submicron channel length are described. Strategies for implementing the hot electron effect in the circuit simulator for predicting the lifetime of a device or circuit in a VLSI environment are demonstrated.<>
介绍了一种用于SPICE电路仿真的轻掺杂漏极(LDD) MOS器件模型。UNI-MOS包括一套一致的直流(I-V),交流(C-V)和热电子降解效应模型。对于I-V和C-V模型,描述了实现亚微米通道长度的传统和LDD mosfet的精确和计算效率模型的结果。演示了在电路模拟器中实现热电子效应的策略,以预测VLSI环境中器件或电路的寿命。
{"title":"UNI-MOS: a unified SPICE built-in MOSFET model for circuit simulation and lifetime evaluation","authors":"S. Chung, Jam-Wem Lee, Y. Chen, Po-Chin Hsu","doi":"10.1109/ASIC.1990.186122","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186122","url":null,"abstract":"A lightly doped drain (LDD) MOS device model for circuit simulation in SPICE is described. UNI-MOS includes a consistent set of DC (I-V), AC (C-V), and hot electron degradation effect models. For the I-V and C-V models, results for achieving accurate and computationally efficient models of both conventional and LDD MOSFETs with submicron channel length are described. Strategies for implementing the hot electron effect in the circuit simulator for predicting the lifetime of a device or circuit in a VLSI environment are demonstrated.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122264632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Oversampled A/D and D/A converters for VLSI system integration 用于VLSI系统集成的过采样A/D和D/A转换器
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186149
T. Ritoniemi, V. Eerola, T. Karema, H. Tenhunen
The basic principles of oversampled noise-shaping analog-digital (A/D) and digital-analog (D/A) converters are presented. Basic operation and theory behind sigma-delta modulation are reviewed. The different structures of the sigma-delta converters are described, and the concepts of designing modulators and digital filters are discussed. The latest designs are reviewed.<>
介绍了过采样噪声整形模数转换器(A/D)和数模转换器(D/A)的基本原理。回顾了σ - δ调制的基本操作和原理。描述了不同结构的σ - δ变换器,并讨论了调制器和数字滤波器的设计概念。对最新的设计进行了审查。
{"title":"Oversampled A/D and D/A converters for VLSI system integration","authors":"T. Ritoniemi, V. Eerola, T. Karema, H. Tenhunen","doi":"10.1109/ASIC.1990.186149","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186149","url":null,"abstract":"The basic principles of oversampled noise-shaping analog-digital (A/D) and digital-analog (D/A) converters are presented. Basic operation and theory behind sigma-delta modulation are reviewed. The different structures of the sigma-delta converters are described, and the concepts of designing modulators and digital filters are discussed. The latest designs are reviewed.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122303890","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
An overview of the design methods and tools used in bipolar analog arrays 双极模拟阵列的设计方法和工具概述
Pub Date : 1990-09-17 DOI: 10.1109/ASIC.1990.186078
R. Sparkes
Developments in the area of integrated circuit design methods and computer-aided design tools used in high-frequency (>100 MHz) bipolar arrays are discussed. The developments that occurred in digital integrated circuit design in the areas of simulation, modeling, critiquing, layout, verification, and testing are outlined. From this outline, the ways bipolar analog engineers adapted to these developments are discussed.<>
讨论了高频(>100 MHz)双极阵列中集成电路设计方法和计算机辅助设计工具的发展。概述了数字集成电路设计在仿真、建模、鉴定、布局、验证和测试等方面的发展。从这个大纲,双极模拟工程师适应这些发展的方式进行了讨论。
{"title":"An overview of the design methods and tools used in bipolar analog arrays","authors":"R. Sparkes","doi":"10.1109/ASIC.1990.186078","DOIUrl":"https://doi.org/10.1109/ASIC.1990.186078","url":null,"abstract":"Developments in the area of integrated circuit design methods and computer-aided design tools used in high-frequency (>100 MHz) bipolar arrays are discussed. The developments that occurred in digital integrated circuit design in the areas of simulation, modeling, critiquing, layout, verification, and testing are outlined. From this outline, the ways bipolar analog engineers adapted to these developments are discussed.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124441062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
Third Annual IEEE Proceedings on ASIC Seminar and Exhibit
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