Photonic Integrated Circuits (PICs) have emerged as a promising technology to support applications including datacom, AI, RF signal processing, and quantum computing and sensing. A critical aspect of PIC-based systems is the ability to transmit optical signals between chips, which requires a low-loss, robust interface between the PIC-chip and optical fiber. Here we present a thorough examination of a fiber fusion attachment process to create such an interface. The process used a CO2 laser to heat and fuse the fiber to a silicon nitride chip and achieved a measured coupling loss of ~2.45 dB/facet for 1550 nm light, which represents a reduction in loss of 0.5dB/facet from prior to the fusion splice being formed. A force sensor was integrated into the fusion splicing process to allow for quantitative analysis of splicing conditions. Additionally, the robustness of the fusion splicing process was demonstrated by repeated temperature cycling of a spliced chip between 193 K and 293 K led to an increase in loss of only 0.3 dB after five cycles.
光子集成电路(PIC)已成为支持数据通信、人工智能、射频信号处理以及量子计算和传感等应用的一项前景广阔的技术。基于 PIC 的系统的一个关键方面是芯片之间传输光信号的能力,这就需要在 PIC 芯片和光纤之间建立一个低损耗、坚固耐用的接口。在此,我们对光纤熔接工艺进行了深入研究,以创建这样的接口。该工艺使用二氧化碳激光器将光纤加热并熔接到氮化硅芯片上,1550 nm 光的耦合损耗测量值约为 2.45 dB/facet,与熔接前相比,损耗降低了 0.5dB/facet。熔接过程中集成了力传感器,可对熔接条件进行定量分析。此外,通过在 193 K 和 293 K 之间反复循环拼接芯片的温度,证明了融合拼接过程的稳健性,经过五个循环后,损耗仅增加了 0.3 分贝。
{"title":"Fiber-to-Chip Packaging With Robust Fiber Fusion Splicing for Low-Temperature Applications","authors":"Aaron Hutchins;David Reens;Dave Kharas;Gavin N. West;Cheryl Sorace-Agaskar;John Chiaverini;Robert McConnell;Reuel Swint;Opeyemi Akanbi;Shannon Harding;Wei Guo","doi":"10.1109/LPT.2024.3452039","DOIUrl":"10.1109/LPT.2024.3452039","url":null,"abstract":"Photonic Integrated Circuits (PICs) have emerged as a promising technology to support applications including datacom, AI, RF signal processing, and quantum computing and sensing. A critical aspect of PIC-based systems is the ability to transmit optical signals between chips, which requires a low-loss, robust interface between the PIC-chip and optical fiber. Here we present a thorough examination of a fiber fusion attachment process to create such an interface. The process used a CO2 laser to heat and fuse the fiber to a silicon nitride chip and achieved a measured coupling loss of ~2.45 dB/facet for 1550 nm light, which represents a reduction in loss of 0.5dB/facet from prior to the fusion splice being formed. A force sensor was integrated into the fusion splicing process to allow for quantitative analysis of splicing conditions. Additionally, the robustness of the fusion splicing process was demonstrated by repeated temperature cycling of a spliced chip between 193 K and 293 K led to an increase in loss of only 0.3 dB after five cycles.","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142200611","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-29DOI: 10.1109/LPT.2024.3451615
Li Liu;Bei Liao;Ping Zhao;Wei Xue;Cong Hu
As the key device to realize polarization diversity function, the optical polarizer is a favorable way to solve the polarization sensitivity problem of silicon photonic devices. Nevertheless, on-chip silicon polarizers are still difficult to balance the compact size and superior performance. In order to break the above problems, an inverse design method is exploited to achieve ultra-compact silicon transverse electrical (TE)-pass polarizers. Compared with the reported polarizers (tens of micrometers), the 5.43- $mu $