Pub Date : 2024-12-04DOI: 10.1109/TCPMT.2024.3500715
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information","authors":"","doi":"10.1109/TCPMT.2024.3500715","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3500715","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"C2-C2"},"PeriodicalIF":2.3,"publicationDate":"2024-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10778162","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142777658","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this article, a ceramic Al2O3 material-based MIMO reconfigurable integrated wideband sensing and narrow-band communication dielectric antenna for 5G cognitive radio (CR) application is presented. The proposed CR is a hybrid structure in which the antenna radiator is designed with a alumina (Al2O3) dielectric resonator (DR). The proposed Al2O3 material-based CR is integrated with a reconfigurable wideband antenna and a reconfigurable versatile filter (RVF). The primary function of RVF is to assist in the interweave and underlay CR operations. The proposed antenna performs multipurpose functions including sensing (Mode-1), interweaving (Mode-2), and underlay (Mode-3) CR. It offers a wideband between 1.87 and 4.43 GHz in Mode-1. It offers a tunable narrowband in Mode-2 between 1.76 and 3.82 GHz. It offers tunable band rejection between 1.64 and 3.26 GHz in Mode-3.
{"title":"Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio","authors":"Jayant Kumar Rai;Pinku Ranjan;Rakesh Chowdhury;Mohd Haizal Jamaluddin","doi":"10.1109/TCPMT.2024.3507277","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3507277","url":null,"abstract":"In this article, a ceramic Al2O3 material-based MIMO reconfigurable integrated wideband sensing and narrow-band communication dielectric antenna for 5G cognitive radio (CR) application is presented. The proposed CR is a hybrid structure in which the antenna radiator is designed with a alumina (Al2O3) dielectric resonator (DR). The proposed Al2O3 material-based CR is integrated with a reconfigurable wideband antenna and a reconfigurable versatile filter (RVF). The primary function of RVF is to assist in the interweave and underlay CR operations. The proposed antenna performs multipurpose functions including sensing (Mode-1), interweaving (Mode-2), and underlay (Mode-3) CR. It offers a wideband between 1.87 and 4.43 GHz in Mode-1. It offers a tunable narrowband in Mode-2 between 1.76 and 3.82 GHz. It offers tunable band rejection between 1.64 and 3.26 GHz in Mode-3.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"94-103"},"PeriodicalIF":2.3,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142992822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-27DOI: 10.1109/TCPMT.2024.3507552
Shane Oh;Zhonghao Zhang;Geyu Yan;Paul K. Jo;Muhannad S. Bakir
A fully customizable interconnect technology for radio frequency (RF) heterogeneous integration (HI) applications is proposed and demonstrated in this article. The 3-D stitch-chip (3DSC) consists of two components: a pitch-transitioning coplanar waveguide housed on a fused-silica substrate, and a through-silicon via chiplet that functions as a vertical signal transmission path. A test vehicle consisting of a fused-silica board and a silicon chip was created, whose components were subsequently interconnected with the 3DSC. A baseline was established with a separate test vehicle that was interconnected with wire-bonds. Measurement in the Ka-band across the full signal chain between the $200~mu $ m-pitch chip and the $300~mu $ m-pitch board resulted in >16 dB return loss and <1.3 dB insertion loss. The electrical optimization process of the constituent components and full signal-chain is detailed. The fabrication method is provided and its results are discussed.
{"title":"Heterogeneous Integration Enabled by 3-D Stitch-Chips","authors":"Shane Oh;Zhonghao Zhang;Geyu Yan;Paul K. Jo;Muhannad S. Bakir","doi":"10.1109/TCPMT.2024.3507552","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3507552","url":null,"abstract":"A fully customizable interconnect technology for radio frequency (RF) heterogeneous integration (HI) applications is proposed and demonstrated in this article. The 3-D stitch-chip (3DSC) consists of two components: a pitch-transitioning coplanar waveguide housed on a fused-silica substrate, and a through-silicon via chiplet that functions as a vertical signal transmission path. A test vehicle consisting of a fused-silica board and a silicon chip was created, whose components were subsequently interconnected with the 3DSC. A baseline was established with a separate test vehicle that was interconnected with wire-bonds. Measurement in the Ka-band across the full signal chain between the <inline-formula> <tex-math>$200~mu $ </tex-math></inline-formula>m-pitch chip and the <inline-formula> <tex-math>$300~mu $ </tex-math></inline-formula>m-pitch board resulted in >16 dB return loss and <1.3 dB insertion loss. The electrical optimization process of the constituent components and full signal-chain is detailed. The fabrication method is provided and its results are discussed.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"113-122"},"PeriodicalIF":2.3,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142993688","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-27DOI: 10.1109/TCPMT.2024.3507083
Zhenyao Qian;Yancheng Huang;Bo Wang;Qianqian Qin;Lei Ge;Junfa Mao
In this article, an easy-to-integrate millimeter-wave low-profile filtering magneto-electric (ME) dipole antenna is proposed based on organic high-density-interconnect (HDI) packaging. Due to the advantages of high density and high precision of the HDI packaging, vertically oriented folded shorted metal vias and dielectric loading are introduced in the proposed design. The height of the antenna is reduced from $0.25lambda _{0}$ of conventional ME dipoles to $0.07lambda _{0}$ . Furthermore, by simply loading a stub, a radiation null can be effectively introduced to achieve filtering response. For demonstration, a prototype was designed and manufactured. Measurement and simulation results are in good agreement, showing that the prototype operates at 22.4–29 GHz, achieving a stable gain of 7 dBi, low cross-polarization level of less than −18 dB, and low back radiation of less than −15 dB, as well as additional good filtering performance with return loss of 13 dB and high selectivity.
{"title":"A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging","authors":"Zhenyao Qian;Yancheng Huang;Bo Wang;Qianqian Qin;Lei Ge;Junfa Mao","doi":"10.1109/TCPMT.2024.3507083","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3507083","url":null,"abstract":"In this article, an easy-to-integrate millimeter-wave low-profile filtering magneto-electric (ME) dipole antenna is proposed based on organic high-density-interconnect (HDI) packaging. Due to the advantages of high density and high precision of the HDI packaging, vertically oriented folded shorted metal vias and dielectric loading are introduced in the proposed design. The height of the antenna is reduced from <inline-formula> <tex-math>$0.25lambda _{0}$ </tex-math></inline-formula> of conventional ME dipoles to <inline-formula> <tex-math>$0.07lambda _{0}$ </tex-math></inline-formula>. Furthermore, by simply loading a stub, a radiation null can be effectively introduced to achieve filtering response. For demonstration, a prototype was designed and manufactured. Measurement and simulation results are in good agreement, showing that the prototype operates at 22.4–29 GHz, achieving a stable gain of 7 dBi, low cross-polarization level of less than −18 dB, and low back radiation of less than −15 dB, as well as additional good filtering performance with return loss of 13 dB and high selectivity.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"206-213"},"PeriodicalIF":2.3,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142993612","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this article, an ultrawideband (UWB) filtering phased array antenna is proposed based on the tightly coupled dipole concept by introducing short-terminal vias and open-terminal vias in the radiation unit cells. The short-terminal vias and the open-terminal vias contribute to the low and high radiation nulls, respectively, which are also evaluated simply. Then, a vertical integrated Marchand balun is applied to feed the coupled dipole and the short-terminal vias are combined as its ground via array. Thus, the proposed UWB filtering phased array antenna can be designed using the multilayer printed circuit broad (PCB) with low profile. To achieve a large ratio between via height and via diameter, the BGA-via technique is also used for the phased array antenna design. Then, the active reflection coefficients are simulated and the resonances within its operating band are analyzed for $theta =60^{circ }$ scan in the E-plane and H-plane. Finally, a phased array antenna prototype is fabricated and assembled to demonstrate the designed performances, including active voltage standing wave ratio (VSWR), antenna gain, and antenna patterns from 5 to 15.5 GHz. About 15-dB radiation suppression performances can be provided out of the band, which can be further improved by cooperating with the front-end chips to relieve the application of the high-performance filter chips in the array. The measured results show agreement with the simulated ones, and the discrepancies at low frequencies are caused by the air gaps within the array.
{"title":"Ultrawideband Filtering Phased Array Antenna Based on Multilayer PCB and BGA-Via for AESA Vertical Heterogeneous Integration","authors":"Dalong Xu;Chaofeng Xing;Yongrong Shi;Xun Jiang;Xiangxiang Li;Hao Wang;Qihui Wu","doi":"10.1109/TCPMT.2024.3506733","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3506733","url":null,"abstract":"In this article, an ultrawideband (UWB) filtering phased array antenna is proposed based on the tightly coupled dipole concept by introducing short-terminal vias and open-terminal vias in the radiation unit cells. The short-terminal vias and the open-terminal vias contribute to the low and high radiation nulls, respectively, which are also evaluated simply. Then, a vertical integrated Marchand balun is applied to feed the coupled dipole and the short-terminal vias are combined as its ground via array. Thus, the proposed UWB filtering phased array antenna can be designed using the multilayer printed circuit broad (PCB) with low profile. To achieve a large ratio between via height and via diameter, the BGA-via technique is also used for the phased array antenna design. Then, the active reflection coefficients are simulated and the resonances within its operating band are analyzed for <inline-formula> <tex-math>$theta =60^{circ }$ </tex-math></inline-formula> scan in the E-plane and H-plane. Finally, a phased array antenna prototype is fabricated and assembled to demonstrate the designed performances, including active voltage standing wave ratio (VSWR), antenna gain, and antenna patterns from 5 to 15.5 GHz. About 15-dB radiation suppression performances can be provided out of the band, which can be further improved by cooperating with the front-end chips to relieve the application of the high-performance filter chips in the array. The measured results show agreement with the simulated ones, and the discrepancies at low frequencies are caused by the air gaps within the array.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"182-195"},"PeriodicalIF":2.3,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142993695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-21DOI: 10.1109/TCPMT.2024.3503599
Sourish S. Sinha;Pouria Zaghari;Jong Eun Ryu;Bill Batchelor;Raymond A. Fillion;Douglas C. Hopkins
This article demonstrates design guidelines and development of a novel 3-D heterogeneous integration (3-DHI) thin glass substrate-based half-bridge switching power module for future onboard CPU, transceivers, and so on, power delivery applications. Due to extreme space constraints in onboard power supply applications, this design will support switching frequencies of >50 MHz with power levels of >30 W. To illustrate the capabilities of this module, the detailed ANSYS finite element analysis (FEA) analysis was carried out through thermomechanical and electromagnetic simulations. Extracting thermals is a major limitation factor in a compact layout. Hence, a thermal via density and substrate thickness parametric study was conducted, and effects on the integrity of the mechanical structure were verified through the simulation-based stress analysis. Finally, to switch at very high frequencies, the power and signal loop interconnects were routed through a thin glass substrate to achieve ultralow-power and gate loop parasitics. Two significant contributions demonstrate stacking various component layers in a half-bridge power stage and system-level packaging in a vertical profile.
{"title":"Investigation of High Current Fine Grain Power Delivery for 3-D Heterogeneous Integration","authors":"Sourish S. Sinha;Pouria Zaghari;Jong Eun Ryu;Bill Batchelor;Raymond A. Fillion;Douglas C. Hopkins","doi":"10.1109/TCPMT.2024.3503599","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3503599","url":null,"abstract":"This article demonstrates design guidelines and development of a novel 3-D heterogeneous integration (3-DHI) thin glass substrate-based half-bridge switching power module for future onboard CPU, transceivers, and so on, power delivery applications. Due to extreme space constraints in onboard power supply applications, this design will support switching frequencies of >50 MHz with power levels of >30 W. To illustrate the capabilities of this module, the detailed ANSYS finite element analysis (FEA) analysis was carried out through thermomechanical and electromagnetic simulations. Extracting thermals is a major limitation factor in a compact layout. Hence, a thermal via density and substrate thickness parametric study was conducted, and effects on the integrity of the mechanical structure were verified through the simulation-based stress analysis. Finally, to switch at very high frequencies, the power and signal loop interconnects were routed through a thin glass substrate to achieve ultralow-power and gate loop parasitics. Two significant contributions demonstrate stacking various component layers in a half-bridge power stage and system-level packaging in a vertical profile.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2258-2270"},"PeriodicalIF":2.3,"publicationDate":"2024-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142918470","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-20DOI: 10.1109/TCPMT.2024.3503561
Yue Deng;Fengjuan Wang;Xiangkun Yin;Yuan Yang;Ningmei Yu;Yan Li
Transformers are the key passive devices in many radio frequency integrated circuit (RF IC) applications. In this article, a kind of ultrahigh coupling coefficient and symmetric transformer based on through-silicon via (TSV) is proposed. HFSS software is used to model and simulate the transformers with turn ratios of 1:1, 1:2, and 1:3, and the three structures are manufactured and measured. The measurement results show that the coupling coefficients of the three are 0.956, 0.971, and 0.954, and the areas are 0.007, 0.012, and 0.015 mm2. Compared with other literatures, it has the characteristics of high coupling and miniaturization.
{"title":"A High Coupling Coefficient and Symmetric Transformer Based on TSV","authors":"Yue Deng;Fengjuan Wang;Xiangkun Yin;Yuan Yang;Ningmei Yu;Yan Li","doi":"10.1109/TCPMT.2024.3503561","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3503561","url":null,"abstract":"Transformers are the key passive devices in many radio frequency integrated circuit (RF IC) applications. In this article, a kind of ultrahigh coupling coefficient and symmetric transformer based on through-silicon via (TSV) is proposed. HFSS software is used to model and simulate the transformers with turn ratios of 1:1, 1:2, and 1:3, and the three structures are manufactured and measured. The measurement results show that the coupling coefficients of the three are 0.956, 0.971, and 0.954, and the areas are 0.007, 0.012, and 0.015 mm2. Compared with other literatures, it has the characteristics of high coupling and miniaturization.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"165-172"},"PeriodicalIF":2.3,"publicationDate":"2024-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142993693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-18DOI: 10.1109/TCPMT.2024.3501401
Xin Guo;Yang Tao;Wen Wu
In this article, a kind of miniaturized broadband balun is proposed and designed with high operating frequency and low insertion loss based on the low-cost self-packaged air-filled suspended line and its specialized extended filter theory. The filter theory is extended as follows. First, through making clear the out-of-phase outputs, impedance property of half-wavelength resonator, and miniaturized resonator topology, the three-port balun circuit could be synthesized with exact element values, according to the required in-band ripple and bandwidth. Second, the quantitative design of quasi-lumped component based on self-packaged air-filled suspended line is executed to obtain low-loss balun at high frequency within the compact size. Third, taking full advantage of features of circuit topology and physical structure, the direct feeding method and the strong coupling strength provided by these double-layer quasi-lumped components guarantee a wide operating band. For validation, one fourth-order balun operating at 10 GHz and one sixth-order balun operating at 6 GHz are fabricated and measured. The good performance validates the proposed design approach and low-loss compact self-packaged structure.
{"title":"High-Frequency Balun With Compact Size and Low Loss on Self-Packaged Air-Filled Suspended Line","authors":"Xin Guo;Yang Tao;Wen Wu","doi":"10.1109/TCPMT.2024.3501401","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3501401","url":null,"abstract":"In this article, a kind of miniaturized broadband balun is proposed and designed with high operating frequency and low insertion loss based on the low-cost self-packaged air-filled suspended line and its specialized extended filter theory. The filter theory is extended as follows. First, through making clear the out-of-phase outputs, impedance property of half-wavelength resonator, and miniaturized resonator topology, the three-port balun circuit could be synthesized with exact element values, according to the required in-band ripple and bandwidth. Second, the quantitative design of quasi-lumped component based on self-packaged air-filled suspended line is executed to obtain low-loss balun at high frequency within the compact size. Third, taking full advantage of features of circuit topology and physical structure, the direct feeding method and the strong coupling strength provided by these double-layer quasi-lumped components guarantee a wide operating band. For validation, one fourth-order balun operating at 10 GHz and one sixth-order balun operating at 6 GHz are fabricated and measured. The good performance validates the proposed design approach and low-loss compact self-packaged structure.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 2","pages":"356-366"},"PeriodicalIF":2.3,"publicationDate":"2024-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143446361","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-18DOI: 10.1109/TCPMT.2024.3502137
Binkun Liu;Yu Kang;Yun-Bo Zhao;Yang Cao;Zhenyi Xu
Predicting solder paste printing anomaly on the printed circuit board (PCB) can improve first-pass yield and reduce rework costs. Considering the impact of the PCB layout on the quality of solder paste printing, we propose a PCB layout-based spatiotemporal graph convolution network, in which we construct a graph to model the spatial distribution of solder pads. Specifically, since the printing quality is related to the spatial distribution of the pads, we convert the PCB to a graph according to the Pearson correlation of the printing quality and then trim the edges of the graph with a correlation threshold to model the spatial distribution of solder pads. To model the time-varying physicochemical properties of the solder paste, normalize the production time, calculate the attention of the production time, and reconstruct the printing quality based on the attention. Then, we devise a weighted loss to improve the performance of predicted printing of defective products due to the scarcity of defective products. Ultimately, the predicted printing quality is compared with the inspection threshold to estimate the degree of anomaly. The proposed method is validated on six days of real solder paste printing data, improving the average $F1$ score by 0.057 and the average accuracy by 0.022 for three typical anomalous printing behaviors over two temporal prediction scales.
{"title":"PCB Layout-Based Spatiotemporal Graph Convolution Network for Anomaly Prediction in Solder Paste Printing","authors":"Binkun Liu;Yu Kang;Yun-Bo Zhao;Yang Cao;Zhenyi Xu","doi":"10.1109/TCPMT.2024.3502137","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3502137","url":null,"abstract":"Predicting solder paste printing anomaly on the printed circuit board (PCB) can improve first-pass yield and reduce rework costs. Considering the impact of the PCB layout on the quality of solder paste printing, we propose a PCB layout-based spatiotemporal graph convolution network, in which we construct a graph to model the spatial distribution of solder pads. Specifically, since the printing quality is related to the spatial distribution of the pads, we convert the PCB to a graph according to the Pearson correlation of the printing quality and then trim the edges of the graph with a correlation threshold to model the spatial distribution of solder pads. To model the time-varying physicochemical properties of the solder paste, normalize the production time, calculate the attention of the production time, and reconstruct the printing quality based on the attention. Then, we devise a weighted loss to improve the performance of predicted printing of defective products due to the scarcity of defective products. Ultimately, the predicted printing quality is compared with the inspection threshold to estimate the degree of anomaly. The proposed method is validated on six days of real solder paste printing data, improving the average <inline-formula> <tex-math>$F1$ </tex-math></inline-formula> score by 0.057 and the average accuracy by 0.022 for three typical anomalous printing behaviors over two temporal prediction scales.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"214-223"},"PeriodicalIF":2.3,"publicationDate":"2024-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142992903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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