Pub Date : 2024-09-13DOI: 10.1109/TCPMT.2024.3460655
Wesley Spain;John Papapolymerou;Prem Chahal;Matthew Hodek;John D. Albrecht
Printed millimeter-wave (mmW) electronics have been of high interest in the field of communications for some time now due to the potential ability to fabricate mmW systems that utilize 3-D heterogeneous integration (3DHI) to improve performance beyond traditional systems. In this article, a method for fabricating transferable mmW structures via aerosol-jet printing (AJP) is presented. A polydimethylsiloxane (PDMS) stamp-assisted liftoff procedure is developed to separate the printed part from a rigid printing support surface and apply it to an adhesive target surface. Several microstrip (MS) line structures are demonstrated to characterize the effect of stamp transfer on the RF performance of the printed circuits. The effects of printed vias on RF probe pads and shifts in the resonant frequencies of a Beatty standard line after transfer are considered and characterized using S-parameter measurements.
印刷毫米波（mmW）电子器件在通信领域受到高度关注已有一段时间，因为它具有制造毫米波系统的潜在能力，可利用三维异质集成（3DHI）提高性能，超越传统系统。本文介绍了一种通过气溶胶喷射打印（AJP）制造可转移毫米波结构的方法。开发了一种聚二甲基硅氧烷（PDMS）印章辅助升空程序，用于将打印部件从刚性打印支撑表面分离，并将其应用于粘合目标表面。演示了几种微带 (MS) 线路结构，以确定印章转移对印刷电路射频性能的影响。考虑了射频探针焊盘上印刷孔的影响以及转移后 Beatty 标准线路谐振频率的偏移，并使用 S 参数测量进行了表征。
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Pub Date : 2024-09-12DOI: 10.1109/TCPMT.2024.3456649
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/TCPMT.2024.3456649","DOIUrl":"10.1109/TCPMT.2024.3456649","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10679205","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142220028","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-12DOI: 10.1109/TCPMT.2024.3459639
Na Ji;Guangxu Shen;Wenjie Feng;Quan Xue;Wenquan Che
This article proposes a high-selectivity bandpass filter-integrated single-pole double-throw (SPDT) switch based on switchable dual-mode hybrid resonators. To solve the intrinsic conflict between the high ON-state loss and high OFF-state suppression (OSS), a switchable dual-mode hybrid resonator with two resonant modes constructed by 16-mode SIW, microstrip stub, and PIN diode is proposed. The PIN diode loaded on the open end of the 16-mode SIW is used to switch the resonant state. To enhance the isolation between the ON and OFF channels, a common coupled feed line is used to provide two identical coupling paths, mitigating the impedance impact from the OFF-state channel. In addition, by adjusting the structural parameters of the proposed resonator, the transmission zeros (TZs) of the switch can be controlled independently. For theoretical analysis, the equivalent circuit modeling for the SPDT switch is investigated. Based on the equivalent circuit, the frequencies of TZs are calculated. For experimental verification, the second-order BPF-integrated SPDT switch at center frequency $f_{0} =4.9$ GHz with ripple bandwidth 400 MHz is designed, fabricated, and measured. Low insertion loss of only 1.18 dB, high upper stopband suppression, and multiple transmission zeroes are realized.
{"title":"High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators","authors":"Na Ji;Guangxu Shen;Wenjie Feng;Quan Xue;Wenquan Che","doi":"10.1109/TCPMT.2024.3459639","DOIUrl":"10.1109/TCPMT.2024.3459639","url":null,"abstract":"This article proposes a high-selectivity bandpass filter-integrated single-pole double-throw (SPDT) switch based on switchable dual-mode hybrid resonators. To solve the intrinsic conflict between the high ON-state loss and high OFF-state suppression (OSS), a switchable dual-mode hybrid resonator with two resonant modes constructed by 16-mode SIW, microstrip stub, and PIN diode is proposed. The PIN diode loaded on the open end of the 16-mode SIW is used to switch the resonant state. To enhance the isolation between the ON and OFF channels, a common coupled feed line is used to provide two identical coupling paths, mitigating the impedance impact from the OFF-state channel. In addition, by adjusting the structural parameters of the proposed resonator, the transmission zeros (TZs) of the switch can be controlled independently. For theoretical analysis, the equivalent circuit modeling for the SPDT switch is investigated. Based on the equivalent circuit, the frequencies of TZs are calculated. For experimental verification, the second-order BPF-integrated SPDT switch at center frequency \u0000<inline-formula> <tex-math>$f_{0} =4.9$ </tex-math></inline-formula>\u0000 GHz with ripple bandwidth 400 MHz is designed, fabricated, and measured. Low insertion loss of only 1.18 dB, high upper stopband suppression, and multiple transmission zeroes are realized.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142220027","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-11DOI: 10.1109/TCPMT.2024.3447513
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Pub Date : 2024-09-11DOI: 10.1109/TCPMT.2024.3447519
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2024.3447519","DOIUrl":"10.1109/TCPMT.2024.3447519","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676334","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142220029","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-11DOI: 10.1109/TCPMT.2024.3456651
{"title":"IEEE Open Access Publishing","authors":"","doi":"10.1109/TCPMT.2024.3456651","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3456651","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676336","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142173982","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-11DOI: 10.1109/TCPMT.2024.3453124
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/TCPMT.2024.3453124","DOIUrl":"10.1109/TCPMT.2024.3453124","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676335","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142219833","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-11DOI: 10.1109/TCPMT.2024.3447517
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2024.3447517","DOIUrl":"10.1109/TCPMT.2024.3447517","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676332","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142219832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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