首页 > 最新文献

IEEE Spectrum最新文献

英文 中文
Cover 3 封面 3
IF 3.1 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491397
{"title":"Cover 3","authors":"","doi":"10.1109/MSPEC.2024.10491397","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491397","url":null,"abstract":"","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"CV3-CV3"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10491397","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Why Bloat is Still Software's Biggest Vulnerability: A 2024 plea for lean software 为什么臃肿仍然是软件的最大弱点?2024 年对精益软件的呼吁
IF 3.1 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491389
Bert Hubert
SOME YEARS AGO I DID A TALK at a local university on cybersecurity, titled” Cyber and Infor-mation Security: Have We All Gone Mad?” It is still worth reading today since we have gone quite mad collectively.
几年前,我在当地一所大学做了一次关于网络安全的演讲,题目是 "网络和信息安全:我们都疯了吗?这篇文章今天仍然值得一读,因为我们已经集体疯了。
{"title":"Why Bloat is Still Software's Biggest Vulnerability: A 2024 plea for lean software","authors":"Bert Hubert","doi":"10.1109/MSPEC.2024.10491389","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491389","url":null,"abstract":"SOME YEARS AGO I DID A TALK at a local university on cybersecurity, titled” Cyber and Infor-mation Security: Have We All Gone Mad?” It is still worth reading today since we have gone quite mad collectively.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"22-50"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140348355","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Cover 4 封面 4
IF 3.1 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491396
{"title":"Cover 4","authors":"","doi":"10.1109/MSPEC.2024.10491396","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491396","url":null,"abstract":"","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"CV4-CV4"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10491396","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346737","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
News: Open-Source Hardware Secures a Win > sprung From Risc-v's Roots, the First Open Security Chip Hits the Market 新闻:开源硬件赢得胜利 > 源自 Risc-v 的首款开放式安全芯片投放市场
IF 3.1 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491400
Dina Genkina
The first commercial silicon chip that includes open-source, built-in hardware security was announced in February by the OpenTitan coalition.
今年 2 月,OpenTitan 联盟宣布推出首款包含开源内置硬件安全功能的商用硅芯片。
{"title":"News: Open-Source Hardware Secures a Win > sprung From Risc-v's Roots, the First Open Security Chip Hits the Market","authors":"Dina Genkina","doi":"10.1109/MSPEC.2024.10491400","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491400","url":null,"abstract":"The first commercial silicon chip that includes open-source, built-in hardware security was announced in February by the OpenTitan coalition.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"6-13"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10491400","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Inkjets Are for More Than Just Printing: They can Build DNA Arrays, 3D Structures, and Much More 喷墨打印机的用途不仅仅是打印:它们能构建 DNA 阵列、三维结构等更多内容
IF 3.1 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491386
Phillip W. Barth;Leslie A. Field
IN THE EARLY 1980s, offices were noisy places, filled with the sound of metal striking inked ribbons to mark characters on paper. IBM Selectric typewriters clacked, daisy wheel printers clattered, and dot-matrix printers made loud ripping sounds.
20 世纪 80 年代初,办公室是一个嘈杂的地方,充满了金属撞击墨带在纸上标记字符的声音。IBM Selectric 打字机发出咔嗒声,菊轮打印机发出咔嗒声,点阵打印机发出巨大的撕裂声。
{"title":"Inkjets Are for More Than Just Printing: They can Build DNA Arrays, 3D Structures, and Much More","authors":"Phillip W. Barth;Leslie A. Field","doi":"10.1109/MSPEC.2024.10491386","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491386","url":null,"abstract":"IN THE EARLY 1980s, offices were noisy places, filled with the sound of metal striking inked ribbons to mark characters on paper. IBM Selectric typewriters clacked, daisy wheel printers clattered, and dot-matrix printers made loud ripping sounds.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"32-37"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346738","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Software Sucks, But It Doesn't Have To: How to make leaner, greener software 软件糟透了,但不必如此:如何制作更精简、更环保的软件
IF 3.1 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491394
Asim Hussain
You can't see, hear, taste, feel, or smell it, but software is everywhere around us. It underpins modern civilization even while consuming more energy, wealth, and time than it needs to and burping out a significant amount of carbon dioxide into the atmosphere. The software industry and the code it ships need to be much more efficient in order to minimize the emissions attributable to programs running in data centers and over transmission networks. Two approaches to software development featured in this issue can help us get there.
你看不到、听不到、尝不到、感觉不到或闻不到,但软件在我们身边无处不在。它支撑着现代文明,却消耗着比它所需更多的能源、财富和时间,并向大气层排放大量二氧化碳。软件产业及其代码需要提高效率,以尽量减少在数据中心和传输网络中运行的程序所产生的排放。本期介绍的两种软件开发方法可以帮助我们实现这一目标。
{"title":"Software Sucks, But It Doesn't Have To: How to make leaner, greener software","authors":"Asim Hussain","doi":"10.1109/MSPEC.2024.10491394","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491394","url":null,"abstract":"You can't see, hear, taste, feel, or smell it, but software is everywhere around us. It underpins modern civilization even while consuming more energy, wealth, and time than it needs to and burping out a significant amount of carbon dioxide into the atmosphere. The software industry and the code it ships need to be much more efficient in order to minimize the emissions attributable to programs running in data centers and over transmission networks. Two approaches to software development featured in this issue can help us get there.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"2-2"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346741","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Most Hackable Handheld Ham Radio Yet > The UV-K5 can be modded at the click of a mouse 迄今为止最易改装的手持式 Ham 无线电设备 > 轻点鼠标即可改装 UV-K5
IF 3.1 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491276
Stephen Cass
All right, confession time. I don't use my handheld ham radio for much more than eavesdrop-ping on the subway dispatcher when my train rumbles to a mysterious halt in a dark tunnel. But even I couldn't help but hear the buzz surrounding a new handheld, Quansheng's UV-K5.
好吧,坦白的时候到了。除了在黑暗的隧道里偷听地铁调度员的声音,我很少使用手持火腿无线电。但即使是我,也忍不住要听听围绕着一种新型手持设备--全胜公司的 UV-K5 的嗡嗡声。
{"title":"The Most Hackable Handheld Ham Radio Yet > The UV-K5 can be modded at the click of a mouse","authors":"Stephen Cass","doi":"10.1109/MSPEC.2024.10491276","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491276","url":null,"abstract":"All right, confession time. I don't use my handheld ham radio for much more than eavesdrop-ping on the subway dispatcher when my train rumbles to a mysterious halt in a dark tunnel. But even I couldn't help but hear the buzz surrounding a new handheld, Quansheng's UV-K5.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"16-18"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346786","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mechanical Megatalent 机械巨塔
IF 3.1 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491398
In late 2023, researchers at Georgia Tech in Atlanta unveiled a robotic performance sculpture they named Medusai. It is modeled after Medusa, the mythological Gorgon who turned anyone who looked at her to stone. The bot has snakelike arms that allow it to simultaneously play percussion and strings and interactively “dance” with observers. “The eerie and uncanny notion of AI-driven robotic snakes following and threatening humans is balanced by the sculpture's potential to inspire humans to push the boundaries of their creativity and expression,” explains Gil Weinberg, the professor at Georgia Tech's Center for Music Technology who heads the team that created Medusai.
2023 年底,亚特兰大佐治亚理工学院的研究人员推出了一个机器人表演雕塑,并将其命名为 Medusai。它是以美杜莎为原型设计的,美杜莎是神话中的高竿女妖,她把任何看她的人都变成了石头。这个机器人拥有蛇一样的手臂,可以同时演奏打击乐和弦乐,并与观察者互动 "跳舞"。"佐治亚理工学院音乐技术中心教授吉尔-温伯格(Gil Weinberg)解释说:"人工智能驱动的机器蛇跟随并威胁人类,这种阴森恐怖的概念与该雕塑激发人类突破创造力和表现力极限的潜力相平衡。
{"title":"Mechanical Megatalent","authors":"","doi":"10.1109/MSPEC.2024.10491398","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491398","url":null,"abstract":"In late 2023, researchers at Georgia Tech in Atlanta unveiled a robotic performance sculpture they named Medusai. It is modeled after Medusa, the mythological Gorgon who turned anyone who looked at her to stone. The bot has snakelike arms that allow it to simultaneously play percussion and strings and interactively “dance” with observers. “The eerie and uncanny notion of AI-driven robotic snakes following and threatening humans is balanced by the sculpture's potential to inspire humans to push the boundaries of their creativity and expression,” explains Gil Weinberg, the professor at Georgia Tech's Center for Music Technology who heads the team that created Medusai.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"14-15"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10491398","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140348356","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Messy Reality Behind a Silicon Valley Unicorn 硅谷独角兽背后的混乱现实
IF 3.1 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491393
Benjamin Shestakofsky
A VC-backed startup's push for growth left little time for actual engineering
一家风险投资支持的初创企业急于求成,几乎没有时间进行实际的工程设计
{"title":"The Messy Reality Behind a Silicon Valley Unicorn","authors":"Benjamin Shestakofsky","doi":"10.1109/MSPEC.2024.10491393","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491393","url":null,"abstract":"A VC-backed startup's push for growth left little time for actual engineering","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"44-49"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346735","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
We Need to Decarbonize Software: The Way We Write Software has Unappreciated Environmental Impacts 我们需要让软件去碳化:我们编写软件的方式对环境的影响尚未得到重视
IF 3.1 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491388
Rina Diane Caballar
SOFTWARE MAY BE EATING THE WORLD, but it is also heating it. In December 2023, representatives from nearly 200 countries gathered in Dubai for COP28, the U.N.'s climate-change conference, to discuss the urgent need to lower emissions. Meanwhile, COP28's website produced 3.69 grams of carbon dioxide (CO2) per page load, according to the website sustainability scoring tool Ecograder. That appears to be a tiny amount, but if the site gets 10,000 views each month for a year, its emissions would be a little over that of a one-way flight from San Francisco to Toronto.
软件可能正在吞噬世界,但同时也在加热世界。2023 年 12 月,来自近 200 个国家的代表齐聚迪拜,参加联合国气候变化大会 COP28,讨论降低排放的紧迫性。与此同时,根据网站可持续发展评分工具Ecograder的数据,COP28的网站每次页面加载产生3.69克二氧化碳(CO2)。这似乎是一个很小的数字,但如果该网站每月的浏览量为 1 万次,持续一年,其排放量将略高于从旧金山飞往多伦多的单程航班的排放量。
{"title":"We Need to Decarbonize Software: The Way We Write Software has Unappreciated Environmental Impacts","authors":"Rina Diane Caballar","doi":"10.1109/MSPEC.2024.10491388","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491388","url":null,"abstract":"SOFTWARE MAY BE EATING THE WORLD, but it is also heating it. In December 2023, representatives from nearly 200 countries gathered in Dubai for COP28, the U.N.'s climate-change conference, to discuss the urgent need to lower emissions. Meanwhile, COP28's website produced 3.69 grams of carbon dioxide (CO\u0000<inf>2</inf>\u0000) per page load, according to the website sustainability scoring tool Ecograder. That appears to be a tiny amount, but if the site gets 10,000 views each month for a year, its emissions would be a little over that of a one-way flight from San Francisco to Toronto.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"26-31"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140348360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
IEEE Spectrum
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1