A 90 W-Ni-Cu-Sn alloy system was prepared via liquid-phase sintering, and its dynamic mechanical properties were investigated. By adjusting the Ni/Cu/Sn ratio and sintering temperature, the regulatory mechanism of tin element on alloy microstructure evolution and dynamic mechanical performance was revealed. Samples were fabricated using cold isostatic pressing (CIP) and hydrogen atmosphere sintering at temperatures ranging from 1150 °C to 1350 °C. The resulting materials were characterized through SEM, EDS, XRD, and mechanical testing—including quasi-static and dynamic compression as well as Vickers hardness measurements—to analyze density, grain size, and failure mechanisms. Results demonstrate that Sn addition significantly reduces liquid-phase sintering temperature, achieving 99.1 %–99.4 % relative density while reducing average grain size by 30 % compared to conventional alloys. Tin incorporation elevates quasi-static yield strength to 858 MPa; under dynamic compression, yield strength reaches 1700 MPa with thermal softening dominating plastic deformation, promoting adiabatic shear band (ASB) propagation along W-matrix interfaces.Microstructural analysis indicates that the synergistic effect of fine grain size and lower sintering temperatures may promote localized dynamic recrystallization processes, thereby facilitating the formation of ASBs. This work elucidates the optimization mechanism of Sn on tungsten alloy's dynamic mechanical properties, providing theoretical foundations for developing high-performance armor-piercing penetrator materials.
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