MEMS-based piezoelectric ultrasonic energy harvesters (PUEH) have become one of the most promising options for replacing or transferring energy to batteries in medical implants, where device miniaturization and power optimization are needed. Among the most commonly used piezoelectric materials in PUEH, lead zirconate titanate (PZT) is widely acknowledged for its excellent piezoelectric properties, good stability, and low cost. However, the performance of PZT degrades when the processing temperature approaches and exceeds half of its Curie temperature (T $_{mathrm {c}}$ ), limiting its application. Here, we demonstrate a highly miniaturized, low-temperature fabricated MEMS-based PUEH with an effective ultrasound harvesting area of 0.79 mm2 and an effective device volume of 0.35 mm3. The low-temperature adhesive epoxy bonding ensures the temperature throughout the entire fabrication process remains below $85~^{circ }$ C, which preserves the properties of the integrated piezoelectric material to the greatest extent. This allows the use of bulk PZT-5H, a material that possesses superior piezoelectric properties, but has a relatively low Tc, to enhance device performance. Our device outputs a root-mean-square (RMS) voltage of 0.62 V and an RMS power of 0.19 mW on a 2 k $Omega $ resistive load at an optimum operating frequency of 200 kHz, with a reception distance of 20 mm in water and input acoustic power intensity of 178 mW/cm2. The proposed design and fabrication technique enable our device to achieve the smallest effective size among the reported MEMS-based PUEH while still being capable of powering up numerous implantable medical devices and being compatible with various commercially available power management units. [2024-0081]
{"title":"Low-Temperature Fabrication of Millimeter-Scale MEMS-Based Piezoelectric Ultrasonic Energy Harvesters for Medical Implants","authors":"Xu Tian;Theocharis Nikiforos Iordanidis;Göran Stemme;Niclas Roxhed","doi":"10.1109/JMEMS.2024.3418580","DOIUrl":"10.1109/JMEMS.2024.3418580","url":null,"abstract":"MEMS-based piezoelectric ultrasonic energy harvesters (PUEH) have become one of the most promising options for replacing or transferring energy to batteries in medical implants, where device miniaturization and power optimization are needed. Among the most commonly used piezoelectric materials in PUEH, lead zirconate titanate (PZT) is widely acknowledged for its excellent piezoelectric properties, good stability, and low cost. However, the performance of PZT degrades when the processing temperature approaches and exceeds half of its Curie temperature (T\u0000<inline-formula> <tex-math>$_{mathrm {c}}$ </tex-math></inline-formula>\u0000), limiting its application. Here, we demonstrate a highly miniaturized, low-temperature fabricated MEMS-based PUEH with an effective ultrasound harvesting area of 0.79 mm2 and an effective device volume of 0.35 mm3. The low-temperature adhesive epoxy bonding ensures the temperature throughout the entire fabrication process remains below \u0000<inline-formula> <tex-math>$85~^{circ }$ </tex-math></inline-formula>\u0000C, which preserves the properties of the integrated piezoelectric material to the greatest extent. This allows the use of bulk PZT-5H, a material that possesses superior piezoelectric properties, but has a relatively low Tc, to enhance device performance. Our device outputs a root-mean-square (RMS) voltage of 0.62 V and an RMS power of 0.19 mW on a 2 k\u0000<inline-formula> <tex-math>$Omega $ </tex-math></inline-formula>\u0000 resistive load at an optimum operating frequency of 200 kHz, with a reception distance of 20 mm in water and input acoustic power intensity of 178 mW/cm2. The proposed design and fabrication technique enable our device to achieve the smallest effective size among the reported MEMS-based PUEH while still being capable of powering up numerous implantable medical devices and being compatible with various commercially available power management units. [2024-0081]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-07-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141610942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this letter, we present a CMOS-compatible MEMS micromachined and fully packaged two-dimensional (2D) thermal flow sensor. The sensor’s design parameters are determined by a nonlinear one-dimensional (1D) model. The fabricated 2D flow sensor features a $4mu $ m thick suspended circular membrane and is further packaged into a bypass housing structure. Compared to state-of-the-art sensors, the packaged 2D flow sensor shows a higher normalized sensitivity of 50mV/(m/s)/W and low power consumption of less than 7mW. Besides, the developed sensor system achieved a measured angle error of less than 3° and an average velocity error of less than 4% for an input airflow of 0-30m/s within the full range of 360°. It also achieved a response time of <11ms across all airflow speeds. The experimental results conclude that the developed 2D flow sensor is promising for airflow measurement in smart buildings and meteorological monitoring systems.[2024-0048]
{"title":"CMOS-Compatible MEMS 2D Thermal Flow Sensor With High Sensitivity and Low Power Consumption","authors":"Ruining Xu;Izhar;Xiangyu Song;Linze Hong;Minghao Huang;Wei Xu","doi":"10.1109/JMEMS.2024.3420420","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3420420","url":null,"abstract":"In this letter, we present a CMOS-compatible MEMS micromachined and fully packaged two-dimensional (2D) thermal flow sensor. The sensor’s design parameters are determined by a nonlinear one-dimensional (1D) model. The fabricated 2D flow sensor features a \u0000<inline-formula> <tex-math>$4mu $ </tex-math></inline-formula>\u0000m thick suspended circular membrane and is further packaged into a bypass housing structure. Compared to state-of-the-art sensors, the packaged 2D flow sensor shows a higher normalized sensitivity of 50mV/(m/s)/W and low power consumption of less than 7mW. Besides, the developed sensor system achieved a measured angle error of less than 3° and an average velocity error of less than 4% for an input airflow of 0-30m/s within the full range of 360°. It also achieved a response time of <11ms across all airflow speeds. The experimental results conclude that the developed 2D flow sensor is promising for airflow measurement in smart buildings and meteorological monitoring systems.[2024-0048]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142368412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-07-03DOI: 10.1109/JMEMS.2024.3418373
Nafis Mustakim;Luis F. Rodriguez Vera;Jose Pacheco Pinto;Sang-Woo Seo
Gold nanorods (GNRs) are one of the most promising biomaterial choices for the photothermal activation of neurons due to their relative biocompatibility, unique photothermal properties, and broad optical tunability through their synthetic shape control. While photothermal stimulation using randomly accumulated GNRs successfully demonstrates the potential treatment of functional neural disorders by modulating the neuronal activities using localized heating, there are limited demonstrations to translate this new concept into large-arrayed neural stimulations. In this paper, we report an arrayed PDMS micropillar platform in which GNRs are embedded as pixel-like, arrayed photothermal stimulators at the tips of the pillars. The proposed platform will be able to localize GNRs at predetermined pillar positions and create thermal stimulations using near-infrared (NIR) light. This will address the limitations of randomly distributed GNR-based approaches. Furthermore, a flexible PDMS pillar structure will create intimate interfaces on target cells. By characterizing the spatiotemporal temperature change in the platform with rhodamine B dye, we have shown that the localized temperature can be optically modulated within 4°C, which is in the range of temperature variation required for neuromodulation using NIR light. We envision that our proposed platform has the potential to be applied as a photothermal, neuronal stimulation interface with high spatiotemporal resolution. [2024-0092]
{"title":"Gold Nanorod-Embedded PDMS Micro-Pillar Array for Localized Photothermal Stimulation","authors":"Nafis Mustakim;Luis F. Rodriguez Vera;Jose Pacheco Pinto;Sang-Woo Seo","doi":"10.1109/JMEMS.2024.3418373","DOIUrl":"10.1109/JMEMS.2024.3418373","url":null,"abstract":"Gold nanorods (GNRs) are one of the most promising biomaterial choices for the photothermal activation of neurons due to their relative biocompatibility, unique photothermal properties, and broad optical tunability through their synthetic shape control. While photothermal stimulation using randomly accumulated GNRs successfully demonstrates the potential treatment of functional neural disorders by modulating the neuronal activities using localized heating, there are limited demonstrations to translate this new concept into large-arrayed neural stimulations. In this paper, we report an arrayed PDMS micropillar platform in which GNRs are embedded as pixel-like, arrayed photothermal stimulators at the tips of the pillars. The proposed platform will be able to localize GNRs at predetermined pillar positions and create thermal stimulations using near-infrared (NIR) light. This will address the limitations of randomly distributed GNR-based approaches. Furthermore, a flexible PDMS pillar structure will create intimate interfaces on target cells. By characterizing the spatiotemporal temperature change in the platform with rhodamine B dye, we have shown that the localized temperature can be optically modulated within 4°C, which is in the range of temperature variation required for neuromodulation using NIR light. We envision that our proposed platform has the potential to be applied as a photothermal, neuronal stimulation interface with high spatiotemporal resolution. [2024-0092]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141550770","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-07-03DOI: 10.1109/JMEMS.2024.3418335
Sofia Rahiminejad;Sven van Berkel;Robert Lin;Subash Khanal;Cecile Jung-Kubiak;Goutam Chattopadhyay;Mina Rais-Zadeh
This paper presents a Single-Pole Double-Throw MEMS waveguide switch operating at $500-750~GHz$ . The switch consist of a U-bend waveguide surrounded by an electromagnetic bandgap (EBG) surface. The EBG surface is used to isolate the electromagnetic wave without mechanical or electrical contact. The U-bend is placed on a rotating arm, that moves between two positions. The arms movement is controlled by a rotating MEMS motor that can rotate ±4.5° at $70~V$ . The switch is fabricated using silicon micromachining and is designed to be in-plane with the connecting waveguides. This allows it to be implemented into a silicon micromachined waveguide network. The waveguide switch has a measured insertion loss less than $2.5~dB$ and an isolation larger than $30~dB$ between $550-750~GHz$ . Since the electromagnetic wave can be routed with the EBG surface instead of needing electrical or mechanical contact, the MEMS waveguide switch can operate without the need for mechanical contact and avoids common MEMS switch issues such as stiction between the switch and its ports. [2024-0059]
{"title":"500-750 GHz Contactless Rotating MEMS Single-Pole Double-Throw Waveguide Switch","authors":"Sofia Rahiminejad;Sven van Berkel;Robert Lin;Subash Khanal;Cecile Jung-Kubiak;Goutam Chattopadhyay;Mina Rais-Zadeh","doi":"10.1109/JMEMS.2024.3418335","DOIUrl":"10.1109/JMEMS.2024.3418335","url":null,"abstract":"This paper presents a Single-Pole Double-Throw MEMS waveguide switch operating at \u0000<inline-formula> <tex-math>$500-750~GHz$ </tex-math></inline-formula>\u0000. The switch consist of a U-bend waveguide surrounded by an electromagnetic bandgap (EBG) surface. The EBG surface is used to isolate the electromagnetic wave without mechanical or electrical contact. The U-bend is placed on a rotating arm, that moves between two positions. The arms movement is controlled by a rotating MEMS motor that can rotate ±4.5° at \u0000<inline-formula> <tex-math>$70~V$ </tex-math></inline-formula>\u0000. The switch is fabricated using silicon micromachining and is designed to be in-plane with the connecting waveguides. This allows it to be implemented into a silicon micromachined waveguide network. The waveguide switch has a measured insertion loss less than \u0000<inline-formula> <tex-math>$2.5~dB$ </tex-math></inline-formula>\u0000 and an isolation larger than \u0000<inline-formula> <tex-math>$30~dB$ </tex-math></inline-formula>\u0000 between \u0000<inline-formula> <tex-math>$550-750~GHz$ </tex-math></inline-formula>\u0000. Since the electromagnetic wave can be routed with the EBG surface instead of needing electrical or mechanical contact, the MEMS waveguide switch can operate without the need for mechanical contact and avoids common MEMS switch issues such as stiction between the switch and its ports. [2024-0059]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141550769","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-28DOI: 10.1109/JMEMS.2024.3416320
Yulong Zhang;Jianwen Sun;Huiliang Liu;Zewen Liu
Thermal process is an important factor for metal cantilever profile, which may cause stress change and degeneration of device reliability. In this paper, prestressing-based thermal budget study of MEMS cantilever and its application in package processes are conducted. Cantilever profiles are reviewed, modeled and fitted by polynomial functions at different stress gradient situations. The Gold-Nickel (AuNi) alloy cantilevers are fabricated by electroplating process, and the electroplating current density (ECD) is modified from 0.5 to 2.5 ampere per square decimeter (ASD) for residual stress gradient regulation, which is called prestressing method of the cantilever. The profiles of cantilevers are observed by three-dimensional (3D) optical microscope (OM). Responses of cantilevers electroplated by 1.0 ASD are tested pre- and post-thermal processes with dwelling temperatures from 200 to 350 ° C and time from 5 to 30 minutes. On the basis of the evaluation, thermal processes in AuIn and AuSn eutectic bonding are designed and imitated, with temperatures of 200 and 290 ° C, respectively. All of the cantilevers electroplated by ECD from 0.5 to 2.5 ASD are treated by the two designed thermal processes. Among these test results, thermal process with 200 ° C for 5 minutes is suitable for the cantilevers electroplated by 0.75 ASD; and thermal process with 290 ° C for 5 minutes is suitable for the cantilevers electroplated by 1.0 ASD. In conclusion, the prestressing model and thermal budget model are established, which are helpful for realization of the packaged flat cantilever device and its reliability improvement. [2024-0083]
{"title":"Prestressing-Based Thermal Budget Study of MEMS Cantilever and Its Application in Package Processes","authors":"Yulong Zhang;Jianwen Sun;Huiliang Liu;Zewen Liu","doi":"10.1109/JMEMS.2024.3416320","DOIUrl":"10.1109/JMEMS.2024.3416320","url":null,"abstract":"Thermal process is an important factor for metal cantilever profile, which may cause stress change and degeneration of device reliability. In this paper, prestressing-based thermal budget study of MEMS cantilever and its application in package processes are conducted. Cantilever profiles are reviewed, modeled and fitted by polynomial functions at different stress gradient situations. The Gold-Nickel (AuNi) alloy cantilevers are fabricated by electroplating process, and the electroplating current density (ECD) is modified from 0.5 to 2.5 ampere per square decimeter (ASD) for residual stress gradient regulation, which is called prestressing method of the cantilever. The profiles of cantilevers are observed by three-dimensional (3D) optical microscope (OM). Responses of cantilevers electroplated by 1.0 ASD are tested pre- and post-thermal processes with dwelling temperatures from 200 to 350 ° C and time from 5 to 30 minutes. On the basis of the evaluation, thermal processes in AuIn and AuSn eutectic bonding are designed and imitated, with temperatures of 200 and 290 ° C, respectively. All of the cantilevers electroplated by ECD from 0.5 to 2.5 ASD are treated by the two designed thermal processes. Among these test results, thermal process with 200 ° C for 5 minutes is suitable for the cantilevers electroplated by 0.75 ASD; and thermal process with 290 ° C for 5 minutes is suitable for the cantilevers electroplated by 1.0 ASD. In conclusion, the prestressing model and thermal budget model are established, which are helpful for realization of the packaged flat cantilever device and its reliability improvement. [2024-0083]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141506498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Light Detection and Ranging (LiDAR) devices are critical for constructing three-dimensional scenes around vehicles, making them essential for automatic and intelligent driving systems. Micro-Electro-Mechanical Systems (MEMS) electromagnetic micromirrors have significantly developed MEMS-based LiDAR due to their inherent advantages. However, the traditional electromagnetic micromirrors, typically actuated by a single coil, experience crosstalk between the slow and fast axes. In this study, we introduce a dual-axis electromagnetic micromirror designed to eliminate this crosstalk. Unlike conventional micromirrors, our model features two distinct driving coils placed over the balance gimbal and reflecting mirror to control the slow and fast axes independently. This micromirror, with a 7.2 mm-diameter circular mirror, is manufactured using silicon on insulation (SOI) technology and incorporates a low-residual-stress packaging design. Our tests show that the scanning images from the fast axis of the proposed micromirror exhibit no crosstalk, achieving a significant improvement over traditional designs. Performance evaluation through geometric optical testing revealed that the slow axis resonates at 132 Hz and achieves a deflection angle of 36.3° with a quality factor of 26.9, while the fast axis resonates at 712 Hz, reaching 35.2° with a quality factor of 53.5. Additionally, the angle sensor performance was assessed, showing outputs that are highly proportional to the optical angles, recorded at 13.04 mV/deg and 9.80 mV/deg for the slow and fast axes, respectively.[2024-0084]
{"title":"A 2D MEMS Crosstalk-Free Electromagnetic Micromirror for LiDAR Application","authors":"Xiao-Yong Fang;Er-Qi Tu;Jun-Feng Zhou;Ang Li;Wen-Ming Zhang","doi":"10.1109/JMEMS.2024.3415156","DOIUrl":"10.1109/JMEMS.2024.3415156","url":null,"abstract":"Light Detection and Ranging (LiDAR) devices are critical for constructing three-dimensional scenes around vehicles, making them essential for automatic and intelligent driving systems. Micro-Electro-Mechanical Systems (MEMS) electromagnetic micromirrors have significantly developed MEMS-based LiDAR due to their inherent advantages. However, the traditional electromagnetic micromirrors, typically actuated by a single coil, experience crosstalk between the slow and fast axes. In this study, we introduce a dual-axis electromagnetic micromirror designed to eliminate this crosstalk. Unlike conventional micromirrors, our model features two distinct driving coils placed over the balance gimbal and reflecting mirror to control the slow and fast axes independently. This micromirror, with a 7.2 mm-diameter circular mirror, is manufactured using silicon on insulation (SOI) technology and incorporates a low-residual-stress packaging design. Our tests show that the scanning images from the fast axis of the proposed micromirror exhibit no crosstalk, achieving a significant improvement over traditional designs. Performance evaluation through geometric optical testing revealed that the slow axis resonates at 132 Hz and achieves a deflection angle of 36.3° with a quality factor of 26.9, while the fast axis resonates at 712 Hz, reaching 35.2° with a quality factor of 53.5. Additionally, the angle sensor performance was assessed, showing outputs that are highly proportional to the optical angles, recorded at 13.04 mV/deg and 9.80 mV/deg for the slow and fast axes, respectively.[2024-0084]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141506501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper presents a general instability model of mode-split MEMS gyroscopes. The proposed model can accurately predict the bias instability of a given device based on the applied angular rate and system parameters. The model consists of two noise models: bias instability and scale factor instability. Four flicker noise sources are considered that are the most significant contributors. These include phase flicker noise of the drive capacitance to voltage converter, sense analog-to-digital (ADC) scale factor instability, proof mass voltage flicker noise, and additive flicker noise. All the noise contributors are thoroughly analyzed and experimentally characterized on four triaxial research devices. Based on the results of the experimental characterization, the proposed scale factor and bias instability models are verified against the measurement data. We find a good match between the presented model and measurements. As anticipated by the proposed model, a reduction of the phase flicker noise of the drive capacitance to voltage converter has led to up to 50% improvement in bias instability.[2024-0018]
{"title":"Root-Causes of Bias Instability Noise in Mode-Split MEMS Gyroscopes","authors":"Miloš Vujadinović;Tobias Hiller;Thorsten Balslink;Mourad Elsobky;Lukas Blocher;Alexander Buhmann;Thomas Northemann;Bhaskar Choubey","doi":"10.1109/JMEMS.2024.3406584","DOIUrl":"10.1109/JMEMS.2024.3406584","url":null,"abstract":"This paper presents a general instability model of mode-split MEMS gyroscopes. The proposed model can accurately predict the bias instability of a given device based on the applied angular rate and system parameters. The model consists of two noise models: bias instability and scale factor instability. Four flicker noise sources are considered that are the most significant contributors. These include phase flicker noise of the drive capacitance to voltage converter, sense analog-to-digital (ADC) scale factor instability, proof mass voltage flicker noise, and additive flicker noise. All the noise contributors are thoroughly analyzed and experimentally characterized on four triaxial research devices. Based on the results of the experimental characterization, the proposed scale factor and bias instability models are verified against the measurement data. We find a good match between the presented model and measurements. As anticipated by the proposed model, a reduction of the phase flicker noise of the drive capacitance to voltage converter has led to up to 50% improvement in bias instability.[2024-0018]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141506543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-24DOI: 10.1109/JMEMS.2024.3405456
Jian Zhao;Heng Zhong;Rongjian Sun;Najib Kacem;Ming Lyu;Zeyuan Dong;Pengbo Liu
The snap through phenomenon of curved beam structures offers the possibility for designing high-performance filters, however, superharmonic resonances outside the filter’s passband are difficult to be attenuated. Therefore, a two-stage bandpass filter incorporating two electromagnetically coupled curved microbeams is designed, which possesses excellent specifications of sharp switching in the stopband and flat bandwidth compared to single curved-beam based filter. The reduced-order model considering the nonlinear electromagnetic forces and geometric nonlinearities is established, and discretized using the Galerkin method. Then, the resulting static and dynamic reduced order models are numerically solved. Extensive numerical simulation results show that the improved filter has a rectangular coefficient close to 1.0, a passband ripple of 0.2 dB, and a bandwidth ratio of 14.8%, which drastically reduces the stopband interference to 10% of the passband signal. Finally, the effects of DC voltage, AC voltage and coupling strength on the center frequency and bandwidth are parametrically investigated, where the center frequency can be tuned between 23.81 kHz and 25.16 kHz and the bandwidth covers the frequency range from 22.46 kHz to 26.05 kHz. [2024-0054]
{"title":"A Tunable Two-Stage Bandpass Filter Incorporating Two Electromagnetically Coupled Curved Beams","authors":"Jian Zhao;Heng Zhong;Rongjian Sun;Najib Kacem;Ming Lyu;Zeyuan Dong;Pengbo Liu","doi":"10.1109/JMEMS.2024.3405456","DOIUrl":"10.1109/JMEMS.2024.3405456","url":null,"abstract":"The snap through phenomenon of curved beam structures offers the possibility for designing high-performance filters, however, superharmonic resonances outside the filter’s passband are difficult to be attenuated. Therefore, a two-stage bandpass filter incorporating two electromagnetically coupled curved microbeams is designed, which possesses excellent specifications of sharp switching in the stopband and flat bandwidth compared to single curved-beam based filter. The reduced-order model considering the nonlinear electromagnetic forces and geometric nonlinearities is established, and discretized using the Galerkin method. Then, the resulting static and dynamic reduced order models are numerically solved. Extensive numerical simulation results show that the improved filter has a rectangular coefficient close to 1.0, a passband ripple of 0.2 dB, and a bandwidth ratio of 14.8%, which drastically reduces the stopband interference to 10% of the passband signal. Finally, the effects of DC voltage, AC voltage and coupling strength on the center frequency and bandwidth are parametrically investigated, where the center frequency can be tuned between 23.81 kHz and 25.16 kHz and the bandwidth covers the frequency range from 22.46 kHz to 26.05 kHz. [2024-0054]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-06-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141529499","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-11DOI: 10.1109/JMEMS.2024.3409155
Kevin R. Talley;Benjamen N. Taber;Rick Morton;Steve K. Brainerd;Austin J. Fox
Optimization of bulk acoustic wave (BAW) resonator border ring (BR) thicknesses and widths has traditionally been done using multi-wafer splits, often in combination with modeling techniques. Here we describe a single-wafer, two-factor experimental design with 21 distinct experimental regions where we employed custom ion trim and photoresist exposure procedures to optimize BR thickness and width. This resulted in a methodology for optimizing device performance in a manner that reduces the time and cost compared to traditional methods. Though we applied this experimental design to investigating the impact of BR thickness and width on radio frequency BAW filter passband performance, it is generalizable, thereby enabling single-wafer multi-factor experimental designs across an array of device components. [2024-0039]
{"title":"Single-Wafer Combinatorial Optimization of Border Rings for Bulk Acoustic Wave Filters","authors":"Kevin R. Talley;Benjamen N. Taber;Rick Morton;Steve K. Brainerd;Austin J. Fox","doi":"10.1109/JMEMS.2024.3409155","DOIUrl":"10.1109/JMEMS.2024.3409155","url":null,"abstract":"Optimization of bulk acoustic wave (BAW) resonator border ring (BR) thicknesses and widths has traditionally been done using multi-wafer splits, often in combination with modeling techniques. Here we describe a single-wafer, two-factor experimental design with 21 distinct experimental regions where we employed custom ion trim and photoresist exposure procedures to optimize BR thickness and width. This resulted in a methodology for optimizing device performance in a manner that reduces the time and cost compared to traditional methods. Though we applied this experimental design to investigating the impact of BR thickness and width on radio frequency BAW filter passband performance, it is generalizable, thereby enabling single-wafer multi-factor experimental designs across an array of device components. [2024-0039]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141884716","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-05DOI: 10.1109/JMEMS.2024.3405430
Guangpeng Chen;Zhan Zhan;Xiaowen Wang;Zuhang Zhou;Lingyun Wang
This paper reports a strong robustness MEMS QMG with the parallel coupled structure design, for the first time. The motions of the four masses of the gyroscope in the drive and sense directions are coupled and connected through different rings to achieve the parallel coupled effect. We demonstrated that the parallel coupled QMG has stronger robustness by numerical analysis, FEA and experiments. We study the kinematic equations of the parallel coupled QMG and compare it with the serial coupled QMG to analyze the effect of the difference in stiffness matrices and damping mismatch on the gyroscope performance and carry out numerical analyses under the conditions of stiffness mismatch and external vibration, and the results show that the parallel coupled QMG has stronger stiffness robustness and vibration robustness. We applied accelerations of different magnitudes and directions to the parallel and serial QMG to simulate the external loads, and the results show that the bandwidth of the parallel QMG is almost unaffected by the acceleration. We fabricated the parallel coupled QMG prototype using the SOG process, and designed circuits to test the performance. The results indicate that the gyroscope is sensitive to small input angles with $mathrm {0.0603 ^{circ }/s/surd Hz}$ ARW and 0.0135∘/s BI at 162 Hz frequency mismatch and $30~^{circ }$ C temperature compensation. Moreover, the frequency and quality factor of the parallel QMG are little affected by temperature and the bandwidth remains almost constant with good temperature robustness. These results indicate that the parallel structure has the potential to deliver better performance. [2024-0021]
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