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Quadruple Mass Gyroscope Angle Random Walk Reduction Through Linearized Transduction 通过线性化传导减少四倍质量陀螺仪角度随机漫步
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-03-18 DOI: 10.1109/JMEMS.2023.3337636
Ryan R. Knight;Ryan Q. Rudy;Jeffrey S. Pulskamp;Robert R. Benoit;Don L. DeVoe;Esmond Lau
A quadruple mass Coriolis vibratory gyroscope operating in the mode-matched condition has been redesigned with the singular focus of minimizing nonlinear transduction mechanisms, thereby allowing for angle random walk (ARW) noise reduction when operating at amplitudes higher than $2~mu text{m}$ . This is achieved through the following steps: (i) redesigning the Coriolis mass folded flexures and shuttle springs, (ii) linearizing the antiphase coupler spring rate while maintaining parasitic modal separation, (iii) replacing parallel plate transducers with linear combs, (iv) implementing dedicated force-balanced electrostatic frequency tuners, and (v) microTorr vacuum packaging enabling operation at the thermoelastic dissipation limit of silicon. Additionally, cross-axis stiffness is reduced through folded-flexure moment balancing to further reduce ARW. By the balancing of positive and negative Duffing frequency contributions, net frequency nonlinearity was further reduced to −20 ppm. The gyroscope presented in this study has achieved an ARW of 0.0005 deg/ $surd $ hr, with an uncompensated bias instability of 0.08 deg/hr. These advancements hold promise for enhancing the performance of precision vibratory gyroscopes for navigation and North-finding applications. [2023-0144]
重新设计了在模式匹配条件下工作的四重科里奥利振动陀螺仪,其唯一重点是最大限度地减少非线性传导机制,从而在振幅高于 2~mu text{m}$ 时减少角度随机漫步(ARW)噪声。这可以通过以下步骤实现:(i) 重新设计科里奥利质量折叠挠性件和穿梭弹簧,(ii) 在保持寄生模态分离的同时使反相耦合器弹簧率线性化,(iii) 用线性梳状器取代平行板传感器,(iv) 采用专用的力平衡静电频率调谐器,(v) 采用微托真空包装,从而能够在硅的热弹性耗散极限下工作。此外,还通过折曲力矩平衡来降低横轴刚度,从而进一步减少 ARW。通过平衡正负达芬频率贡献,净频率非线性进一步降低到 -20 ppm。本研究中介绍的陀螺仪实现了 0.0005 deg/$surd $ hr 的 ARW,未补偿偏置不稳定性为 0.08 deg/hr。这些进步有望提高用于导航和测北应用的精密振动陀螺仪的性能。[2023-0144]
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引用次数: 0
Electrostatic MEMS Speakers With Embedded Vertical Actuation 具有嵌入式垂直致动功能的静电 MEMS 扬声器
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-03-17 DOI: 10.1109/JMEMS.2024.3394809
Md Emran Hossain Bhuiyan;Prithviraj Palit;Siavash Pourkamali
In this research, micromachined silicon membranes with embedded electrostatic vertical actuator arrays capable of high out-of-plane displacement have been presented. The performance of such devices as MEMS speakers has been characterized by showing relatively high Sound Pressure level (SPL) compared to existing MEMS electrostatic speakers. Large arrays of electrostatic actuator cells, consisting of up to 10,000 cells with submicron transduction gaps, are formed on the edges of the membranes, inducing a bending moment in the membrane upon excitation. The large number of cells, along with submicron transduction gaps, allow much larger vibrational energy to be pumped into the vibrating membrane compared to the conventional electrostatic acoustic transducers, leading to higher sound output. For $50 , mu $ m thick membranes with a device footprint of 5mm $ times 5$ mm, a maximum SPL of 114 dB in open air was measured at a 1 cm distance, translating to an out-of- plane displacement of over $16 , mu $ m for the membrane. The transducer strength figure of merit defined as acoustic pressure per membrane surface area per actuation voltage, for the tested devices, is calculated to be up to $25.1 times 10^{-5}$ Pa/mm2/V, which is over 5X higher than the highest values calculated for the existing art. [2023-0192]
在这项研究中,展示了带有嵌入式静电垂直致动器阵列的微机械硅膜,该阵列能够产生较大的平面外位移。与现有的 MEMS 静电扬声器相比,这种装置作为 MEMS 扬声器的性能表现出相对较高的声压级 (SPL)。由多达 10,000 个具有亚微米传导间隙的单元组成的大型静电致动器单元阵列位于薄膜边缘,在受到激励时会在薄膜上产生弯矩。与传统的静电声学换能器相比,大量的单元和亚微米级的传导间隙可以将更大的振动能量泵入振动膜,从而获得更高的声音输出。对于厚度为 50 mu $ m、设备占地面积为 5 mm 乘以 5 mm 的膜,在 1 cm 距离处测得的开放空气中最大声压级为 114 dB,即膜的平面外位移超过 16 mu $ m。经计算,测试装置的换能器强度优点值(定义为每启动电压下每膜表面积的声压)高达 25.1 times 10^{-5}$ Pa/mm2/V,比现有技术计算出的最高值高出 5 倍多。[2023-0192]
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引用次数: 0
Multipurpose Acoustic Metamaterial Anchors for Aluminum Scandium Nitride Contour Mode Resonators 用于氮化铝钪轮廓模式谐振器的多用途声超材料锚点
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-03-16 DOI: 10.1109/JMEMS.2024.3399593
Xuanyi Zhao;Onurcan Kaya;Tommaso Maggioli;Cristian Cassella
We present a new design for AlScN contour-mode-resonators (CMRs) operating in the radiofrequency (RF) range. This design relies on acoustic metamaterials (AM) based lateral anchors to greatly enhance the power handling compared to conventional CMR-designs. Such anchors generate acoustic stopbands that prevent the leakage of piezo-generated acoustic energy from the resonating body into the substrate. The AM anchors reported in this work consist of the same AlScN film as in the CMRs’ active region, combined with a periodic array of SiO2 rods. Their use allows a reduction of CMRs’ thermal resistance with respect to conventional designs, and enables a significant temperature compensation. As a result, the CMRs with AM anchors reported in this work show a ~60% reduction in their Duffing coefficient with respect to conventional designs with fully-etched lateral sides, hence an improved linearity. Furthermore, when used to set the output frequency of high-power feedback loop oscillators, the CMRs with the AM anchors reported here enable a lower phase-noise compared to what achievable when employing the conventional counterparts.[2024-0053]
我们提出了一种在射频(RF)范围内工作的 AlScN 轮廓模式谐振器(CMR)的新设计。与传统的 CMR 设计相比,这种设计依靠基于声超材料 (AM) 的横向锚来大大提高功率处理能力。这种锚能产生声学阻带,防止共振体产生的压电声能泄漏到基底中。本研究中报告的 AM 锚点由与 CMR 有源区相同的 AlScN 薄膜和周期性排列的 SiO2 棒组成。与传统设计相比,使用它们可以降低 CMR 的热阻,并实现显著的温度补偿。因此,与侧面完全蚀刻的传统设计相比,本研究报告中采用 AM 锚点的 CMR 的达芬系数降低了约 60%,从而提高了线性度。此外,当用于设置高功率反馈环路振荡器的输出频率时,与采用传统设计相比,本文报告的带调幅锚的 CMR 可实现更低的相位噪声。
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引用次数: 0
Suspended Silicon Nitride Platforms for Thermal Sensing Applications in the Limit of Minimized Membrane Thickness 在膜厚度最小化极限下用于热传感应用的悬浮式氮化硅平台
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-03-15 DOI: 10.1109/JMEMS.2024.3392855
Ethan A. Scott;Hwijong Lee;John N. Nogan;Don Bethke;Peter A. Sharma;Patrick E. Hopkins;Tzu-Ming Lu;C. Thomas Harris
Silicon nitride has long been employed in the microfabrication of thermal sensors due to its favorable material properties and the ease with which it facilitates surface micromachining. While a variety of studies have utilized thin silicon nitride membranes for high sensitivity thermal measurements, limited reports exist on the physical characteristics of membranes and platforms in a thickness limit much less than 100 nm. Herein, we report on the development of low-stress, suspended silicon nitride platform devices that enable thermal characterization of membranes ranging from 120 nm to less than 10 nm in thickness, providing thermal conductivities as low as 1.1 W m−1 K−1 near room temperature. Applications of these platforms may enable appreciable enhancement in the performance of devices reliant upon environmental thermal isolation including bolometers, calorimeters, and gas sensors, among others. [2024-0003]
氮化硅具有良好的材料特性,而且易于进行表面微加工,因此长期以来一直被用于热传感器的微加工。虽然已有多项研究利用薄氮化硅膜进行高灵敏度热测量,但有关厚度远小于 100 纳米的膜和平台的物理特性的报道却十分有限。在此,我们报告了低应力、悬浮式氮化硅平台设备的开发情况,这些设备可以对厚度从 120 纳米到小于 10 纳米的膜进行热表征,在室温附近提供低至 1.1 W m-1 K-1 的热导率。这些平台的应用可显著提高依赖于环境热隔离的设备的性能,包括热量计、热量计和气体传感器等。[2024-0003]
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引用次数: 0
Design, Fabrication, and Characterization of High-Performance PMUT Arrays Based on Potassium Sodium Niobate 基于铌酸钾钠的高性能 PMUT 阵列的设计、制造和特性分析
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-03-14 DOI: 10.1109/JMEMS.2024.3395294
Lei Zhao;Chong Yang;Xinyue Zhang;Zhiwei You;Yipeng Lu
The demand for high-performance lead-free piezoelectric ultrasound transducers has grown significantly, driven by their applications in implantable, biocompatible medical devices and environmentally friendly consumer electronics. In this study, we present the design, fabrication, and characterization of arrays of lead-free (K, Na)NbO3 (KNN)-based piezoelectric micromechanical ultrasonic transducers (PMUTs) with a center frequency of 4.7 MHz in liquid and 5.85 MHz in air. High-quality KNN thin film (FWHM of 0.32°, $e_{mathrm {31,}f}= -12$ C/m2, $epsilon _{r} =1200$ ) was deposited via physical vapor deposition (PVD) and patterned using an optimized wet etching process with an oxide layer as a mask. Additionally, we obtained a −6 dB fractional bandwidth of 95.7% through optimizing layer stacks and transducers mutual acoustic impedance based on finite element model (FEM) and lumped element model (LEM) methods. We achieved high transmitting performance of 3.8 kPa/V at 3 cm away from a PMUT super-pixel (with an area of 0.278 mm2, consisting of $3times 12$ PMUTs). The measured transducer performance is comparable to previous PMUTs based on PZT (lead-included) thin films and demonstrates the potential of KNN-based PMUTs in future advanced applications. [2024-0005]
由于高性能无铅压电超声换能器在植入式生物兼容医疗设备和环保型消费电子产品中的应用,市场对其需求大幅增长。在本研究中,我们介绍了基于无铅(K, Na)NbO3(KNN)的压电微机械超声换能器(PMUT)阵列的设计、制造和表征,其在液体中的中心频率为 4.7 MHz,在空气中的中心频率为 5.85 MHz。高质量的 KNN 薄膜(FWHM 为 0.32°,$e_{mathrm {31,}f}= -12$ C/m2,$epsilon _{r} =1200$)是通过物理气相沉积(PVD)沉积而成的,并使用优化的湿法蚀刻工艺以氧化层作为掩膜进行图案化。此外,通过基于有限元模型(FEM)和叠加元模型(LEM)方法优化层堆叠和换能器互声阻抗,我们获得了 95.7% 的 -6 dB 分数带宽。我们在距离 PMUT 超级像素(面积为 0.278 平方毫米,由 12$ PMUT 组成)3 厘米处实现了 3.8 kPa/V 的高传输性能。测得的传感器性能与之前基于 PZT(含铅)薄膜的 PMUT 不相上下,证明了基于 KNN 的 PMUT 在未来先进应用中的潜力。[2024-0005]
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引用次数: 0
Characterization and Optimization of PZT-Based PMUTs With Wide Range Frequency Tuning 基于 PZT 的 PMUT 的特征描述和优化与宽频调谐
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-03-09 DOI: 10.1109/JMEMS.2024.3394509
Yufeng Gao;Lei Zhao;Chong Yang;Yipeng Lu
In this paper, we present air-coupled lead-zirconate-titanate (PZT) piezoelectric micromachined ultrasonic transducers (PMUTs) which demonstrate ultra-wide frequency tuning range via controllable in-plane stress generated by DC bias voltage. A PMUT designed to have a resonant frequency of ~200kHz generates a 223kHz total frequency shift from 182.5kHz to 405.5kHz with ±35V DC bias (corresponding to 97.8% variation referring to the resonant frequency without bias), and a 124kHz frequency shift from 188kHz to 312kHz with ±10V DC bias (corresponding to 54.4% variation). The effects of DC bias tuning were further characterized by both impedance analyzer and laser Doppler vibrometer (LDV), the fluctuation of electromechanical coupling coefficient ( ${k}_{mathrm {t}}^{mathrm {2}}$ ) and the change of the direction of polarization of the piezoelectric layer were successfully observed. Frequency tuning along different curves of the hysteresis loop was studied, and given both reasonably good ${k}_{mathrm {t}}^{mathrm {2}}$ (<5%)> $1sim 6$ V DC bias is chosen from the best option of the hysteresis loop. Furthermore, characteristics of PMUTs with different top electrode thickness were studied and summarized, and thinner top electrode was considered as an optimization method to achieve better performance for PMUT under DC bias in terms of frequency tuning. PMUTs with various frequencies were evaluated, and measurement results show a smaller tuning range of PMUTs with higher resonant frequency than those with lower resonant frequency due to the different membrane modulus, and, therefore different contributions of intrinsic stress generated by DC bias to the overall membrane modulus. [2024-0036]
本文介绍了空气耦合锆钛酸铅(PZT)压电微机械超声换能器(PMUT),该换能器通过直流偏置电压产生的可控面内应力实现了超宽频率调谐范围。设计谐振频率为 ~200kHz 的 PMUT 在 ±35V 直流偏压下产生了 223kHz 的总频率偏移,从 182.5kHz 到 405.5kHz(相当于无偏压时谐振频率的 97.8% 变化),在 ±10V 直流偏压下产生了 124kHz 的频率偏移,从 188kHz 到 312kHz(相当于 54.4% 变化)。通过阻抗分析仪和激光多普勒测振仪(LDV)进一步表征了直流偏压调谐的效果,成功观测到了机电耦合系数(${k}_{mathrm {t}}^{mathrm {2}}$)的波动和压电层极化方向的变化。研究了沿磁滞环不同曲线的频率调谐,并给出了合理的 ${k}_{mathrm {t}^{mathrm {2}}$ (1sim 6$ V 直流偏压是从磁滞环的最佳选项中选择的)。此外,还研究并总结了不同顶电极厚度的 PMUT 的特性,并考虑采用更薄的顶电极作为优化方法,使直流偏压下的 PMUT 在频率调谐方面获得更好的性能。对不同频率的 PMUT 进行了评估,测量结果表明,由于膜模量不同,共振频率较高的 PMUT 的调谐范围小于共振频率较低的 PMUT,因此直流偏压产生的内在应力对整个膜模量的贡献也不同。[2024-0036]
{"title":"Characterization and Optimization of PZT-Based PMUTs With Wide Range Frequency Tuning","authors":"Yufeng Gao;Lei Zhao;Chong Yang;Yipeng Lu","doi":"10.1109/JMEMS.2024.3394509","DOIUrl":"10.1109/JMEMS.2024.3394509","url":null,"abstract":"In this paper, we present air-coupled lead-zirconate-titanate (PZT) piezoelectric micromachined ultrasonic transducers (PMUTs) which demonstrate ultra-wide frequency tuning range via controllable in-plane stress generated by DC bias voltage. A PMUT designed to have a resonant frequency of ~200kHz generates a 223kHz total frequency shift from 182.5kHz to 405.5kHz with ±35V DC bias (corresponding to 97.8% variation referring to the resonant frequency without bias), and a 124kHz frequency shift from 188kHz to 312kHz with ±10V DC bias (corresponding to 54.4% variation). The effects of DC bias tuning were further characterized by both impedance analyzer and laser Doppler vibrometer (LDV), the fluctuation of electromechanical coupling coefficient (\u0000<inline-formula> <tex-math>${k}_{mathrm {t}}^{mathrm {2}}$ </tex-math></inline-formula>\u0000) and the change of the direction of polarization of the piezoelectric layer were successfully observed. Frequency tuning along different curves of the hysteresis loop was studied, and given both reasonably good \u0000<inline-formula> <tex-math>${k}_{mathrm {t}}^{mathrm {2}}$ </tex-math></inline-formula>\u0000 (<5%)> <tex-math>$1sim 6$ </tex-math></inline-formula>\u0000V DC bias is chosen from the best option of the hysteresis loop. Furthermore, characteristics of PMUTs with different top electrode thickness were studied and summarized, and thinner top electrode was considered as an optimization method to achieve better performance for PMUT under DC bias in terms of frequency tuning. PMUTs with various frequencies were evaluated, and measurement results show a smaller tuning range of PMUTs with higher resonant frequency than those with lower resonant frequency due to the different membrane modulus, and, therefore different contributions of intrinsic stress generated by DC bias to the overall membrane modulus. [2024-0036]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 4","pages":"427-437"},"PeriodicalIF":2.5,"publicationDate":"2024-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140925934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Higher Order Mode Elimination for SAW Resonators Based on LiNbO₃/SiO₂/poly-Si/Si Substrate by Si Orientation Optimization 通过硅取向优化消除基于 LiNbO$_{3}$/SiO$_{2}$/poly-Si/Si 衬底的声表面波谐振器的高阶模式
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-03-08 DOI: 10.1109/JMEMS.2024.3369639
Huiping Xu;Sulei Fu;Rongxuan Su;Peisen Liu;Boyuan Xiao;Shuai Zhang;Rui Wang;Cheng Song;Fei Zeng;Weibiao Wang;Feng Pan
Lithium-niobate-on-insulator (LNOI) platform has emerged as a promising solution for fabricating wideband and low-loss surface acoustic wave (SAW) filters. However, it simultaneously excites higher order modes, causing out-of-band (OoB) spurious responses. In this work, the elimination condition for higher order modes in LiNbO3 (LN)/SiO2/poly-Si/Si structure was summarized from analyzing the coupling mechanism between the velocities of shear bulk acoustic waves ( $V_{mathrm {S}}$ ) of Si and that of higher order mode ( $V_{mathrm {p-h}}$ ). According to the elimination condition of $V_{mathrm {p-h}}$ exceeding $V_{mathrm {S}}$ , meticulously selecting the crystal plane and propagation angle $alpha $ of Si to obtain desired $V_{mathrm {S}}$ is necessary. First, the resonators built on $32^{circ }Y$ - $X$ LN/SiO2/poly-Si/Si platforms with typical Si (100), Si (110) and Si (111) substrates were studied by simulation, which reveals that Si (110) manifests the optimal suppression capacity with $alpha _{110}$ window of $18^{circ }-60^{circ }$ , followed by the Si (111) plane of $alpha _{111}= 14^{circ }-36^{circ }$ . Si (100) substrate can hardly suppress higher order modes. Furthermore, resonators were designed and prepared on the above three Si planes. In coherence with the theoretical prediction, the resonators built on Si (135°, 90°, 45°) substrate can effectively eliminate the OoB ripples, while the resonators based on Si (0°, 0°, 45°) and Si (135°, 54.74°, 60°) substrates both excite the higher order modes, whose maximum admittance ratios (AR $_{mathrm {h}}$ ) are 15.0 dB and 19.9 dB, respectively. This work demonstrates a valid methodology for constructing spurious-free filters meeting 5G requirements. [2023-0212]
绝缘体上的铌酸锂(LNOI)平台已成为制造宽带、低损耗表面声波(SAW)滤波器的理想解决方案。然而,它同时会激发高阶模式,导致带外(OoB)杂散响应。在这项研究中,通过分析硅的剪切体声波速度($V_{mathrm {S}}$ )与高阶模式速度($V_{mathrm {p-h}}$ )之间的耦合机制,总结出了铌酸锂(LN)/二氧化硅(SiO2)/聚硅/硅结构中高阶模式的消除条件。根据$V_{mmathrm {p-h}}$ 超过$V_{mmathrm {S}}$的消除条件,必须精心选择硅的晶面和传播角$α$,以获得所需的$V_{mmathrm {S}}$。首先,通过仿真研究了建立在 32^{circ }Y$ - $X$ LN/SiO2/ 聚硅/硅平台上的谐振器,其基底分别为典型的 Si (100)、Si (110) 和 Si (111)、结果表明,Si (110) 的最佳抑制能力为 $18^{circ }-60^{circ }$,其次是 Si (111) 平面的 $alpha _{111}= 14^{circ }-36^{circ }$。硅(100)基板很难抑制高阶模式。此外,我们还在上述三个硅平面上设计并制备了谐振器。与理论预测一致,基于硅(135°, 90°, 45°)基板的谐振器能有效消除 OoB 波纹,而基于硅(0°, 0°, 45°)和硅(135°, 54.74°, 60°)基板的谐振器都能激发高阶模,其最大导纳比(AR $_{mathrm {h}}$ )分别为 15.0 dB 和 19.9 dB。这项工作展示了构建符合 5G 要求的无杂散滤波器的有效方法。[2023-0212]
{"title":"Higher Order Mode Elimination for SAW Resonators Based on LiNbO₃/SiO₂/poly-Si/Si Substrate by Si Orientation Optimization","authors":"Huiping Xu;Sulei Fu;Rongxuan Su;Peisen Liu;Boyuan Xiao;Shuai Zhang;Rui Wang;Cheng Song;Fei Zeng;Weibiao Wang;Feng Pan","doi":"10.1109/JMEMS.2024.3369639","DOIUrl":"10.1109/JMEMS.2024.3369639","url":null,"abstract":"Lithium-niobate-on-insulator (LNOI) platform has emerged as a promising solution for fabricating wideband and low-loss surface acoustic wave (SAW) filters. However, it simultaneously excites higher order modes, causing out-of-band (OoB) spurious responses. In this work, the elimination condition for higher order modes in LiNbO3 (LN)/SiO2/poly-Si/Si structure was summarized from analyzing the coupling mechanism between the velocities of shear bulk acoustic waves (\u0000<inline-formula> <tex-math>$V_{mathrm {S}}$ </tex-math></inline-formula>\u0000) of Si and that of higher order mode (\u0000<inline-formula> <tex-math>$V_{mathrm {p-h}}$ </tex-math></inline-formula>\u0000). According to the elimination condition of \u0000<inline-formula> <tex-math>$V_{mathrm {p-h}}$ </tex-math></inline-formula>\u0000 exceeding \u0000<inline-formula> <tex-math>$V_{mathrm {S}}$ </tex-math></inline-formula>\u0000, meticulously selecting the crystal plane and propagation angle \u0000<inline-formula> <tex-math>$alpha $ </tex-math></inline-formula>\u0000 of Si to obtain desired \u0000<inline-formula> <tex-math>$V_{mathrm {S}}$ </tex-math></inline-formula>\u0000 is necessary. First, the resonators built on \u0000<inline-formula> <tex-math>$32^{circ }Y$ </tex-math></inline-formula>\u0000-\u0000<inline-formula> <tex-math>$X$ </tex-math></inline-formula>\u0000 LN/SiO2/poly-Si/Si platforms with typical Si (100), Si (110) and Si (111) substrates were studied by simulation, which reveals that Si (110) manifests the optimal suppression capacity with \u0000<inline-formula> <tex-math>$alpha _{110}$ </tex-math></inline-formula>\u0000 window of \u0000<inline-formula> <tex-math>$18^{circ }-60^{circ }$ </tex-math></inline-formula>\u0000, followed by the Si (111) plane of \u0000<inline-formula> <tex-math>$alpha _{111}= 14^{circ }-36^{circ }$ </tex-math></inline-formula>\u0000. Si (100) substrate can hardly suppress higher order modes. Furthermore, resonators were designed and prepared on the above three Si planes. In coherence with the theoretical prediction, the resonators built on Si (135°, 90°, 45°) substrate can effectively eliminate the OoB ripples, while the resonators based on Si (0°, 0°, 45°) and Si (135°, 54.74°, 60°) substrates both excite the higher order modes, whose maximum admittance ratios (AR\u0000<inline-formula> <tex-math>$_{mathrm {h}}$ </tex-math></inline-formula>\u0000) are 15.0 dB and 19.9 dB, respectively. This work demonstrates a valid methodology for constructing spurious-free filters meeting 5G requirements. [2023-0212]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 2","pages":"163-173"},"PeriodicalIF":2.7,"publicationDate":"2024-03-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140072791","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 3 Degrees-of-Freedom Electrothermal Micro-Positioner for Optical Chip-to-Chip Alignment 用于光学芯片间对准的 3 自由度电热微型定位器
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-03-07 DOI: 10.1109/JMEMS.2024.3371829
Almur A. S. Rabih;Seyedfakhreddin Nabavi;Michaël Ménard;Frederic Nabki
This article proposes an electrothermal three-degrees-of-freedom (3-DOF) micro-positioner equipped with a waveguide path, which can potentially be used for chip-to-chip alignment in photonic integrated circuits. The micro-positioner provides translational displacements along the x-, y- and z- axes with manageable levels of cross-sensitivity between axes. A fabricated prototype provides displacements of $pm 3.35~mu text{m}$ at 105 mW along the x-axis, and $+4.5~mu text{m}$ at 140 mW along the y-axis. Moreover, $+7~mu text{m}$ of out-of-plane displacement is achieved along the z-axis when 210 mW is applied to the x-axis actuators to buckle the structure. The AC response of the micro-positioner shows that the fundamental resonance mode occurs at 18.8 kHz. [2023-0208]
本文提出了一种配备波导路径的电热三自由度(3-DOF)微型定位器,可用于光子集成电路中芯片到芯片的对准。该微型定位器沿 x、y 和 z 轴提供平移位移,各轴之间的交叉灵敏度在可控范围内。制造出的原型在 105 mW 的功率下可沿 x 轴提供 $pm 3.35~mu text{m}$,在 140 mW 的功率下可沿 y 轴提供 $+4.5~mu text{m}$。此外,当对 x 轴致动器施加 210 mW 以扣合结构时,沿 z 轴可实现 $+7~mu text{m}$的平面外位移。微型定位器的交流响应显示,基本共振模式发生在 18.8 kHz。[2023-0208]
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引用次数: 0
Optimization of Hemispherical Shell Resonator Structure Based on Thermoelastic Dissipation 基于热弹性耗散的半球壳谐振器结构优化
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-03-05 DOI: 10.1109/JMEMS.2024.3360460
Xiaoyan Sun;Haikuan Chen;Zhouwei He;Haoning Zheng;Ji’an Duan;Youwang Hu
This paper reports a method to optimize the structure of a hemispherical shell resonator by reducing the thermoelastic dissipation. In accordance with the thermoelastic damping theory, we set up a thermal insulation structure to change the heat conduction distance to improve the thermoelastic quality factor. And according to the distribution of elastic strain energy on the resonator, we set up the thermal insulating cavities and thermal insulating layers at the top and rim of the resonator to change the heat conduction distance, respectively. The vibration characteristics of the four new resonators are compared with the conventional resonator by finite element calculation, and the new structural resonators are fabricated with the optimal parameter. We measured that the quality factor ( $Q$ -factor) of the optimized resonator was improved by 13.8 times than that of the original structural resonator. It is also found that by adjusting the insulation structure, not only the thermoelastic quality factor of the resonator can be improved, but also the modal frequency of the resonator can be adjusted, which is able to realize the fine control of the vibration characteristics of the resonator. [2023-0168]
本文报告了一种通过减少热弹性耗散来优化半球壳谐振器结构的方法。根据热弹性阻尼理论,我们设置了隔热结构来改变热传导距离,从而提高热弹性品质因数。并根据弹性应变能在谐振器上的分布,在谐振器顶部和边缘分别设置了隔热腔和隔热层,以改变热传导距离。通过有限元计算将四种新型谐振器的振动特性与传统谐振器进行比较,并以最优参数制造出新型结构谐振器。我们测得,优化谐振器的品质因数($Q$因子)比原始结构谐振器提高了 13.8 倍。研究还发现,通过调整绝缘结构,不仅可以提高谐振器的热弹性品质因数,还可以调整谐振器的模态频率,从而实现对谐振器振动特性的精细控制。[2023-0168]
{"title":"Optimization of Hemispherical Shell Resonator Structure Based on Thermoelastic Dissipation","authors":"Xiaoyan Sun;Haikuan Chen;Zhouwei He;Haoning Zheng;Ji’an Duan;Youwang Hu","doi":"10.1109/JMEMS.2024.3360460","DOIUrl":"10.1109/JMEMS.2024.3360460","url":null,"abstract":"This paper reports a method to optimize the structure of a hemispherical shell resonator by reducing the thermoelastic dissipation. In accordance with the thermoelastic damping theory, we set up a thermal insulation structure to change the heat conduction distance to improve the thermoelastic quality factor. And according to the distribution of elastic strain energy on the resonator, we set up the thermal insulating cavities and thermal insulating layers at the top and rim of the resonator to change the heat conduction distance, respectively. The vibration characteristics of the four new resonators are compared with the conventional resonator by finite element calculation, and the new structural resonators are fabricated with the optimal parameter. We measured that the quality factor (\u0000<inline-formula> <tex-math>$Q$ </tex-math></inline-formula>\u0000-factor) of the optimized resonator was improved by 13.8 times than that of the original structural resonator. It is also found that by adjusting the insulation structure, not only the thermoelastic quality factor of the resonator can be improved, but also the modal frequency of the resonator can be adjusted, which is able to realize the fine control of the vibration characteristics of the resonator. [2023-0168]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 2","pages":"133-142"},"PeriodicalIF":2.7,"publicationDate":"2024-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140043917","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Characterization of a Temperature-Sensitive Nano Piezoelectric Mechanical Resonator With a 20nm Free-Standing Hf0.5Zr0.5O2 Membrane JMEMS Letters.1pt 利用 20nm 独立式 Hf_{0.5}$Zr_{0.5}$O$_{2}$ 膜对温度敏感的纳米压电机械谐振器进行表征
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-03-03 DOI: 10.1109/JMEMS.2024.3392402
Jingyi Zhang;Haoqi Lyu;Wuhao Yang;Hai Zhong;Zhuohui Liu;Xiaorui Bie;Xingyin Xiong;Zheng Wang;Chen Ge;Xudong Zou
We studied the temperature effects on the resonant frequency of nano piezoelectric mechanical resonators based on Hf0.5Zr0.5O2 thin films. Two square-shaped resonators of 30 $mu$ m and 50 $mu$ m in length were fabricated and tested, having a resonant frequency of 225.8 kHz and 98.5 kHz, respectively. The temperature coefficient of frequency (TCF) of the devices was characterized in the range from −20 °C to 147 °C. Both devices exhibited a positive TCF around 83.6 ppm/°C to 105 ppm/°C in the range from 30 °C to 147 °C, which may result from the combined effect of thermal expansion mismatch between the materials and the temperature coefficient of Young’s modulus of the HZO material. Moreover, the 50 $mu$ m device shows a negative TCF around −110 ppm/°C to −99.9 ppm/°C within the range from −20 °C to 30 °C, which may be due to stress relaxation during the heating process. These results underscore the significance of HZO material in nanoscale piezoelectric resonator applications and lay the foundation for our future work aimed at developing nanoscale piezoelectric devices based on HZO. [2024-0040]
我们研究了温度对基于 Hf0.5Zr0.5O2 薄膜的纳米压电机械谐振器谐振频率的影响。我们制作并测试了两个长度分别为 30 和 50 m 的方形谐振器,它们的谐振频率分别为 225.8 kHz 和 98.5 kHz。器件的频率温度系数(TCF)在-20 °C到147 °C的范围内进行了表征。在 30 ℃ 至 147 ℃ 范围内,两种器件都显示出约 83.6 ppm/°C 至 105 ppm/°C 的正 TCF,这可能是材料间热膨胀不匹配和 HZO 材料杨氏模量温度系数的共同作用结果。此外,在 -20 °C 至 30 °C 的范围内,50 $mu$ m 器件显示出约 -110 ppm/°C 至 -99.9 ppm/°C 的负 TCF,这可能是由于加热过程中的应力松弛造成的。这些结果强调了 HZO 材料在纳米级压电谐振器应用中的重要意义,并为我们今后开发基于 HZO 的纳米级压电器件奠定了基础。[2024-0040]
{"title":"Characterization of a Temperature-Sensitive Nano Piezoelectric Mechanical Resonator With a 20nm Free-Standing Hf0.5Zr0.5O2 Membrane","authors":"Jingyi Zhang;Haoqi Lyu;Wuhao Yang;Hai Zhong;Zhuohui Liu;Xiaorui Bie;Xingyin Xiong;Zheng Wang;Chen Ge;Xudong Zou","doi":"10.1109/JMEMS.2024.3392402","DOIUrl":"10.1109/JMEMS.2024.3392402","url":null,"abstract":"We studied the temperature effects on the resonant frequency of nano piezoelectric mechanical resonators based on Hf0.5Zr0.5O2 thin films. Two square-shaped resonators of 30 \u0000<inline-formula> <tex-math>$mu$ </tex-math></inline-formula>\u0000 m and 50 \u0000<inline-formula> <tex-math>$mu$ </tex-math></inline-formula>\u0000 m in length were fabricated and tested, having a resonant frequency of 225.8 kHz and 98.5 kHz, respectively. The temperature coefficient of frequency (TCF) of the devices was characterized in the range from −20 °C to 147 °C. Both devices exhibited a positive TCF around 83.6 ppm/°C to 105 ppm/°C in the range from 30 °C to 147 °C, which may result from the combined effect of thermal expansion mismatch between the materials and the temperature coefficient of Young’s modulus of the HZO material. Moreover, the 50 \u0000<inline-formula> <tex-math>$mu$ </tex-math></inline-formula>\u0000 m device shows a negative TCF around −110 ppm/°C to −99.9 ppm/°C within the range from −20 °C to 30 °C, which may be due to stress relaxation during the heating process. These results underscore the significance of HZO material in nanoscale piezoelectric resonator applications and lay the foundation for our future work aimed at developing nanoscale piezoelectric devices based on HZO. [2024-0040]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 4","pages":"405-407"},"PeriodicalIF":2.5,"publicationDate":"2024-03-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140838831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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Journal of Microelectromechanical Systems
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