Pub Date : 2024-02-02DOI: 10.1109/JMEMS.2023.3348604
{"title":"Journal of Microelectromechanical Systems","authors":"","doi":"10.1109/JMEMS.2023.3348604","DOIUrl":"https://doi.org/10.1109/JMEMS.2023.3348604","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-02-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10419085","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139676302","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-02-02DOI: 10.1109/JMEMS.2023.3348649
{"title":"Member ad suite","authors":"","doi":"10.1109/JMEMS.2023.3348649","DOIUrl":"https://doi.org/10.1109/JMEMS.2023.3348649","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-02-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10419112","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139676332","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-02-02DOI: 10.1109/JMEMS.2023.3348628
{"title":"TechRxiv: Share Your Preprint Research with the World!","authors":"","doi":"10.1109/JMEMS.2023.3348628","DOIUrl":"https://doi.org/10.1109/JMEMS.2023.3348628","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-02-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10419113","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139676268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-30DOI: 10.1109/JMEMS.2024.3355400
Liangliang Lv;Qingrui Yang;Haolin Li;Zhaoxun Wang;Quanning Li;Xuejiao Chen;Menglun Zhang;Wei Pang
It is a longstanding issue that high-order width-extensional (WE) piezoelectric microelectromechanical system (MEMS) resonators suffer low quality factors (Q-factors). In this study, it is observed that the mode distortion occurs in each unit when it couples with each other to constitute the high-order WE-mode resonator, leading to a decreased Q-factor. Based on this finding, we propose a new Q-factor boost strategy by improving mode matching degree between adjacent units from the view of dividing the high-order resonator into units. Both simulation and experimental results show a significant improvement in mode matching degree between adjacent units with varied unit length. Resonator’s Q-factor measured in air improved by 53% compared with the conventional resonator with constant unit length. It is believed that the proposed strategy could apply to other WE-mode MEMS resonators with different orders or dimensions; and Q-factor can be further improved by combining the proposed method with traditional energy reflection methods. [2023-0201]
长期以来，高阶宽度扩展（WE）压电微机电系统（MEMS）谐振器的品质因数（Q 因子）较低。在本研究中，我们观察到每个单元在相互耦合构成高阶 WE 模式谐振器时都会发生模式畸变，从而导致 Q 因子降低。基于这一发现，我们提出了一种新的 Q 因子提升策略，即从将高阶谐振器划分为若干单元的角度出发，提高相邻单元之间的模式匹配度。仿真和实验结果都表明，随着单元长度的变化，相邻单元之间的模式匹配度得到了显著改善。与单位长度不变的传统谐振器相比，在空气中测量的谐振器 Q 因子提高了 53%。相信所提出的策略可适用于其他不同阶数或尺寸的 WE 模式 MEMS 谐振器；通过将所提出的方法与传统的能量反射方法相结合，可进一步提高 Q 因子。[2023-0201]
{"title":"A Q-factor Boost Strategy for High-Order Width-Extensional Mode MEMS Resonators by Varied Unit Length","authors":"Liangliang Lv;Qingrui Yang;Haolin Li;Zhaoxun Wang;Quanning Li;Xuejiao Chen;Menglun Zhang;Wei Pang","doi":"10.1109/JMEMS.2024.3355400","DOIUrl":"10.1109/JMEMS.2024.3355400","url":null,"abstract":"It is a longstanding issue that high-order width-extensional (WE) piezoelectric microelectromechanical system (MEMS) resonators suffer low quality factors (Q-factors). In this study, it is observed that the mode distortion occurs in each unit when it couples with each other to constitute the high-order WE-mode resonator, leading to a decreased Q-factor. Based on this finding, we propose a new Q-factor boost strategy by improving mode matching degree between adjacent units from the view of dividing the high-order resonator into units. Both simulation and experimental results show a significant improvement in mode matching degree between adjacent units with varied unit length. Resonator’s Q-factor measured in air improved by 53% compared with the conventional resonator with constant unit length. It is believed that the proposed strategy could apply to other WE-mode MEMS resonators with different orders or dimensions; and Q-factor can be further improved by combining the proposed method with traditional energy reflection methods. [2023-0201]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139950736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-26DOI: 10.1109/JMEMS.2024.3354235
Zhao Zhang;Hemin Zhang;Yongcun Hao;Honglong Chang
This paper reviews the development of silicon resonant accelerometers from 1987 to 2022. For more than 30 years, silicon resonant accelerometers have developed into varieties of structures based on different sensing methods. In the beginning, resonant accelerometers were reported to realize acceleration measurements by detecting the frequency shifts of resonators. A variety of advancements have emerged in the realm of accelerometers, encompassing various aspects such as resonator diversity, enhancements in scale factor, expanded sensing orientations, reduced temperature sensitivity, and the integration of CMOS technology. Furthermore, innovative accelerometer designs have harnessed mode-localized phenomena, synchronization techniques, and parametric modulation, with the overarching goal of enhancing their performance and expanding their applicability. This paper reviews and analyzes the performances and structures of a range of silicon resonant accelerometers over the past three decades, providing a detailing reference and guidance for researchers in this field.
{"title":"A Review on MEMS Silicon Resonant Accelerometers","authors":"Zhao Zhang;Hemin Zhang;Yongcun Hao;Honglong Chang","doi":"10.1109/JMEMS.2024.3354235","DOIUrl":"10.1109/JMEMS.2024.3354235","url":null,"abstract":"This paper reviews the development of silicon resonant accelerometers from 1987 to 2022. For more than 30 years, silicon resonant accelerometers have developed into varieties of structures based on different sensing methods. In the beginning, resonant accelerometers were reported to realize acceleration measurements by detecting the frequency shifts of resonators. A variety of advancements have emerged in the realm of accelerometers, encompassing various aspects such as resonator diversity, enhancements in scale factor, expanded sensing orientations, reduced temperature sensitivity, and the integration of CMOS technology. Furthermore, innovative accelerometer designs have harnessed mode-localized phenomena, synchronization techniques, and parametric modulation, with the overarching goal of enhancing their performance and expanding their applicability. This paper reviews and analyzes the performances and structures of a range of silicon resonant accelerometers over the past three decades, providing a detailing reference and guidance for researchers in this field.","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-01-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139950789","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-23DOI: 10.1109/JMEMS.2024.3352396
Victor Vareilles;Elisa Kaiser;Philippe Voarino;Maike Wiesenfarth;Romain Cariou;Frank Dimroth;Yannick Veschetti;Mohamed Amara;Henning Helmers
Surface tension-driven self-alignment is a promising technique to align millimeter-scale components with a high accuracy of a few microns. It is based on liquid capillary forces moving and aligning a solid component on its receiving pad. Using molten solders as the liquid is a promising way to bond, connect and align a chip with its substrate. Micro-solar cells soldering experiments for micro-concentrator photovoltaics have been carried out. It has been found experimentally that the solder volume, the receiving pad size and the initial placement of the chip have an impact on the placement accuracy. In this work, an analytical and a numerical model of the capillary forces during self-alignment are built to improve the understanding of the experimental results. Guidelines to reach a high placement accuracy are presented. In practice, low solder volumes, receiving pads smaller than the chip and an initial chip displacement of about 10% of the chip size yield a higher placement accuracy. [2023-0153]
{"title":"Experimental and Simulative Correlations of the Influence of Solder Volume and Receptor Size on the Capillary Self-Alignment of Micro Solar Cells","authors":"Victor Vareilles;Elisa Kaiser;Philippe Voarino;Maike Wiesenfarth;Romain Cariou;Frank Dimroth;Yannick Veschetti;Mohamed Amara;Henning Helmers","doi":"10.1109/JMEMS.2024.3352396","DOIUrl":"10.1109/JMEMS.2024.3352396","url":null,"abstract":"Surface tension-driven self-alignment is a promising technique to align millimeter-scale components with a high accuracy of a few microns. It is based on liquid capillary forces moving and aligning a solid component on its receiving pad. Using molten solders as the liquid is a promising way to bond, connect and align a chip with its substrate. Micro-solar cells soldering experiments for micro-concentrator photovoltaics have been carried out. It has been found experimentally that the solder volume, the receiving pad size and the initial placement of the chip have an impact on the placement accuracy. In this work, an analytical and a numerical model of the capillary forces during self-alignment are built to improve the understanding of the experimental results. Guidelines to reach a high placement accuracy are presented. In practice, low solder volumes, receiving pads smaller than the chip and an initial chip displacement of about 10% of the chip size yield a higher placement accuracy. [2023-0153]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139950828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-23DOI: 10.1109/JMEMS.2023.3348872
Gaëtan Vauche;Christophe Corbier
This paper shows that a pre-excitation boost sequence as a friction phase before vertical separation mode improves low frequency triboelectric nanogenerators (LF-TENG) in energy. A space modeling of motions based Maxwell’s approach is proposed. Experimental investigations from a real device and comparisons between measurements and theory are carried out. [2023-0051]
{"title":"Enhanced Performance in Energy of Low Frequency Triboelectric-Nanogenerator Systems","authors":"Gaëtan Vauche;Christophe Corbier","doi":"10.1109/JMEMS.2023.3348872","DOIUrl":"10.1109/JMEMS.2023.3348872","url":null,"abstract":"This paper shows that a pre-excitation boost sequence as a friction phase before vertical separation mode improves low frequency triboelectric nanogenerators (LF-TENG) in energy. A space modeling of motions based Maxwell’s approach is proposed. Experimental investigations from a real device and comparisons between measurements and theory are carried out. [2023-0051]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139951045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Suspended microchannels are of great interest in applications such as physical and chemical sensor systems. In this study, we developed a suspended microchannel resonator (SMR) by bonding two separate Au-coated silicon–insulator–silicon substrates via thermal diffusion bonding. To obtain a secure bond between Au films, we investigated different bonding temperatures and Au film thicknesses. As a result, we successfully fabricated an SMR. We show that the developed resonator has a resonance frequency of 229.55 kHz and a quality factor of 171 for the empty channel. The response of the channel to absolute mass was 18.7 pg/Hz. The measurement results were in good agreement with the results of numerical simulations. In addition, we estimated the practical mass detectability of the developed SMR via statistical analysis. The developed SMR enabled mass detection with a resolution of 710.6 pg. Our SMR can be produced via typical semiconductor fabrication technology, which is advantageous in terms of mass production. [2023-0164]
{"title":"Silicon-Based Suspended Microchannel Resonator Developed Using Au Thermal Diffusion Bonding for Mass Sensing of Biomaterials","authors":"Keita Funayama;Atsushi Miura;Fumihito Arai;Hiroya Tanaka","doi":"10.1109/JMEMS.2024.3352835","DOIUrl":"10.1109/JMEMS.2024.3352835","url":null,"abstract":"Suspended microchannels are of great interest in applications such as physical and chemical sensor systems. In this study, we developed a suspended microchannel resonator (SMR) by bonding two separate Au-coated silicon–insulator–silicon substrates via thermal diffusion bonding. To obtain a secure bond between Au films, we investigated different bonding temperatures and Au film thicknesses. As a result, we successfully fabricated an SMR. We show that the developed resonator has a resonance frequency of 229.55 kHz and a quality factor of 171 for the empty channel. The response of the channel to absolute mass was 18.7 pg/Hz. The measurement results were in good agreement with the results of numerical simulations. In addition, we estimated the practical mass detectability of the developed SMR via statistical analysis. The developed SMR enabled mass detection with a resolution of 710.6 pg. Our SMR can be produced via typical semiconductor fabrication technology, which is advantageous in terms of mass production. [2023-0164]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-01-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10411500","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139950825","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-17DOI: 10.1109/JMEMS.2024.3350132
Minwoo Choi;Taeyeong Kim;Bong Jae Lee;Jaeman Song;Jungchul Lee
The pattern fabrication using a shadow mask does not involve the use of solutions, which is beneficial for scenarios incompatible with wet processes. However, when the shadow mask is partially fixed from its edges, the conformal overlay of the mask may be not ensured, which can give rise to blurred patterns. This study proposes a conformally overlaid ferromagnetic shadow mask (FSM) to the substrate with the help of magnetic force. We identify the strength of the magnetic field that is appropriate for minimizing the inherent gap between the shadow mask and the substrate. Reactive ion etching and electron-beam evaporation processes using a conformally overlaid nickel-cobalt FSM result in processed patterns that exhibit a precise congruence with the mask opening. The development lays the groundwork for more accurate and reliable pattern fabrication without photolithography. [2023-0137]
{"title":"Conformally Overlaid Ferromagnetic Shadow Masks for Etching and Deposition Processes","authors":"Minwoo Choi;Taeyeong Kim;Bong Jae Lee;Jaeman Song;Jungchul Lee","doi":"10.1109/JMEMS.2024.3350132","DOIUrl":"10.1109/JMEMS.2024.3350132","url":null,"abstract":"The pattern fabrication using a shadow mask does not involve the use of solutions, which is beneficial for scenarios incompatible with wet processes. However, when the shadow mask is partially fixed from its edges, the conformal overlay of the mask may be not ensured, which can give rise to blurred patterns. This study proposes a conformally overlaid ferromagnetic shadow mask (FSM) to the substrate with the help of magnetic force. We identify the strength of the magnetic field that is appropriate for minimizing the inherent gap between the shadow mask and the substrate. Reactive ion etching and electron-beam evaporation processes using a conformally overlaid nickel-cobalt FSM result in processed patterns that exhibit a precise congruence with the mask opening. The development lays the groundwork for more accurate and reliable pattern fabrication without photolithography. [2023-0137]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-01-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139950822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-17DOI: 10.1109/JMEMS.2024.3351470
Jonathan MacArthur;Paulo Lozano
Ionic liquids are used in a variety of chemical, microfluidic, aerospace, and other diverse applications. Microfluidic applications often require a small footprint and manage small volumes of fluid in their channels on the order of microliters or less. Many microfluidic devices utilize external pressure systems or mechanical pumping mechanisms to control the flow of fluids through the device, inherently limiting the footprint of the device. Open microchannel microfluidics have at least one fluid boundary open to the environment instead of a channel wall surface confining liquid completely. A promising micro-scale fluid system for spacecraft propulsion applications is the electrospray thruster. Electrospray thrusters utilizes ionic liquids for propellant whereby ions are accelerated via electric field for thrust. These propulsion systems currently have few suitably sized active propellant management options, leaving the overall system less robust than desired. For use as a micro-scale ionic liquid propellant management device in these small electrospray spacecraft propulsion systems, a solid-state flow controller is proposed. By including an electrowetting region within an open microchannel fluid path, a change in liquid pressure can be achieved via electrowetting effect so long as contact angle is free to change within the electrowetting channel region. Various open microchannels are fabricated in silicon and tested, showing that rounding of the open microchannel ledges prevents liquid pinning along the channel, allowing for contact angle changes via electrowetting to manifest a change in pressure within the liquid in the channel, demonstrating a solid-state ionic liquid flow controller for use in electrospray propulsion systems. [2023-0191]
{"title":"Electrowetting Ionic Liquid Flow Controller","authors":"Jonathan MacArthur;Paulo Lozano","doi":"10.1109/JMEMS.2024.3351470","DOIUrl":"10.1109/JMEMS.2024.3351470","url":null,"abstract":"Ionic liquids are used in a variety of chemical, microfluidic, aerospace, and other diverse applications. Microfluidic applications often require a small footprint and manage small volumes of fluid in their channels on the order of microliters or less. Many microfluidic devices utilize external pressure systems or mechanical pumping mechanisms to control the flow of fluids through the device, inherently limiting the footprint of the device. Open microchannel microfluidics have at least one fluid boundary open to the environment instead of a channel wall surface confining liquid completely. A promising micro-scale fluid system for spacecraft propulsion applications is the electrospray thruster. Electrospray thrusters utilizes ionic liquids for propellant whereby ions are accelerated via electric field for thrust. These propulsion systems currently have few suitably sized active propellant management options, leaving the overall system less robust than desired. For use as a micro-scale ionic liquid propellant management device in these small electrospray spacecraft propulsion systems, a solid-state flow controller is proposed. By including an electrowetting region within an open microchannel fluid path, a change in liquid pressure can be achieved via electrowetting effect so long as contact angle is free to change within the electrowetting channel region. Various open microchannels are fabricated in silicon and tested, showing that rounding of the open microchannel ledges prevents liquid pinning along the channel, allowing for contact angle changes via electrowetting to manifest a change in pressure within the liquid in the channel, demonstrating a solid-state ionic liquid flow controller for use in electrospray propulsion systems. [2023-0191]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-01-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139950824","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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