Pub Date : 2025-04-30DOI: 10.1109/JMEMS.2025.3560138
Shun Yasunaga;Motohiko Ezawa;Yoshio Mita
In-plane moving MEMS bistable elements with symmetrical stable states can be realized using post-process compression of a straight beam to be made buckle. This paper derives and experimentally demonstrates an analytical theory of this element. Design parameters of the component structures, a buckling beam, supporting arms, and compression mechanisms with a receptacle that can be made flexible are related to the behavior including the beam’s profile, the force required to make a flip to the other state, and the displacement where the flip happens. Test devices were fabricated using the silicon-on-insulator MEMS technique and their response to an electrostatic attraction was measured. The experimental results matched the developed theory. The theory and the experimental results presented in this paper can facilitate the introduction of symmetrical bistable structures as a new mechanical element in future MEMS devices. [2025-0002]
{"title":"Theory and Experimental Demonstration of Symmetrically Bistable MEMS Pin-Joint Buckled Beam","authors":"Shun Yasunaga;Motohiko Ezawa;Yoshio Mita","doi":"10.1109/JMEMS.2025.3560138","DOIUrl":"https://doi.org/10.1109/JMEMS.2025.3560138","url":null,"abstract":"In-plane moving MEMS bistable elements with symmetrical stable states can be realized using post-process compression of a straight beam to be made buckle. This paper derives and experimentally demonstrates an analytical theory of this element. Design parameters of the component structures, a buckling beam, supporting arms, and compression mechanisms with a receptacle that can be made flexible are related to the behavior including the beam’s profile, the force required to make a flip to the other state, and the displacement where the flip happens. Test devices were fabricated using the silicon-on-insulator MEMS technique and their response to an electrostatic attraction was measured. The experimental results matched the developed theory. The theory and the experimental results presented in this paper can facilitate the introduction of symmetrical bistable structures as a new mechanical element in future MEMS devices. [2025-0002]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 4","pages":"408-421"},"PeriodicalIF":3.1,"publicationDate":"2025-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144756771","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-04-28DOI: 10.1109/JMEMS.2025.3560854
Jack Guida;Siddhartha Ghosh
This work presents a two-fold study on the numerical modeling and experimental demonstration of phononic components using surface acoustic waves (SAWs) in 30% scandium aluminum nitride (ScAlN) thin films on silicon carbide (SiC). Compact phononic integrated circuits (PnICs) enabled by focusing interdigitated transducers (FIDTs) in slow-on-fast piezoelectric platforms offer a promising approach for signal processing by exploiting acoustic wave manipulation. Key working principles, including acoustic waveguiding with three-dimensional confinement, bending, splitting, and coupling, are demonstrated to advance the development of PnICs, facilitating the creation of compact, efficient devices for signal processing applications. [2024-0205]
{"title":"Phononic Integrated Circuit Component Design and Analysis for Surface Acoustic Waves in ScAlN on Silicon Carbide","authors":"Jack Guida;Siddhartha Ghosh","doi":"10.1109/JMEMS.2025.3560854","DOIUrl":"https://doi.org/10.1109/JMEMS.2025.3560854","url":null,"abstract":"This work presents a two-fold study on the numerical modeling and experimental demonstration of phononic components using surface acoustic waves (SAWs) in 30% scandium aluminum nitride (ScAlN) thin films on silicon carbide (SiC). Compact phononic integrated circuits (PnICs) enabled by focusing interdigitated transducers (FIDTs) in slow-on-fast piezoelectric platforms offer a promising approach for signal processing by exploiting acoustic wave manipulation. Key working principles, including acoustic waveguiding with three-dimensional confinement, bending, splitting, and coupling, are demonstrated to advance the development of PnICs, facilitating the creation of compact, efficient devices for signal processing applications. [2024-0205]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 4","pages":"368-378"},"PeriodicalIF":3.1,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144758437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-04-18DOI: 10.1109/JMEMS.2025.3535688
Camila Sola Ruiz;Valter Salles do Nascimento;Clovis Fischer;Frederico Hummel Cioldin;Audrey Roberto Silva;Jose Alexandre Diniz
The high-performance mechanical resistance has attracted intensive scientific interest in Hardmasks (HMs) films applicable via the Bosch etching process for Silicon Micro-Channels (SiMCs) fabrication. This manuscript compares different film deposition methods and metal film behavior as HMs during the dry etching for the Bosch process in the Inductively Coupled Plasma and Reactive Ion Etching system. The HMs were deposited by thermal evaporation Aluminum (Alev), DC Sputtering Aluminum (Alspu), and bath chemical Nickel-phosphorus (Ni-P). The 500nm, $1mu $ m and $1mu $ m thick layers of Alspu, Alev and Ni-P films, respectively, were deposited on the Si wafer (p-type (100) orientation, $400mu $ m thick layer, and 3-inch diameter). The Four Point Probe Measurements and Atomic Force Microscopy (AFM) analyses extract the resistivity and grain size values, respectively. For this work, the HM patterns consist of parallel metallic lines ranging from 175 to $220~mu $ m in width with spacing between 230 and $500~mu $ m. The pattern transfer technique was carried out by lithography and wet etching. All samples were cleaved on $10times 10$ mm squares with a $400~mu $ m thick layer. The Bosch etching process was applied for time variations between 40sec and 60sec per cycle, using SF${}_{6}+$ Ar and C4F${}_{8}+$ Ar, to obtain the SiMCs, with anisotropic etching and depth values between $66~mu $ m and $104~mu $ m. The SiMC depth values were measured using Scanning Electron Microscopy (SEM) and Scan Profile analyses. The Al and Ni-P film analyses of the resistivity and grain size were related to the HM performance during the Bosch process. Key Words: ICP-RIE, Si Microchannel, Bosch process.[2024-0149]
{"title":"Characterization of Al and Ni-P Films as Hardmasks for the ICP-RIE Plasma Etching Bosch Process","authors":"Camila Sola Ruiz;Valter Salles do Nascimento;Clovis Fischer;Frederico Hummel Cioldin;Audrey Roberto Silva;Jose Alexandre Diniz","doi":"10.1109/JMEMS.2025.3535688","DOIUrl":"https://doi.org/10.1109/JMEMS.2025.3535688","url":null,"abstract":"The high-performance mechanical resistance has attracted intensive scientific interest in Hardmasks (HMs) films applicable via the Bosch etching process for Silicon Micro-Channels (SiMCs) fabrication. This manuscript compares different film deposition methods and metal film behavior as HMs during the dry etching for the Bosch process in the Inductively Coupled Plasma and Reactive Ion Etching system. The HMs were deposited by thermal evaporation Aluminum (Alev), DC Sputtering Aluminum (Alspu), and bath chemical Nickel-phosphorus (Ni-P). The 500nm, <inline-formula> <tex-math>$1mu $ </tex-math></inline-formula>m and <inline-formula> <tex-math>$1mu $ </tex-math></inline-formula>m thick layers of Alspu, Alev and Ni-P films, respectively, were deposited on the Si wafer (p-type (100) orientation, <inline-formula> <tex-math>$400mu $ </tex-math></inline-formula>m thick layer, and 3-inch diameter). The Four Point Probe Measurements and Atomic Force Microscopy (AFM) analyses extract the resistivity and grain size values, respectively. For this work, the HM patterns consist of parallel metallic lines ranging from 175 to <inline-formula> <tex-math>$220~mu $ </tex-math></inline-formula>m in width with spacing between 230 and <inline-formula> <tex-math>$500~mu $ </tex-math></inline-formula>m. The pattern transfer technique was carried out by lithography and wet etching. All samples were cleaved on <inline-formula> <tex-math>$10times 10$ </tex-math></inline-formula>mm squares with a <inline-formula> <tex-math>$400~mu $ </tex-math></inline-formula>m thick layer. The Bosch etching process was applied for time variations between 40sec and 60sec per cycle, using SF<inline-formula> <tex-math>${}_{6}+$ </tex-math></inline-formula>Ar and C4F<inline-formula> <tex-math>${}_{8}+$ </tex-math></inline-formula>Ar, to obtain the SiMCs, with anisotropic etching and depth values between <inline-formula> <tex-math>$66~mu $ </tex-math></inline-formula>m and <inline-formula> <tex-math>$104~mu $ </tex-math></inline-formula>m. The SiMC depth values were measured using Scanning Electron Microscopy (SEM) and Scan Profile analyses. The Al and Ni-P film analyses of the resistivity and grain size were related to the HM performance during the Bosch process. Key Words: ICP-RIE, Si Microchannel, Bosch process.[2024-0149]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 3","pages":"244-251"},"PeriodicalIF":2.5,"publicationDate":"2025-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144206202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
By introducing the strengths of the vertical interconnection of TGV (Through Glass Via) technology into FAIMS (high-Field Asymmetric waveform Ion Mobility Spectrometry) chip manufacturing, we propose a wafer-level TGV-MS (multi-stack) FAIMS chip manufacturing method and achieve the wafer-level fabrication of 14 chips on a 6-inch glass wafer for the first time. The test results demonstrate that the TGV wafer manufactured based on this method shows excellent airtightness, electrical properties, and consistency with a leakage rate of $3.94times 10 ^{-11}$ Pa$cdot $ m3/s, a resistivity of $1.92times 10 ^{-4}~Omega cdot $ cm. A single FAIMS chip volume is $4.8times 1.6 times 0.16$ cm3, weight is 2.28 g, the relative thickness error is less than 0.3%, and the parallelism error is less than 0.01°. Meanwhile, typical volatile organic compounds benzene and toluene were selected as samples to test the separation performance of the FAIMS chip, and the detection spectra under different gas concentrations and voltages were obtained. The experimental results show that the wafer-level FAIMS chip has a good resolution for benzene and toluene, and the linear detection range for the two samples is 0.1 ppm to 2 ppm (linear fitting coefficients 98.9%, 99.5%). The detection limit for benzene and toluene is 77 ppb. This paper solves the problem that microfluidic structures with electrodes cannot be manufactured at the wafer level due to side planar electrode leads, greatly simplifies the structure of the chip, realizes the mass production of FAIMS chips, and provides a technical reference for the wafer-level manufacturing of analysis sensors such as microfluidic chips with electrode structures and MEMS mass analyzers. [2024-0229]
{"title":"Wafer-Level Fabrication of FAIMS Chips Based on TGV Technology","authors":"Zhengrui Hu;Han Wang;Shan Li;Youjiang Liu;Chunjing Xu;Shaomin Liu;Jianhui Wei;Chilai Chen","doi":"10.1109/JMEMS.2025.3554629","DOIUrl":"https://doi.org/10.1109/JMEMS.2025.3554629","url":null,"abstract":"By introducing the strengths of the vertical interconnection of TGV (Through Glass Via) technology into FAIMS (high-Field Asymmetric waveform Ion Mobility Spectrometry) chip manufacturing, we propose a wafer-level TGV-MS (multi-stack) FAIMS chip manufacturing method and achieve the wafer-level fabrication of 14 chips on a 6-inch glass wafer for the first time. The test results demonstrate that the TGV wafer manufactured based on this method shows excellent airtightness, electrical properties, and consistency with a leakage rate of <inline-formula> <tex-math>$3.94times 10 ^{-11}$ </tex-math></inline-formula> Pa<inline-formula> <tex-math>$cdot $ </tex-math></inline-formula>m<sup>3</sup>/s, a resistivity of <inline-formula> <tex-math>$1.92times 10 ^{-4}~Omega cdot $ </tex-math></inline-formula>cm. A single FAIMS chip volume is <inline-formula> <tex-math>$4.8times 1.6 times 0.16$ </tex-math></inline-formula> cm<sup>3</sup>, weight is 2.28 g, the relative thickness error is less than 0.3%, and the parallelism error is less than 0.01°. Meanwhile, typical volatile organic compounds benzene and toluene were selected as samples to test the separation performance of the FAIMS chip, and the detection spectra under different gas concentrations and voltages were obtained. The experimental results show that the wafer-level FAIMS chip has a good resolution for benzene and toluene, and the linear detection range for the two samples is 0.1 ppm to 2 ppm (linear fitting coefficients 98.9%, 99.5%). The detection limit for benzene and toluene is 77 ppb. This paper solves the problem that microfluidic structures with electrodes cannot be manufactured at the wafer level due to side planar electrode leads, greatly simplifies the structure of the chip, realizes the mass production of FAIMS chips, and provides a technical reference for the wafer-level manufacturing of analysis sensors such as microfluidic chips with electrode structures and MEMS mass analyzers. [2024-0229]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 3","pages":"252-259"},"PeriodicalIF":2.5,"publicationDate":"2025-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144206199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-04-09DOI: 10.1109/JMEMS.2025.3555563
Hong Xue;Jiabin Ai;Zichao Zhang;Bo Li;Bing Bai;Cun Li;Yulong Zhao
Quartz is an indispensable material in microelectromechanical system (MEMS) technology to manufacture miniaturized oscillators and sensors. The fabrication process of quartz, however, encumbers its development for extensive applications, as it is difficult to ideally control processed dimensions. Although dry etching or other special machining techniques have been profoundly researched, wet etching is still the most practical and cost-effective method to obtain desired structures. In this study, z-cut $alpha $ -quartz wafers were etched by ammonium bifluoride solutions of different concentrations at various temperatures, and the etched results including depth, roughness, and morphology were measured, calculated and analyzed. Subsequently, the tendency of the etched results with respect to temperature and concentration reflected the correlation of conditional parameters on the etched results, and suggested that the distinction of roughness at a specific etched depth was insignificant despite the variation in etchant concentration. Additionally, the etched results were analyzed further to reveal the etching mechanism of different fluorine-based solutions. At last, the pendulum of quartz resonant accelerometer was fabricated by different etchants, and their mechanical and thermal performances were compared, indicating that smoother etched surface is beneficial to realize appropriate sensitivity and optimize thermal stability. These investigations provide quantitative data and qualitative analyses to improve the deep wet etching process in terms of design, manufacture, and performance for quartz MEMS devices. [2025-0007]
{"title":"Deep Wet Etching of a Z-Cut α-Quartz Wafer by Fluorine-Based Solutions: Experiment, Mechanism, and Application","authors":"Hong Xue;Jiabin Ai;Zichao Zhang;Bo Li;Bing Bai;Cun Li;Yulong Zhao","doi":"10.1109/JMEMS.2025.3555563","DOIUrl":"https://doi.org/10.1109/JMEMS.2025.3555563","url":null,"abstract":"Quartz is an indispensable material in microelectromechanical system (MEMS) technology to manufacture miniaturized oscillators and sensors. The fabrication process of quartz, however, encumbers its development for extensive applications, as it is difficult to ideally control processed dimensions. Although dry etching or other special machining techniques have been profoundly researched, wet etching is still the most practical and cost-effective method to obtain desired structures. In this study, z-cut <inline-formula> <tex-math>$alpha $ </tex-math></inline-formula>-quartz wafers were etched by ammonium bifluoride solutions of different concentrations at various temperatures, and the etched results including depth, roughness, and morphology were measured, calculated and analyzed. Subsequently, the tendency of the etched results with respect to temperature and concentration reflected the correlation of conditional parameters on the etched results, and suggested that the distinction of roughness at a specific etched depth was insignificant despite the variation in etchant concentration. Additionally, the etched results were analyzed further to reveal the etching mechanism of different fluorine-based solutions. At last, the pendulum of quartz resonant accelerometer was fabricated by different etchants, and their mechanical and thermal performances were compared, indicating that smoother etched surface is beneficial to realize appropriate sensitivity and optimize thermal stability. These investigations provide quantitative data and qualitative analyses to improve the deep wet etching process in terms of design, manufacture, and performance for quartz MEMS devices. [2025-0007]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 3","pages":"332-346"},"PeriodicalIF":2.5,"publicationDate":"2025-04-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144206039","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-04-08DOI: 10.1109/JMEMS.2025.3546836
{"title":"Journal of Microelectromechanical Systems Publication Information","authors":"","doi":"10.1109/JMEMS.2025.3546836","DOIUrl":"https://doi.org/10.1109/JMEMS.2025.3546836","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 2","pages":"C2-C2"},"PeriodicalIF":2.5,"publicationDate":"2025-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10956169","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143800978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-04-04DOI: 10.1109/JMEMS.2025.3553118
Lei Han;Yutang Pan;Saisai Liu;Chuyuan Gao;Lifan Cheng
In this paper, we report a novel three-state Radio Frequency Microelectromechanical Systems (RF MEMS) switch, which is based on origami structure for large tunable capability. Combined with the origami structure, the switch can achieve the deep-on state by raising the height of the origami beam. This switch has been designed and fabricated successfully with the silicon process. Experimental results show that the origami beam can be raised to $76~mu $ m at the deep-on state with an amplification factor of 12.6 compared to the on state. In the frequency range of 10-30 GHz, when the switch is at the on state, the insertion loss is better than −0.4 dB and the return loss is better than -18dB. At the deep-on state, the return loss achieves −31dB with the improvement of 13 dB. At the off state, the isolation of the switch is better than −20 dB. As a result, the presented switch based on origami structure can be a promising choice for low loss, high isolation, and large tunable range applications.[2024-0221]
{"title":"A Novel Three-State RF MEMS Switch Based on Origami Structure","authors":"Lei Han;Yutang Pan;Saisai Liu;Chuyuan Gao;Lifan Cheng","doi":"10.1109/JMEMS.2025.3553118","DOIUrl":"https://doi.org/10.1109/JMEMS.2025.3553118","url":null,"abstract":"In this paper, we report a novel three-state Radio Frequency Microelectromechanical Systems (RF MEMS) switch, which is based on origami structure for large tunable capability. Combined with the origami structure, the switch can achieve the deep-on state by raising the height of the origami beam. This switch has been designed and fabricated successfully with the silicon process. Experimental results show that the origami beam can be raised to <inline-formula> <tex-math>$76~mu $ </tex-math></inline-formula>m at the deep-on state with an amplification factor of 12.6 compared to the on state. In the frequency range of 10-30 GHz, when the switch is at the on state, the insertion loss is better than −0.4 dB and the return loss is better than -18dB. At the deep-on state, the return loss achieves −31dB with the improvement of 13 dB. At the off state, the isolation of the switch is better than −20 dB. As a result, the presented switch based on origami structure can be a promising choice for low loss, high isolation, and large tunable range applications.[2024-0221]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 3","pages":"276-282"},"PeriodicalIF":2.5,"publicationDate":"2025-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144206200","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-04-04DOI: 10.1109/JMEMS.2025.3553291
Jianfeng Zhang;Jintang Shang
Currently, medical magnetic localization necessitates complex and costly gradient coil systems, primarily due to the limited sensitivity of the magnetic sensors in use. This article presents a highly sensitive, compact multipoint quantum magnetometer (CMQM) characterized by a straightforward design and low cost. The core of the sensor is a MEMS 3D Rubidium (Rb) atomic cell with an optical path of 3.0 cm, which is manufactured through a mold foaming process. The size of the compact sensor head is less than 11.5 cm3. The CMQM obtains magnetic field magnitude at six points by measuring Larmor frequency of rubidium atoms within corresponding positions. A uniform magnetic field coils is calibrated with the CMQM within a ferromagnetic shield. The vector synthesis method is used to enhance the accuracy by reducing interference from remanent magnetic field. The deviation between the measured magnetic field and those predicted using closed cylinder approximation (CCA) is less than 1.1%. The magnetic noise density at different points varies between 2.289 pT/Hz1/2 and 6.015 pT/Hz1/2. The effective magnetic resolution of the CMQM is ~0.65 nT. Theoretical spatial resolution of the CMQM can reach to $17.5~mu $ m with a simple circular coil. [2024-0230]
{"title":"Compact Multi-Point Quantum Magnetometer With a Molded Foaming 3D MEMS Vapor Cell for Magnetic Localization","authors":"Jianfeng Zhang;Jintang Shang","doi":"10.1109/JMEMS.2025.3553291","DOIUrl":"https://doi.org/10.1109/JMEMS.2025.3553291","url":null,"abstract":"Currently, medical magnetic localization necessitates complex and costly gradient coil systems, primarily due to the limited sensitivity of the magnetic sensors in use. This article presents a highly sensitive, compact multipoint quantum magnetometer (CMQM) characterized by a straightforward design and low cost. The core of the sensor is a MEMS 3D Rubidium (Rb) atomic cell with an optical path of 3.0 cm, which is manufactured through a mold foaming process. The size of the compact sensor head is less than 11.5 cm<sup>3</sup>. The CMQM obtains magnetic field magnitude at six points by measuring Larmor frequency of rubidium atoms within corresponding positions. A uniform magnetic field coils is calibrated with the CMQM within a ferromagnetic shield. The vector synthesis method is used to enhance the accuracy by reducing interference from remanent magnetic field. The deviation between the measured magnetic field and those predicted using closed cylinder approximation (CCA) is less than 1.1%. The magnetic noise density at different points varies between 2.289 pT/Hz<sup>1/2</sup> and 6.015 pT/Hz<sup>1/2</sup>. The effective magnetic resolution of the CMQM is ~0.65 nT. Theoretical spatial resolution of the CMQM can reach to <inline-formula> <tex-math>$17.5~mu $ </tex-math></inline-formula>m with a simple circular coil. [2024-0230]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 3","pages":"316-323"},"PeriodicalIF":2.5,"publicationDate":"2025-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144205885","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-04-01DOI: 10.1109/JMEMS.2025.3550932
Zhen Peng;Zhimi Zhang;Ziyi He;Adrian J. T. Teo;Yihao Long;Muhammad Tahir;Jun Dai;Yixiao Dong;Liang He;King Ho Holden Li
Cell lysis is fundamental yet crucial for downstream bioassays. The use of chemical reagents will directly affect the subsequent workflows. Important research involving microfluidics is emerging in cell lysis, for its merits in less reagent usage and high automation of agent manipulation. In this study, a novel microfluidic system was designed and validated in achieving the synergistic effect of mechanical and chemical lysis. The consumption of cell lysis reagent is reduced by half without compromising lysis efficiency. A PDMS-based microfluidic system with a magnetically driven stirring bar enhances cell lysis through mechanical agitation. The lysed cell sample can be centrifuged into the detection chamber for observation. Experiments conducted using oral CAL-27 adenosquamous carcinoma cells showed that the mechanical shock generated in situ had a positive synergistic effect on chemical cell lysing, further optimizing traditional lysing procedures. The maximum cell lysis efficiency was improved from 88% to 94% while reducing the use of reagents. Critical parameters also enable similar lysis efficiencies at half the dosage required. This microfluidic system can enable on-site biological sample preparation for point-of-care detection, offering significant cost and time savings while ensuring high efficiency and reliability.[2025-0012]
{"title":"Integrated Microfluidic System for Mechanical Agitation-Based Cell Lysis and Fluorescence Detection Using Reduced Amount of Reagent","authors":"Zhen Peng;Zhimi Zhang;Ziyi He;Adrian J. T. Teo;Yihao Long;Muhammad Tahir;Jun Dai;Yixiao Dong;Liang He;King Ho Holden Li","doi":"10.1109/JMEMS.2025.3550932","DOIUrl":"https://doi.org/10.1109/JMEMS.2025.3550932","url":null,"abstract":"Cell lysis is fundamental yet crucial for downstream bioassays. The use of chemical reagents will directly affect the subsequent workflows. Important research involving microfluidics is emerging in cell lysis, for its merits in less reagent usage and high automation of agent manipulation. In this study, a novel microfluidic system was designed and validated in achieving the synergistic effect of mechanical and chemical lysis. The consumption of cell lysis reagent is reduced by half without compromising lysis efficiency. A PDMS-based microfluidic system with a magnetically driven stirring bar enhances cell lysis through mechanical agitation. The lysed cell sample can be centrifuged into the detection chamber for observation. Experiments conducted using oral CAL-27 adenosquamous carcinoma cells showed that the mechanical shock generated in situ had a positive synergistic effect on chemical cell lysing, further optimizing traditional lysing procedures. The maximum cell lysis efficiency was improved from 88% to 94% while reducing the use of reagents. Critical parameters also enable similar lysis efficiencies at half the dosage required. This microfluidic system can enable on-site biological sample preparation for point-of-care detection, offering significant cost and time savings while ensuring high efficiency and reliability.[2025-0012]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 3","pages":"324-331"},"PeriodicalIF":2.5,"publicationDate":"2025-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144206038","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：