Pub Date : 2024-09-26DOI: 10.1109/JMEMS.2024.3460401
Andrea Buffoli;Marco Gadola;Philippe Robert;Giacomo Langfelder
This document presents a novel architecture of a microelectromechanical system (MEMS) gyroscope for in-plane angular rate sensing (i.e. pitch or roll axis), with a detailed characterization of the performance, including effects of etching nonuniformities and quadrature, which are relevant when dealing with these specific sensing axes. The adopted technology features 20- $mu $ m-thick frames and springs, and 250-nm-thick and -wide resistive gauges, which are subject to stress under Coriolis-force-induced tilt of a torsional lever. The new design increases by a factor larger than 3 the efficiency of the transduction between tilting of the Coriolis frame inside the gyroscope and corresponding stress on the resistive gauges, in turn improving scale-factor, and bringing noise and stability down to record levels for pitch or roll planar silicon micromachined gyroscopes. At the same time, with respect to a former architecture, a comparative analysis of the impact of the new design choices on the dispersion of the mode-split value is carried out. Results demonstrate that the dispersion increases by a negligible amount, from 36 Hz (old design) to 44 Hz (new design). Most of tested gyroscopes have quadrature value within 5000 dps: however, within a 6-V supply operated board, only part of these sensors could be properly operated under automatic quadrature compensation, reaching under these conditions noise in the range of $0.02~^{circ }$ / $surd $ hr and the minimum of the Allan deviation at $0.12~^{circ }$ /hr.[2024-0124]
{"title":"MEMS Pitch Gyroscope Based on (250-nm)² Gauges Achieving 0.12 °/hr Over 1000 dps Full-Scale","authors":"Andrea Buffoli;Marco Gadola;Philippe Robert;Giacomo Langfelder","doi":"10.1109/JMEMS.2024.3460401","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3460401","url":null,"abstract":"This document presents a novel architecture of a microelectromechanical system (MEMS) gyroscope for in-plane angular rate sensing (i.e. pitch or roll axis), with a detailed characterization of the performance, including effects of etching nonuniformities and quadrature, which are relevant when dealing with these specific sensing axes. The adopted technology features 20-\u0000<inline-formula> <tex-math>$mu $ </tex-math></inline-formula>\u0000m-thick frames and springs, and 250-nm-thick and -wide resistive gauges, which are subject to stress under Coriolis-force-induced tilt of a torsional lever. The new design increases by a factor larger than 3 the efficiency of the transduction between tilting of the Coriolis frame inside the gyroscope and corresponding stress on the resistive gauges, in turn improving scale-factor, and bringing noise and stability down to record levels for pitch or roll planar silicon micromachined gyroscopes. At the same time, with respect to a former architecture, a comparative analysis of the impact of the new design choices on the dispersion of the mode-split value is carried out. Results demonstrate that the dispersion increases by a negligible amount, from 36 Hz (old design) to 44 Hz (new design). Most of tested gyroscopes have quadrature value within 5000 dps: however, within a 6-V supply operated board, only part of these sensors could be properly operated under automatic quadrature compensation, reaching under these conditions noise in the range of \u0000<inline-formula> <tex-math>$0.02~^{circ }$ </tex-math></inline-formula>\u0000/\u0000<inline-formula> <tex-math>$surd $ </tex-math></inline-formula>\u0000hr and the minimum of the Allan deviation at \u0000<inline-formula> <tex-math>$0.12~^{circ }$ </tex-math></inline-formula>\u0000/hr.[2024-0124]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"660-667"},"PeriodicalIF":2.5,"publicationDate":"2024-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10695088","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142761465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this paper, the design, concept and experimental validation of the performances of a piezoelectric resonant microelectromechanical systems (MEMS) phase comparator is presented. Compared to traditional integrated circuits, the potential benefits of a MEMS phase comparator include a low power consumption, higher sensitivity, higher selectivity and improved robustness. The design and experimental validation of a resonant MEMS phase comparator are presented along with characterization recommendations. The operation of this resonant MEMS phase comparator is experimentally validated over the first five eigen modes at 108 kHz, 298.7 kHz, 583.3 kHz, 962.8 kHz and 1.4375 MHz. Calibration of the resonant MEMS phase comparator is presented, allowing for simple device operation, which is validated under various waveform stimulations: sinusoidal, square, and triangular. This work is expected to lead to the development of new applications for MEMS resonating devices. [2024-0037]
{"title":"Design and Experimental Validation of a Piezoelectric Resonant MEMS Phase Comparator","authors":"Mathieu Gratuze;Mohammad Kazemi;Seyedfakhreddin Nabavi;Paul-Vahé Cicek;Alexandre Robichaud;Frederic Nabki","doi":"10.1109/JMEMS.2024.3455106","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3455106","url":null,"abstract":"In this paper, the design, concept and experimental validation of the performances of a piezoelectric resonant microelectromechanical systems (MEMS) phase comparator is presented. Compared to traditional integrated circuits, the potential benefits of a MEMS phase comparator include a low power consumption, higher sensitivity, higher selectivity and improved robustness. The design and experimental validation of a resonant MEMS phase comparator are presented along with characterization recommendations. The operation of this resonant MEMS phase comparator is experimentally validated over the first five eigen modes at 108 kHz, 298.7 kHz, 583.3 kHz, 962.8 kHz and 1.4375 MHz. Calibration of the resonant MEMS phase comparator is presented, allowing for simple device operation, which is validated under various waveform stimulations: sinusoidal, square, and triangular. This work is expected to lead to the development of new applications for MEMS resonating devices. [2024-0037]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"747-757"},"PeriodicalIF":2.5,"publicationDate":"2024-09-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142761496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-18DOI: 10.1109/JMEMS.2024.3455095
Roufaida Bensalem;Mohannad Y. Elsayed;Hani H. Tawfik;Mourad N. El-Gamal
This paper presents a novel approach to enhance ultrasound transmission using capacitive micromachined ultrasonic transducers (CMUTs). This is achieved by increasing the cavity height through the use of electrostatic repulsion. Conventional CMUTs based on attractive forces have promising electroacoustic characteristics but limited output pressure, compared to piezoelectric transducers due to the limited motion ranges for CMUTs imposed by the capacitive transduction gap. Therefore, we propose here an electrostatic repulsive CMUT design with three fixed electrodes and one movable electrode that displaces out-of-plane. Simulation results demonstrate the design’s effectiveness in increasing the transducer’s range of motion, thus enhancing transmission sound pressure. Prototypes were fabricated using MEMSCAP’s PolyMUMPs process. Repulsive actuation allows for more than an order of magnitude (11x) improvement in the allowable motion range and therefore an improvement in the acoustic output by a factor up to 25.42 dB. Experimental tests using a vibrometer and an ultrasonic microphone confirm the effectiveness of the proposed approach. The CMUT array operates over a wide band of frequencies from 150 kHz to 650 kHz, which opens the doors for several applications such as ranging, gesture recognition, and non-destructive testing, with the potential for further improvements in ultrasound transmission. [2023-0158]
{"title":"Capacitive Micromachined Transducers With Out-of-Plane Repulsive Actuation for Enhancing Ultrasound Transmission in Air","authors":"Roufaida Bensalem;Mohannad Y. Elsayed;Hani H. Tawfik;Mourad N. El-Gamal","doi":"10.1109/JMEMS.2024.3455095","DOIUrl":"10.1109/JMEMS.2024.3455095","url":null,"abstract":"This paper presents a novel approach to enhance ultrasound transmission using capacitive micromachined ultrasonic transducers (CMUTs). This is achieved by increasing the cavity height through the use of electrostatic repulsion. Conventional CMUTs based on attractive forces have promising electroacoustic characteristics but limited output pressure, compared to piezoelectric transducers due to the limited motion ranges for CMUTs imposed by the capacitive transduction gap. Therefore, we propose here an electrostatic repulsive CMUT design with three fixed electrodes and one movable electrode that displaces out-of-plane. Simulation results demonstrate the design’s effectiveness in increasing the transducer’s range of motion, thus enhancing transmission sound pressure. Prototypes were fabricated using MEMSCAP’s PolyMUMPs process. Repulsive actuation allows for more than an order of magnitude (11x) improvement in the allowable motion range and therefore an improvement in the acoustic output by a factor up to 25.42 dB. Experimental tests using a vibrometer and an ultrasonic microphone confirm the effectiveness of the proposed approach. The CMUT array operates over a wide band of frequencies from 150 kHz to 650 kHz, which opens the doors for several applications such as ranging, gesture recognition, and non-destructive testing, with the potential for further improvements in ultrasound transmission. [2023-0158]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"677-684"},"PeriodicalIF":2.5,"publicationDate":"2024-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142257829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper introduces a novel and simple etching technique that utilizes a mixture of sulfuric acid (H2 SO4) and hydrofluoric acid (HF). This method selectively etches silicon dioxide (SiO2) over aluminum (Al) in Micro-Electro-Mechanical Systems (MEMS) fabrication, offering an alternative to traditional methods that often damage Al or require expensive setups. Here, we employ H2 SO4’s hygroscopic properties to effectively dehydrate HF, reducing water content and limiting fluoride ion generation, which is the cause for Al etching during SiO2 etching. Experimental results demonstrate an exceptional selectivity ratio exceeding 130,000:1 for SiO2 over Al, confirming the method’s precision and the preservation of Al’s integrity. The etching technique preserves the electrical and mechanical properties of Al films, even after extended exposure to the etchant, and demonstrates its effectiveness in the practical fabrication of back-end-of-line (BEOL) micro-electromechanical switches. By utilizing readily available chemicals, the proposed etching method enhances economic feasibility and accessibility, demonstrating significant advancements in MEMS fabrication. The reliability and cost-effectiveness offer a promising solution for integrating microscale structures composed of Al without compromising device performance.[2024-0115]
{"title":"Highly Selective Etching of Silicon Dioxide Over Aluminum Using Mixtures of Sulfuric Acid and Hydrofluoric Acid","authors":"Tae-Soo Kim;Yong-Bok Lee;So-Young Lee;Sung-Ho Kim;Jun-Bo Yoon","doi":"10.1109/JMEMS.2024.3450911","DOIUrl":"10.1109/JMEMS.2024.3450911","url":null,"abstract":"This paper introduces a novel and simple etching technique that utilizes a mixture of sulfuric acid (H2 SO4) and hydrofluoric acid (HF). This method selectively etches silicon dioxide (SiO2) over aluminum (Al) in Micro-Electro-Mechanical Systems (MEMS) fabrication, offering an alternative to traditional methods that often damage Al or require expensive setups. Here, we employ H2 SO4’s hygroscopic properties to effectively dehydrate HF, reducing water content and limiting fluoride ion generation, which is the cause for Al etching during SiO2 etching. Experimental results demonstrate an exceptional selectivity ratio exceeding 130,000:1 for SiO2 over Al, confirming the method’s precision and the preservation of Al’s integrity. The etching technique preserves the electrical and mechanical properties of Al films, even after extended exposure to the etchant, and demonstrates its effectiveness in the practical fabrication of back-end-of-line (BEOL) micro-electromechanical switches. By utilizing readily available chemicals, the proposed etching method enhances economic feasibility and accessibility, demonstrating significant advancements in MEMS fabrication. The reliability and cost-effectiveness offer a promising solution for integrating microscale structures composed of Al without compromising device performance.[2024-0115]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"729-735"},"PeriodicalIF":2.5,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142216961","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-30DOI: 10.1109/JMEMS.2024.3447694
Satish K. Verma;Bhaskar Mitra
This paper introduces a method for signal amplification and enhancement of full width half maxima (FWHM) in a depletion layer-transduced flexural resonator using the parametric effect. The device can be used as a filter-amplifier, or as a low-noise readout method for sensors. Parametric excitation shows a significant drop in device impedance, from 334.2 k $Omega $ without a pump signal to 45.9 k $Omega $ with a 300 mV pump signal. In the absence of the pump signal, with an input power of −10 dBm, the resonator produces an output power of −44.87 dBm at ~400 kHz and a FWHM value of 23 Hz. However, when a 200 mV pump signal at $2f_{0}$ with $pi $ /2 phase shift, is superimposed with the same input power, the resonator’s output power amplifies to −11.49 dBm, and the FWHM value substantially decreases to 10 Hz. This leads to a 33.58 dBm of amplification and 2.3x improvement in Q attributed to the parametric effect. A detailed analytical model of the transducer is presented. [2024-0061]
本文介绍了一种利用参数效应放大和增强耗尽层换能器全宽半最大值的方法。该装置可以用作滤波放大器，也可以用作传感器的低噪声读出方法。参数激励显示设备阻抗显著下降，从没有泵信号的334.2 k $Omega $到300 mV泵信号的45.9 k $Omega $。在没有泵浦信号的情况下，在输入功率为−10 dBm的情况下，谐振器在400 kHz时产生−44.87 dBm的输出功率，频宽值为23 Hz。然而，当一个200 mV的$2f_{0}$相移$pi $ /2的泵浦信号与相同的输入功率叠加时，谐振器的输出功率放大到- 11.49 dBm， FWHM值大幅降低到10 Hz。这导致33.58 dBm的放大和2.3倍的改进Q归因于参数效应。给出了换能器的详细分析模型。[2024-0061]
{"title":"Parametric Amplification in Depletion Layer Transduced Microelectromechanical Resonator","authors":"Satish K. Verma;Bhaskar Mitra","doi":"10.1109/JMEMS.2024.3447694","DOIUrl":"10.1109/JMEMS.2024.3447694","url":null,"abstract":"This paper introduces a method for signal amplification and enhancement of full width half maxima (FWHM) in a depletion layer-transduced flexural resonator using the parametric effect. The device can be used as a filter-amplifier, or as a low-noise readout method for sensors. Parametric excitation shows a significant drop in device impedance, from 334.2 k\u0000<inline-formula> <tex-math>$Omega $ </tex-math></inline-formula>\u0000 without a pump signal to 45.9 k\u0000<inline-formula> <tex-math>$Omega $ </tex-math></inline-formula>\u0000 with a 300 mV pump signal. In the absence of the pump signal, with an input power of −10 dBm, the resonator produces an output power of −44.87 dBm at ~400 kHz and a FWHM value of 23 Hz. However, when a 200 mV pump signal at \u0000<inline-formula> <tex-math>$2f_{0}$ </tex-math></inline-formula>\u0000 with \u0000<inline-formula> <tex-math>$pi $ </tex-math></inline-formula>\u0000/2 phase shift, is superimposed with the same input power, the resonator’s output power amplifies to −11.49 dBm, and the FWHM value substantially decreases to 10 Hz. This leads to a 33.58 dBm of amplification and 2.3x improvement in Q attributed to the parametric effect. A detailed analytical model of the transducer is presented. [2024-0061]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"668-676"},"PeriodicalIF":2.5,"publicationDate":"2024-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142216966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Microheaters have evolved to become a key component of devices in a wide range of applications, many of which require a thermal profile with good uniformity. To this end, it is critical not only to select an appropriate device geometry but also to have reliable tools to assess the uniformity in the microscale. This paper presents a collection of novel sensors to experimentally extract the mean temperature in various regions of the micro-hotplate with high accuracy, offering an innovative alternative to other uniformity measurement tools that are often not available or not sufficiently precise. The studies are articulated around a series of meander-based microheaters, for which the temperature versus voltage profile, response time, power consumption and uniformity are studied. In this way, insight into the influence of different geometrical parameters (i.e. line arrangement, scaling, linewidth and line spacing) is provided. Finite Element Method simulations are performed based on certain assumptions and boundary conditions and exhibit strong concordance with our experimental data, thus we demonstrated that the sensors serve as a tool to validate the representativeness of a model.[2024-0110]
{"title":"Integrated Sensors to Experimentally Measure Microheater Uniformity: Geometry Implications in Meander-Based Structures","authors":"Maider Calderon-Gonzalez;David Cheyns;Rob Ameloot;Jan Genoe","doi":"10.1109/JMEMS.2024.3447880","DOIUrl":"10.1109/JMEMS.2024.3447880","url":null,"abstract":"Microheaters have evolved to become a key component of devices in a wide range of applications, many of which require a thermal profile with good uniformity. To this end, it is critical not only to select an appropriate device geometry but also to have reliable tools to assess the uniformity in the microscale. This paper presents a collection of novel sensors to experimentally extract the mean temperature in various regions of the micro-hotplate with high accuracy, offering an innovative alternative to other uniformity measurement tools that are often not available or not sufficiently precise. The studies are articulated around a series of meander-based microheaters, for which the temperature versus voltage profile, response time, power consumption and uniformity are studied. In this way, insight into the influence of different geometrical parameters (i.e. line arrangement, scaling, linewidth and line spacing) is provided. Finite Element Method simulations are performed based on certain assumptions and boundary conditions and exhibit strong concordance with our experimental data, thus we demonstrated that the sensors serve as a tool to validate the representativeness of a model.[2024-0110]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"736-746"},"PeriodicalIF":2.5,"publicationDate":"2024-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142216962","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-27DOI: 10.1109/JMEMS.2024.3443641
Chengxin Li;Aojie Quan;Hemin Zhang;Chen Wang;Linlin Wang;Mustafa Mert Torunbalci;Yuan Wang;Michael Kraft
In this work, the relationship between nonlinear effects and the signal-to-noise ratio of a resonator is analyzed and the impact of reducing nonlinear effects of the resonator on the performance of a resonant accelerometer is investigated. A theoretical framework is formulated to evaluate the dynamic range of the double clamped-clamped resonator. A reduction of the mechanical nonlinearity is achieved through an external electrostatic force, resulting in an enhancement of the dynamic range from 93.8 dB to 132.6 dB. Experimental findings indicate the nonlinear coefficient is reduced to 2.2% compared to an approach without nonlinearity compensation. The nonlinearity compensation demonstrates a 12.8 dB improvement in the signal-to-noise ratio of the resonator, leading to a 5.5-fold increase in resolution of the accelerometer and an extension of the dynamic range by 15 dB. The proposed technique enables the performance of resonant sensors to be further optimized. [2024-0107]
{"title":"On Extending Signal-to-Noise Ratio of Resonators for a MEMS Resonant Accelerometers Using Nonlinearity Compensation","authors":"Chengxin Li;Aojie Quan;Hemin Zhang;Chen Wang;Linlin Wang;Mustafa Mert Torunbalci;Yuan Wang;Michael Kraft","doi":"10.1109/JMEMS.2024.3443641","DOIUrl":"10.1109/JMEMS.2024.3443641","url":null,"abstract":"In this work, the relationship between nonlinear effects and the signal-to-noise ratio of a resonator is analyzed and the impact of reducing nonlinear effects of the resonator on the performance of a resonant accelerometer is investigated. A theoretical framework is formulated to evaluate the dynamic range of the double clamped-clamped resonator. A reduction of the mechanical nonlinearity is achieved through an external electrostatic force, resulting in an enhancement of the dynamic range from 93.8 dB to 132.6 dB. Experimental findings indicate the nonlinear coefficient is reduced to 2.2% compared to an approach without nonlinearity compensation. The nonlinearity compensation demonstrates a 12.8 dB improvement in the signal-to-noise ratio of the resonator, leading to a 5.5-fold increase in resolution of the accelerometer and an extension of the dynamic range by 15 dB. The proposed technique enables the performance of resonant sensors to be further optimized. [2024-0107]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 5","pages":"568-576"},"PeriodicalIF":2.5,"publicationDate":"2024-08-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10651611","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142216963","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
2D arrays are crucial for developing compact and efficient 3D ultrasound systems. Capacitive micromachined ultrasonic transducer (CMUT) arrays, providing convenient integration with supporting electronics, are advantageous for implementing such systems. Fabricating 2D CMUT arrays and integrated circuits (ICs) separately and then combining them in the packaging stage provides flexibility in design and integration. The integrated system can be used for beam-steering and electronic focusing in 3D space. Previously, fabrication processes were reported for implementing 2D CMUT arrays on glass substrates with copper through-glass-via (Cu-TGV) interconnects using anodic bonding and silicon through-glass-via (Si-TGV) interconnects using a sacrificial-release process. Both approaches had challenges, such as voids in Cu-vias, microcracks in laser-drilled glass, mechanical stress in CVD nitride layers, and low fill factor due to fabrication limitations. These challenges can be overcome by combining Si-TGV interconnects with an anodic bonding process. We developed a Si-TGV wafer with a backside glass layer to make it compatible with anodic bonding. We designed and fabricated $32times 32~2$ D CMUT arrays with a single cell per element to increase the fill factor and to produce high pressure. We measured an output pressure as high as 4.75 MPa $_{textbf {pp}}$ at 1.8 MHz by focusing the array at 8 mm (F $#1$ ). Four arrays, tiled next to each other in a $2times 2$ grid, focusing at 15 mm produced up to 8.65 MPa $_{textbf {pp}}$ pressure at 1.8 MHz. We achieved 99.9% element yield measured in a single array.[2024-0078]
{"title":"Fabrication of 32×32 2 D CMUT Arrays on a Borosilicate Glass Substrate With Silicon- Through-Wafer Interconnects Using Non- Aligned and Aligned Anodic Bonding","authors":"Muhammetgeldi Annayev;Ali Önder Biliroğlu;Erdem Şennik;Feysel Yalçın Yamaner;Ömer Oralkan","doi":"10.1109/JMEMS.2024.3440191","DOIUrl":"10.1109/JMEMS.2024.3440191","url":null,"abstract":"2D arrays are crucial for developing compact and efficient 3D ultrasound systems. Capacitive micromachined ultrasonic transducer (CMUT) arrays, providing convenient integration with supporting electronics, are advantageous for implementing such systems. Fabricating 2D CMUT arrays and integrated circuits (ICs) separately and then combining them in the packaging stage provides flexibility in design and integration. The integrated system can be used for beam-steering and electronic focusing in 3D space. Previously, fabrication processes were reported for implementing 2D CMUT arrays on glass substrates with copper through-glass-via (Cu-TGV) interconnects using anodic bonding and silicon through-glass-via (Si-TGV) interconnects using a sacrificial-release process. Both approaches had challenges, such as voids in Cu-vias, microcracks in laser-drilled glass, mechanical stress in CVD nitride layers, and low fill factor due to fabrication limitations. These challenges can be overcome by combining Si-TGV interconnects with an anodic bonding process. We developed a Si-TGV wafer with a backside glass layer to make it compatible with anodic bonding. We designed and fabricated \u0000<inline-formula> <tex-math>$32times 32~2$ </tex-math></inline-formula>\u0000D CMUT arrays with a single cell per element to increase the fill factor and to produce high pressure. We measured an output pressure as high as 4.75 MPa\u0000<inline-formula> <tex-math>$_{textbf {pp}}$ </tex-math></inline-formula>\u0000 at 1.8 MHz by focusing the array at 8 mm (F\u0000<inline-formula> <tex-math>$#1$ </tex-math></inline-formula>\u0000). Four arrays, tiled next to each other in a \u0000<inline-formula> <tex-math>$2times 2$ </tex-math></inline-formula>\u0000 grid, focusing at 15 mm produced up to 8.65 MPa\u0000<inline-formula> <tex-math>$_{textbf {pp}}$ </tex-math></inline-formula>\u0000 pressure at 1.8 MHz. We achieved 99.9% element yield measured in a single array.[2024-0078]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 5","pages":"586-595"},"PeriodicalIF":2.5,"publicationDate":"2024-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142216964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper reports the experimental estimation of the mechanical quality factor ( $Q_{m}$ ) of polymer films, which can be used as damping materials for MEMS. Considering the application to MEMS devices, polymer/PZT composite actuators using two thick photoresists (TMMR-NA1000 and SU8) and PDMS were fabricated and the Q factors were evaluated in a vacuum environment. The comparison between the measured and simulated Q factor confirmed a $Q_{m}$ range of 14-18 for TMMR-NA1000, 13-20 for SU8, and 5-8 for PDMS, indicating the superior damping capability of PDMS. Additionally, it was also found that the PZT thin film used in this study exhibited $Q_{m}$ of 200-220 under the driving voltage of 2 Vpp with +1V DC offset. The evaluation approach developed for assessing $Q_{m}$ of polymer materials is straightforward, easily implementable, and has broad structure applicability, offering a promising tool for assessing a wide array of materials. [2024-0096]
{"title":"Mechanical Quality Factor Evaluation of Damping Film Materials for Polymer/PZT Composite MEMS Actuator","authors":"Xuchen Wang;Yukio Suzuki;Chung-Min Li;Shuji Tanaka","doi":"10.1109/JMEMS.2024.3436865","DOIUrl":"10.1109/JMEMS.2024.3436865","url":null,"abstract":"This paper reports the experimental estimation of the mechanical quality factor (\u0000<inline-formula> <tex-math>$Q_{m}$ </tex-math></inline-formula>\u0000) of polymer films, which can be used as damping materials for MEMS. Considering the application to MEMS devices, polymer/PZT composite actuators using two thick photoresists (TMMR-NA1000 and SU8) and PDMS were fabricated and the Q factors were evaluated in a vacuum environment. The comparison between the measured and simulated Q factor confirmed a \u0000<inline-formula> <tex-math>$Q_{m}$ </tex-math></inline-formula>\u0000 range of 14-18 for TMMR-NA1000, 13-20 for SU8, and 5-8 for PDMS, indicating the superior damping capability of PDMS. Additionally, it was also found that the PZT thin film used in this study exhibited \u0000<inline-formula> <tex-math>$Q_{m}$ </tex-math></inline-formula>\u0000 of 200-220 under the driving voltage of 2 Vpp with +1V DC offset. The evaluation approach developed for assessing \u0000<inline-formula> <tex-math>$Q_{m}$ </tex-math></inline-formula>\u0000 of polymer materials is straightforward, easily implementable, and has broad structure applicability, offering a promising tool for assessing a wide array of materials. [2024-0096]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 5","pages":"631-639"},"PeriodicalIF":2.5,"publicationDate":"2024-08-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142216965","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-01DOI: 10.1109/JMEMS.2024.3422749
{"title":"TechRxiv: Share Your Preprint Research with the World!","authors":"","doi":"10.1109/JMEMS.2024.3422749","DOIUrl":"10.1109/JMEMS.2024.3422749","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 4","pages":"503-503"},"PeriodicalIF":2.5,"publicationDate":"2024-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10619996","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141884816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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