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2012 IEEE 30th VLSI Test Symposium (VTS)最新文献

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A Memory Failure Pattern Analyzer for memory diagnosis and repair 用于记忆诊断和修复的记忆故障模式分析器
Pub Date : 2012-04-23 DOI: 10.1109/VTS.2012.6231059
Bing-Yang Lin, Mincent Lee, Cheng-Wen Wu
As VLSI technology advances and memories occupy more and more area in a typical SOC, memory diagnosis has become an important issue. In this paper, we propose the Memory Failure Pattern Analyzer (MFPA), which is developed for different memories and technologies that are currently used in the industry. The MFPA can locate weak regions of the memory array, i.e., those with high failure rate. It can also be used to analyze faulty-cell/defect distributions automatically. We also propose a new defect distribution model which has 1-12 times higher accuracy than other theoretical models. Based on this model, we propose a defect-spectrum-based methodology to identify critical failure patterns from failure bitmaps. These failure patterns can further be translated to corresponding defects by our memory fault simulator (RAMSES) and physical-level failure analysis tool (FAME). In an industrial case, the MFPA fits the defect distribution with the proposed model, which has 12 times higher accuracy than the Poisson distribution. With our model, it further identifies two special failure patterns from 132,488 faulty 4-Mb macros in 1.2 minutes.
随着超大规模集成电路技术的进步,存储器在典型SOC中所占的比重越来越大,存储器诊断已成为一个重要的问题。在本文中,我们提出了记忆失效模式分析仪(MFPA),它是针对目前工业上使用的不同存储器和技术而开发的。MFPA可以定位存储阵列的薄弱区域,即故障率高的区域。它还可以用于自动分析缺陷单元/缺陷分布。我们还提出了一种新的缺陷分布模型,其精度比其他理论模型高1-12倍。基于此模型,我们提出了一种基于缺陷谱的方法来从故障位图中识别关键故障模式。这些故障模式可以通过我们的内存故障模拟器(RAMSES)和物理级故障分析工具(FAME)进一步转化为相应的缺陷。在一个工业案例中,MFPA与所提出的模型拟合缺陷分布,其精度比泊松分布高12倍。使用我们的模型,它可以在1.2分钟内从132,488个错误的4 mb宏中进一步识别出两种特殊的故障模式。
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引用次数: 9
A pseudo-dynamic comparator for error detection in fault tolerant architectures 容错体系结构中用于错误检测的伪动态比较器
Pub Date : 2012-04-23 DOI: 10.1109/VTS.2012.6231079
D. Tran, A. Virazel, A. Bosio, L. Dilillo, P. Girard, A. Todri, M. Imhof, H. Wunderlich
Although CMOS technology scaling offers many advantages, it suffers from robustness problem caused by hard, soft and timing errors. The robustness of future CMOS technology nodes must be improved and the use of fault tolerant architectures is probably the most viable solution. In this context, Duplication/Comparison scheme is widely used for error detection. Traditionally, this scheme uses a static comparator structure that detects hard error. However, it is not effective for soft and timing errors detection due to the possible masking of glitches by the comparator itself. To solve this problem, we propose a pseudo-dynamic comparator architecture that combines a dynamic CMOS transition detector and a static comparator. Experimental results show that the proposed comparator detects not only hard errors but also small glitches related to soft and timing errors. Moreover, its dynamic characteristics allow reducing the power consumption while keeping an equivalent silicon area compared to a static comparator. This study is the first step towards a full fault tolerant approach targeting robustness improvement of CMOS logic circuits.
尽管CMOS技术的缩放具有许多优点,但它也存在由硬误差、软误差和时序误差引起的鲁棒性问题。未来CMOS技术节点的稳健性必须得到改进,使用容错架构可能是最可行的解决方案。在这种情况下,复制/比较方案被广泛用于错误检测。传统上,该方案使用检测硬错误的静态比较器结构。然而,由于比较器本身可能掩盖小故障,它对软错误和定时错误检测无效。为了解决这个问题,我们提出了一种结合动态CMOS跃迁检测器和静态比较器的伪动态比较器架构。实验结果表明,该比较器不仅可以检测到硬误差,还可以检测到与软误差和定时误差相关的小故障。此外,它的动态特性允许降低功耗,同时保持与静态比较器相当的硅面积。这项研究是迈向完全容错方法的第一步,目标是提高CMOS逻辑电路的鲁棒性。
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引用次数: 17
An oscillation-based test structure for timing information extraction 一种基于振荡的时序信息提取测试结构
Pub Date : 2012-04-23 DOI: 10.1109/VTS.2012.6231083
E. Jang, A. Gattiker, S. Nassif, J. Abraham
Technology scaling introduces many sources of variability and uncertainty that are difficult to model and predict [3]. The result of these uncertainties is a degradation in our ability to predict the performance of fabricated chips, i.e., a lack of model-to-hardware matching. The prediction of circuit performance is the result of a complex hierarchy of models starting at the basic MOSFET device model and rising to full-chip models of important performance metrics like power, frequency of operation, etc. The assessment of the quality of such models is an important activity, but it is becoming harder and more complex with rising levels of variability, as well as with the increase in the number of systematic effects observed in modern CMOS processes. The purpose of this paper is to introduce a special-purpose test structure that specifically focuses on ensuring the accuracy of gate timing models. The certification of digital design correctness (the so-called signoff) is based largely on the results of performing a Static Timing Analysis (STA) [15], [18], which, in turn, is based entirely on the gate timing models. Our test structure compares favorably to alternative approaches; it is far easier to obtain the desired results than direct delay measurement, and it is much more general than simple ring oscillator structures. Further, the structure is specified at a high level, allowing it to be synthesized using a standard ASIC place-and-route flow, thus capturing the systematic local layout effects which can sometimes be lost by simpler (e.g., ring oscillator) structures. Experimental results show the structure can play an important role in identifying mismatches between timing models and observed hardware.
技术规模化引入了许多难以建模和预测的可变性和不确定性来源[3]。这些不确定性的结果是我们预测制造芯片性能的能力下降,即缺乏模型与硬件的匹配。电路性能的预测是一个复杂的模型层次结构的结果,从基本的MOSFET器件模型开始,上升到重要性能指标的全芯片模型,如功率,工作频率等。评估这种模式的质量是一项重要的活动,但随着变率水平的上升,以及在现代CMOS过程中观察到的系统效应数量的增加,评估变得越来越困难和复杂。本文的目的是介绍一种专门用于保证门时序模型精度的专用测试结构。数字设计正确性的认证(即所谓的签名)主要基于执行静态时序分析(STA)的结果[15],[18],而静态时序分析则完全基于门时序模型。我们的测试结构优于其他方法;它比直接延迟测量更容易获得期望的结果,而且比简单的环形振荡器结构更通用。此外,该结构在高水平上被指定,允许它使用标准的ASIC放置和路由流来合成,从而捕获系统的局部布局效果,这有时会被更简单的结构(例如,环形振荡器)所丢失。实验结果表明,该结构在识别时序模型与观测硬件之间的不匹配方面发挥了重要作用。
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引用次数: 8
Delay test resource allocation and scheduling for multiple frequency domains 多频域延迟测试资源分配与调度
Pub Date : 2012-04-23 DOI: 10.1109/VTS.2012.6231089
B. Arslan, A. Orailoglu
As the number of frequency domains aggressively grows in today's SOCs, the delivery of high delay test quality across numerous frequency domains while meeting test budgets is crucial. This goal necessitates not only the consideration of fault coverage but also the distinct characteristics of each domain such as frequency and the distribution of path lengths and, additionally, the delay test quality tradeoffs across these domains. This paper proposes a method to identify the optimal test time allocation per domain based on the distinct characteristics of each in order to minimize overall delay defect escape level. The proposed method not only considers test time allocation but also concurrent scheduling of domains to optimize the delay test quality for SOCs that support the testing of multiple frequency domains in parallel.
随着当今soc中频域数量的急剧增长,在满足测试预算的同时,跨多个频域交付高延迟测试质量至关重要。这个目标不仅需要考虑故障覆盖,还需要考虑每个域的不同特征,如频率和路径长度的分布,此外,还要考虑跨这些域的延迟测试质量权衡。本文提出了一种基于每个域的不同特征来确定最佳测试时间分配的方法,以最小化总体延迟缺陷逃逸水平。该方法既考虑测试时间分配,又考虑域的并发调度,以优化支持多频域并行测试的soc的延迟测试质量。
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引用次数: 2
Dual-frequency incoherent subsampling driven test response acquisition of spectrally sparse wideband signals with enhanced time resolution 增强时间分辨率的频谱稀疏宽带信号的双频非相干次采样驱动测试响应采集
Pub Date : 2012-04-23 DOI: 10.1109/VTS.2012.6231093
Nicholas Tzou, Thomas Moon, Xian Wang, H. Choi, A. Chatterjee
In this paper, we propose a new test response acquisition technique for high-speed devices-based on dual-frequency incoherent sub-sampling and sparse signal reconstruction. The proposed technique enables reconstruction of spectrally sparse wideband signals such as multi-tone signals and short pseudo-random bit sequences (PRBS) with enhanced time/frequency resolution as opposed to current methods. The sampling hardware utilizes dual analog-to-digital converters (ADCs) and dedicated sampling frequency synthesizers with a common frequency reference. As compared to other compressive sampling architectures [1], the proposed hardware architecture is easy to implement at low cost since it does not require accurate sampling clock phase adjustment or random timing generation. For digital signal reconstruction, the proposed technique requires less number of waveform samples than conventional equivalent-time sampling techniques. In addition, the use of an resolution-enhanced discrete Fourier transform (DFT) frame and basis pursuit algorithms minimizes spectral leakage of incoherently sub-sampled signals. This co-design of sampling hardware and signal reconstruction algorithms enables testing of spectrally sparse wideband signals with enhanced time/frequency resolution.
本文提出了一种基于双频非相干子采样和稀疏信号重构的高速器件测试响应采集新技术。所提出的技术能够重建频谱稀疏的宽带信号,如多音信号和短伪随机比特序列(PRBS),与现有方法相比,具有增强的时间/频率分辨率。采样硬件采用双模数转换器(adc)和专用采样频率合成器与一个共同的频率参考。与其他压缩采样架构相比[1],由于不需要精确的采样时钟相位调整或随机时序生成,因此所提出的硬件架构易于以低成本实现。对于数字信号重建,所提出的技术比传统的等效时间采样技术需要更少的波形样本。此外,使用分辨率增强的离散傅立叶变换(DFT)帧和基跟踪算法最大限度地减少了非相干次采样信号的频谱泄漏。这种采样硬件和信号重建算法的共同设计使频谱稀疏宽带信号的测试具有增强的时间/频率分辨率。
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引用次数: 2
Estimating Power Supply Noise and its impact on path delay 估计电源噪声及其对路径延迟的影响
Pub Date : 2012-04-23 DOI: 10.1109/VTS.2012.6231066
S. K. Rao, C. Sathyanarayana, Ajay Kallianpur, R. Robucci, C. Patel
Power Supply Noise has a significant impact on path delay and therefore its estimation is critical in delay testing. In deep sub-micron technologies, voltages are scaled and the number of switching gates has increased which make chips susceptible to power supply noise. Running full-chip simulations on large designs to predict the noise is time consuming and expensive. Therefore, most existing techniques are based on statistical approaches. In this paper, we propose a current-based dynamic method to estimate power supply noise and use the framework to predict the increase in path delay caused by the variations in power supply voltage without carrying out a full-chip simulation. A convolution-based technique is used to compute the path delays where standalone paths are extracted and simulated. Experimental results reported for estimating noise using the ISCAS-85 benchmark circuit are within 10% of full-chip results. The delay predictions carried out on two other experimental designs using our technique closely match full-chip results with a maximum error of 2%.
电源噪声对路径延迟的影响很大,因此其估计在延迟测试中至关重要。在深亚微米技术中,电压被缩放,开关门的数量增加,这使得芯片容易受到电源噪声的影响。在大型设计上运行全芯片模拟来预测噪声既耗时又昂贵。因此,大多数现有技术都是基于统计方法。在本文中,我们提出了一种基于电流的动态方法来估计电源噪声,并使用该框架来预测由电源电压变化引起的路径延迟的增加,而无需进行全芯片仿真。使用基于卷积的技术来计算路径延迟,其中提取和模拟独立路径。使用ISCAS-85基准电路估计噪声的实验结果在全芯片结果的10%以内。使用我们的技术对另外两个实验设计进行的延迟预测与全芯片结果非常接近,最大误差为2%。
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引用次数: 8
Low-cost high-speed pseudo-random bit sequence characterization using nonuniform periodic sampling in the presence of noise 在存在噪声的情况下,采用非均匀周期采样的低成本高速伪随机比特序列表征
Pub Date : 2012-04-23 DOI: 10.1109/VTS.2012.6231094
Thomas Moon, Nicholas Tzou, Xian Wang, H. Choi, A. Chatterjee
In this paper, we propose a wideband signal reconstruction scheme for testing high-speed pseudo random bit sequences (PRBSs) in the presence of jitter noise using incoherent sampling. The proposed approach exploits synchronous multirate sampling (SMRS) hardware and multicoset back-end signal processing algorithms. The SMRS hardware consists of multiple analog-to-digital converters (ADCs) whose sampling frequencies are synchronized with a common frequency reference and can be individually configured. The optimal sampling frequency of each ADC is chosen based on the input signal information and sampling hardware specifications. As compared to other sampling hardware used for multicoset signal reconstruction, the proposed approach uses less number of ADCs and does not require accurate sampling clock phase adjustment. In the digital signal reconstruction, the input waveform is reconstructed by the multicoset signal processing algorithms and the phase noise of each tone of the PRBS test signal is measured.
在本文中,我们提出了一种宽带信号重建方案,用于在存在抖动噪声的情况下使用非相干采样测试高速伪随机比特序列(PRBSs)。该方法利用同步多速率采样(SMRS)硬件和多集后端信号处理算法。SMRS硬件由多个模数转换器(adc)组成,其采样频率与公共参考频率同步,并且可以单独配置。根据输入信号信息和采样硬件规格选择各个ADC的最佳采样频率。与用于多共集信号重建的其他采样硬件相比,所提出的方法使用的adc数量较少,并且不需要精确的采样时钟相位调整。在数字信号重构中,通过多共集信号处理算法重构输入波形,测量PRBS测试信号各音调的相位噪声。
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引用次数: 7
Are advanced DfT structures sufficient for preventing scan-attacks? 高级DfT结构是否足以防止扫描攻击?
Pub Date : 2012-04-23 DOI: 10.1109/VTS.2012.6231061
Jean DaRolt, G. D. Natale, M. Flottes, B. Rouzeyre
Standard Design for Testability (DfT) structures are well known as potential sources of confidential information leakage. Scan-based attacks have been reported in publications since the early 2000s. It has been shown for instance that the secret key for symmetric encryption standards (DES, AES) could be retrieved from information gathered on scan-out pins when scan-chains are fully observed through these pins. However DfT practices have progressed to adapt to large and complex designs such as test response compaction, associated X-masking structure, partial scan, etc. As a side effect, these techniques mask part of the information collected on scan outputs. Thus, at first glance, they may appear as countermeasures against scan-based attacks. Nevertheless, in this paper we show that DfT structures, regardless of their nature, do not inherently enhance security and that specific additional countermeasures are still needed. We propose a new-scan attack able to deal with designs where only part of the internal circuit's state is observed for test purpose.
众所周知,可测试性标准设计(DfT)结构是机密信息泄露的潜在来源。自21世纪初以来,基于扫描的攻击一直在出版物中报道。例如,当扫描链通过这些引脚被完全观察到时,可以从扫描出引脚上收集的信息中检索对称加密标准(DES, AES)的秘密密钥。然而,DfT实践已经发展到适应大型和复杂的设计,如测试响应压缩,相关的x屏蔽结构,部分扫描等。作为副作用,这些技术掩盖了扫描输出中收集的部分信息。因此,乍一看,它们可能是针对基于扫描的攻击的对策。然而,在本文中,我们证明了DfT结构,无论其性质如何,都不会固有地增强安全性,并且仍然需要特定的附加对策。我们提出了一种新的扫描攻击,能够处理仅为测试目的而观察部分内部电路状态的设计。
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引用次数: 70
Test generation for subtractive specification errors 减法规范错误的测试生成
Pub Date : 2012-04-23 DOI: 10.1109/VTS.2012.6231063
Patricia S. Lee, I. Harris
We propose Specification-Based Test Generation (SBTG) which automatically generates functional tests directly from specification, rather than the HDL description of the design. The main benefit of generating tests from the specification is the ability to detect Specification-based Translation Errors (SBTEs) that occur due to a misunderstanding of the specification. Our results show that our test generation approach is more effective at detecting these errors than approaches that generate tests from the HDL code to maximize code coverage metrics.
我们提出了基于规格的测试生成(SBTG),它直接从规格中自动生成功能测试,而不是从设计的HDL描述中生成。根据规范生成测试的主要好处是能够检测由于对规范的误解而产生的基于规范的转换错误(sbte)。我们的结果表明,我们的测试生成方法在检测这些错误方面比从HDL代码生成测试以最大化代码覆盖率的方法更有效。
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引用次数: 1
HBIST: An approach towards zero external test cost HBIST:实现零外部测试成本的方法
Pub Date : 2012-04-23 DOI: 10.1109/VTS.2012.6231073
M. Bubna, K. Roy, A. Goel
Test cost is increasingly becoming a major component of a product's design cost in scaled technologies. Exponential increase in test data volumes for sub-45 designs, especially for testing delay faults has led to large increase in ATE cost and test application time. In order to reduce external test cost, Logic BIST has been explored as a possible alternative to manufacturing test [1-5]. However, this paper shows that a large number of faults in BIST logic of large IWLS'05 and ITC'99 benchmark processors remain undetected after BIST run (42% of stuck-at and 34% of transition faults on average) and thus, BIST logic needs to be tested properly. This paper proposes a hierarchical BIST methodology `HBIST' which uses different BIST techniques to obtain complete stuck-at and transition fault coverage of CUT and then introduces additional levels of BIST logic to test for faults in the BIST logic at the preceding levels. A design methodology is proposed to optimize the number of additional levels of BIST required while keeping the BIST area and power overhead, and the addition of extra faults in BIST logic minimal. Experiments on large benchmarks show an average of 95.9% CUT stuck-at fault coverage (ATPG coverage of 96.4%) and 93.5% CUT transition fault coverage (ATPG coverage of 95.3%) is obtained using HBIST. Also, up to 99.2% (average 93.2%) reduction in external ATE test cost (including cost needed to test additional BIST levels) is obtained using two levels of BIST at 7% average area overhead (compared to scan overhead of 38.2%) and 18% increase in test power.
在规模化技术中,测试成本日益成为产品设计成本的重要组成部分。sub-45设计的测试数据量呈指数级增长,特别是测试延迟故障,导致ATE成本和测试应用时间大幅增加。为了降低外部测试成本,已经探索了逻辑BIST作为制造测试的可能替代方案[1-5]。然而,本文表明,在大型IWLS'05和ITC'99基准处理器的BIST逻辑中,大量故障在BIST运行后仍未被检测到(平均42%的卡滞故障和34%的转换故障),因此,需要对BIST逻辑进行适当的测试。本文提出了一种分层的BIST方法“HBIST”,该方法使用不同的BIST技术来获得CUT的完全卡住和转换故障覆盖,然后引入额外的BIST逻辑级别来测试前一层BIST逻辑中的故障。提出了一种设计方法,以优化所需的BIST附加层的数量,同时保持BIST的面积和功率开销,并在BIST逻辑中添加最小的额外故障。大型基准实验表明,使用HBIST平均获得95.9%的CUT卡故障覆盖率(ATPG覆盖率为96.4%)和93.5%的CUT过渡故障覆盖率(ATPG覆盖率为95.3%)。此外,使用两级BIST,平均面积开销为7%(扫描开销为38.2%),测试功率增加18%,外部ATE测试成本(包括测试额外BIST级别所需的成本)降低了99.2%(平均为93.2%)。
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引用次数: 1
期刊
2012 IEEE 30th VLSI Test Symposium (VTS)
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