Slip deformation in compatible bicrystal models with a tilted angle grain boundary subjected to tensile load is investigated using a finite element crystal plasticity analysis code. The accumulation of geometrically necessary dislocations (GNDs) and statistically stored dislocations (SSDs) is studied in detail. Uniform deformation was expected to occur because the mutual constraint of crystal grains through the grain boundary plane does not occur in compatible bicrystals, but some results of the analysis show asymmetric deformation with the accumulation of GNDs near the grain boundary caused by the difference in strain hardening of slip systems, kink bands perpendicular to the primary slip direction and secondary slip bands parallel to the primary slip plane with accumulation of GNDs on the primary slip system in the form of bands. The mechanism of dislocation pattern formation in the bicrystals with a tilted angle grain boundary is discussed from the viewpoint of an imaginary disclination deformation field with pair body interaction.
{"title":"Grain Boundary Accumulation of Geometrically Necessary Dislocations and Asymmetric Deformations in Compatible Bicrystals with Tilted Angle Grain Boundary under Tensile Loading","authors":"Ryouji Kondou, T. Ohashi","doi":"10.1299/JSMEA.49.581","DOIUrl":"https://doi.org/10.1299/JSMEA.49.581","url":null,"abstract":"Slip deformation in compatible bicrystal models with a tilted angle grain boundary subjected to tensile load is investigated using a finite element crystal plasticity analysis code. The accumulation of geometrically necessary dislocations (GNDs) and statistically stored dislocations (SSDs) is studied in detail. Uniform deformation was expected to occur because the mutual constraint of crystal grains through the grain boundary plane does not occur in compatible bicrystals, but some results of the analysis show asymmetric deformation with the accumulation of GNDs near the grain boundary caused by the difference in strain hardening of slip systems, kink bands perpendicular to the primary slip direction and secondary slip bands parallel to the primary slip plane with accumulation of GNDs on the primary slip system in the form of bands. The mechanism of dislocation pattern formation in the bicrystals with a tilted angle grain boundary is discussed from the viewpoint of an imaginary disclination deformation field with pair body interaction.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127024298","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A computational procedure for analyzing the deformation and fracture of solid polymers is developed based on a molecular chain model. In the model, the polymer solid is represented by a network of nonlinear elastic chains. Cellular automata modeling is employed to generate the network of polymer chains. Van der Waals and viscous forces acting on the chains are taken into account and are approximated to act at the nodal points of the network. A stiffness equation is derived by employing the principle of virtual work, in which geometrical nonlinearity due to a large deformation is considered. Slippage and scission of chains are also taken into consideration. The effects of molecular weight distribution and molecular chain scission due to UV-degradation are discussed.
{"title":"Analysis of Mechanical Behavior of Polymers Using Molecular Chain Network Model","authors":"A. Shinozaki, H. Inoue, K. Kishimoto","doi":"10.1299/JSMEA.49.503","DOIUrl":"https://doi.org/10.1299/JSMEA.49.503","url":null,"abstract":"A computational procedure for analyzing the deformation and fracture of solid polymers is developed based on a molecular chain model. In the model, the polymer solid is represented by a network of nonlinear elastic chains. Cellular automata modeling is employed to generate the network of polymer chains. Van der Waals and viscous forces acting on the chains are taken into account and are approximated to act at the nodal points of the network. A stiffness equation is derived by employing the principle of virtual work, in which geometrical nonlinearity due to a large deformation is considered. Slippage and scission of chains are also taken into consideration. The effects of molecular weight distribution and molecular chain scission due to UV-degradation are discussed.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124093803","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper describes the experimental results of ultrasonically welding ceramics and metals. In comparison to other methods, ultrasonic vibration is easier and quicker for welding ceramics, such as ZrO2, SiC, and Si3N4, and metals such as aluminum, magnesium, and copper. In this study, ceramics and Mg were welded under the following conditions: amplitude, 30µm; welding pressure, 10MPa; required duration, 1.0s. Ultrasonic welding of the ceramics with metals was possible when the condition E=KPn < f(P, E) (E: energy density P: welding pressure) was satisfied and the welding interface temperature was in the range of 300-400°C. When the ceramics were preheated, welding was possible within a short time and under low pressure, and the material had good weldability even at a high temperature (200°C). It is presumed that in this environment, oxide and organic films are efficiently removed from the bonded interfaces by the vibration of ultrasonic waves.
{"title":"Direct Welding of Metals and Ceramics by Ultrasonic Vibration","authors":"H. Imai, S. Matsuoka","doi":"10.1299/JSMEA.49.444","DOIUrl":"https://doi.org/10.1299/JSMEA.49.444","url":null,"abstract":"This paper describes the experimental results of ultrasonically welding ceramics and metals. In comparison to other methods, ultrasonic vibration is easier and quicker for welding ceramics, such as ZrO2, SiC, and Si3N4, and metals such as aluminum, magnesium, and copper. In this study, ceramics and Mg were welded under the following conditions: amplitude, 30µm; welding pressure, 10MPa; required duration, 1.0s. Ultrasonic welding of the ceramics with metals was possible when the condition E=KPn < f(P, E) (E: energy density P: welding pressure) was satisfied and the welding interface temperature was in the range of 300-400°C. When the ceramics were preheated, welding was possible within a short time and under low pressure, and the material had good weldability even at a high temperature (200°C). It is presumed that in this environment, oxide and organic films are efficiently removed from the bonded interfaces by the vibration of ultrasonic waves.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128703455","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The crack growth along the interface between a submicron-thick film (Cu) and a substrate (Si) under fatigue is experimentally investigated at the load-frequencies of 0.1Hz and 1Hz in a laboratory environment (45 ±5%RH). A modified four-point bend specimen, which has only one interface crack to facilitate the control of crack growth, is used for the tests. The results reveal that the clear interface crack between Cu and Si grows under the cyclic load. The crack growth rate per cycle, da/dN, is governed by the stress intensity factor range, ΔKi, at each frequency and the sigmoidal relationship consisting of three stages are observed in the da/dN-ΔKi curve; the threshold, the stable growth and the critical growth. da/dNgreatly increases as the frequency decreases in the stable growth region. The crack growth rate per time, da/dt, shows a good correlation with the maximum stress intensity factor, Kimax, independently of the loading frequency. This indicates that the environmental effect due to humidity in air plays a dominant role on the crack growth.
{"title":"Effect of Loading Frequency on Fatigue Crack Growth between a Submicron-Thick Film and a Substrate","authors":"D. Truong, H. Hirakata, T. Kitamura","doi":"10.1299/JSMEA.49.370","DOIUrl":"https://doi.org/10.1299/JSMEA.49.370","url":null,"abstract":"The crack growth along the interface between a submicron-thick film (Cu) and a substrate (Si) under fatigue is experimentally investigated at the load-frequencies of 0.1Hz and 1Hz in a laboratory environment (45 ±5%RH). A modified four-point bend specimen, which has only one interface crack to facilitate the control of crack growth, is used for the tests. The results reveal that the clear interface crack between Cu and Si grows under the cyclic load. The crack growth rate per cycle, da/dN, is governed by the stress intensity factor range, ΔKi, at each frequency and the sigmoidal relationship consisting of three stages are observed in the da/dN-ΔKi curve; the threshold, the stable growth and the critical growth. da/dNgreatly increases as the frequency decreases in the stable growth region. The crack growth rate per time, da/dt, shows a good correlation with the maximum stress intensity factor, Kimax, independently of the loading frequency. This indicates that the environmental effect due to humidity in air plays a dominant role on the crack growth.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121151030","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
An erythrocyte and a spherocyte are subjected to aspiration pressure with a micropipette and analyzed by the finite element method (FEM). The comparison of the erythrocyte and the spherocyte indicates that the y-direction displacement of the erythrocyte was larger than that of the spherocyte under the same aspiration pressure. The x-direction stress distributions show that it is easier to change the shape of the erythrocyte model than that of the spherocyte model because a force in the opposite direction appears in the erythrocyte. This force seems to move the erythrocyte membrane to its center. The results indicate that the shape of the erythrocyte membrane changes partially under aspiration pressure at the point of contact with the micropipette and aspiration pressure. The results also indicate that the shape of the spherocyte membrane changes under aspiration pressure, but not only at a point of contact with the micropipette and the area subject to aspiration pressure; the entire spherocyte membrane seem to change the shape.
{"title":"Finite Element Method Analysis of the Deformation of Human Red Blood Cells","authors":"Rie Higuchi, Y. Kanno","doi":"10.1299/JSMEA.49.331","DOIUrl":"https://doi.org/10.1299/JSMEA.49.331","url":null,"abstract":"An erythrocyte and a spherocyte are subjected to aspiration pressure with a micropipette and analyzed by the finite element method (FEM). The comparison of the erythrocyte and the spherocyte indicates that the y-direction displacement of the erythrocyte was larger than that of the spherocyte under the same aspiration pressure. The x-direction stress distributions show that it is easier to change the shape of the erythrocyte model than that of the spherocyte model because a force in the opposite direction appears in the erythrocyte. This force seems to move the erythrocyte membrane to its center. The results indicate that the shape of the erythrocyte membrane changes partially under aspiration pressure at the point of contact with the micropipette and aspiration pressure. The results also indicate that the shape of the spherocyte membrane changes under aspiration pressure, but not only at a point of contact with the micropipette and the area subject to aspiration pressure; the entire spherocyte membrane seem to change the shape.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116977364","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
H. Tohmyoh, K. Yamanobe, M. Saka, J. Utsunomiya, Takeshi Nakamura, Y. Nakano
To determine the friction coefficient of a press-fit pin in thin plating, both experiments and three-dimensional finite element analysis are carried out. The compliant press-fit pins are assembled into printed circuit boards with two types of plated through holes, one is Cu and Sn plated and the other only Cu plated, and the load-displacement relationships of the pin during assembly are recorded. Based on the load-displacement relationships of the pin obtained experimentally and the nodal reactions of the pin contacting with the plated hole, obtained from numerical analysis, performed assuming a fiction-less condition, the friction coefficients of the pin in plated holes during assembly are successfully determined. The friction coefficient of the pin in the Sn/Cu plated hole exhibits a higher value than that for the Cu plated hole during assembly, due to the adhesion in the contacting region. In an attempt to check the validity of the determined coefficients of friction, different press-fit assemblies are considered, and the load-displacement relationships of the pin are predicted. The simulations are found to be in good agreement with experimental measurements. The retention forces between the pin and the plated holes are also predicted.
{"title":"Determination of Friction Coefficient of a Press-Fit Pin in Thin Plating","authors":"H. Tohmyoh, K. Yamanobe, M. Saka, J. Utsunomiya, Takeshi Nakamura, Y. Nakano","doi":"10.1299/JSMEA.49.363","DOIUrl":"https://doi.org/10.1299/JSMEA.49.363","url":null,"abstract":"To determine the friction coefficient of a press-fit pin in thin plating, both experiments and three-dimensional finite element analysis are carried out. The compliant press-fit pins are assembled into printed circuit boards with two types of plated through holes, one is Cu and Sn plated and the other only Cu plated, and the load-displacement relationships of the pin during assembly are recorded. Based on the load-displacement relationships of the pin obtained experimentally and the nodal reactions of the pin contacting with the plated hole, obtained from numerical analysis, performed assuming a fiction-less condition, the friction coefficients of the pin in plated holes during assembly are successfully determined. The friction coefficient of the pin in the Sn/Cu plated hole exhibits a higher value than that for the Cu plated hole during assembly, due to the adhesion in the contacting region. In an attempt to check the validity of the determined coefficients of friction, different press-fit assemblies are considered, and the load-displacement relationships of the pin are predicted. The simulations are found to be in good agreement with experimental measurements. The retention forces between the pin and the plated holes are also predicted.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126656673","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Shobu, J. Mizuki, Kenji Suzuki, Y. Akiniwa, Keisuke Tanaka
The surface aberration effect in the strain scanning method with a Ge analyzer was examined using high- energy X-rays from the undulator synchrotron source. The synchrotron X-rays from the undulator source had an enough intensity for the strain scanning method using a goniometer with the analyzer. The use of a Ge (111) analyzer showed remarkable reduction of the surface aberration effect. However, there still existed the surface aberration for the very-near surface region from the surface to the depth of 50µm. A correction method was proposed by taking into account of the effects of the divergence of the Ge analyzer, the mis-setting of the analyzer and the X-ray attenuation. The proposed correction method was very useful for eliminating the surface aberration effect. The correction method enables a high space-resolutive evaluation of the subsurface stress distribution. The method was successfully applied to the determination of the residual stress distribution of the shot-peened steel. A precise d0 value of the strain-free lattice spacing necessary was determined from the surface stress measured by the conventional sin2ψ method using Cr-Kα radiation.
利用波动同步加速器源的高能x射线，研究了锗分析仪应变扫描法中的表面像差效应。来自波动源的同步加速器x射线具有足够的强度，可以使用带有分析仪的测角仪进行应变扫描。Ge(111)分析仪的使用显著降低了表面像差效应。然而，从表面到50µm深度的极近表面区域仍然存在表面像差。考虑锗分析仪发散、分析仪错置和x射线衰减的影响，提出了一种校正方法。所提出的校正方法对于消除表面像差效应非常有用。该校正方法能够对地下应力分布进行高空间分辨率的评价。该方法成功地应用于喷丸钢残余应力分布的测定。利用cr - k - α辐射，利用传统的sin2ψ法测量表面应力，确定了所需的无应变晶格间距的精确d0值。
{"title":"High Space-Resolutive Evaluation of Subsurface Stress Distribution by Strain Scanning Method with Analyzer Using High-Energy Synchrotron X-Rays ∗","authors":"T. Shobu, J. Mizuki, Kenji Suzuki, Y. Akiniwa, Keisuke Tanaka","doi":"10.1299/JSMEA.49.376","DOIUrl":"https://doi.org/10.1299/JSMEA.49.376","url":null,"abstract":"The surface aberration effect in the strain scanning method with a Ge analyzer was examined using high- energy X-rays from the undulator synchrotron source. The synchrotron X-rays from the undulator source had an enough intensity for the strain scanning method using a goniometer with the analyzer. The use of a Ge (111) analyzer showed remarkable reduction of the surface aberration effect. However, there still existed the surface aberration for the very-near surface region from the surface to the depth of 50µm. A correction method was proposed by taking into account of the effects of the divergence of the Ge analyzer, the mis-setting of the analyzer and the X-ray attenuation. The proposed correction method was very useful for eliminating the surface aberration effect. The correction method enables a high space-resolutive evaluation of the subsurface stress distribution. The method was successfully applied to the determination of the residual stress distribution of the shot-peened steel. A precise d0 value of the strain-free lattice spacing necessary was determined from the surface stress measured by the conventional sin2ψ method using Cr-Kα radiation.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125115736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Yoneyama, A. Kitagawa, Koji Kitamura, H. Kikuta
Two-dimensional displacement measurement using digital image correlation with lens distortion correction is described in this paper. A single cross-grating is used as a calibration reference. Using two-dimensional Fourier transform, the phases of the grating pattern are analyzed and lens distortion distribution is obtained from the unwrapped phase maps. After detecting lens distortion, the coefficients of lens distortion are determined using the least-squares method. Then, the displacement distributions without the lens distortion are obtained. The effectiveness of the method is demonstrated by applying the proposed method to the rigid body translation test and the uniaxial tension test. The results show that the proposed distortion correction method removes the effect of lens distortion from the measured displacements. By the proposed method, accurate measurements can be performed even if images are deformed by lens distortion.
{"title":"In-Plane Displacement Measurement Using Digital Image Correlation with Lens Distortion Correction","authors":"S. Yoneyama, A. Kitagawa, Koji Kitamura, H. Kikuta","doi":"10.1299/JSMEA.49.458","DOIUrl":"https://doi.org/10.1299/JSMEA.49.458","url":null,"abstract":"Two-dimensional displacement measurement using digital image correlation with lens distortion correction is described in this paper. A single cross-grating is used as a calibration reference. Using two-dimensional Fourier transform, the phases of the grating pattern are analyzed and lens distortion distribution is obtained from the unwrapped phase maps. After detecting lens distortion, the coefficients of lens distortion are determined using the least-squares method. Then, the displacement distributions without the lens distortion are obtained. The effectiveness of the method is demonstrated by applying the proposed method to the rigid body translation test and the uniaxial tension test. The results show that the proposed distortion correction method removes the effect of lens distortion from the measured displacements. By the proposed method, accurate measurements can be performed even if images are deformed by lens distortion.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"159 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128931745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this paper, a method for identifying of a crack in a plate that uses a genetic algorithm (GA) based on changes in natural frequencies is presented. To calculate the natural frequencies of the cracked plates, a FEM (Finite Element Method) program, which is based on the BFM (Bogner, Fox and Schmidt) model, is developed since the accuracy of the forward solver is important. In the analysis, two types of cracks, i.e., internal and edge cracks are considered. To identify the crack location and the depth from frequency measurements, the width and position of the crack in a plate are coded into a fixed-length binary digit string. Using GA, the square sum of residuals between the measured data and the calculated data is minimized in the identification process and thus the crack is identified. To avoid a high calculation cost, the response surface method (RSM) is also adopted in the minimizing process. The combination of GA and RSM makes the identification more effective and robust. The applicability of the proposed method is confirmed by the results of numerical simulation.
{"title":"Crack Identification of Plates Using Genetic Algorithm","authors":"T. Horibe, Kensuke Watanabe","doi":"10.1299/JSMEA.49.403","DOIUrl":"https://doi.org/10.1299/JSMEA.49.403","url":null,"abstract":"In this paper, a method for identifying of a crack in a plate that uses a genetic algorithm (GA) based on changes in natural frequencies is presented. To calculate the natural frequencies of the cracked plates, a FEM (Finite Element Method) program, which is based on the BFM (Bogner, Fox and Schmidt) model, is developed since the accuracy of the forward solver is important. In the analysis, two types of cracks, i.e., internal and edge cracks are considered. To identify the crack location and the depth from frequency measurements, the width and position of the crack in a plate are coded into a fixed-length binary digit string. Using GA, the square sum of residuals between the measured data and the calculated data is minimized in the identification process and thus the crack is identified. To avoid a high calculation cost, the response surface method (RSM) is also adopted in the minimizing process. The combination of GA and RSM makes the identification more effective and robust. The applicability of the proposed method is confirmed by the results of numerical simulation.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116962087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Sugeta, Y. Uematsu, Keitaro Tomita, K. Hirose, M. Jono
A small in-plane bending fatigue testing machine for in-situ observation of small fatigue crack growth behavior by means of an atomic force microscope (AFM) was successfully developed. The multiple layer piezoelectric ceramics were adopted as an actuator in order to miniaturize the fatigue loading facility operating on the stage of an AFM. Small fatigue crack growth test under constant amplitude loading was then carried out on α-brass and successive observation of small fatigue crack growth behavior was performed by the AFM. The fatigue crack tended to grow along one slip direction with the highest Schmid factor, as the crack driving force of a small crack was not large enough to operate other slip directions with lower Schmid factors simultaneously. Frequent crack branching and deflection behavior were also observed during crack growth. It was considered that the constraint of slip deformation due to the cyclic strain hardening was mainly responsible for crack branching and deflection behavior. The intervals of branching or deflection were affected by the difference of mobility among slip planes.
{"title":"Development of Fatigue Testing System for in-situ Observation by an Atomic Force Microscope and Small Fatigue Crack Growth Behavior in α-Brass","authors":"A. Sugeta, Y. Uematsu, Keitaro Tomita, K. Hirose, M. Jono","doi":"10.1299/JSMEA.49.382","DOIUrl":"https://doi.org/10.1299/JSMEA.49.382","url":null,"abstract":"A small in-plane bending fatigue testing machine for in-situ observation of small fatigue crack growth behavior by means of an atomic force microscope (AFM) was successfully developed. The multiple layer piezoelectric ceramics were adopted as an actuator in order to miniaturize the fatigue loading facility operating on the stage of an AFM. Small fatigue crack growth test under constant amplitude loading was then carried out on α-brass and successive observation of small fatigue crack growth behavior was performed by the AFM. The fatigue crack tended to grow along one slip direction with the highest Schmid factor, as the crack driving force of a small crack was not large enough to operate other slip directions with lower Schmid factors simultaneously. Frequent crack branching and deflection behavior were also observed during crack growth. It was considered that the constraint of slip deformation due to the cyclic strain hardening was mainly responsible for crack branching and deflection behavior. The intervals of branching or deflection were affected by the difference of mobility among slip planes.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122511503","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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