Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805498
S. Junge, F. Jakobs, W. Lang
This paper provides an overview of the development, fabrication and measurement results of a new type of silicon microphone. It mainly consists of a low stress nickel membrane with a nonlinear frequency response and a gold backplate electrode. The microphone can be used as condenser or electret microphone. A sensitivity of -64dBV/Pa at 52V bias was obtained with an air gap of 20¿m and membrane resonance at 20kHz.
{"title":"Measurement Results of the First Two Chip Silicon Microphone with Low Stress Nickel Membrane Covering Full Audio Range","authors":"S. Junge, F. Jakobs, W. Lang","doi":"10.1109/MEMSYS.2009.4805498","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805498","url":null,"abstract":"This paper provides an overview of the development, fabrication and measurement results of a new type of silicon microphone. It mainly consists of a low stress nickel membrane with a nonlinear frequency response and a gold backplate electrode. The microphone can be used as condenser or electret microphone. A sensitivity of -64dBV/Pa at 52V bias was obtained with an air gap of 20¿m and membrane resonance at 20kHz.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"551 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115309584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805491
R. Huang, Y. Tai
In this paper, we present a novel packaging technique that utilizes a simple, flexible parylene (chip) pocket on silicon substrate with metal pads. This pocket can house an IC chip or a discrete component inside and provide electrical connections to it. On the other hand, recent achievement in silicon probes implantation in the parietal cortex enables technological advances in neural prosthesis research. However, most of these technologies suffer from high signal-to-noise ratio and expensive integration scheme with IC chips or lack thereof. As a demonstration, this work uses this technique to produce an 8-shank silicon probe array integrated with a fully functional 16-channel amplifier CMOS chip.
{"title":"Parylene-Pocket Chip Integration","authors":"R. Huang, Y. Tai","doi":"10.1109/MEMSYS.2009.4805491","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805491","url":null,"abstract":"In this paper, we present a novel packaging technique that utilizes a simple, flexible parylene (chip) pocket on silicon substrate with metal pads. This pocket can house an IC chip or a discrete component inside and provide electrical connections to it. On the other hand, recent achievement in silicon probes implantation in the parietal cortex enables technological advances in neural prosthesis research. However, most of these technologies suffer from high signal-to-noise ratio and expensive integration scheme with IC chips or lack thereof. As a demonstration, this work uses this technique to produce an 8-shank silicon probe array integrated with a fully functional 16-channel amplifier CMOS chip.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115073708","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805449
S. Tsang, K. Simard, I. Foulds, H. Izadi, K. Karim, M. Parameswaran
This paper presents the first process to allow the embedding of amorphous silicon thin film transistors in surface micromachined polymerMEMS. The presented polymerMEMs fabrication technique embeds hydrogenated amorphous silicon thin film transistors (¿-Si:H TFT) into polyimide for active sensing. An out-of-plane differential calorimetric flow sensor has been fabricated using this method to demonstrate the feasibility of this fabrication process. The calorimetric flow sensor uses the ¿-Si:H TFTs as active sensing elements and has a linear unamplified sensitivity of 2.2mV/(cm/s). This paper provides details for the fabrication process and reports on the design and functional results of calorimetric flow sensor fabricated by embedding ¿-Si:H TFTs into polymerMEMS.
{"title":"Thin Film Transistor (TFT) Sensing Elements Fabricated in Surface Micromachined Polymermems for a Differential Calorimetric Flow Sensor","authors":"S. Tsang, K. Simard, I. Foulds, H. Izadi, K. Karim, M. Parameswaran","doi":"10.1109/MEMSYS.2009.4805449","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805449","url":null,"abstract":"This paper presents the first process to allow the embedding of amorphous silicon thin film transistors in surface micromachined polymerMEMS. The presented polymerMEMs fabrication technique embeds hydrogenated amorphous silicon thin film transistors (¿-Si:H TFT) into polyimide for active sensing. An out-of-plane differential calorimetric flow sensor has been fabricated using this method to demonstrate the feasibility of this fabrication process. The calorimetric flow sensor uses the ¿-Si:H TFTs as active sensing elements and has a linear unamplified sensitivity of 2.2mV/(cm/s). This paper provides details for the fabrication process and reports on the design and functional results of calorimetric flow sensor fabricated by embedding ¿-Si:H TFTs into polymerMEMS.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115551935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805501
H. Lee, B. Lee, T.H. Kwon
As a part of effort to develop an artificial hair cell (AHC) sensor, we designed and fabricated a high-aspect-ratio/single cilium structure and a mechanoreceptor since they are the most important components for AHC sensor. The high-aspect-ratio single/cilium structure was successfully replicated by means of a hot embossing process with a help of a double-sided mold system. Especially for the high-aspect-ratio microstructure, we have proposed a new concept of a separated micro mold system utilizing LIGA process. A multi-wall carbon nanotube polydimethylsiloxane (MWNT-PDMS) composite was used as a force sensitive resistive of a mechanoreceptor. The top-bottom electrodes type mechanoreceptor was designed since it is more effective than in-plane electrodes type. The performance of the mechanoreceptor was characterized by a nano indentation system.
{"title":"Biomimetic Design and Fabrication of Components for Artificial Hair Cell Sensor","authors":"H. Lee, B. Lee, T.H. Kwon","doi":"10.1109/MEMSYS.2009.4805501","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805501","url":null,"abstract":"As a part of effort to develop an artificial hair cell (AHC) sensor, we designed and fabricated a high-aspect-ratio/single cilium structure and a mechanoreceptor since they are the most important components for AHC sensor. The high-aspect-ratio single/cilium structure was successfully replicated by means of a hot embossing process with a help of a double-sided mold system. Especially for the high-aspect-ratio microstructure, we have proposed a new concept of a separated micro mold system utilizing LIGA process. A multi-wall carbon nanotube polydimethylsiloxane (MWNT-PDMS) composite was used as a force sensitive resistive of a mechanoreceptor. The top-bottom electrodes type mechanoreceptor was designed since it is more effective than in-plane electrodes type. The performance of the mechanoreceptor was characterized by a nano indentation system.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125265953","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805582
J. Liu, M. Noman, J. Bain, T. E. Schlesinger, G. Fedder
We report on new lever-based CMOS-MEMS electrothermal probes for Memory-Intensive Self-Configuring Integrated Circuits (MISCICs). The MISCIC vision is to use MEMS conductive probes to reconfigure ICs, mainly RF ICs such as inductors, by mechanically addressing and passing current through resistance change (RC) vias embedded within the chip circuitry. The lever-based actuation causes the probe tips to move away from the probe substrate and toward the RC via substrate, which is in contrast to the previous design where actuation caused the tips to move away from the RC via substrate. Two independently actuated probes are located 3 ¿m apart to provide two simultaneous contacts that form a reconfiguration current return path. Thermal management such as dummy heater beams and thermal isolation structures are employed to improve the temperature uniformity and drive efficiency. A statistic semi-sphere model is employed to model the contact.
{"title":"Lever-Based CMOS-MEMS Probes for Reconfigurable RF IC's","authors":"J. Liu, M. Noman, J. Bain, T. E. Schlesinger, G. Fedder","doi":"10.1109/MEMSYS.2009.4805582","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805582","url":null,"abstract":"We report on new lever-based CMOS-MEMS electrothermal probes for Memory-Intensive Self-Configuring Integrated Circuits (MISCICs). The MISCIC vision is to use MEMS conductive probes to reconfigure ICs, mainly RF ICs such as inductors, by mechanically addressing and passing current through resistance change (RC) vias embedded within the chip circuitry. The lever-based actuation causes the probe tips to move away from the probe substrate and toward the RC via substrate, which is in contrast to the previous design where actuation caused the tips to move away from the RC via substrate. Two independently actuated probes are located 3 ¿m apart to provide two simultaneous contacts that form a reconfiguration current return path. Thermal management such as dummy heater beams and thermal isolation structures are employed to improve the temperature uniformity and drive efficiency. A statistic semi-sphere model is employed to model the contact.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121291229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805558
K. Kumar, X.J. Zhang
A CMOS-compatible 3-mask process for 2-axis self-aligned vertical comb-driven micromirror fabrication is described. Our 1024¿m diameter mirrors exhibit resonance at 2.81kHz, 669Hz, and maximum scan angles of 22°, 12° and 5.0°, 4.5° for resonant and static voltage operation on inner and outer axes. Reflectance confocal images of USAF1951 resolution target and epithelial breast tissue obtained at 3.0fps with 0.49¿m, 4.18¿m lateral and axial resolution over 200×125¿m field of view indicate the potential of these devices for large field-of-view microendoscopes.
{"title":"CMOS-Compatible 2-Axis Self-Aligned Vertical Comb-Driven Micromirror for Large Field-of-View Microendoscopes","authors":"K. Kumar, X.J. Zhang","doi":"10.1109/MEMSYS.2009.4805558","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805558","url":null,"abstract":"A CMOS-compatible 3-mask process for 2-axis self-aligned vertical comb-driven micromirror fabrication is described. Our 1024¿m diameter mirrors exhibit resonance at 2.81kHz, 669Hz, and maximum scan angles of 22°, 12° and 5.0°, 4.5° for resonant and static voltage operation on inner and outer axes. Reflectance confocal images of USAF1951 resolution target and epithelial breast tissue obtained at 3.0fps with 0.49¿m, 4.18¿m lateral and axial resolution over 200×125¿m field of view indicate the potential of these devices for large field-of-view microendoscopes.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"149 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122724943","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805517
J. Lee, C. Spadaccini, E. Mukerjee, W. King
This paper introduces an array of single crystal silicon micro hotplates for differential scanning calorimetry. Based on heat transfer analysis considering tradeoffs between response time, temperature uniformity, and measurement sensitivity, suspended membrane micro hotplates with full backside release were found to be optimal designs. Due to the requirements of routine sample loading, the size of the heater is 100 or 200 ¿m while the size of the backside membrane cavity is 400 ¿m. Our design achieves a combination of time constant, temperature sensitivity, and heating efficiency that are comparable or superior to previously reported microcalorimeters.
{"title":"Suspended Membrane Single Crystal Silicon Micro Hotplate for Differential Scanning Calorimetry","authors":"J. Lee, C. Spadaccini, E. Mukerjee, W. King","doi":"10.1109/MEMSYS.2009.4805517","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805517","url":null,"abstract":"This paper introduces an array of single crystal silicon micro hotplates for differential scanning calorimetry. Based on heat transfer analysis considering tradeoffs between response time, temperature uniformity, and measurement sensitivity, suspended membrane micro hotplates with full backside release were found to be optimal designs. Due to the requirements of routine sample loading, the size of the heater is 100 or 200 ¿m while the size of the backside membrane cavity is 400 ¿m. Our design achieves a combination of time constant, temperature sensitivity, and heating efficiency that are comparable or superior to previously reported microcalorimeters.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"316 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128865539","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805514
S. Wright, Y. Gianchandani
This paper describes microdischarge-based pressure sensors which operate by measuring the change, with pressure, in the spatial current distribution of pulsed DC microdischarges. These devices are well-suited for high temperature operation because of the inherently high temperatures of the ions and electrons in the microdischarges, and are designed to allow for unequal expansion of electrodes and substrate during high temperature operation. These sensors use three-dimensional arrays of horizontal bulk metal electrodes embedded in quartz substrates with electrode diameters of 1-2 mm and 50-100 ¿m inter-electrode spacing. The sensors were operated in nitrogen over a range of 10-2,000 Torr, at temperatures as high as 1,000°C. The maximum measured sensitivity was 5,420 ppm/Torr at the low end of the dynamic range and 500 ppm/Torr at the high end, while the temperature coefficient of sensitivity ranged from -925 ppm/K to -550 ppm/K.
{"title":"A Micromachined Quartz and Steel Pressure Sensor Operating Upto 1000°C and 2000 Torr","authors":"S. Wright, Y. Gianchandani","doi":"10.1109/MEMSYS.2009.4805514","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805514","url":null,"abstract":"This paper describes microdischarge-based pressure sensors which operate by measuring the change, with pressure, in the spatial current distribution of pulsed DC microdischarges. These devices are well-suited for high temperature operation because of the inherently high temperatures of the ions and electrons in the microdischarges, and are designed to allow for unequal expansion of electrodes and substrate during high temperature operation. These sensors use three-dimensional arrays of horizontal bulk metal electrodes embedded in quartz substrates with electrode diameters of 1-2 mm and 50-100 ¿m inter-electrode spacing. The sensors were operated in nitrogen over a range of 10-2,000 Torr, at temperatures as high as 1,000°C. The maximum measured sensitivity was 5,420 ppm/Torr at the low end of the dynamic range and 500 ppm/Torr at the high end, while the temperature coefficient of sensitivity ranged from -925 ppm/K to -550 ppm/K.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129287367","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805320
W.C. Lee, F. Kuypers, Y. Cho, A. Pisano
We present a novel single-cell analyzer, flow-lysometry, to measure cytosolic components in large cell populations. The present flow-lysometry performs and synchronizes three functions (cell-detection, cell-lysis, and component-sensing) in a continuous microfluidic channel, thus achieving high-throughput measurements (20 cells/min) of wide target components. In the experimental study, we measure the cytosolic component (Ca++ ion) from each single RBC and verify population analysis of single cells in mixed cell populations. Thus, this work shows that the present flow-lysometry is useful to characterize complex cell populations, which is required for various biomedical studies.
{"title":"Flow-Lysometry and its Biomedical Application: Cytosolic Analysis of Single Cells in Large Populations","authors":"W.C. Lee, F. Kuypers, Y. Cho, A. Pisano","doi":"10.1109/MEMSYS.2009.4805320","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805320","url":null,"abstract":"We present a novel single-cell analyzer, flow-lysometry, to measure cytosolic components in large cell populations. The present flow-lysometry performs and synchronizes three functions (cell-detection, cell-lysis, and component-sensing) in a continuous microfluidic channel, thus achieving high-throughput measurements (20 cells/min) of wide target components. In the experimental study, we measure the cytosolic component (Ca++ ion) from each single RBC and verify population analysis of single cells in mixed cell populations. Thus, this work shows that the present flow-lysometry is useful to characterize complex cell populations, which is required for various biomedical studies.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125677630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805324
J. Han, M. Uchic, T. Saif
We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T ≫ 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.
{"title":"Novel MEMS Apparatus for in Situ Thermo-Mechanical Tensile Testing of Materials at the Micro- and Nano-Scale","authors":"J. Han, M. Uchic, T. Saif","doi":"10.1109/MEMSYS.2009.4805324","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805324","url":null,"abstract":"We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T ≫ 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126650152","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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