Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805545
M. G. Kim, K. Jo, Y. S. Park, W. Jang, J. Lee
On-axis LDV (Laser Doppler Vibrometer), where the direction of incident beam is the same as that of the movement, intrinsically offers an accurate dynamic measurement, but it is not presently applicable to the MEMS actuator with in-plane motion due to no accessibility of the sidewall. The only available measurement method is off-axis LDV, which still shows a serious measurement error depending on the device pattern of the target surface. The on-axis FLDV (Fiber-optic LDV) with a 45°-angled optical fiber is proposed to accurately measure the in-plane motion of MEMS actuator. The performance of the proposed FLDV is evaluated in terms of signal stability and the measurable range.
{"title":"Accuracy Enhancement in the In-Plane Dynamic Measurement of MEMS Actuators using a Laser Doppler Vibrometer with a 45°-Angled Optical Fiber","authors":"M. G. Kim, K. Jo, Y. S. Park, W. Jang, J. Lee","doi":"10.1109/MEMSYS.2009.4805545","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805545","url":null,"abstract":"On-axis LDV (Laser Doppler Vibrometer), where the direction of incident beam is the same as that of the movement, intrinsically offers an accurate dynamic measurement, but it is not presently applicable to the MEMS actuator with in-plane motion due to no accessibility of the sidewall. The only available measurement method is off-axis LDV, which still shows a serious measurement error depending on the device pattern of the target surface. The on-axis FLDV (Fiber-optic LDV) with a 45°-angled optical fiber is proposed to accurately measure the in-plane motion of MEMS actuator. The performance of the proposed FLDV is evaluated in terms of signal stability and the measurable range.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131747694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805519
F. Ke, J. Miao, J. Oberhammer
This paper presents a RF MEMS switch with a new ruthenium/gold multi-layer contact metallization scheme, which combines the advantages of a hard ruthenium contact surface for high contact reliability and of a low, total contact resistance as typical for gold alloys. The performance of the new concept has been analyzed theoretically and was experimentally verified by contact resistance and life-time characterization of fabricated MEMS switches with conventional Au-Au and with the novel Au/Ru-Ru/Au contact metallization scheme. The switches are based on a low-stress SiN/SiO2 diaphragm which is polymer transfer-bonded and equipped with corrugations for reducing the stiffness and for lowering the stress. The reduced stiffness allows for early encapsulation by clamping the membrane all around its circumference, by maintaining medium actuation voltages.
{"title":"Ruthenium/Gold Hard-Surface/Low-Resistivity Contact Metallization for Polymer-Encapsulated Microswitch with Stress-Reduced Corrugated SiN/SiO2 Diaphragm","authors":"F. Ke, J. Miao, J. Oberhammer","doi":"10.1109/MEMSYS.2009.4805519","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805519","url":null,"abstract":"This paper presents a RF MEMS switch with a new ruthenium/gold multi-layer contact metallization scheme, which combines the advantages of a hard ruthenium contact surface for high contact reliability and of a low, total contact resistance as typical for gold alloys. The performance of the new concept has been analyzed theoretically and was experimentally verified by contact resistance and life-time characterization of fabricated MEMS switches with conventional Au-Au and with the novel Au/Ru-Ru/Au contact metallization scheme. The switches are based on a low-stress SiN/SiO2 diaphragm which is polymer transfer-bonded and equipped with corrugations for reducing the stiffness and for lowering the stress. The reduced stiffness allows for early encapsulation by clamping the membrane all around its circumference, by maintaining medium actuation voltages.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133687142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805376
B. T. Chia, Sheng-An Yang, Ming-Yuan Cheng, Chun-Liang Lin, Chii-wann Lin, Y. Yang
In this paper, the development of a portable polymerase chain reaction (PCR) device is presented. The fully integrated self-contained system consists of four major parts: a disposable chamber chip with micro-channels and pumping membranes, a heater chip with micro-heaters and temperature sensors, a linear array of electromagnetic actuators, and a control/sensing circuit. The system can be fully operated with a 5V DC voltage, and does not require any external air compressor or bulky power supply. The size of the whole system is 67 mm × 66 mm × 25 mm, and is smaller than a PDA cell-phone. The miniaturized PCR system not only has the advantage of smaller size, less consumption of DNA solution, but also can effectively reduce the PCR process time into one-third of the time required by typical commercial PCR system.
{"title":"A Self-Contained Miniaturized PCR System using Electromagnetic Actuators","authors":"B. T. Chia, Sheng-An Yang, Ming-Yuan Cheng, Chun-Liang Lin, Chii-wann Lin, Y. Yang","doi":"10.1109/MEMSYS.2009.4805376","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805376","url":null,"abstract":"In this paper, the development of a portable polymerase chain reaction (PCR) device is presented. The fully integrated self-contained system consists of four major parts: a disposable chamber chip with micro-channels and pumping membranes, a heater chip with micro-heaters and temperature sensors, a linear array of electromagnetic actuators, and a control/sensing circuit. The system can be fully operated with a 5V DC voltage, and does not require any external air compressor or bulky power supply. The size of the whole system is 67 mm × 66 mm × 25 mm, and is smaller than a PDA cell-phone. The miniaturized PCR system not only has the advantage of smaller size, less consumption of DNA solution, but also can effectively reduce the PCR process time into one-third of the time required by typical commercial PCR system.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123857482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805415
A. Aiyar, C. Song, S. Kim, M. Allen
This paper presents an out-of-plane micromachined piezoresistive flow sensor array based on laser micromachining of polymer films, microstencil printing, and stress-engineered curvature. The developed process is suitable for low cost, large-area sensor array fabrication, and can leverage traditional flex-circuit fabrication. Each device is composed of an out-of-plane curved microtuft formed from laser-machined Kapton® polyimide and PECVD-deposited SiO2, and a conductive elastomer piezoresistor with a measured gage factor of 7.3 located at the base of the microtuft. The fabrication and performance of a prototype array and a fabrication sequence for large-area arrays on flexible substrates is demonstrated, for flow field mapping across an airfoil. The fabrication sequence also enables backside interconnects without adding further process complexity, which facilitates integration and enables the sensing of airflow with minimum interference due to the sensing circuitry. Individual microtufts as small as 1.5mm in length and 0.4mm in width, with 70 ¿m wide piezoresistor lines have been fabricated. Wind tunnel testing demonstrated sensitivities as high as 66 ¿/(m/s).
{"title":"An All Polymer Air-Flow Sensor Array using a Piezoresistive Composite Elastomer","authors":"A. Aiyar, C. Song, S. Kim, M. Allen","doi":"10.1109/MEMSYS.2009.4805415","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805415","url":null,"abstract":"This paper presents an out-of-plane micromachined piezoresistive flow sensor array based on laser micromachining of polymer films, microstencil printing, and stress-engineered curvature. The developed process is suitable for low cost, large-area sensor array fabrication, and can leverage traditional flex-circuit fabrication. Each device is composed of an out-of-plane curved microtuft formed from laser-machined Kapton® polyimide and PECVD-deposited SiO2, and a conductive elastomer piezoresistor with a measured gage factor of 7.3 located at the base of the microtuft. The fabrication and performance of a prototype array and a fabrication sequence for large-area arrays on flexible substrates is demonstrated, for flow field mapping across an airfoil. The fabrication sequence also enables backside interconnects without adding further process complexity, which facilitates integration and enables the sensing of airflow with minimum interference due to the sensing circuitry. Individual microtufts as small as 1.5mm in length and 0.4mm in width, with 70 ¿m wide piezoresistor lines have been fabricated. Wind tunnel testing demonstrated sensitivities as high as 66 ¿/(m/s).","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123916134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805483
E. Saeedi, J. Etzkorn, L. Draghi, B. Parviz
Self-assembly is a promising technique for fast and cost-effective integration of microcomponents especially at smaller scales. Methods are needed to program the self-assembly process so that we can assemble heterogeneous components necessary to build a complex system. Here we present a new method of programming the self-assembly process which is based on optically removing blocking polymer from designated receptor sites. In order to perform the self-assembly process we need to fabricate free-standing microcomponents and templates. Templates were fabricated on both plastic and glass. We have shown successful assembly of four types of silicon microcomponents on plastic. The blocking AZ4620 resist was removed from the designated receptor sites immediately prior to the assembly of the desired microcomponents by using optical masks, UV exposure, and resist developer. 98% yield of proper positioning of microcomponents on a plastic template was achieved within ~10min of pipetting the components onto a template in a fluidic medium.
{"title":"Optically Programmable Self-Assembly of Heterogeneous Micro-Components on Unconventional Substrates","authors":"E. Saeedi, J. Etzkorn, L. Draghi, B. Parviz","doi":"10.1109/MEMSYS.2009.4805483","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805483","url":null,"abstract":"Self-assembly is a promising technique for fast and cost-effective integration of microcomponents especially at smaller scales. Methods are needed to program the self-assembly process so that we can assemble heterogeneous components necessary to build a complex system. Here we present a new method of programming the self-assembly process which is based on optically removing blocking polymer from designated receptor sites. In order to perform the self-assembly process we need to fabricate free-standing microcomponents and templates. Templates were fabricated on both plastic and glass. We have shown successful assembly of four types of silicon microcomponents on plastic. The blocking AZ4620 resist was removed from the designated receptor sites immediately prior to the assembly of the desired microcomponents by using optical masks, UV exposure, and resist developer. 98% yield of proper positioning of microcomponents on a plastic template was achieved within ~10min of pipetting the components onto a template in a fluidic medium.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128026609","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805346
Chih-Chun Lee, S. Hsiao, W. Fang
This study presents a novel microlens formation technology to implement a polymer ball lens in liquid medium. The highly symmetric ball lens is achieved due to the lower gravity influence in liquid. The microlens' diameter is controlled by the volume of the dispensed polymer. Moreover, it is easy to dispense, form, and align the liquid-phase polymer microlens with MEMS structures while processing in liquid. Thus, the microlens can either be a discrete optical component, or directly integrated with MEMS structures during the process to form a SiOB (silicon-optical-bench). To date, ball lenses with diameter ranging 200¿m~600¿m and surface roughness ≪10nm are fabricated. A typical sphericity is 8.6¿m for a 525¿m diameter ball lens. The integration of such polymer micro ball lens on SiOB is also demonstrated.
{"title":"Formation and Integration of a Ball Lens Utilizing Two Phase Liquid Technology","authors":"Chih-Chun Lee, S. Hsiao, W. Fang","doi":"10.1109/MEMSYS.2009.4805346","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805346","url":null,"abstract":"This study presents a novel microlens formation technology to implement a polymer ball lens in liquid medium. The highly symmetric ball lens is achieved due to the lower gravity influence in liquid. The microlens' diameter is controlled by the volume of the dispensed polymer. Moreover, it is easy to dispense, form, and align the liquid-phase polymer microlens with MEMS structures while processing in liquid. Thus, the microlens can either be a discrete optical component, or directly integrated with MEMS structures during the process to form a SiOB (silicon-optical-bench). To date, ball lenses with diameter ranging 200¿m~600¿m and surface roughness ≪10nm are fabricated. A typical sphericity is 8.6¿m for a 525¿m diameter ball lens. The integration of such polymer micro ball lens on SiOB is also demonstrated.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128923432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805441
Y. Takei, T. Kan, E. Iwase, Kiyoshi Matsumoto, I. Shimoyama
This paper describes an integration method of bridging-structural single-walled carbon nanotubes (SWNTs) onto the flexible PDMS sheet by stamping transfer. Silicon microstructures and the SWNTs which directly synthesized between the gaps of the microstructures were lifted off by PDMS stamp sheets with high yield (97.8%) and accuracy (position error ≪ 100 nm). From the SEM observation of our transferred structures, we confirmed that our method could transfer the bridging-structural SWNTs on to the flexible materials without any damage to the SWNTs' bridging.
{"title":"Integration of Bridging-Structural SWNTs on Flexible PDMS Sheet by Stamping Transfer","authors":"Y. Takei, T. Kan, E. Iwase, Kiyoshi Matsumoto, I. Shimoyama","doi":"10.1109/MEMSYS.2009.4805441","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805441","url":null,"abstract":"This paper describes an integration method of bridging-structural single-walled carbon nanotubes (SWNTs) onto the flexible PDMS sheet by stamping transfer. Silicon microstructures and the SWNTs which directly synthesized between the gaps of the microstructures were lifted off by PDMS stamp sheets with high yield (97.8%) and accuracy (position error ≪ 100 nm). From the SEM observation of our transferred structures, we confirmed that our method could transfer the bridging-structural SWNTs on to the flexible materials without any damage to the SWNTs' bridging.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116004996","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805343
W. Choi, Minoo Akbarian, V. Rubtsov, C. Kim
In many fields, including medical and manufacturing, endoscopy is a powerful tool for remote visual inspection. However, images obtained by an endoscope are mostly planar and provide no accurate size or distance information about the object of interest. Use of stereo images to solve these problems greatly increases the performance of such inspection tools due to its three dimensional measurability. In this study, a method to obtain stereo images using a single "flipping" glass disc device for endoscopic applications, and its realization into a miniaturized device are presented.
{"title":"Microfabricated Flipping Glass Disc for Stereo Imaging in Endoscopic Visual Inspection","authors":"W. Choi, Minoo Akbarian, V. Rubtsov, C. Kim","doi":"10.1109/MEMSYS.2009.4805343","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805343","url":null,"abstract":"In many fields, including medical and manufacturing, endoscopy is a powerful tool for remote visual inspection. However, images obtained by an endoscope are mostly planar and provide no accurate size or distance information about the object of interest. Use of stereo images to solve these problems greatly increases the performance of such inspection tools due to its three dimensional measurability. In this study, a method to obtain stereo images using a single \"flipping\" glass disc device for endoscopic applications, and its realization into a miniaturized device are presented.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115209006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805356
S. R. Green, Y. Gianchandani
This paper presents a system for wirelessly monitoring the accumulation of sludge within biliary stents. The system comprises a sensor and biasing permanent magnet layer that conform to the meshed topology and tubular curvature of a biliary stent. The sensors have an active area of 7.5 mm × 29 mm and a mass of 9.1 mg. Annealing the sensor at 375°C results in reducing the required biasing magnetic field from 6 Oe to 2 Oe. The integrated system shows a 38% decrease in resonant frequency (from 61.6 kHz to 38.2 kHz) after an applied mass load of 20.9 mg, or 2.3× the mass of the sensor. The system architecture allows the mechanical properties of the stent to be maintained while adding important monitoring capabilities to the implanted device.
{"title":"A Batch-Patterned Self-Expanding Biliary Stent with Conformal Magnetic PDMS Layer and Topologically-Matched Wireless Magnetoelastic Sensor","authors":"S. R. Green, Y. Gianchandani","doi":"10.1109/MEMSYS.2009.4805356","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805356","url":null,"abstract":"This paper presents a system for wirelessly monitoring the accumulation of sludge within biliary stents. The system comprises a sensor and biasing permanent magnet layer that conform to the meshed topology and tubular curvature of a biliary stent. The sensors have an active area of 7.5 mm × 29 mm and a mass of 9.1 mg. Annealing the sensor at 375°C results in reducing the required biasing magnetic field from 6 Oe to 2 Oe. The integrated system shows a 38% decrease in resonant frequency (from 61.6 kHz to 38.2 kHz) after an applied mass load of 20.9 mg, or 2.3× the mass of the sensor. The system architecture allows the mechanical properties of the stent to be maintained while adding important monitoring capabilities to the implanted device.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"139 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115559793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805538
G. Casinovi, X. Gao, F. Ayazi
This paper introduces two newly developed models of capacitive silicon bulk acoustic resonators (SiBARs). The first model is analytical and is obtained from an approximate solution of the linear elastodynamics equations for the SiBAR geometry. The second is numerical and is based on finite-element, multi-physics simulation of both acoustic wave propagation in the resonator and electromechanical transduction in the capacitive gaps of the device. This latter model makes it possible to compute SiBAR performance parameters that cannot be obtained from the analytical model, e.g. the relationship between transduction area and insertion loss. Comparisons with measurements taken on a set of silicon resonators fabricated using electron-beam lithography show that both models can predict the resonant frequencies of SiBARs with a relative error smaller than 1%.
{"title":"Analytical Modeling and Numerical Simulation of Capacitive Silicon Bulk Acoustic Resonators","authors":"G. Casinovi, X. Gao, F. Ayazi","doi":"10.1109/MEMSYS.2009.4805538","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805538","url":null,"abstract":"This paper introduces two newly developed models of capacitive silicon bulk acoustic resonators (SiBARs). The first model is analytical and is obtained from an approximate solution of the linear elastodynamics equations for the SiBAR geometry. The second is numerical and is based on finite-element, multi-physics simulation of both acoustic wave propagation in the resonator and electromechanical transduction in the capacitive gaps of the device. This latter model makes it possible to compute SiBAR performance parameters that cannot be obtained from the analytical model, e.g. the relationship between transduction area and insertion loss. Comparisons with measurements taken on a set of silicon resonators fabricated using electron-beam lithography show that both models can predict the resonant frequencies of SiBARs with a relative error smaller than 1%.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114482926","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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