Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805457
C. Kamezawa, Yuji Suzuki, N. Kasagi
Mechanical response of high-thermally-stable-grade parylene (diX-SR/HR) is investigated for flexible spring applications. Pendulum structures with a high-aspect-ratio beam are microfabricated using different parylene materials, and their amplitude and stress at resonant oscillation are measured. Based on fatigue tests and measurements of the temperature coefficient of Young's modulus, MEMS structures with diX-SR/HR are proved to have better thermal tolerance than parylene-C, while they have almost the same mechanical properties as parylene-C.
{"title":"Mechanical Response Evaluation of High-Thermally-Stable-Grade Parylene Spring","authors":"C. Kamezawa, Yuji Suzuki, N. Kasagi","doi":"10.1109/MEMSYS.2009.4805457","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805457","url":null,"abstract":"Mechanical response of high-thermally-stable-grade parylene (diX-SR/HR) is investigated for flexible spring applications. Pendulum structures with a high-aspect-ratio beam are microfabricated using different parylene materials, and their amplitude and stress at resonant oscillation are measured. Based on fatigue tests and measurements of the temperature coefficient of Young's modulus, MEMS structures with diX-SR/HR are proved to have better thermal tolerance than parylene-C, while they have almost the same mechanical properties as parylene-C.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124639352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805492
S. Lee, J. Cho, S. W. Lee, M. Zaman, F. Ayazi, K. Najafi
This paper presents a generic vacuum packaging technology for environment-resistant MEMS devices. This packaging approach simultaneously provides low-power oven-controlled thermal environment and vibration isolation using an isolation platform. The oven-controlled structure is thermally isolated from the environment by crab-leg suspensions made out of a 100 ¿m-thick glass wafer, an anti-radiation shield, and vacuum encapsulation. Performance is evaluated by packaging Pirani gauges and mode-matched tuning fork gyroscopes (M2-TFGs). The package has maintained vacuum pressure of ~6 mTorr for ~1 year. A packaged M2-TFG shows a high-Q mode-matched operation (Q~65,000) at a constant temperature of -5 °C. Allan variance analysis displays an estimated angle random walk (ARW) of 0.012 °/¿hr and a bias instability value of 0.55 °/hr at a constant -5 °C. Drive frequency stability of 0.22 ppm/°C is obtained using a compensated oven-control approach. Low power consumption of 33 mW for oven-control at 80 °C is demonstrated when the environment temperature is -30 °C.
{"title":"A Low-Power Oven-Controlled Vacuum Package Technology for High-Performance MEMS","authors":"S. Lee, J. Cho, S. W. Lee, M. Zaman, F. Ayazi, K. Najafi","doi":"10.1109/MEMSYS.2009.4805492","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805492","url":null,"abstract":"This paper presents a generic vacuum packaging technology for environment-resistant MEMS devices. This packaging approach simultaneously provides low-power oven-controlled thermal environment and vibration isolation using an isolation platform. The oven-controlled structure is thermally isolated from the environment by crab-leg suspensions made out of a 100 ¿m-thick glass wafer, an anti-radiation shield, and vacuum encapsulation. Performance is evaluated by packaging Pirani gauges and mode-matched tuning fork gyroscopes (M2-TFGs). The package has maintained vacuum pressure of ~6 mTorr for ~1 year. A packaged M2-TFG shows a high-Q mode-matched operation (Q~65,000) at a constant temperature of -5 °C. Allan variance analysis displays an estimated angle random walk (ARW) of 0.012 °/¿hr and a bias instability value of 0.55 °/hr at a constant -5 °C. Drive frequency stability of 0.22 ppm/°C is obtained using a compensated oven-control approach. Low power consumption of 33 mW for oven-control at 80 °C is demonstrated when the environment temperature is -30 °C.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124739004","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805408
S. Umezu, T. Kitajima, H. Murase, H. Ohmori, K. Katahira, Y. Ito
We fabricated living cell lines, cell wall and cell cylinder utilizing electrostatic inkjet phenomena. The inkjet phenomena have two merits, higher resolution than commercial printer and ability to eject highly viscous liquid. These merits were preferable to print liquid with cells precisely and to eject liquid with scaffolds that were relatively high viscosity. In spite that high voltage was applied in case of the electrostatic inkjet phenomena, cells were living because current did not flow through cells but around cells.
{"title":"Fabrication of Living Cell Structure Utilizing Electro-Static Inkjet Phenomena","authors":"S. Umezu, T. Kitajima, H. Murase, H. Ohmori, K. Katahira, Y. Ito","doi":"10.1109/MEMSYS.2009.4805408","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805408","url":null,"abstract":"We fabricated living cell lines, cell wall and cell cylinder utilizing electrostatic inkjet phenomena. The inkjet phenomena have two merits, higher resolution than commercial printer and ability to eject highly viscous liquid. These merits were preferable to print liquid with cells precisely and to eject liquid with scaffolds that were relatively high viscosity. In spite that high voltage was applied in case of the electrostatic inkjet phenomena, cells were living because current did not flow through cells but around cells.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129453030","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805486
Young-Suk Hwang, Hyoung-Kyoon Jung, Eunseok Song, Ik-Jae Hyeon, Yong-Kweon Kim, C. Baek
This paper reports a novel process to fabricate electrostatically-actuated, in-plane micromechanical resonators made of fused quartz for high-Q microsensor applications. Two key processes - low temperature plasma-assisted Silicon-on-Quartz (SoQ) direct bonding and quartz DRIE using C4F8/He plasma - have been used in combination with thin metallization to fabricate fused quartz resonators driven by electrostatic force. The proposed method enables wafer-level fabrication of fused quartz resonators readily mounted on the substrate, which is advantageous over the conventional fabrication method of quartz crystal resonators. By using the proposed process, 40-¿m-thick laterally-driven fused quartz cantilever resonators have been successfully fabricated. The measured Q-values of the metal-coated fused quartz cantilevers are 21,700~48,900 according to the length of the cantilever.
{"title":"Fabrication of Electrostatically-Actuated, In-Plane Fused Quartz Resonators using Silicon-on-Quartz (SOQ) Bonding and Quartz Drie","authors":"Young-Suk Hwang, Hyoung-Kyoon Jung, Eunseok Song, Ik-Jae Hyeon, Yong-Kweon Kim, C. Baek","doi":"10.1109/MEMSYS.2009.4805486","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805486","url":null,"abstract":"This paper reports a novel process to fabricate electrostatically-actuated, in-plane micromechanical resonators made of fused quartz for high-Q microsensor applications. Two key processes - low temperature plasma-assisted Silicon-on-Quartz (SoQ) direct bonding and quartz DRIE using C4F8/He plasma - have been used in combination with thin metallization to fabricate fused quartz resonators driven by electrostatic force. The proposed method enables wafer-level fabrication of fused quartz resonators readily mounted on the substrate, which is advantageous over the conventional fabrication method of quartz crystal resonators. By using the proposed process, 40-¿m-thick laterally-driven fused quartz cantilever resonators have been successfully fabricated. The measured Q-values of the metal-coated fused quartz cantilevers are 21,700~48,900 according to the length of the cantilever.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130122363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805401
E. Dy, C. Ho
In this work electrostatic actuation in ionic liquid environments was achieved through a unique atmospheric pressure packaging scheme in conjunction with Trichloro(1H, 1H, 2H, 2H-Perfluorooctyl)Silane surface modification. This technique avoids common problems of electrolysis, charge blocking, and current leakage without the need for any drive signal considerations. When combined with cellular self-assembly onto sacrificial polymers, this breakthrough opens the possibility of creating a cytomic force transduction system through which mechanobiological experiments can be conducted on a multitude of cell phenotypes in vitro. Testing of the device in liquid demonstrated actuation with as little as 15V and continuous operation in liquid was successful for over two weeks.
{"title":"Development of a Cytomic Force Transducer for Experimental Mechanobiology","authors":"E. Dy, C. Ho","doi":"10.1109/MEMSYS.2009.4805401","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805401","url":null,"abstract":"In this work electrostatic actuation in ionic liquid environments was achieved through a unique atmospheric pressure packaging scheme in conjunction with Trichloro(1H, 1H, 2H, 2H-Perfluorooctyl)Silane surface modification. This technique avoids common problems of electrolysis, charge blocking, and current leakage without the need for any drive signal considerations. When combined with cellular self-assembly onto sacrificial polymers, this breakthrough opens the possibility of creating a cytomic force transduction system through which mechanobiological experiments can be conducted on a multitude of cell phenotypes in vitro. Testing of the device in liquid demonstrated actuation with as little as 15V and continuous operation in liquid was successful for over two weeks.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130688993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805468
M. Komatsubara, T. Namazu, N. Naka, S. Kashiwagi, K. Ohtsuki, S. Inoue
This paper describes an experimental analysis method for evaluating surface stress distribution in single-crystalline silicon (SCS) microstructures using laser Raman spectroscope. A biaxial tensile tester designed for film specimens was employed to apply uni/biaxial stresses to SCS specimen having 270-nm-high, 4-¿m-square SCS convex structures in the gauge section. As reported in Transducers 2007 [1], two-curve fitting of Raman spectrum was useful for analyzing stress magnitude at the edge of convex structures. In this study, the partial least-square (PLS) method was adopted for the obtained Raman spectra at the convex edge in order to determine stress components as well as their magnitudes. By using the PLS method, the shear stress component was able to be measured in addition to the normal stress components. The stress magnitude in respective stress components was in very good agreement with that estimated by finite element analysis (FEA).
{"title":"Non-Destructive Quantitative Measurement Method for Normal and Shear Stresses on Single-Crystalline Silicon Structures for Reliability of Silicon-MEMS","authors":"M. Komatsubara, T. Namazu, N. Naka, S. Kashiwagi, K. Ohtsuki, S. Inoue","doi":"10.1109/MEMSYS.2009.4805468","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805468","url":null,"abstract":"This paper describes an experimental analysis method for evaluating surface stress distribution in single-crystalline silicon (SCS) microstructures using laser Raman spectroscope. A biaxial tensile tester designed for film specimens was employed to apply uni/biaxial stresses to SCS specimen having 270-nm-high, 4-¿m-square SCS convex structures in the gauge section. As reported in Transducers 2007 [1], two-curve fitting of Raman spectrum was useful for analyzing stress magnitude at the edge of convex structures. In this study, the partial least-square (PLS) method was adopted for the obtained Raman spectra at the convex edge in order to determine stress components as well as their magnitudes. By using the PLS method, the shear stress component was able to be measured in addition to the normal stress components. The stress magnitude in respective stress components was in very good agreement with that estimated by finite element analysis (FEA).","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"130 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132268944","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805417
Miao Chen, T. Hsu, F. Tseng
In this work, a low hysteresis surface prepared by hierarchical textures for the reduction of liquid droplet adhesion is proposed. This surface is important to provide a platform for droplet-based biological reactions with minimum surface interferences. The hierarchical textures, mimicking lotus leaf surface, were composed of two length scales (nano-/micro-textures). Hereby, a high contact angle (160°) and low hysteresis (~2.7°) was obtained and comparable to the surface properties of lotus leaf. In dynamic contact angle analysis by droplet impinging onto the surface, multi-metastable states were categorized and showed a high correlation to the multilength scale that would be noticeable for contact angle control.
{"title":"Biomimic Low Hysteresis Surface Prepared by Hierarchical Micro/Nano Textures","authors":"Miao Chen, T. Hsu, F. Tseng","doi":"10.1109/MEMSYS.2009.4805417","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805417","url":null,"abstract":"In this work, a low hysteresis surface prepared by hierarchical textures for the reduction of liquid droplet adhesion is proposed. This surface is important to provide a platform for droplet-based biological reactions with minimum surface interferences. The hierarchical textures, mimicking lotus leaf surface, were composed of two length scales (nano-/micro-textures). Hereby, a high contact angle (160°) and low hysteresis (~2.7°) was obtained and comparable to the surface properties of lotus leaf. In dynamic contact angle analysis by droplet impinging onto the surface, multi-metastable states were categorized and showed a high correlation to the multilength scale that would be noticeable for contact angle control.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128774041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805506
Chih-Ming Sun, M. Tsai, W. Fang
This study presents a novel single proof-mass tri-axis capacitive CMOS MEMS accelerometer to reduce the footprint of chip. A serpentine out-of-plane (Z-axis) spring is designed to reduce cross-axis error. A magnetic actuation for Z-axis self-test is also presented. The tri-axis accelerometer has been successfully implemented using TSMC 2P4M process and our in-house post-process. Measurement results show that sensitivities (non-linearity) of etch direction are 0.53mV/G (2.64%) of X-axis, 0.28mV/G (3.15%) of Y-axis, and 0.2mV/G (3.36%) of Z-axis. The cross-axis sensitivities range from 1% to 8.3%, and the measurement range is between 0.8~6G, respectively.
{"title":"Design and Implementation of a Novel CMOS-MEMS Single Proof-Mass Tri-Axis Accelerometer","authors":"Chih-Ming Sun, M. Tsai, W. Fang","doi":"10.1109/MEMSYS.2009.4805506","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805506","url":null,"abstract":"This study presents a novel single proof-mass tri-axis capacitive CMOS MEMS accelerometer to reduce the footprint of chip. A serpentine out-of-plane (Z-axis) spring is designed to reduce cross-axis error. A magnetic actuation for Z-axis self-test is also presented. The tri-axis accelerometer has been successfully implemented using TSMC 2P4M process and our in-house post-process. Measurement results show that sensitivities (non-linearity) of etch direction are 0.53mV/G (2.64%) of X-axis, 0.28mV/G (3.15%) of Y-axis, and 0.2mV/G (3.36%) of Z-axis. The cross-axis sensitivities range from 1% to 8.3%, and the measurement range is between 0.8~6G, respectively.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128834759","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805469
J. Salvia, R. Melamud, S. Chandorkar, H.K. Lee, Y. Qu, S. Lord, B. Murmann, T. Kenny
We present a new temperature compensation system for microresonator based frequency references. It consists of a phase lock loop whose inputs are derived from two microresonators with different temperature coefficients of frequency. The resonators are suspended within an encapsulated cavity and are heated to constant temperature by the phase lock loop controller, thereby achieving active temperature compensation. We show repeated real-time measurements of two prototypes which achieve frequency stability of better than ±1 ppm from -20 °C to + 80°C without calibration look-up tables and ±0.05 ppm with calibration.
{"title":"Phase Lock Loop based Temperature Compensation for MEMS Oscillators","authors":"J. Salvia, R. Melamud, S. Chandorkar, H.K. Lee, Y. Qu, S. Lord, B. Murmann, T. Kenny","doi":"10.1109/MEMSYS.2009.4805469","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805469","url":null,"abstract":"We present a new temperature compensation system for microresonator based frequency references. It consists of a phase lock loop whose inputs are derived from two microresonators with different temperature coefficients of frequency. The resonators are suspended within an encapsulated cavity and are heated to constant temperature by the phase lock loop controller, thereby achieving active temperature compensation. We show repeated real-time measurements of two prototypes which achieve frequency stability of better than ±1 ppm from -20 °C to + 80°C without calibration look-up tables and ±0.05 ppm with calibration.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123302128","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-03-27DOI: 10.1109/MEMSYS.2009.4805490
A. B. Graham, M. Messana, P. Hartwell, J. Provine, S. Yoneoka, B. Kim, R. Melamud, R. Howe, T. Kenny
Packaging of microelectromechanical systems (MEMS) is a critical step in the transition from product development to production. This paper presents a robust, hermetically-sealed encapsulation method that can accommodate many traditional MEMS devices by allowing large lateral deflection structures within a clean environment. Using the new technology described in this paper, trench widths ranging from 1¿m to 100¿m were successfully encapsulated at the wafer level while maintaining devices as thick as 20¿m. Devices produced with this method have proven durable enough to withstand harsh post-processing such as dicing and wire bonding. Two different types of MEMS resonators are also discussed, demonstrating the use of both large and small trench widths within the encapsulation.
{"title":"Wafer Scale Encapsulation of Large Lateral Deflection MEMS Structures","authors":"A. B. Graham, M. Messana, P. Hartwell, J. Provine, S. Yoneoka, B. Kim, R. Melamud, R. Howe, T. Kenny","doi":"10.1109/MEMSYS.2009.4805490","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805490","url":null,"abstract":"Packaging of microelectromechanical systems (MEMS) is a critical step in the transition from product development to production. This paper presents a robust, hermetically-sealed encapsulation method that can accommodate many traditional MEMS devices by allowing large lateral deflection structures within a clean environment. Using the new technology described in this paper, trench widths ranging from 1¿m to 100¿m were successfully encapsulated at the wafer level while maintaining devices as thick as 20¿m. Devices produced with this method have proven durable enough to withstand harsh post-processing such as dicing and wire bonding. Two different types of MEMS resonators are also discussed, demonstrating the use of both large and small trench widths within the encapsulation.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123340218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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