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Investigation of the Interaction Between Cu2-x S +So Coatings and Pd(II) Ions by Cyclic Voltammetry and X-ray Photoelectron Spectroscopy 循环伏安法和x射线光电子能谱法研究Cu2-x S +So涂层与Pd(II)离子的相互作用
IF 1.9 4区 材料科学 Q4 ELECTROCHEMISTRY Pub Date : 1999-01-01 DOI: 10.1080/00202967.1999.11871291
J. Vinkevičius, I. Mozginskiene, V. Jasulaitienė
The interaction between Pd 2+ ions and Cu 2-x S coating formed by three cycles and containing ∼30 at.% of elementary S has been investigated by the methods of cyclic voltammetry and photoelectron spectroscopy (one cycle of coating formation includes treatment of the surface with Cu(I)+Cu(II) ammoniate solution, hydrolysis of the adsorbed copper compounds and sulphidation of copper oxygen compounds in Na 2 S n solution). After exposure of such a coating to Pd 2+ ions (1.7 mM PdCl 2 , pH=2), an exchange as well as a redox interaction between the coating components and Pd 2+ ions has been shown to occur Due to this the amount of copper in the coating decreases from 2 to 4 times and that ofsulphur from 1.5 to 5 times. The coating modified in such a way has been found to contain up to 75 at.% of palladium, ∼90% of it being in a metallic state. It has been determined that at the beginning S 0 is bound into a soluble compound: 2Pd 2+ + S 0 + 3H 2 O → 2Pd 0 + H 2 SO 3 + 4H + . The Cu 2 S present in the coating is considered to interact with Pd 2+ , with the formation of Pd 0 and CuPdS 2 , while CuS reacts most likely according to the reaction: CuS + 3Pd 2+ + 3H 2 O → 3Pd 0 + H 2 SO 3 + Cu 2+ + 4H + . The Cu 2-x S + S 0 coating formed on a dielectric and modified with Pd 2+ , contrary to the initial Cu 2-x S + S 0 coating, can be plated with copper from any electrolyte for copper deposition.
Pd +离子与含~ 30 at的三次循环形成的cu2 -x S涂层之间的相互作用。用循环伏安法和光电子能谱法研究了%的元素S(一个周期的涂层形成包括Cu(I)+Cu(II)氨化溶液对表面的处理,吸附的铜化合物的水解和铜氧化合物在na2sn溶液中的硫化)。在这种涂层暴露于Pd +离子(1.7 mM PdCl 2, pH=2)后,涂层成分与Pd +离子之间发生交换和氧化还原相互作用。由于这种相互作用,涂层中的铜量从2减少到4倍,硫从1.5减少到5倍。用这种方法改性的涂层已被发现含有高达75个at。%的钯,约90%的钯处于金属状态。经测定,最初s0结合成可溶性化合物:2Pd 2+ + s0 + 3h2o→2Pd 0 + h2so3 + 4H +。涂层中存在的cu2s被认为与pd2 +相互作用,形成Pd 0和cupd2,而Cu最可能的反应是:Cu + 3Pd 2+ + 3h2o→3Pd 0 + h2so3 + cu2 + + 4H +。与最初的Cu 2-x S + S 0涂层不同,在电介质上形成用Pd 2+修饰的Cu 2-x S + S 0涂层,可以用任何电解质镀铜。
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引用次数: 1
Preparation and characterization of Cu-MoSi2 composite coatings Cu-MoSi2复合镀层的制备与表征
IF 1.9 4区 材料科学 Q4 ELECTROCHEMISTRY Pub Date : 1999-01-01 DOI: 10.1080/00202967.1999.11871245
Y. Wan, Y. L. Wang, H. Tao, G. Cheng, X. Dong
Cu-MoSi 2 composite coatings were obtained by an electrodeposition technique from a conventional acid copper sulfate bath. The effects of plating variable, such as particle concentration in the bath, cathode current density, stir rate and stir type on particle content in the composite coatings (Vp) were between Vp and stir rate, particle concentration in the bath and current density were related to the nature of incorporated particles (the density and electrical resistivity). Moreover, stir type showed a great effect on Vp of Cu-MoSi 2 . The codeposition rate and internal stress of Cu-MoSi 2 composite coatings were greatly influenced by plating variables. The physicomechanical properties electrical resistivity, hardness and wear resistance of Cu-MoSi 2 and Cu-Al 2 O 3 were determined. It was established that microhardness and wear resistance increased with the increase of Vp for both Cu-MoSi 2 and Cu-Al 2 O 3 . The hardness and electrical resistivity of Cu-MoSi 2 were lower compared with Cu-Al 2 O 3 . However, it was more abrasive than Cu-Al 2 O 3 .
采用电沉积技术在常规酸性硫酸铜浴中制备了Cu-MoSi - 2复合镀层。镀液中颗粒浓度、阴极电流密度、搅拌速率和搅拌方式等镀变量对复合镀层中颗粒含量(Vp)的影响介于Vp和搅拌速率之间,镀液中颗粒浓度和电流密度与掺入颗粒的性质(密度和电阻率)有关。此外,搅拌方式对cu - mosi2的Vp有较大影响。cu - mosi2复合镀层的共沉积速率和内应力受镀层参数的影响较大。测定了cu - mosi2和cu - al2o3的物理力学性能、电阻率、硬度和耐磨性。结果表明,随着Vp的增加,cu - mosi2和cu - al2o3的显微硬度和耐磨性均有所提高。与cu - al2o3相比,cu - mosi2的硬度和电阻率较低。然而,它比cu - al2o3更具磨蚀性。
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引用次数: 7
Hydraulic bulge test of electrodeposited copper foil 电沉积铜箔的水力膨胀试验
IF 1.9 4区 材料科学 Q4 ELECTROCHEMISTRY Pub Date : 1999-01-01 DOI: 10.1080/00202967.1999.11871247
H. D. Merchant, M. G. Rozboril
The 18 pm to 72 μ thick commercial electrodeposited copper foils GR I and GR 3, the experimentalfoil TCAM and the commercial rolled foil GR 8 are tested in bulge and in tension at temperatures up t...
对18 ~ 72 μ厚的商业电沉积铜箔GR I和GR 3、实验箔TCAM和商业轧制箔GR 8进行了在高温下的胀形和拉伸试验。
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引用次数: 0
Application of Silane Technology to Prevent Corrosion of Metals and Improve Paint Adhesion 硅烷技术在防止金属腐蚀和提高涂料附着力中的应用
IF 1.9 4区 材料科学 Q4 ELECTROCHEMISTRY Pub Date : 1999-01-01 DOI: 10.1080/00202967.1999.11871249
T. Child, W. V. Ooij
Environmental, safety and cost issues surrounding the continued use of chromates have led to increased R&D activities to find alternative materials. Recent developments in the application of silane...
围绕铬酸盐的持续使用,环境、安全和成本问题导致研发活动增加,以寻找替代材料。硅烷应用的最新进展…
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引用次数: 98
An expert system to identify anodic coating process defects. Part 2 : Compiling the hypertext database 阳极涂层工艺缺陷识别专家系统。第2部分:编译超文本数据库
IF 1.9 4区 材料科学 Q4 ELECTROCHEMISTRY Pub Date : 1999-01-01 DOI: 10.1080/00202967.1999.11871264
A. Brace
The advantages of using a neural networks program for the identification of anodic coating process defects has been detailed in Part I of this paper. Having identified the defect it was considered desirable to develop a database which would provide information on the causes of defects, advise on corrective measures, include a relevant bibliography and be able to provide a graphics display of the defect where applicable. After illustrating some of the earlier databases the advantages of using a program containing a hypertext facility has been demonstrated and possible further development of the system is discussed.
本文第一部分详细介绍了使用神经网络程序识别阳极涂层工艺缺陷的优点。在确定了缺陷之后,人们认为开发一个数据库是可取的,该数据库将提供关于缺陷原因的信息,对纠正措施提出建议,包括相关的参考书目,并能够在适用的地方提供缺陷的图形显示。在说明了一些早期的数据库之后,演示了使用包含超文本功能的程序的优点,并讨论了该系统的进一步开发。
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引用次数: 0
Electrochemical cell reactions 电化学电池反应
IF 1.9 4区 材料科学 Q4 ELECTROCHEMISTRY Pub Date : 1999-01-01 DOI: 10.1080/00202967.1999.11871275
F. Walsh, G. Ottewill
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引用次数: 1
Novel Room Temperature Molten Salts for Aluminium Electrodeposition 新型铝电沉积用常温熔盐
IF 1.9 4区 材料科学 Q4 ELECTROCHEMISTRY Pub Date : 1999-01-01 DOI: 10.1080/00202967.1999.11871238
A. Abbott, C. Eardley, N. Farley, A. Pratt
SUMMARYThis work describes novel room temperature molten salts which can be used for aluminium electrodeposition. We have characterised the conductivity as a function of the bath composition and shown that the changes in conductivity occur because of an equilibrium between [Al2Cl7] and [AlCl2 The voltammetry of the optimum melt is analysed together with the mechanism of nucleation. Hull cell tests were performed and the morphology of the deposits was analysed using scanning electron microscopy. These room temperature molten salts have a number of advantages over those described in the literature including lower water sensitivity, greater ease of purification and greatly reduced cost. The electrodeposition of adherent, dull aluminium is demonstrated. It is also shown that soluble aluminium anodes can be used. These novel baths form a viable alternative to conventional methods of depositing aluminium.
本工作描述了一种可用于铝电沉积的新型室温熔盐。我们将电导率表征为熔池组成的函数,并表明电导率的变化是由于[Al2Cl7]和[AlCl2]之间的平衡而发生的。进行了壳细胞试验,并使用扫描电子显微镜分析了沉积物的形态。与文献中描述的熔盐相比,这些室温熔盐具有许多优点,包括较低的水敏感性,更易于净化和大大降低成本。电沉积的粘附,暗铝演示。结果表明,可溶铝阳极是可行的。这些新颖的槽形成了传统沉积铝方法的可行替代方案。
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引用次数: 11
Studies of Electroless Nickel Deposits with Low Phosphorus Content 低磷化学镀镍的研究
IF 1.9 4区 材料科学 Q4 ELECTROCHEMISTRY Pub Date : 1999-01-01 DOI: 10.1080/00202967.1999.11871252
Y. Zhang, M. Yao
SUMMARYA useful coating technology for electroless Ni-1.5wt%P has been developed. The bath can work normally for more than 5 turnovers with a plating rate of 20 μm/h. In the as-deposited condition, Ni-1.5wt%P deposit is a supersaturated solid solution of P dissolved in a nanocrystalline Ni matrix with a grain size of several nanometers. The microstructure transformed into a larger grain size Ni matrix with dispersive Ni3P precipitates with increasing the heat treatment temperature. Ni-1.5wt%P deposit possesses as-deposited hardness and wear resistance superior to Ni-10.5wt%P deposit. The microhardness and wear resistance can be further improved by proper heat treatment. The optimum wear resistance of Ni-1.5wt%P deposit corresponds to its peak hardness (annealing at 375°C for 1 h), whereas for Ni-10.5wt%P deposit the optimum wear resistance is obtained after annealing at 650°C for 1 h. Ni-1.5wt%Ppossesses a corrosion resistance in NaOH solution superior to conventional medium and high phosphorus deposits, ...
开发了一种实用的化学镀Ni-1.5wt%P涂层技术。镀液可正常工作5次以上,电镀速率可达20 μm/h。在沉积状态下,Ni-1.5wt%P沉积是P的过饱和固溶体,溶解在晶粒尺寸为几纳米的纳米晶Ni基体中。随着热处理温度的升高,微观组织转变为晶粒尺寸较大的Ni基体,析出弥散的Ni3P相。Ni-1.5wt%P沉积层的硬度和耐磨性优于Ni-10.5wt%P沉积层。通过适当的热处理,可进一步提高显微硬度和耐磨性。Ni-1.5wt%P镀层的最佳耐磨性对应于其峰值硬度(在375°C退火1 h),而Ni-10.5wt%P镀层的最佳耐磨性是在650°C退火1 h后获得的。Ni-1.5wt%P镀层在NaOH溶液中的耐腐蚀性优于传统的中磷和高磷镀层。
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引用次数: 22
An Electrochemical Evaluation of Possible Non-Chromate Conversion Coating Treatments for Electrodeposited Zinc-Nickel Alloys 电沉积锌镍合金非铬酸盐转化涂层处理的电化学评价
IF 1.9 4区 材料科学 Q4 ELECTROCHEMISTRY Pub Date : 1999-01-01 DOI: 10.1080/00202967.1999.11871272
J. Wharton, G. Wilcox, K. R. Baldwin
A number of possible non-chromate conversion coating formulations have been studied to examine their efficacy as replacements for chromate-based coating treatments on electrodeposited zinc-nickel alloys. Data have been collected from both electrochemical and conventional salt fog corrosion tests. In the latter tests all the alternative non-chromate systems studied delayed the onset of the corrosion of the zinc-nickel coating itself but only the simple molybdate and the permanganate/molybdate dual treatment brought about improvements in times to red rusting of the steel substrate. The electrochemical evaluations suggested that simple molybdate-treated surfaces act as only moderate barriers to the chloride environments. Of the two dual treatments, permanganate/molybdate behaved similarly to the simple molybdate treated surfaces in the electrochemical tests, but the molybdate/permanganate was more protective, although this was not exhibited in the salt fog corrosion tests.
研究了一些可能的非铬酸盐转化涂层配方,以检验它们作为电沉积锌镍合金铬基涂层处理的替代品的有效性。从电化学和常规盐雾腐蚀试验中收集了数据。在后一种试验中,所研究的所有可选的非铬酸盐体系都延迟了锌镍镀层本身腐蚀的开始,但只有简单的钼酸盐和高锰酸盐/钼酸盐双重处理对钢基体红锈的时间有所改善。电化学评价表明,简单的钼酸盐处理表面对氯化物环境仅起中等屏障作用。在两种双重处理中,高锰酸盐/钼酸盐在电化学测试中的表现与简单钼酸盐处理的表面相似,但钼酸盐/高锰酸盐的保护作用更强,尽管这在盐雾腐蚀试验中没有表现出来。
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引用次数: 15
Studies on the Mechanism, Structure and Microhardness of Ni-W Alloy Electrodeposits Ni-W合金镀层的机理、组织和显微硬度研究
IF 1.9 4区 材料科学 Q4 ELECTROCHEMISTRY Pub Date : 1999-01-01 DOI: 10.1080/00202967.1999.11871279
Ling Huang, J. Dong, Fang-Zu Yang, Shukai Xu, Sm Zhou
SUMMARYThe electrodeposition of Ni-W alloy has been studied on the glassy carbon electrode by the cyclic voltammetry and potentiostatic step methods. It has been found that electrodeposition of Ni-W alloy involves an intermediate valence tungsten oxide which inhibits hydrogen evolution. Ni-W alloy electrodeposition occurs by a mechanism involving progressive nucleation followed by three dimensional growth.The structures of nickel-tungsten alloy deposits were analyzed by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). The XRD results from Ni-W alloy deposits reveal a face-centered cubic solid solution, the microstructure of the deposits exhibit (111) preferred orientation. The lattice constant and microhardness of Ni-W alloy deposit increase as the tungsten content increases, the XPS results of Ni-W alloy deposits indicate that the nickel and tungsten of the deposits exist in the metallic state, but the Ni-W alloy deposit with a tungsten content of 40.7% is an intermetallic compound. Th...
摘要采用循环伏安法和恒电位步进法研究了Ni-W合金在玻碳电极上的电沉积。发现镍钨合金的电沉积过程中含有抑制析氢的中间价氧化钨。Ni-W合金电沉积的发生机制是渐进形核和三维生长。采用x射线衍射(XRD)和x射线光电子能谱(XPS)分析了镍钨合金镀层的结构。Ni-W合金镀层的XRD分析结果表明,Ni-W合金镀层为面心立方固溶体,其显微组织表现为(111)择优取向。Ni-W合金镀层的晶格常数和显微硬度随钨含量的增加而增加,镍- w合金镀层的XPS结果表明,镀层中的镍和钨以金属态存在,而钨含量为40.7%的Ni-W合金镀层为金属间化合物。Th……
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引用次数: 16
期刊
Transactions of The Institute of Metal Finishing
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