Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871266
G. Guvendik, D. Gabe
The significance and importance of solution conductivity for electrodeposition solutions and their efficient use are discussed. The dearth of reliable data is revealed and a collation of available data is provided for the commoner metals and solutions.
{"title":"Solution conductivity in electrodeposition processes","authors":"G. Guvendik, D. Gabe","doi":"10.1080/00202967.1999.11871266","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871266","url":null,"abstract":"The significance and importance of solution conductivity for electrodeposition solutions and their efficient use are discussed. The dearth of reliable data is revealed and a collation of available data is provided for the commoner metals and solutions.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871266","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742773","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871277
I. D. Kudrjavtzeva
We define colloid-electrolytes as those plating baths where metal deposits are formed by reducing not only metal ions but also colloids and fine dispersions of metal compounds. Such dispersions in the field of the cathode (ie in the part of the diffusion layer where the rate of stirring usually tends to zero) may be treated in certain optimal cases as systems of mobile pores, giving rise to equilibrium and nonequilibrium electrokinetic phenomena, (electroosmosis, electrophoresis, diffusiophoresis and so on) and thus to efficient stirring. This results in reducing or eliminating the diffusion control and in an essential rise of the limiting current densities. Dispersions may arise by anode dissolution and by secondary cathodic processes (hydrogen evolution, dissociation of complexes). Adsorbed polyelectrolyte compounds may be good dispersion stabilizers, also giving rise to Marangoni instability, interphase convection and (or) turbulence and thus supplementing
{"title":"High speed electroplating in low-concentrate colloid-electrolyte baths","authors":"I. D. Kudrjavtzeva","doi":"10.1080/00202967.1999.11871277","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871277","url":null,"abstract":"We define colloid-electrolytes as those plating baths where metal deposits are formed by reducing not only metal ions but also colloids and fine dispersions of metal compounds. Such dispersions in the field of the cathode (ie in the part of the diffusion layer where the rate of stirring usually tends to zero) may be treated in certain optimal cases as systems of mobile pores, giving rise to equilibrium and nonequilibrium electrokinetic phenomena, (electroosmosis, electrophoresis, diffusiophoresis and so on) and thus to efficient stirring. This results in reducing or eliminating the diffusion control and in an essential rise of the limiting current densities. Dispersions may arise by anode dissolution and by secondary cathodic processes (hydrogen evolution, dissociation of complexes). Adsorbed polyelectrolyte compounds may be good dispersion stabilizers, also giving rise to Marangoni instability, interphase convection and (or) turbulence and thus supplementing","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871277","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871278
Ying Jin, Dong-bai Sun, Jingzhi Yu, C. Dong, Dejun Yang
Three kinds of complexing agents were selected to investigate their effects on the morphology and porosity of electroless nickel (EN) deposits on a mild steel substrate. The porosity of the EN coating was tested as a function of the variety of complexing agents with both an electrochemical technique and commonly used chemical spot tests. Meanwhile, the morphology and surface roughness of deposits were examined by atom force microscopy (AFM). It was found that the more stable is the nickel complex, the lower the roughness and the less the porosity of the coating. The reason for this is discussed, considering the complexing agent's effect on the deposition process of EN.
{"title":"Effects of complexing agent on the morphology and porosity of electroless nickel deposits","authors":"Ying Jin, Dong-bai Sun, Jingzhi Yu, C. Dong, Dejun Yang","doi":"10.1080/00202967.1999.11871278","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871278","url":null,"abstract":"Three kinds of complexing agents were selected to investigate their effects on the morphology and porosity of electroless nickel (EN) deposits on a mild steel substrate. The porosity of the EN coating was tested as a function of the variety of complexing agents with both an electrochemical technique and commonly used chemical spot tests. Meanwhile, the morphology and surface roughness of deposits were examined by atom force microscopy (AFM). It was found that the more stable is the nickel complex, the lower the roughness and the less the porosity of the coating. The reason for this is discussed, considering the complexing agent's effect on the deposition process of EN.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871278","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871290
A. Averill, J. Ingram, P. Nolan
SUMMARYExperimental results are presented which allow comparison between the cleaning performance of recently available environmentally friendly solvents and traditionally used solvents. Particular emphasis is given to considering the removal of different kinds of grease contamination from components with blind holes or crevices. The fundamental principles underlying the process of removal of organic contamination from metal surfaces with organic solvents are discussed and a simple mechanism postulated to explain the gradual decrease in the decontamination rate that occurs as the cleaning process progresses. It is considered most likely that the primary role of ultrasonification in the cleaning of metals is to promote detachment of contaminant from the surface rather than enhanced transport of dissolved material away from the surface/solvent interface.
{"title":"On the Performance and Mechanism of Ultrasonically Cleaning Metal Components with Environmentally Acceptable Organic Solvents","authors":"A. Averill, J. Ingram, P. Nolan","doi":"10.1080/00202967.1999.11871290","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871290","url":null,"abstract":"SUMMARYExperimental results are presented which allow comparison between the cleaning performance of recently available environmentally friendly solvents and traditionally used solvents. Particular emphasis is given to considering the removal of different kinds of grease contamination from components with blind holes or crevices. The fundamental principles underlying the process of removal of organic contamination from metal surfaces with organic solvents are discussed and a simple mechanism postulated to explain the gradual decrease in the decontamination rate that occurs as the cleaning process progresses. It is considered most likely that the primary role of ultrasonification in the cleaning of metals is to promote detachment of contaminant from the surface rather than enhanced transport of dissolved material away from the surface/solvent interface.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871290","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58743416","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871241
J. Vinkevičius, A. Žielienė, G. Valiulienė
The composition of non-stoichiometric copper sulphide (Cu) coatings obtained during the interaction of Cu(II) with Na 2 S n (n = 1-4) has been investigated by cyclic voltammetry in 0.05 M H 2 SO 4 solution. The overall reaction has been shown to correspond to the equation. 4 Na 2 S 0 + 2 Cu(OH) 2ad →Cu 2 S ad + (4n-3) S 0 ad + 4 NaOH + 2 Na 2 S in which S o /Cu = (4n 3 1/2). Such a stoichiometry of reaction has been explained by the formation of an intermediate the adsorbed Cut II) polysulphide (Na 2 CuS n ) or a polynuclear complex (Na 2 Cu 2 S and its decomposition in simultaneous intramolecular redox reaction between Cu(II) and S 2 . When increasing n from I to 4/2-x) increases from 1.91 to 1.99 approximately.
{"title":"The role of Cu(II) in the process of forming non-stoichiometric copper sulphide coatings by a chemical route","authors":"J. Vinkevičius, A. Žielienė, G. Valiulienė","doi":"10.1080/00202967.1999.11871241","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871241","url":null,"abstract":"The composition of non-stoichiometric copper sulphide (Cu) coatings obtained during the interaction of Cu(II) with Na 2 S n (n = 1-4) has been investigated by cyclic voltammetry in 0.05 M H 2 SO 4 solution. The overall reaction has been shown to correspond to the equation. 4 Na 2 S 0 + 2 Cu(OH) 2ad →Cu 2 S ad + (4n-3) S 0 ad + 4 NaOH + 2 Na 2 S in which S o /Cu = (4n 3 1/2). Such a stoichiometry of reaction has been explained by the formation of an intermediate the adsorbed Cut II) polysulphide (Na 2 CuS n ) or a polynuclear complex (Na 2 Cu 2 S and its decomposition in simultaneous intramolecular redox reaction between Cu(II) and S 2 . When increasing n from I to 4/2-x) increases from 1.91 to 1.99 approximately.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871241","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742001","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871243
M. Onoda, K. Shimizu, Yukio Tateishi, Tohru Watanabe
SUMMARYWe electrodeposited Ni-B ahoy films using a rotary electrode under various plating conditions and investigated the mechanism of the codeposition of B into the plated films by analyzing the relationship between the electrodeposition conditions and the composition of the plated films, as well as by analyzing electrochemical measurements. We reached the following conclusions: 1) In Ni-B alloy plating by electrodeposition, use of a rotary electrode expands the useful current density regions compared to a static bath.2) Unionized TMAB is present in the plating solution, and the deposition rate of B is related to the thickness of the diffusion layer at the cathode surface, regardless of the electrode potential. Accordingly, the amount of codedeposited B can he calculated from v0.7 and l/I, i.e., peripheral speed and current density.
{"title":"Mechanism of Boron Codeposition in Electrodeposited Ni-B Alloy Films and Calculation of the Amount of Codeposited Boron","authors":"M. Onoda, K. Shimizu, Yukio Tateishi, Tohru Watanabe","doi":"10.1080/00202967.1999.11871243","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871243","url":null,"abstract":"SUMMARYWe electrodeposited Ni-B ahoy films using a rotary electrode under various plating conditions and investigated the mechanism of the codeposition of B into the plated films by analyzing the relationship between the electrodeposition conditions and the composition of the plated films, as well as by analyzing electrochemical measurements. We reached the following conclusions: 1) In Ni-B alloy plating by electrodeposition, use of a rotary electrode expands the useful current density regions compared to a static bath.2) Unionized TMAB is present in the plating solution, and the deposition rate of B is related to the thickness of the diffusion layer at the cathode surface, regardless of the electrode potential. Accordingly, the amount of codedeposited B can he calculated from v0.7 and l/I, i.e., peripheral speed and current density.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871243","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58741694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871268
B. Bozzini
A simple model is proposed correlating operating conditions (electrochemical kinetic behaviour of the metal matrix deposition process, concentration of suspended particles, particle dimensions, hydrodynamic conditions) and cathode growth stability for electrodeposited metal matrix particulate composites with dispersions of non-conducling particies. Even though variations of all the considered variables have a bearing on growth stability, the most important single effect is polarisation (as, e.g., expressed by the local Tafel slope): the deposition of metal with high polarisation makes codeposition possible and renders viable the achievement of sufficiently smooth and thick materials; metals deposited at low overvoltage are mostly associated with unsuccessful composite plating The predictions of the model were confirmed with deposition experiments, cathode stability was judged according to SEM in-plane and cross-sectional micrographs as well as by roughness measurements.
{"title":"Cathode growth stability of electrodeposited metal matrix particulate composites","authors":"B. Bozzini","doi":"10.1080/00202967.1999.11871268","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871268","url":null,"abstract":"A simple model is proposed correlating operating conditions (electrochemical kinetic behaviour of the metal matrix deposition process, concentration of suspended particles, particle dimensions, hydrodynamic conditions) and cathode growth stability for electrodeposited metal matrix particulate composites with dispersions of non-conducling particies. Even though variations of all the considered variables have a bearing on growth stability, the most important single effect is polarisation (as, e.g., expressed by the local Tafel slope): the deposition of metal with high polarisation makes codeposition possible and renders viable the achievement of sufficiently smooth and thick materials; metals deposited at low overvoltage are mostly associated with unsuccessful composite plating The predictions of the model were confirmed with deposition experiments, cathode stability was judged according to SEM in-plane and cross-sectional micrographs as well as by roughness measurements.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871268","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742815","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871282
Kulwant Singh, D. Wasnik, A. K. Grover, M. Totlani, A. K. Suri
TiN films on mild steel were deposited by reactive d.c. magnetron sputtering; electroplated chromiunt was incorporated as an interlayer, Surface hardness, measured by the Knoop indentation method under a load of 25 gf, phase analysis by the X-ray diffraction method and corrosion behaviour by the potentiodynamic measurement technique of these coatings have been evaluated. Surface hardness values were found to increase from about 1000-1100 for TiN coatings on mild steel to about 1800-1900 (HK 25 ) for TiN coatings with chromium as interlayer, Potentiodynamic corrosion tests, performed in IN H 2 SO 4 solutions, have shown that with a chromium interlayer the corrosion resistance increases significantly as compared to TiN only sputtered coatings on mild steel samples. No spalling of TiN coatings was observed during full sweep voltage of -1000 mV to +1000 mV when they were tested with a chromium interlayer.
{"title":"TiN coatings modified by an interlayer of electroplated chromium on mild steel","authors":"Kulwant Singh, D. Wasnik, A. K. Grover, M. Totlani, A. K. Suri","doi":"10.1080/00202967.1999.11871282","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871282","url":null,"abstract":"TiN films on mild steel were deposited by reactive d.c. magnetron sputtering; electroplated chromiunt was incorporated as an interlayer, Surface hardness, measured by the Knoop indentation method under a load of 25 gf, phase analysis by the X-ray diffraction method and corrosion behaviour by the potentiodynamic measurement technique of these coatings have been evaluated. Surface hardness values were found to increase from about 1000-1100 for TiN coatings on mild steel to about 1800-1900 (HK 25 ) for TiN coatings with chromium as interlayer, Potentiodynamic corrosion tests, performed in IN H 2 SO 4 solutions, have shown that with a chromium interlayer the corrosion resistance increases significantly as compared to TiN only sputtered coatings on mild steel samples. No spalling of TiN coatings was observed during full sweep voltage of -1000 mV to +1000 mV when they were tested with a chromium interlayer.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871282","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58743044","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871292
S. S. Rehim, S. A. Wahab, S. Rashwan, Z. M. Anwar
Copper-nickel alloys have been electrodeposited on steel substrates from a bath containing copper sulphate, nickel sulphate, sodium sulphate, sodium citrate and boric acid. Galvanostatic cathodic polarization, cathodic current efficiency and composition of the alloys were studied as influenced by bath composition, current density and temperature. The bath is characterized by high cathodic current efficiency. Current density is found to strongly influence the composition of the deposits. At low current densities (lower than a certain transition current density), a copper-rich alloy is deposited with copper (the more noble metal) being the preferentially deposited metal. At larger current densities, nickel becomes the nobler metal and is deposited preferentially. The magnitude of the transition current density depends upon the bath composition and temperature. The structure and surface morphology of the as-deposited alloys were examined by XRD and SEM. The results reveal the presence of single solid solution phase with face centred cubic structure. The morphology of the deposits is mainly controlled by the alloy composition.
{"title":"Electrodeposition of Copper-Nickel Alloys from a Citrate Bath Containing Boric Acid","authors":"S. S. Rehim, S. A. Wahab, S. Rashwan, Z. M. Anwar","doi":"10.1080/00202967.1999.11871292","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871292","url":null,"abstract":"Copper-nickel alloys have been electrodeposited on steel substrates from a bath containing copper sulphate, nickel sulphate, sodium sulphate, sodium citrate and boric acid. Galvanostatic cathodic polarization, cathodic current efficiency and composition of the alloys were studied as influenced by bath composition, current density and temperature. The bath is characterized by high cathodic current efficiency. Current density is found to strongly influence the composition of the deposits. At low current densities (lower than a certain transition current density), a copper-rich alloy is deposited with copper (the more noble metal) being the preferentially deposited metal. At larger current densities, nickel becomes the nobler metal and is deposited preferentially. The magnitude of the transition current density depends upon the bath composition and temperature. The structure and surface morphology of the as-deposited alloys were examined by XRD and SEM. The results reveal the presence of single solid solution phase with face centred cubic structure. The morphology of the deposits is mainly controlled by the alloy composition.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871292","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58743280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871288
M. Ananth
Ni-Mn-Fe alloys were electrodeposited from three compositionally altered Ni-Mn electrolytes containing a small amount of FeSO 4 (NH 4 ) 2 SO 4 .6H 2 O (10gl -1 ). Texture development in the resultant co-deposits was investigated with opticical colour polarisation microscopy. Addition of Fe in the electrodeposited Ni-Mn system results in the development of additional textures. Most of the samples show three different types of textures though the texture types are characteristic of the bath composition and deposition CD.
{"title":"Texture development in electrodeposited nanocrystalline Ni-Mn-Fe alloys","authors":"M. Ananth","doi":"10.1080/00202967.1999.11871288","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871288","url":null,"abstract":"Ni-Mn-Fe alloys were electrodeposited from three compositionally altered Ni-Mn electrolytes containing a small amount of FeSO 4 (NH 4 ) 2 SO 4 .6H 2 O (10gl -1 ). Texture development in the resultant co-deposits was investigated with opticical colour polarisation microscopy. Addition of Fe in the electrodeposited Ni-Mn system results in the development of additional textures. Most of the samples show three different types of textures though the texture types are characteristic of the bath composition and deposition CD.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871288","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58743297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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