Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871284
A. Averill, J. Ingram, P. Nolan
A Monte Carlo simulation using a diffusion based exposure assessment model was employed to aid forecasting of solvent vapour concentrations in the workspace during wipe cleaning of metal component. Range values for the important variables were chosen so as to be appropriate for wipe cleaning with either highly volatile solvents such as Vertrel-MCA or HFE71DE or with less volatile solvents such as n-propylbromide (nPBr). Emphasis is put on confirming that the range values of variables and the distributions taken are applicable to the workplace environment so that the simulation values obtained are reasonable estimates of the true vapour concentrations. The results obtained using Monte Carlo forecasts are considered most useful when taken in conjunction with the relevant occupational exposure limits for the solvents in question
{"title":"A study of the dispersion of solvent vapour in the workspace during wipe cleaning of metal components with organic solvents - A Monte Carlo uncertainty analysis","authors":"A. Averill, J. Ingram, P. Nolan","doi":"10.1080/00202967.1999.11871284","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871284","url":null,"abstract":"A Monte Carlo simulation using a diffusion based exposure assessment model was employed to aid forecasting of solvent vapour concentrations in the workspace during wipe cleaning of metal component. Range values for the important variables were chosen so as to be appropriate for wipe cleaning with either highly volatile solvents such as Vertrel-MCA or HFE71DE or with less volatile solvents such as n-propylbromide (nPBr). Emphasis is put on confirming that the range values of variables and the distributions taken are applicable to the workplace environment so that the simulation values obtained are reasonable estimates of the true vapour concentrations. The results obtained using Monte Carlo forecasts are considered most useful when taken in conjunction with the relevant occupational exposure limits for the solvents in question","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871284","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871269
M. El-Sharif, J. Mcdougall, C. Chisholm
SUMMARYHexavalent chromium process provides unique engineering coatings in terms of wear and corrosion resistance. However, this process is under pressure due to its environmentally unfriendly attributes. Recently significant advances have been made on the development of an electrolyte based on chromium(III)-glycine complex. A successful enhancement of both quality of deposits and the rate of deposition has been achieved using high speed and conventional techniques. A clear correlation has been established between the percentage chromium metal deposited and the formation of chromium (III)-glycine complexes leading to the identification of the species suitable for chromium deposition.
{"title":"Electrodeposition of thick chromium coatings from an environmentally acceptable chromium (III)-glycine complex","authors":"M. El-Sharif, J. Mcdougall, C. Chisholm","doi":"10.1080/00202967.1999.11871269","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871269","url":null,"abstract":"SUMMARYHexavalent chromium process provides unique engineering coatings in terms of wear and corrosion resistance. However, this process is under pressure due to its environmentally unfriendly attributes. Recently significant advances have been made on the development of an electrolyte based on chromium(III)-glycine complex. A successful enhancement of both quality of deposits and the rate of deposition has been achieved using high speed and conventional techniques. A clear correlation has been established between the percentage chromium metal deposited and the formation of chromium (III)-glycine complexes leading to the identification of the species suitable for chromium deposition.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871269","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871274
J. Abys, E. Kudrak, C. Fan
SUMMARYPalladium and its alloys have become the standard precious metal finishes for high reliability connectors. While pure palladium is preferred for high temperature automotive applications, palladium-nickel has become the preferred finish for ambient temperature, high insertion applications such as edge card connectors. However, palladium-nickel, when plated over nickel, is not without its problems. Quality control issues related to the measurement of composition and thickness by simple, non-destructive XRF analysis remain a significant concern. Palladium-cobalt does not suffer from this shortcoming, and furthermore has been found to outperform palladium-nickel for high durability applications.In this study, the metallurgical structure of palladium-nickel and palladium-cobalt electrodeposits is characterized by X-ray diffraction and electron microscopy. In addition, the hardness, porosity, wear performance and thermal stability, among other properties, are discussed.
{"title":"The materials properties and contact reliability of palladium-cobalt","authors":"J. Abys, E. Kudrak, C. Fan","doi":"10.1080/00202967.1999.11871274","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871274","url":null,"abstract":"SUMMARYPalladium and its alloys have become the standard precious metal finishes for high reliability connectors. While pure palladium is preferred for high temperature automotive applications, palladium-nickel has become the preferred finish for ambient temperature, high insertion applications such as edge card connectors. However, palladium-nickel, when plated over nickel, is not without its problems. Quality control issues related to the measurement of composition and thickness by simple, non-destructive XRF analysis remain a significant concern. Palladium-cobalt does not suffer from this shortcoming, and furthermore has been found to outperform palladium-nickel for high durability applications.In this study, the metallurgical structure of palladium-nickel and palladium-cobalt electrodeposits is characterized by X-ray diffraction and electron microscopy. In addition, the hardness, porosity, wear performance and thermal stability, among other properties, are discussed.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871274","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742839","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871261
S. E. Hadian, D. Gabe
The scope of pulse plating has been defined in the context of the manufacturing production of platinum electrodeposits. The influence of electrolyte variables on the current efficiency has been investigated for P salt solution. Deposition performances under conventional and pulsed current have been compared and increases in current efficiency noted.
{"title":"The use of pulsed current techniques for electrodeposition of platinum","authors":"S. E. Hadian, D. Gabe","doi":"10.1080/00202967.1999.11871261","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871261","url":null,"abstract":"The scope of pulse plating has been defined in the context of the manufacturing production of platinum electrodeposits. The influence of electrolyte variables on the current efficiency has been investigated for P salt solution. Deposition performances under conventional and pulsed current have been compared and increases in current efficiency noted.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871261","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742877","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871281
Can-zhu Gao, Y. Lu, Hai-tao Wang, S. Yue
SUMMARYThe effects of saccharin and three kinds of pyridine derivatives [pyridine, 3-amino-pyridine and pyridinium-1-propane-3′-sulfonate (PPS)] on the surface morphology and crystal orientation of nickel electrodeposited from a Watts bath (1M NiSO4 + 0.2 M NiCl2 + 0.5 M H3BO3) have been studied by means of electrochemical methods, scanning electron microscopy, and measurement of X-ray diffraction patterns. Saccharin and three kinds of pyridine derivatives were adsorbed on the electrode and inhibited the reduction of nickel ion. The inhibitory effect on the reduction of nickel ion increased in the order 3-amino-pyridine, pyridine and PPS. Large-grained electrodeposits were obtained from the Watts bath in the absence of organic additives. Fine-grained, bright, compact and smooth nickel electrodeposits, which had a preferred orientation with a (111) plane parallel to the surface, were obtained from the Watts bath containing PPS, saccharin and EPB.
摘要采用电化学、扫描电镜和x射线衍射等方法研究了糖精和三种吡啶衍生物[吡啶、3-氨基吡啶和吡啶-1-丙烷-3′-磺酸盐(PPS)]对瓦浴(1M NiSO4 + 0.2 M NiCl2 + 0.5 M H3BO3)电沉积镍的表面形貌和晶体取向的影响。糖精和三种吡啶衍生物吸附在电极上，抑制了镍离子的还原。对镍离子还原的抑制效果依次为3-氨基吡啶、吡啶、PPS。在没有有机添加剂的情况下，从瓦茨浴中获得了大晶粒的镀层。在含有PPS、糖精和EPB的Watts浴液中，获得了晶粒细、光亮、致密、光滑的镍镀层，其取向与表面平行(111)面。
{"title":"Effects of saccharin and pyridine derivatives on the electrocrystallization of nickel","authors":"Can-zhu Gao, Y. Lu, Hai-tao Wang, S. Yue","doi":"10.1080/00202967.1999.11871281","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871281","url":null,"abstract":"SUMMARYThe effects of saccharin and three kinds of pyridine derivatives [pyridine, 3-amino-pyridine and pyridinium-1-propane-3′-sulfonate (PPS)] on the surface morphology and crystal orientation of nickel electrodeposited from a Watts bath (1M NiSO4 + 0.2 M NiCl2 + 0.5 M H3BO3) have been studied by means of electrochemical methods, scanning electron microscopy, and measurement of X-ray diffraction patterns. Saccharin and three kinds of pyridine derivatives were adsorbed on the electrode and inhibited the reduction of nickel ion. The inhibitory effect on the reduction of nickel ion increased in the order 3-amino-pyridine, pyridine and PPS. Large-grained electrodeposits were obtained from the Watts bath in the absence of organic additives. Fine-grained, bright, compact and smooth nickel electrodeposits, which had a preferred orientation with a (111) plane parallel to the surface, were obtained from the Watts bath containing PPS, saccharin and EPB.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871281","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58743028","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871237
A. Averill, J. Ingram, P. Nolan
SUMMARYIn replacing traditionally used solvents for external wipe cleaning applications with newer and more environmentally friendly solvent systems, account has to be taken of their volatility since this has a great bearing on the cost of the cleaning process as well as on occupational health hazards to operatives. To determine the concentrations of solvent vapour which will be produced in the workspace and to make sure that these do not exceed occupational exposure limits, it is necessary to know not only the workspace ventilation conditions but also the source evaporation rate of the solvent used. A study carried out to compare the evaporation rates of the traditional solvents under varying conditions to those of the proposed replacement substances is reported and a detailed discussion given of the usefulness of evaporation models to predict emission rates.
{"title":"Replacing TCA and CFC-113 with HFE and HFC based azeotropes and n-propyl bromide based solvents for wipe cleaning metal components: Source evaporation rates and models","authors":"A. Averill, J. Ingram, P. Nolan","doi":"10.1080/00202967.1999.11871237","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871237","url":null,"abstract":"SUMMARYIn replacing traditionally used solvents for external wipe cleaning applications with newer and more environmentally friendly solvent systems, account has to be taken of their volatility since this has a great bearing on the cost of the cleaning process as well as on occupational health hazards to operatives. To determine the concentrations of solvent vapour which will be produced in the workspace and to make sure that these do not exceed occupational exposure limits, it is necessary to know not only the workspace ventilation conditions but also the source evaporation rate of the solvent used. A study carried out to compare the evaporation rates of the traditional solvents under varying conditions to those of the proposed replacement substances is reported and a detailed discussion given of the usefulness of evaporation models to predict emission rates.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871237","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58741839","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871254
C. L. Aravinda, S. Mayanna
SUMMARYThin films of Ni-Fe alloys of various compositions have been deposited potentiostatically from an alkaline sulfate bath solution containing the sodium salt of ethylene diamine tetraacetic acid (EDTA) and triammonium citrate (TAC). The complex nature of the bath solution was analyzed by cyclic potentiometric and spectrophotometric studies. The composition of the alloy was found to vary with the plating bath composition (Ni/Fe), plating potential and the concentration of complexing agent (EDTA). XRD studies showed that alloys are solid solutions of Fe in Ni (γ-Phase) with fcc structure, free from oxides/hydroxides and pore free. The surface analysis by SEM revealed the nucleation by crystallites giving smooth deposit. The magnetic properties (Hc, Ms and squareness ratio) were evaluated from the parallel (in-plane) and perpendicular hysteresis loops. Plating conditions were optimized to plate good quality thin films of Ni-Fe alloy with 80% Ni(Permalloy) with tailor made magnetic properties which suit ...
{"title":"Potentiostatic deposition of thin films of Ni-Fe alloys","authors":"C. L. Aravinda, S. Mayanna","doi":"10.1080/00202967.1999.11871254","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871254","url":null,"abstract":"SUMMARYThin films of Ni-Fe alloys of various compositions have been deposited potentiostatically from an alkaline sulfate bath solution containing the sodium salt of ethylene diamine tetraacetic acid (EDTA) and triammonium citrate (TAC). The complex nature of the bath solution was analyzed by cyclic potentiometric and spectrophotometric studies. The composition of the alloy was found to vary with the plating bath composition (Ni/Fe), plating potential and the concentration of complexing agent (EDTA). XRD studies showed that alloys are solid solutions of Fe in Ni (γ-Phase) with fcc structure, free from oxides/hydroxides and pore free. The surface analysis by SEM revealed the nucleation by crystallites giving smooth deposit. The magnetic properties (Hc, Ms and squareness ratio) were evaluated from the parallel (in-plane) and perpendicular hysteresis loops. Plating conditions were optimized to plate good quality thin films of Ni-Fe alloy with 80% Ni(Permalloy) with tailor made magnetic properties which suit ...","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871254","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742228","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871270
J. Farr, C. M. Mustafa
{"title":"The determination of chlorine dioxide in the presence of other oxychlorine species","authors":"J. Farr, C. M. Mustafa","doi":"10.1080/00202967.1999.11871270","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871270","url":null,"abstract":"","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871270","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871260
Z. Junxi, Chen Jian, Qiao Yinan, Cao Chunan
A thick passive film showing interference colours has been obtained on 304 stainless steel in sulfuric acid solution without Cr 6+ ions by applying alternating square wave polarization. An investigation of the chemical composition and the distribution of valence states in the profile of the film has been carried out by using XPS. A mechanism for the colouring process is proposed.
{"title":"The growth mechanism of the coloured passive film formed on 304 stainless steel in sulfuric solution without Cr6+ ion by using A.V. passivation","authors":"Z. Junxi, Chen Jian, Qiao Yinan, Cao Chunan","doi":"10.1080/00202967.1999.11871260","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871260","url":null,"abstract":"A thick passive film showing interference colours has been obtained on 304 stainless steel in sulfuric acid solution without Cr 6+ ions by applying alternating square wave polarization. An investigation of the chemical composition and the distribution of valence states in the profile of the film has been carried out by using XPS. A mechanism for the colouring process is proposed.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871260","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58742854","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1999-01-01DOI: 10.1080/00202967.1999.11871291
J. Vinkevičius, I. Mozginskiene, V. Jasulaitienė
The interaction between Pd 2+ ions and Cu 2-x S coating formed by three cycles and containing ∼30 at.% of elementary S has been investigated by the methods of cyclic voltammetry and photoelectron spectroscopy (one cycle of coating formation includes treatment of the surface with Cu(I)+Cu(II) ammoniate solution, hydrolysis of the adsorbed copper compounds and sulphidation of copper oxygen compounds in Na 2 S n solution). After exposure of such a coating to Pd 2+ ions (1.7 mM PdCl 2 , pH=2), an exchange as well as a redox interaction between the coating components and Pd 2+ ions has been shown to occur Due to this the amount of copper in the coating decreases from 2 to 4 times and that ofsulphur from 1.5 to 5 times. The coating modified in such a way has been found to contain up to 75 at.% of palladium, ∼90% of it being in a metallic state. It has been determined that at the beginning S 0 is bound into a soluble compound: 2Pd 2+ + S 0 + 3H 2 O → 2Pd 0 + H 2 SO 3 + 4H + . The Cu 2 S present in the coating is considered to interact with Pd 2+ , with the formation of Pd 0 and CuPdS 2 , while CuS reacts most likely according to the reaction: CuS + 3Pd 2+ + 3H 2 O → 3Pd 0 + H 2 SO 3 + Cu 2+ + 4H + . The Cu 2-x S + S 0 coating formed on a dielectric and modified with Pd 2+ , contrary to the initial Cu 2-x S + S 0 coating, can be plated with copper from any electrolyte for copper deposition.
Pd +离子与含~ 30 at的三次循环形成的cu2 -x S涂层之间的相互作用。用循环伏安法和光电子能谱法研究了%的元素S(一个周期的涂层形成包括Cu(I)+Cu(II)氨化溶液对表面的处理，吸附的铜化合物的水解和铜氧化合物在na2sn溶液中的硫化)。在这种涂层暴露于Pd +离子(1.7 mM PdCl 2, pH=2)后，涂层成分与Pd +离子之间发生交换和氧化还原相互作用。由于这种相互作用，涂层中的铜量从2减少到4倍，硫从1.5减少到5倍。用这种方法改性的涂层已被发现含有高达75个at。%的钯，约90%的钯处于金属状态。经测定，最初s0结合成可溶性化合物:2Pd 2+ + s0 + 3h2o→2Pd 0 + h2so3 + 4H +。涂层中存在的cu2s被认为与pd2 +相互作用，形成Pd 0和cupd2，而Cu最可能的反应是:Cu + 3Pd 2+ + 3h2o→3Pd 0 + h2so3 + cu2 + + 4H +。与最初的Cu 2-x S + S 0涂层不同，在电介质上形成用Pd 2+修饰的Cu 2-x S + S 0涂层，可以用任何电解质镀铜。
{"title":"Investigation of the Interaction Between Cu2-x S +So Coatings and Pd(II) Ions by Cyclic Voltammetry and X-ray Photoelectron Spectroscopy","authors":"J. Vinkevičius, I. Mozginskiene, V. Jasulaitienė","doi":"10.1080/00202967.1999.11871291","DOIUrl":"https://doi.org/10.1080/00202967.1999.11871291","url":null,"abstract":"The interaction between Pd 2+ ions and Cu 2-x S coating formed by three cycles and containing ∼30 at.% of elementary S has been investigated by the methods of cyclic voltammetry and photoelectron spectroscopy (one cycle of coating formation includes treatment of the surface with Cu(I)+Cu(II) ammoniate solution, hydrolysis of the adsorbed copper compounds and sulphidation of copper oxygen compounds in Na 2 S n solution). After exposure of such a coating to Pd 2+ ions (1.7 mM PdCl 2 , pH=2), an exchange as well as a redox interaction between the coating components and Pd 2+ ions has been shown to occur Due to this the amount of copper in the coating decreases from 2 to 4 times and that ofsulphur from 1.5 to 5 times. The coating modified in such a way has been found to contain up to 75 at.% of palladium, ∼90% of it being in a metallic state. It has been determined that at the beginning S 0 is bound into a soluble compound: 2Pd 2+ + S 0 + 3H 2 O → 2Pd 0 + H 2 SO 3 + 4H + . The Cu 2 S present in the coating is considered to interact with Pd 2+ , with the formation of Pd 0 and CuPdS 2 , while CuS reacts most likely according to the reaction: CuS + 3Pd 2+ + 3H 2 O → 3Pd 0 + H 2 SO 3 + Cu 2+ + 4H + . The Cu 2-x S + S 0 coating formed on a dielectric and modified with Pd 2+ , contrary to the initial Cu 2-x S + S 0 coating, can be plated with copper from any electrolyte for copper deposition.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":null,"pages":null},"PeriodicalIF":1.9,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871291","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"58743530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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