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IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits, 1987. Proceedings.最新文献

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Ion-Implanted Self-Aligned-Gate Quantum-well Heterostructure FETs 离子注入自对准门量子阱异质结构场效应晶体管
R. Kiehl, S. Wright, J. Magerlein, D. Frank
Low gate leakage and proper nand p-channel FET thresholds are essential for achieving high performance complementary heterostructure FET (C-HFET) circuits El]. MESFETs and MODFETs have limited potential for C-HFET circuits due to the large leakage currents characteristic of Schottky-gate designs. While insulator-gate HFETs, such as MISFETs and SISFETs, exhibit substantially lower gate leakage at cryogenic temperatures, the leakage of these devices is still too large for room temperature C-HFET operation. Furthermore, the FET thresholds of conventional MISFET and SJSFET devices are fixed at non-optimal values.
低栅漏和适当的nand p沟道FET阈值对于实现高性能互补异质结构FET (c - het)电路至关重要[j]。由于肖特基栅极设计的大泄漏电流特性,mesfet和modfet在C-HFET电路中的潜力有限。虽然绝缘栅hfet,如misfet和sisfet,在低温下表现出较低的栅极泄漏,但这些器件的泄漏对于室温C-HFET操作仍然太大。此外,传统的MISFET和sjfet器件的FET阈值固定在非最优值。
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引用次数: 3
Equivalent Circuits For High Frequency Transistors 高频晶体管等效电路
R. Trew
topology is determined by physical arguments and two-port characterization techniques. Mathematical functions are determined by physical device modeling or curve fitting to experimental data. The functions can then be analyzed to define a topology. In this manner, for example, it can be shown that the input circuit of an FET can be represented as a series RC circuit and the output network can be represented as a parallel RC circuit. The element values and their relationship to device parameters can be determined by analytic device modeling of the physical structure and the mechanisms responsible for device operation. Once the circuit topology is known the element values can also be extracted from experimental data taken from actual devices over a specified frequency band. The equivalent circuit is generally valid only over the frequency band for which the circuit has been determined. Attempts to extrapolate the response of the circuit beyond the characterized frequency band can produce misleading results, especially for circuits that have been simplified for convenience by removing certain elements. If an equivalent circuit is to be used to predict the upper frequency potential of devices (e.g., to determine ft or fmax) the equivalent circuit must be topologically accurate and based upon device physics. Elements representing the physical processes responsible for device operation must be present. The high frequency operation of four candidate transistors for mm-wave applications is compared in this paper. Physically based equivalent circuits are determined and used to predict high frequency potential. The element values are determined by extraction from measured dc and s-parameter data. The circuits are analyzed to determine the elements that limit high frequency operation. The four transistors investigated are listed in Table I and consist of a Hughes GaAs MESFET, the MIT Lincoln Labs PBT, a TRW AlGaAs/GaAs HEMT, and an Alpha AlGaAs/InGaAs/GaAs pseudomorphic HEMT.
拓扑结构由物理参数和双端口表征技术决定。数学函数由物理设备建模或对实验数据的曲线拟合确定。然后可以分析这些函数以定义拓扑。例如,通过这种方式可以表明,场效应管的输入电路可以表示为串联RC电路,输出网络可以表示为并联RC电路。元件值及其与器件参数的关系可以通过物理结构和器件运行机制的解析器件建模来确定。一旦电路拓扑结构已知,元件值也可以从特定频带上实际设备的实验数据中提取出来。等效电路一般只在电路已确定的频带内有效。试图推断电路在特征频带之外的响应可能会产生误导性的结果,特别是对于为了方便而通过去除某些元素而简化的电路。如果等效电路用于预测器件的高频电位(例如,确定ft或fmax),则等效电路必须在拓扑结构上准确并基于器件物理。表示负责设备操作的物理过程的元素必须存在。本文比较了四种候选毫米波晶体管的高频工作特性。确定了基于物理的等效电路,并将其用于预测高频电位。元素值是通过提取测量的直流和s参数数据来确定的。对电路进行分析,确定限制高频工作的因素。所研究的四个晶体管列在表1中,由休斯GaAs MESFET、麻省理工学院林肯实验室PBT、TRW AlGaAs/GaAs HEMT和Alpha AlGaAs/InGaAs/GaAs伪晶HEMT组成。
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引用次数: 10
Enhance / Deplete GaAs SISFETs 增强/耗尽GaAs sisfet
H. Baratte, D. La Tulipe, D. Frank, P. Solomon, T. Jackson, S. Wright
As-grown (enhancement-mode) and implanted (depletion-mode) GaAs SISFETs are fabricated in selective areas of the same chip with a self-aligned refractory gate process. Both types of devices have comparable characteristics (transconductances of 350mS/mm at 300K and 380mS/mm at 77K, maximum drain current of 350mA/mm at 300K and 400mA/mm at 77K for 0.8/spl mu/m gate lengths) and low gate leakage. A drift mobility of 20,000 cm/sup 2/V/sup -1s-1/ is measured at 77K for the implanted GaAs SISFETs while 150,000 cm/sup 2/V/sup -1s-1/ is measured for the as-grown heterostructures. Small circuits, fabricated with these enhance-deplete GaAs SISFETs, are de- scribed.
生长(增强模式)和植入(耗尽模式)的GaAs sisfet采用自对准难熔栅工艺在同一芯片的选择性区域制备。这两种器件具有相似的特性(300K时的跨导率为350mS/mm, 77K时的跨导率为380mS/mm, 300K时的最大漏极电流为350mA/mm, 77K时的最大漏极电流为400mA/mm,栅极长度为0.8/spl mu/m),栅极漏极低。在77K下,植入的GaAs sisfet的漂移迁移率为20,000 cm/sup 2/V/sup -1s-1/,而生长异质结构的漂移迁移率为150,000 cm/sup 2/V/sup -1s-1/。描述了用这些增强耗尽型GaAs sisfet制造的小电路。
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引用次数: 1
Current Directions In Resonant Tunneling Research 共振隧道研究的当前方向
T. Sollner
Resonant tunneling through double-barrier heterostructures has attracted increasing interest recently, largely because of the fast charge transport1 it provides. In addition, the negative differential resistance regions that exist in the current-voltage (I-V) curve (peak-to-valley ratios of 3.5:l at room tem~erature~-~ and nearly 1O:l at 77 K have been measured) suggest that high-speed devices based on the unique character of the I-V curve should be possible. For example, the negative differential resistance region is capable of providing the gain necessary for high-frequency o~cillations.~ In our laboratory we have been attempting to increase the frequency and power of these oscillators,6 and to demonstrate several different highfrequency devices. Others have worked toward a better understanding of the equivalent circuit of the device7 and the underlying processes responsible for the frequency Many three-terminal devices using resonant tunneling in various ways have also been proposed and fabricated.11-20 In this paper we will summarize the work at Lincoln Laboratory on microwave and millimeter-wave devices, discuss the possibility of applications of resonant tunneling to digital logic, and then review some three-terminal devices that have been proposed, and in some cases tested.
通过双势垒异质结构的共振隧穿引起了越来越多的兴趣,主要是因为它提供了快速电荷传输1。此外,电流-电压(I-V)曲线中存在的负差分电阻区(室温下的峰谷比为3.5:1,77 K时的峰谷比接近10:1)表明,基于I-V曲线独特特性的高速器件应该是可能的。例如,负差分电阻区能够提供高频o~振荡所需的增益。在我们的实验室里,我们一直在尝试增加这些振荡器的频率和功率,6并演示了几种不同的高频设备。另一些人则致力于更好地理解器件的等效电路和产生频率的基本过程。许多以各种方式使用谐振隧道的三端器件也被提出和制造出来。在本文中,我们将总结林肯实验室在微波和毫米波器件方面的工作,讨论谐振隧道应用于数字逻辑的可能性,然后回顾一些已经提出的三端器件,并在某些情况下进行了测试。
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引用次数: 2
Planar Fully Ion-Implanted High Power InP MISFETs 平面全离子注入高功率InP misfet
L. Messick, R. Nguyen, D. Collins
Planar fully ion-implanted InP power MISFETS using SiO/sub 2/ as the gate insulator have been fabricated. At 9.7 GHz CW with 3.7 dB ain 800/spl mu/m gate width devices exhibited power per unit gate width as high as 2.9 W/mm, more than twice the highest value ever reported for GaAs FETs. For comparison at the same CW frequency and 4 dB gain our I mm gate width mesa-type epitaxial InP power MISFETs have demonstrated power per unit gate width as high as 4.5 W/mm, more than three times the highest GaAs value.
采用SiO/ sub2 /作为栅极绝缘体,制备了平面全离子注入InP功率misfet。在3.7 dB、800/spl mu/m栅极宽度的9.7 GHz连续波下,器件的单位栅极宽度功率高达2.9 W/mm,是迄今为止报道的GaAs fet的最高值的两倍多。在相同的连续波频率和4 dB增益下,我们的I mm栅极宽度台面型外延InP功率misfet的单位栅极宽度功率高达4.5 W/mm,是GaAs最高值的三倍多。
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引用次数: 4
High Frequency Properties Of InA1As/InGaAs High Electron Mobility Transistors At 77 K 77 K时InA1As/InGaAs高电子迁移率晶体管的高频特性
J. Kolodzey, S. Boor, P. Saunier, J. Lee, H. Tserng
We report the first high frequency measurements at 77 K of an InAlAs/InGaAs high electron mobility transistor. At 296 K, the current gain is 18 dB at 10 GHz and the current gain cutoff frequency is 80 GHz. At 77 K, the current gain increases to 22 dB at 10 GHz but the cutoff frequency drops to 36 GHz. The lower cutoff frequency at 77 K is associated with a steep current gain rolloff which is measured to be 12 dB/octave compared with 6 dBloctave at 296 K. This result can be modeled by excess device capacitance at 77 K.
我们报道了InAlAs/InGaAs高电子迁移率晶体管在77 K下的第一次高频测量。在296 K时,电流增益在10 GHz时为18 dB,电流增益截止频率为80 GHz。在77k时,电流增益增加到10ghz时的22db,但截止频率下降到36ghz。在77k时,较低的截止频率与陡峭的电流增益滚降有关,与296k时的6 dBloctave相比,其测量值为12 dB/octave。这一结果可以用77 K时的器件剩余电容来模拟。
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引用次数: 2
Quantum Transport Simulation Of A Resonant-Tunneling Diode 共振隧穿二极管的量子输运模拟
W. Frensley
The quantum-well resonant-tunneling diode (RTD) [ 1,2] is the simplest semiconductor heterostructure that displays interesting device properties due to quantum coherence effects. It is thus an ideal prototype system for which to develop techniques for the analysis of quantum devices. A form of quantum transport theory has been developed that is adapted to the study of quantum devices because i t provides a means of treating the electrical contacts to the device [3,41. Recent interest in the RTD can be attributed to the work of Sollner et al. [2], who demonstrated nonlinear electrical response in these devices at frequencies up to 2.5 THz. The existence of these results provides a motivation for the development of theoretical techniques to evaluate the small-signal ac response of a tunneling device. The present work demonstrates that such calculations may be readily performed by applying the techniques developed in [31 and [41.
量子阱谐振隧道二极管(RTD)[1,2]是最简单的半导体异质结构,由于量子相干效应而表现出有趣的器件特性。因此,它是开发量子器件分析技术的理想原型系统。量子输运理论的一种形式已经发展出来,它适合于量子器件的研究,因为它提供了一种处理器件电接触的方法[3,41]。最近对RTD的兴趣可以归因于Sollner等人的工作,他们证明了这些器件在高达2.5太赫兹的频率下的非线性电响应。这些结果的存在为理论技术的发展提供了动力,以评估隧道装置的小信号交流响应。目前的工作表明,通过应用[31]和[41]中开发的技术,可以很容易地进行这种计算。
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引用次数: 0
A Self-Aligned AlGaAs/GaAs Heterostructure Bipolar Transistor With Non Alloyed Graded-Gap Ohmic Contacts To The Base And Emitter 自对准AlGaAs/GaAs异质结构双极晶体管与基极和发射极非合金化梯度间隙欧姆接触
M. Rao, S. Long, H. Kroemer
A nonalloyed graded-gap scheme for obtaining ohmic contacts to ntype GaAs, by first growing a graded transition from GaAs to lnAs and then making a nonalloyed metallic contact to the InAs, was proposed by Woodall et al. [l]. The underlying idea was as follows. A metal-to-lnAs interface acts as an ideal negative-barrier ohmic contact because the Fermi level is pinned inside the lnAs conduction band, as shown in Fig. 1. However, if the GaAs-to-lnAs transition were not graded, it would act as a quasi-Schottky barrier, and the contact would be poor overall. Sufficient grading flattens out the heterojunction barrier and leads to an excellent ohmic contact with properties that make it an attractive alternative to the widely used Au/Ge/Ni/Au alloyed system. For p-type GaAs, the Ga(As,Sb) system could be similarly used, as proposed by Chang and Freeouf [2].
Woodall等人提出了一种非合金梯度隙方案,通过首先生长从GaAs到lnAs的梯度过渡,然后与InAs形成非合金金属接触,从而获得非型GaAs的欧姆接触。[1]其基本思想如下。金属-lnAs界面作为理想的负势垒欧姆接触,因为费米能级被固定在lnAs导带内,如图1所示。然而,如果gaas到lnas的跃迁没有分级,它将充当准肖特基势垒,并且总体上接触将很差。充分的级配使异质结势垒变得平坦,并具有优异的欧姆接触性能,使其成为广泛使用的Au/Ge/Ni/Au合金体系的有吸引力的替代品。对于p型砷化镓,同样可以采用Chang和Freeouf[2]提出的Ga(As,Sb)体系。
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引用次数: 0
Temperature Effects On AlGaAs/GaAs Double Barrier Diodes With High Peak-to-Valley Current Ratios 温度对高峰谷电流比AlGaAs/GaAs双势垒二极管的影响
C. Huang, K. lkossi-Anastasiou, M. Paulus, C. Bozada, C. E. Stutz, R.L. Jones, K. Evans
Recent advances in Molecular Beam Epitaxy (MBE) technology have made possible the fabrication of heterojunction double barrier diodes (DBDs) with high peak to valley current (PVC) ratios. Goodhue et a/[ l ] repotted PVC ratios of 3.5 (10.0) at 300K (77K) in an AIAs/GaAs system. More recently, we [2] have reported PVC ratios of 3.9 (14.3) at 300K (77K) in an AIGaAdGaAs (x-0.42) system and of 3.6 (21.7) at 300K (77K) in a DBD in which the barriers were replaced with short period AIAdGaAs superlattices. These results, along with the high speed characteristics of tunneling devices, indicate the DBD may soon find practical application. Additional studies are still needed to characterize the DBD conduction mechanisms and to optimize device design.
分子束外延(MBE)技术的最新进展使得制造具有高峰谷电流(PVC)比的异质结双势垒二极管(dbd)成为可能。Goodhue et a/[l]报道了在300K (77K)下,在AIAs/GaAs体系中PVC比为3.5(10.0)。最近,我们[2]报道了300K (77K)下AIGaAdGaAs (x-0.42)体系的PVC比率为3.9 (14.3),300K (77K)下DBD的PVC比率为3.6(21.7),其中屏障被短周期AIAdGaAs超晶格取代。这些结果以及隧道装置的高速特性表明,DBD可能很快就会得到实际应用。还需要进一步的研究来表征DBD传导机制并优化器件设计。
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引用次数: 0
Monolithic Millimeter Wave Impatt Transmitter 单片毫米波发射器
B. Bayraktaroglu, N. Camilleri, S. A. Lambert
GaAs IMPATT diodes are commonly used as the power source in millimeter wave transmitters. The power performances of IMPATT diodes are unmatched by any other solid1 state device at high frequencies, therefore IMPATT diodes in general and GaAs IMPATTs in particular fulfill the needs of such systems for high power and high efficiency. Conventionally, IMPATTs are used as discrete devices in hybrid circuits to maximize their output. More recently, monolithic circuits containing IMPATT diodes have also become available[l,2] The capability of integrating IMPATTs with passive circuit elements on a single-chip creates the possibilities of realizing more complex yet compact monolithic subsytems at frequencies extending into the mm-wave region. One example of such an integration is the fabrication of oscillators and radiating elements of a phased array system in a monolithic form. In such a system, each radiating element is fed by its own power source eliminating the need for a complex and lossy power distribution network.
GaAs IMPATT二极管是毫米波发射机中常用的电源。在高频率下,IMPATT二极管的功率性能是任何其他固态器件无法比拟的,因此,一般的IMPATT二极管,特别是GaAs IMPATT,满足了这类系统对高功率和高效率的需求。通常,impart用作混合电路中的分立器件,以最大化其输出。最近,包含IMPATT二极管的单片电路也已成为可能[1,2]。将IMPATT与无源电路元件集成在单芯片上的能力创造了在扩展到毫米波区域的频率上实现更复杂但更紧凑的单片子系统的可能性。这种集成的一个例子是以单片形式制造相控阵系统的振荡器和辐射元件。在这样的系统中,每个辐射元件都由自己的电源供电,从而消除了复杂和有损耗的配电网络的需要。
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引用次数: 2
期刊
IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits, 1987. Proceedings.
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