Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103077
M. Yazdan Mehr, A. Bahrami, H. Fischer, S. Gielen, R. Corbeij, W. V. van Driel, G. Zhang
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks. Scanning acoustic microscopy (SAM) is indeed one the best non-destructive tools for failure analysis purposes. It is also a useful technique for imaging the morphology, location and size distribution of defects in different microelectronics components. SAM can detect delaminations at sub-micron thicknesses. It is also one of the only available techniques capable of efficiently evaluating popcorning in PBGA's and is a also useful device to detect sub-micron air gaps. SAM can also be used to measure the thickness of an internal layer of material. Overall, SAM is an efficient tool for evaluating such a wide range of different defects in printed circuit boards, underfills, BGAs, wire bonds, discrete components, and wafers. In SAM a focused sound is directed from a transducer at a small point on a target object, as is schematically shown here. Sound, hitting a defect, inhomogeneity or a boundary inside material, is partly scatted and will be detected. The transducer transforms the reflected sound pulses into electromagnetic pulses which are displayed as pixels with defined gray values thereby creating an image. This article aims at giving an overview of scanning acoustic microscope (SAM) and explaining its operating principles and its limitations. A few examples are also given for further clarification.
{"title":"An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components","authors":"M. Yazdan Mehr, A. Bahrami, H. Fischer, S. Gielen, R. Corbeij, W. V. van Driel, G. Zhang","doi":"10.1109/EUROSIME.2015.7103077","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103077","url":null,"abstract":"In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks. Scanning acoustic microscopy (SAM) is indeed one the best non-destructive tools for failure analysis purposes. It is also a useful technique for imaging the morphology, location and size distribution of defects in different microelectronics components. SAM can detect delaminations at sub-micron thicknesses. It is also one of the only available techniques capable of efficiently evaluating popcorning in PBGA's and is a also useful device to detect sub-micron air gaps. SAM can also be used to measure the thickness of an internal layer of material. Overall, SAM is an efficient tool for evaluating such a wide range of different defects in printed circuit boards, underfills, BGAs, wire bonds, discrete components, and wafers. In SAM a focused sound is directed from a transducer at a small point on a target object, as is schematically shown here. Sound, hitting a defect, inhomogeneity or a boundary inside material, is partly scatted and will be detected. The transducer transforms the reflected sound pulses into electromagnetic pulses which are displayed as pixels with defined gray values thereby creating an image. This article aims at giving an overview of scanning acoustic microscope (SAM) and explaining its operating principles and its limitations. A few examples are also given for further clarification.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128054313","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103167
P. Lall, Junchao Wei, P. Sakalaukus
A new method has been developed for assessment of the onset of degradation in solid state luminaires to classify failure mechanisms by using metrics beyond lumen degradation that are currently used for identification of failure. Luminous Flux output, Correlated Color Temperature Data on Philips LED Lamps has been gathered under 85°C/85%RH till lamp failure. The acquired data has been used in conjunction with Bayesian Probabilistic Models to identify luminaires with onset of degradation much prior to failure through identification of decision boundaries between lamps with accrued damage and lamps beyond the failure threshold in the feature space. In addition luminaires with different failure modes have been classified separately from healthy pristine luminaires. It is expected that, the new test technique will allow the development of failure distributions without testing till L70 life for the manifestation of failure.
{"title":"Bayesian models for life prediction and fault-mode classification in solid state lamps","authors":"P. Lall, Junchao Wei, P. Sakalaukus","doi":"10.1109/EUROSIME.2015.7103167","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103167","url":null,"abstract":"A new method has been developed for assessment of the onset of degradation in solid state luminaires to classify failure mechanisms by using metrics beyond lumen degradation that are currently used for identification of failure. Luminous Flux output, Correlated Color Temperature Data on Philips LED Lamps has been gathered under 85°C/85%RH till lamp failure. The acquired data has been used in conjunction with Bayesian Probabilistic Models to identify luminaires with onset of degradation much prior to failure through identification of decision boundaries between lamps with accrued damage and lamps beyond the failure threshold in the feature space. In addition luminaires with different failure modes have been classified separately from healthy pristine luminaires. It is expected that, the new test technique will allow the development of failure distributions without testing till L70 life for the manifestation of failure.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"544 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133487633","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103095
J. Zarbakhsh, A. Iravani, Zeinab Amin-Akhlaghi
For the first time, nested sub-modeling approach and Finite Element Analysis have been used to analyze the structural mechanical of 3D Printed part, whereas the details of 3D printing patterns included in sub-model. The results present a general tool which can improve the quality of 3D printed parts, which have multidisciplinary application in various fields. It is found that the Maximum Principle stress is highly concentrated at 3D printed layers. For a specific 3D printing pattern, the stress intensity factor has been calculated to have the value of 4. Results have been discussed from theoretical, simulation and experimental observation point of view.
{"title":"Sub-modeling Finite Element Analysis of 3D printed structures","authors":"J. Zarbakhsh, A. Iravani, Zeinab Amin-Akhlaghi","doi":"10.1109/EUROSIME.2015.7103095","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103095","url":null,"abstract":"For the first time, nested sub-modeling approach and Finite Element Analysis have been used to analyze the structural mechanical of 3D Printed part, whereas the details of 3D printing patterns included in sub-model. The results present a general tool which can improve the quality of 3D printed parts, which have multidisciplinary application in various fields. It is found that the Maximum Principle stress is highly concentrated at 3D printed layers. For a specific 3D printing pattern, the stress intensity factor has been calculated to have the value of 4. Results have been discussed from theoretical, simulation and experimental observation point of view.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132584073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103151
J. Heilmann, J. Arnold, B. Wunderle
The generation of meaningful lifetime-models is a serious and time-consuming challenge throughout the field of packaging. Wherever different materials are joined, the CTE mismatch will usually lead to thermo-mechanical fatigue due to the temperature cycles during the usage of the system. As a result, the fatigue of interconnections is the limiting factor for reliability of electronic systems. Usually lifetime investigations are executed as active or passive thermal cycles using the final systems with fixed amplitudes. The main objective is rather the validation that the system will exceed a minimum threshold than the developing of a full lifetime-model. Detailed investigations are often bypassed due to time and financial limitations not realizing the future benefits of a lifetime-model, i.e. by gaining understanding of failure mechanisms and the possibility to predict them by modelling. Especially for interfaces based on new developed and mostly insufficiently examined materials like sintered (porous) or composite with their predicted time-depending or highly anisotropic behavior, more detailed experiments are necessary to understand the physics of failure. Such results are required for the technology developing and optimization of fatigue behavior. Therefor more experiments with samples of different technology-parameters as well as different amplitudes or load-regimes are necessary to examine the stability of failure mechanisms and the damage accumulation. New concepts to conduct such lifetime investigations faster are urgently needed. The idea presented in this paper is to show a suitable method to substitute lengthy thermal cycling tests by results obtained by rapid isothermal fatigue tests at different temperatures and how to establish a correlation between both of them. For now, samples based on galvanically deposited copper are used as common reference-material. Based on physics of failure principles, the applicability and viability of such a concept then is evaluated and discussed. In conclusion, this work shows a approach for a significant acceleration of the design for reliability procedure in system integration. It is based on the now possible rapid generation of a lifetime model by thin metal layer samples which are easily manufacturable with the same technology as the thermal cycling test (TCT) samples and should show the same failure mechanism. Detailed investigations are still needed to confirm an applicability of the method also to other metal layers used in the electronic packaging industry.
{"title":"Acceleration of lifetime modeling by isothermal bending fatigue tests","authors":"J. Heilmann, J. Arnold, B. Wunderle","doi":"10.1109/EUROSIME.2015.7103151","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103151","url":null,"abstract":"The generation of meaningful lifetime-models is a serious and time-consuming challenge throughout the field of packaging. Wherever different materials are joined, the CTE mismatch will usually lead to thermo-mechanical fatigue due to the temperature cycles during the usage of the system. As a result, the fatigue of interconnections is the limiting factor for reliability of electronic systems. Usually lifetime investigations are executed as active or passive thermal cycles using the final systems with fixed amplitudes. The main objective is rather the validation that the system will exceed a minimum threshold than the developing of a full lifetime-model. Detailed investigations are often bypassed due to time and financial limitations not realizing the future benefits of a lifetime-model, i.e. by gaining understanding of failure mechanisms and the possibility to predict them by modelling. Especially for interfaces based on new developed and mostly insufficiently examined materials like sintered (porous) or composite with their predicted time-depending or highly anisotropic behavior, more detailed experiments are necessary to understand the physics of failure. Such results are required for the technology developing and optimization of fatigue behavior. Therefor more experiments with samples of different technology-parameters as well as different amplitudes or load-regimes are necessary to examine the stability of failure mechanisms and the damage accumulation. New concepts to conduct such lifetime investigations faster are urgently needed. The idea presented in this paper is to show a suitable method to substitute lengthy thermal cycling tests by results obtained by rapid isothermal fatigue tests at different temperatures and how to establish a correlation between both of them. For now, samples based on galvanically deposited copper are used as common reference-material. Based on physics of failure principles, the applicability and viability of such a concept then is evaluated and discussed. In conclusion, this work shows a approach for a significant acceleration of the design for reliability procedure in system integration. It is based on the now possible rapid generation of a lifetime model by thin metal layer samples which are easily manufacturable with the same technology as the thermal cycling test (TCT) samples and should show the same failure mechanism. Detailed investigations are still needed to confirm an applicability of the method also to other metal layers used in the electronic packaging industry.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116393711","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103075
I. Schmadlak, B. Yeung, Derek Morgan, P. Gallés
The method of laser marking die for the purpose tracking and identification is well established in the semiconductor industry. This process needs to be well controlled in order to avoid sacrificing the fracture strength of the die. A common way to assess and compare different laser marking processes is to conduct a series of fracture tests and calculate the characteristic strength that can be expected for a certain laser marking process window. This paper presents and discusses a new methodology that allows obtaining stress concentration results by measuring, simulating and testing laser marked die in great detail. It can be used to compare and rate different laser marking processes. The approach therefore has good potentials of saving money and time by reducing the amount of fracture test studies in the future.
{"title":"Fracture risk assessment of laser marked die by means of simulation and test","authors":"I. Schmadlak, B. Yeung, Derek Morgan, P. Gallés","doi":"10.1109/EUROSIME.2015.7103075","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103075","url":null,"abstract":"The method of laser marking die for the purpose tracking and identification is well established in the semiconductor industry. This process needs to be well controlled in order to avoid sacrificing the fracture strength of the die. A common way to assess and compare different laser marking processes is to conduct a series of fracture tests and calculate the characteristic strength that can be expected for a certain laser marking process window. This paper presents and discusses a new methodology that allows obtaining stress concentration results by measuring, simulating and testing laser marked die in great detail. It can be used to compare and rate different laser marking processes. The approach therefore has good potentials of saving money and time by reducing the amount of fracture test studies in the future.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116211698","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103161
V. Kolchuzhin, J. Mehner, E. Sheremet, B. Kunal, R. D. Rodriguez, D. Zahn
This article deals with the models development and FE simulations for mechanical properties of all-metal AFM-TERS tips and electric field enhancement between the tip and the sample. The most important aspects in simulations, the parameters necessary in creating models, and the obtained results are presented and discussed in the article.
{"title":"Understanding tip-enhanced Raman spectroscopy by multiphysics finite element simulations","authors":"V. Kolchuzhin, J. Mehner, E. Sheremet, B. Kunal, R. D. Rodriguez, D. Zahn","doi":"10.1109/EUROSIME.2015.7103161","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103161","url":null,"abstract":"This article deals with the models development and FE simulations for mechanical properties of all-metal AFM-TERS tips and electric field enhancement between the tip and the sample. The most important aspects in simulations, the parameters necessary in creating models, and the obtained results are presented and discussed in the article.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122684063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103153
C. Tonry, M. Patel, M. Desmuliez, W. Yu, C. Bailey
Electric Field Assisted Capillarity is a novel process which has the potential for the fabrication of hollow polymer microstructures as a single step process. The process has been shown to work experimentally on a microscale using PDMS. The process makes use of both the electrohydrodynamics of polymers at a microscale and also the capillary force on the polymer caused by a low contact angle on a heavily wetted surface. Discussed in this paper are the results of a two-dimensional numerical simulation of the process. The results presented here are for the an angular mask producing microchannels and demonstrate how differing contact angles on the top mask effect the thickness of the top of the microstructures and also whether the fabrication of the microstructure is possible at all.
{"title":"Computational electrohydrodynamics in the fabrication of hollow polymer microstructures","authors":"C. Tonry, M. Patel, M. Desmuliez, W. Yu, C. Bailey","doi":"10.1109/EUROSIME.2015.7103153","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103153","url":null,"abstract":"Electric Field Assisted Capillarity is a novel process which has the potential for the fabrication of hollow polymer microstructures as a single step process. The process has been shown to work experimentally on a microscale using PDMS. The process makes use of both the electrohydrodynamics of polymers at a microscale and also the capillary force on the polymer caused by a low contact angle on a heavily wetted surface. Discussed in this paper are the results of a two-dimensional numerical simulation of the process. The results presented here are for the an angular mask producing microchannels and demonstrate how differing contact angles on the top mask effect the thickness of the top of the microstructures and also whether the fabrication of the microstructure is possible at all.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124998978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103092
M. Kudryavtsev, S. Gorgi Zadeh, J. Korvink, T. Bechtold
This work presents the application of mathematical methods of parametric model order reduction (pMOR) for automatic generation of the highly accurate, parametric compact models of radio-frequency micro-devices. More specifically, the miniaturized Faraday-induction-based magnetic resonance sensor is considered. Unlike conventional approaches, when magnetic resonance sensor is represented by a lumped-element-based compact model, mathematical pMOR methods are formal, robust and can be performed in an automated way. The introduced parametrization allows producing compact models that are valid over the range of desired parameter's values without the need to repeat the reduction.
{"title":"A compact parametric model of magnetic resonance micro sensor","authors":"M. Kudryavtsev, S. Gorgi Zadeh, J. Korvink, T. Bechtold","doi":"10.1109/EUROSIME.2015.7103092","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103092","url":null,"abstract":"This work presents the application of mathematical methods of parametric model order reduction (pMOR) for automatic generation of the highly accurate, parametric compact models of radio-frequency micro-devices. More specifically, the miniaturized Faraday-induction-based magnetic resonance sensor is considered. Unlike conventional approaches, when magnetic resonance sensor is represented by a lumped-element-based compact model, mathematical pMOR methods are formal, robust and can be performed in an automated way. The introduced parametrization allows producing compact models that are valid over the range of desired parameter's values without the need to repeat the reduction.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122051464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103098
W. Wiejak, A. Wymyslowski
Simulation of thermal energy transport in complicated structures is usually a challenge. An example of such problem is heat generation and transfer through microwave delay structure in the travelling wave tube (TWT) device. A high level of microwave power and considerable energy of electrons intercepted by the delay line leads to the increase of local temperature of the microwave structure. Determination of the heat transfer from the hot spots is essential for the proper design of the delay line and assisting cooling system. This problem has been investigated by means of a combined: analytical, numerical and experimental approach. Such methodology does not require expensive equipment and is much faster than the pure experimental analysis. Presented analytical model is focused on evaluation of the electron beam power dissipation and microwave losses along the delay line, which is not uniform and most of the power is dissipated at terminal part of the delay line. The analytically evaluated power dissipation was used in numerical simulation in order to assess the temperature distribution. Finally the results were validated experimentally using a designed measuring setup. One of the final conclusions was that the temperature distribution has a nonuniform character and the resulting high temperatures at the delay line output can significantly influence the device reliability parameters.
{"title":"Analytical, numerical and experimental approach to thermal analysis and design of a travelling wave tube","authors":"W. Wiejak, A. Wymyslowski","doi":"10.1109/EUROSIME.2015.7103098","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103098","url":null,"abstract":"Simulation of thermal energy transport in complicated structures is usually a challenge. An example of such problem is heat generation and transfer through microwave delay structure in the travelling wave tube (TWT) device. A high level of microwave power and considerable energy of electrons intercepted by the delay line leads to the increase of local temperature of the microwave structure. Determination of the heat transfer from the hot spots is essential for the proper design of the delay line and assisting cooling system. This problem has been investigated by means of a combined: analytical, numerical and experimental approach. Such methodology does not require expensive equipment and is much faster than the pure experimental analysis. Presented analytical model is focused on evaluation of the electron beam power dissipation and microwave losses along the delay line, which is not uniform and most of the power is dissipated at terminal part of the delay line. The analytically evaluated power dissipation was used in numerical simulation in order to assess the temperature distribution. Finally the results were validated experimentally using a designed measuring setup. One of the final conclusions was that the temperature distribution has a nonuniform character and the resulting high temperatures at the delay line output can significantly influence the device reliability parameters.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127650841","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103162
G. Duchamp, T. Dubois, A. Ayed, C. Marot, H. Frémont
This paper deals with a methodology based on both measurement and simulation approach to study the drift of system electromagnetic characteristics when modifications are made on an electronic board. The objective is to manage the obsolescence of components in electronic assemblies. The main applications involve aeronautical and automotive domains.
{"title":"Measurement and simulation of electromagnetic drift for obsolescence management in electronics","authors":"G. Duchamp, T. Dubois, A. Ayed, C. Marot, H. Frémont","doi":"10.1109/EUROSIME.2015.7103162","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103162","url":null,"abstract":"This paper deals with a methodology based on both measurement and simulation approach to study the drift of system electromagnetic characteristics when modifications are made on an electronic board. The objective is to manage the obsolescence of components in electronic assemblies. The main applications involve aeronautical and automotive domains.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128076274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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