Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103142
S. Wiese, F. Kraemer
This paper discusses the requirements for achieving adequate modelling of the mechanical behaviour of copper interconnect structures in electronic assemblies. In this context it focuses on an experimental approach to characterise the mechanical behaviour of representative copper specimens. For this purpose the general constitutive behaviour of pure copper will be discussed, in doing so covering the specifics of elastic response, the onset of plastic flow with respect to microstructure, as well as load history, and the resulting cyclic elastic-plastic behaviour. The discussion regarding an appropriate experimental methodology starts with considerations about specific deformations of representative thin stripe specimens during a standard tensile test. In the second part this discussion is developed into design ideas for appropriate experimental instrumentation, which enables one to determine the required properties of the representative specimens.
{"title":"Adequate mechanical copper modelling for 2nd level interconnect structures","authors":"S. Wiese, F. Kraemer","doi":"10.1109/EUROSIME.2015.7103142","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103142","url":null,"abstract":"This paper discusses the requirements for achieving adequate modelling of the mechanical behaviour of copper interconnect structures in electronic assemblies. In this context it focuses on an experimental approach to characterise the mechanical behaviour of representative copper specimens. For this purpose the general constitutive behaviour of pure copper will be discussed, in doing so covering the specifics of elastic response, the onset of plastic flow with respect to microstructure, as well as load history, and the resulting cyclic elastic-plastic behaviour. The discussion regarding an appropriate experimental methodology starts with considerations about specific deformations of representative thin stripe specimens during a standard tensile test. In the second part this discussion is developed into design ideas for appropriate experimental instrumentation, which enables one to determine the required properties of the representative specimens.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123728564","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103152
J. Albrecht, R. Dudek, J. Auersperg, R. Pantou, S. Rzepka
The determination of the mechanical and thermo-mechanical behaviour of a UHF-RFID-based smart system embedded in a transmission belt has been the goal of the work reported in this paper. The complex bending and thermal loads occurring during fabrication and service are taken into account by finite element simulations using ABAQUS standard™. In order to achieve quantitatively correct results, dynamic mechanical analyses using DMA Q800, DMA 2000+ as well as thermo-mechanical analyses using TMA Q400 have been performed to characterize the behaviour of the different materials. The results of the finite element analyses match the experimental observations very well. Therefore, recommendations for design optimization could be deduced that prevent early and fatigue failures of the smart system inside the transmission belt.
{"title":"Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications","authors":"J. Albrecht, R. Dudek, J. Auersperg, R. Pantou, S. Rzepka","doi":"10.1109/EUROSIME.2015.7103152","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103152","url":null,"abstract":"The determination of the mechanical and thermo-mechanical behaviour of a UHF-RFID-based smart system embedded in a transmission belt has been the goal of the work reported in this paper. The complex bending and thermal loads occurring during fabrication and service are taken into account by finite element simulations using ABAQUS standard™. In order to achieve quantitatively correct results, dynamic mechanical analyses using DMA Q800, DMA 2000+ as well as thermo-mechanical analyses using TMA Q400 have been performed to characterize the behaviour of the different materials. The results of the finite element analyses match the experimental observations very well. Therefore, recommendations for design optimization could be deduced that prevent early and fatigue failures of the smart system inside the transmission belt.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129708927","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103170
B. Vandevelde, F. Zanon, A. Griffoni, Xiaolong Li, G. Willems, M. Meneghini
The impact of solder-joint tilting on the reliability of high-power LEDs soldered on PCBs is investigated by means of FEM simulations correlated with thermal cycling experiments. A non-uniform solder joint stand-off height is implemented into the FEM and, using crack propagation modelling approach, the number of cycles to complete fracture are predicted.
{"title":"Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis","authors":"B. Vandevelde, F. Zanon, A. Griffoni, Xiaolong Li, G. Willems, M. Meneghini","doi":"10.1109/EUROSIME.2015.7103170","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103170","url":null,"abstract":"The impact of solder-joint tilting on the reliability of high-power LEDs soldered on PCBs is investigated by means of FEM simulations correlated with thermal cycling experiments. A non-uniform solder joint stand-off height is implemented into the FEM and, using crack propagation modelling approach, the number of cycles to complete fracture are predicted.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"31 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131103717","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103105
W. Yuan, P. Altieri-Weimar
In this study a new simulative and analytic method is developed to determine the failure of LED package solder joints at temperature cycling (TC). The solder joint reliability is calculated using a crack growth model, which is based on a combination of cohesive zone modeling and solder creep simulation in FE-model. The crack growth model is calibrated using shear test data after TC loading. The reliability model is validated by means of TC experimental results for three different TC conditions.
{"title":"Modeling of LED solder joint cracking during temperature cycling with Finite Element","authors":"W. Yuan, P. Altieri-Weimar","doi":"10.1109/EUROSIME.2015.7103105","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103105","url":null,"abstract":"In this study a new simulative and analytic method is developed to determine the failure of LED package solder joints at temperature cycling (TC). The solder joint reliability is calculated using a crack growth model, which is based on a combination of cohesive zone modeling and solder creep simulation in FE-model. The crack growth model is calibrated using shear test data after TC loading. The reliability model is validated by means of TC experimental results for three different TC conditions.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128222439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103163
V. Rochus, B. Wang, A. R. Chaudhuri, P. Hélin, S. Severi, X. Rottenberg
This paper presents a fast design strategy for Poly-SiGe MEMS pressure sensors, based on circular Kirchhoff-Love plate theory. The underlying analytical model allows for a rapid and accurate evaluation of the sensitivity of the sensors, crucial for improving their design. The accuracy of the new model is demonstrated by comparing its predictions with more computationally expensive simulation techniques (high-order parametric element and three-dimensional finite element models) and with experimental measurements performed on a 300μm membrane fabricated using the Poly-SiGe platform developed at imec.
{"title":"Fast analytical design of Poly-SiGe MEMS pressure sensors","authors":"V. Rochus, B. Wang, A. R. Chaudhuri, P. Hélin, S. Severi, X. Rottenberg","doi":"10.1109/EUROSIME.2015.7103163","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103163","url":null,"abstract":"This paper presents a fast design strategy for Poly-SiGe MEMS pressure sensors, based on circular Kirchhoff-Love plate theory. The underlying analytical model allows for a rapid and accurate evaluation of the sensitivity of the sensors, crucial for improving their design. The accuracy of the new model is demonstrated by comparing its predictions with more computationally expensive simulation techniques (high-order parametric element and three-dimensional finite element models) and with experimental measurements performed on a 300μm membrane fabricated using the Poly-SiGe platform developed at imec.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130076190","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103144
R. Hamou, Per Dalsjø, C. Dørum, S. Helland, H. Kristiansen, M. Taklo, J. Gakkestad
The aim of this study is to investigate the applicability of using an epoxy based isotropic conductive adhesive (ICA), to mount a silicon 3D system-on chip (SoC) in a ceramic 16 pad leadless chip carrier (LCC). We present and discuss thermo-mechanical FEA simulation results obtained by implementing the viscoelastic properties of the adhesive. A generalized Maxwell model using Prony series was considered in this study. We analyse the generated strain and stress in the ICA interconnect as a function of the adhesive geometry for two high and low operating temperatures. The goal is to define an optimal volume and geometry of the cured adhesive with respect to minimized stress at the interfaces between the pads and the adhesive. The target is to reduce the risk of crack initiation and propagation caused by thermal stress by careful design.
{"title":"Numerical investigation of ceramic package/ interposer interconnects using isotropic conductive adhesive","authors":"R. Hamou, Per Dalsjø, C. Dørum, S. Helland, H. Kristiansen, M. Taklo, J. Gakkestad","doi":"10.1109/EUROSIME.2015.7103144","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103144","url":null,"abstract":"The aim of this study is to investigate the applicability of using an epoxy based isotropic conductive adhesive (ICA), to mount a silicon 3D system-on chip (SoC) in a ceramic 16 pad leadless chip carrier (LCC). We present and discuss thermo-mechanical FEA simulation results obtained by implementing the viscoelastic properties of the adhesive. A generalized Maxwell model using Prony series was considered in this study. We analyse the generated strain and stress in the ICA interconnect as a function of the adhesive geometry for two high and low operating temperatures. The goal is to define an optimal volume and geometry of the cured adhesive with respect to minimized stress at the interfaces between the pads and the adhesive. The target is to reduce the risk of crack initiation and propagation caused by thermal stress by careful design.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123088948","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103089
F. Casset, J. Danel, C. Chappaz, F. Bernard, S. Basrour, B. Desloges, S. Fanget
Numerous applications require tactile interfaces today. In particular, many customers' applications such as Smartphone, tablet PC or touch pad can be concerned by high performances, low voltage haptic interfaces which allow the user to interact with its environment by the sense of touch. This technology is already used but with limitations such as high power consumption and limited feedback effect (simple vibration). We chose to work on the squeeze-film effect. It consists in changing the friction between the finger and a plate resonator. It provides high granularity level of haptic sensation. This paper deals with the design of high performances actuators in order to promote the squeeze-film effect on a 4-inch plate (diagonal of the plate). Using predictive models, we select the best design, able to generate the highest substrate displacement amplitude as possible. We built demonstrators using a generic technology based on thin-film AlN actuators. Electromechanical characterization is ongoing before the integration of the thin-film actuator plate in a haptic demonstrator in a close future.
{"title":"Design of thin-film AlN actuators for 4-inch transparent plates for haptic applications","authors":"F. Casset, J. Danel, C. Chappaz, F. Bernard, S. Basrour, B. Desloges, S. Fanget","doi":"10.1109/EUROSIME.2015.7103089","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103089","url":null,"abstract":"Numerous applications require tactile interfaces today. In particular, many customers' applications such as Smartphone, tablet PC or touch pad can be concerned by high performances, low voltage haptic interfaces which allow the user to interact with its environment by the sense of touch. This technology is already used but with limitations such as high power consumption and limited feedback effect (simple vibration). We chose to work on the squeeze-film effect. It consists in changing the friction between the finger and a plate resonator. It provides high granularity level of haptic sensation. This paper deals with the design of high performances actuators in order to promote the squeeze-film effect on a 4-inch plate (diagonal of the plate). Using predictive models, we select the best design, able to generate the highest substrate displacement amplitude as possible. We built demonstrators using a generic technology based on thin-film AlN actuators. Electromechanical characterization is ongoing before the integration of the thin-film actuator plate in a haptic demonstrator in a close future.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122830676","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103086
Rongsi Wang, D. Papathanassiou, M. Werner, Jing Jin
In automotive electronic control units (ECU) the use of fiber reinforced plastics is widely spread. In contrast to the common utilization of these materials their influence on the reliability of electronic or interconnecting components on Printed Circuit Board (PCB) is not yet sufficiently accounted for in design decisions in early stages of the product development. Fiber reinforced plastic parts exhibit a strong anisotropic macroscopic material behavior. Their deformation under thermal and mechanical load cannot be correctly predicted by simulation if oversimplified material properties are applied. However, this deformation behavior can dominate the strain and stress induced in electronic or interconnecting components on PCB and hence their reliability over lifetime. By means of an integrative simulation approach the influence of the microscopic fiber orientation on the macroscopic behavior of plastic parts can be evaluated. In this paper a study of sensitive parameters of the integrative simulation and their influence on the simulation quality and accuracy is presented. For this purpose test specimen have been cut from an ECU cover which is made of reinforced polybutylene terephthalate with 30 wt% short glass fiber (PBT-GF30). Subsequently, uni-axial, quasi-static tensile tests as well as structural finite element (FE) simulations, comparable to the experiments and including the mapping of fiber orientation information from injection molding simulation were performed.
{"title":"Investigation of sensitive parameters in the structural simulation tool chain for fiber reinforced plastics in automotive electronic control units","authors":"Rongsi Wang, D. Papathanassiou, M. Werner, Jing Jin","doi":"10.1109/EUROSIME.2015.7103086","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103086","url":null,"abstract":"In automotive electronic control units (ECU) the use of fiber reinforced plastics is widely spread. In contrast to the common utilization of these materials their influence on the reliability of electronic or interconnecting components on Printed Circuit Board (PCB) is not yet sufficiently accounted for in design decisions in early stages of the product development. Fiber reinforced plastic parts exhibit a strong anisotropic macroscopic material behavior. Their deformation under thermal and mechanical load cannot be correctly predicted by simulation if oversimplified material properties are applied. However, this deformation behavior can dominate the strain and stress induced in electronic or interconnecting components on PCB and hence their reliability over lifetime. By means of an integrative simulation approach the influence of the microscopic fiber orientation on the macroscopic behavior of plastic parts can be evaluated. In this paper a study of sensitive parameters of the integrative simulation and their influence on the simulation quality and accuracy is presented. For this purpose test specimen have been cut from an ECU cover which is made of reinforced polybutylene terephthalate with 30 wt% short glass fiber (PBT-GF30). Subsequently, uni-axial, quasi-static tensile tests as well as structural finite element (FE) simulations, comparable to the experiments and including the mapping of fiber orientation information from injection molding simulation were performed.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134052432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103160
K. Meier, M. Roellig, K. Bock
In this work we present the results on a reliability study on SMD components mounted on an organic power electronics substrate. The substrate technology has been developed to meet the needs of high ampacity and thermal conductivity with an organic substrate material. Therefore a thick structured copper core was introduced throughout the entire substrate size (see fig. 1). On top of the copper core common FR4 multilayer structures are realised to create a typical SMD PCB surface. The bottom of the copper core was covered with one prepreg with a high thermal conductivity and one copper layer to be able to connect to a heat sink. The copper core becomes structured to enable the use as the layer for conducting high currents. Therefore insulation trenches were manufactured and plugged with a polymer. Introducing a copper core as described changes the thermo-mechanical behaviour of the substrate. Hence, due to the higher stiffness of the copper core PCB, the thermo-mechanical reliability of SMD components can be affected as well. Thermal cycling and shock tests were conducted to reveal the life time of ceramic chip resistors with a size of 0603, 0805 and 1206 in the case of mounting position entirely over the copper core or FR4, over the copper core/FR4 interface or over the copper core insulation trenches (see fig. 2). A specific test board was designed and manufactured (see fig. 3). The achieved results indicate some differences in the reliability of the components depending on the mounting position. In case of component mounting over the copper much higher failure counts have been seen compared to components mounted over FR4 (see fig. 4). Mounting the components on top of the copper core/FR4 interface or insulation trenches changes the reliability in dependence of the component size.
{"title":"Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications","authors":"K. Meier, M. Roellig, K. Bock","doi":"10.1109/EUROSIME.2015.7103160","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103160","url":null,"abstract":"In this work we present the results on a reliability study on SMD components mounted on an organic power electronics substrate. The substrate technology has been developed to meet the needs of high ampacity and thermal conductivity with an organic substrate material. Therefore a thick structured copper core was introduced throughout the entire substrate size (see fig. 1). On top of the copper core common FR4 multilayer structures are realised to create a typical SMD PCB surface. The bottom of the copper core was covered with one prepreg with a high thermal conductivity and one copper layer to be able to connect to a heat sink. The copper core becomes structured to enable the use as the layer for conducting high currents. Therefore insulation trenches were manufactured and plugged with a polymer. Introducing a copper core as described changes the thermo-mechanical behaviour of the substrate. Hence, due to the higher stiffness of the copper core PCB, the thermo-mechanical reliability of SMD components can be affected as well. Thermal cycling and shock tests were conducted to reveal the life time of ceramic chip resistors with a size of 0603, 0805 and 1206 in the case of mounting position entirely over the copper core or FR4, over the copper core/FR4 interface or over the copper core insulation trenches (see fig. 2). A specific test board was designed and manufactured (see fig. 3). The achieved results indicate some differences in the reliability of the components depending on the mounting position. In case of component mounting over the copper much higher failure counts have been seen compared to components mounted over FR4 (see fig. 4). Mounting the components on top of the copper core/FR4 interface or insulation trenches changes the reliability in dependence of the component size.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"33 8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125716436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-04-19DOI: 10.1109/EUROSIME.2015.7103088
D. Kozic, R. Treml, R. Schongrundner, R. Brunner, D. Kiener, J. Zechner, T. Antretter, Hans-Peter Ganser
Novel design of microelectronic components creates new issues concerning their reliability. Internal mechanical loading, e.g. from residual stresses, or external loading when the component is assembled into a microelectronic device, can cause failure via cracking or delamination. In this work, finite element simulations of micro-beam bending experiments for testing the fracture behavior of thin film metal composites deposited on a silicon substrate are presented. Due to the lattice mismatch between the materials, residual stresses are generated. Calculating the magnitude and distribution of these stresses is very important, as they add to the stresses produced by the external loads. Consequently, a stress free setting will behave differently compared to a structure with residual stresses. Additionally, crack propagation is affected by an interface to a material with different characteristics. In what follows, the variation of typical fracture parameters will be shown, depending on the residual stresses in the composite and on the crack position relative to the interface.
{"title":"Fracture mechanics of thin film systems on the sub-micron scale","authors":"D. Kozic, R. Treml, R. Schongrundner, R. Brunner, D. Kiener, J. Zechner, T. Antretter, Hans-Peter Ganser","doi":"10.1109/EUROSIME.2015.7103088","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103088","url":null,"abstract":"Novel design of microelectronic components creates new issues concerning their reliability. Internal mechanical loading, e.g. from residual stresses, or external loading when the component is assembled into a microelectronic device, can cause failure via cracking or delamination. In this work, finite element simulations of micro-beam bending experiments for testing the fracture behavior of thin film metal composites deposited on a silicon substrate are presented. Due to the lattice mismatch between the materials, residual stresses are generated. Calculating the magnitude and distribution of these stresses is very important, as they add to the stresses produced by the external loads. Consequently, a stress free setting will behave differently compared to a structure with residual stresses. Additionally, crack propagation is affected by an interface to a material with different characteristics. In what follows, the variation of typical fracture parameters will be shown, depending on the residual stresses in the composite and on the crack position relative to the interface.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"45 13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131419874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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