Graphene films (GFs) have been widely used in thermal management for electronic devices due to their exceptional thermal conductivity. The ever-increasing power density has placed new demands on the heat flux carrying capacity of GFs, leading to efforts to produce thicker GFs. Nevertheless, increasing the thickness of GFs typically results in a rapid decline in thermal conductivity. Currently, commercial graphene thick films (GTFs) are primarily fabricated by bonding multiple graphene oxide films or GFs to increase thickness, but they usually suffer from poor structural stability and reduced thermal conductivity. Herein, a novel GTFs assembly strategy is proposed to achieve seamless and robust bonding of nano-silver to GFs via evaporative deposition and hot-pressing. The thickness of the composited graphene-silver thick film (GTF-Ag) is 200 μm, with an in-plane thermal conductivity of 1630 W m−1 K−1. Furthermore, GTF-Ag maintains stable structure and thermal conductivity after undergoing temperature treatment from −200 °C to 400 °C and 1200 thermal shock cycles. This work overcomes the traditional trade-off between thickness and thermal conductivity of GTFs, setting a new record for the thermal conductivity of GTFs and providing an efficient and reliable solution for thermal management in high-power devices and extreme environments.
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