To simultaneously tackle the critical issues of electromagnetic (EM) interference and heat accumulation in electronics, tissue-paper-derived carbon fiber (CF)@Co@C composites with a dual network were first synthesized as an advanced bifunctional filler through a facile impregnation-annealing process. The incorporation of CFs with Co@C foams can construct dual networks, multiple heterointerfaces, magnetic-dielectric dual-losses, and electron-phonon dual thermal carriers, enhancing EM wave absorption and heat conduction. Benefiting from the boosted Ohmic loss, polarization loss, and multi-magnetic resonances, results showed that the CF@Co@C composites formed with a Co(NO3)2·6H2O content of 0.005 mol exhibited a high EABW/d (3.55 GHz/mm) and strong absorption (−50.09 dB), excelling CFs and other absorbers. Meanwhile, the CF@Co@C/TPU composite films exhibited high heat conductivity (5.059–6.544 W/(m⋅K)) with a low load of 10 wt%. The highest heat conductivity was 1.85 and 1.43 times larger than those of pure TPU films and 2D CFs/TPU films. Furthermore, the theoretical analysis of the DOS and PDOS revealed the enhancement mechanisms of EM wave absorption and heat conduction. The multiple heterointerfaces between FCC-Co/C, HCP-Co/C, and FCC-Co/HCP-Co provided a built-in electric field for extra electric dipoles, thus enhancing the microwave absorption capabilities of materials. The combination of 2D CFs with Co@C foams enables cooperative heat transfer by electrons and multi-frequency phonons, thereby improving its heat conductivity. Overall, this work offers a novel and simple strategy to develop advanced dual-network composites with magnetic-dielectric dual losses and electron-phonon dual thermal carriers for EM protection and heat management applications in the electronics industry.
扫码关注我们
求助内容:
应助结果提醒方式:
