Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273165
M. Daraban, D. Pitica
Usually crosstalk problems are resolved by using physical methods like, guard tracing or increasing the distance between adjacent traces, [1]. Even if these methods yield good results, the bus surface is increased on the printed circuit board (PCB). A solution to this problem is to encode the sent information. By using crosstalk avoidance codes (CAC), there can be resolved crosstalk and inter-symbol interference (ISI) problems. CAC are developed by imposing rules regarding which switching pattern can be sent via the parallel data bus. By doing so, there are created forbidden transition channels (FTC). The purpose of the CAC is to enable a high speed transmission on a PCB built by using mainstream technologies without the high speed manufacturing processes.
{"title":"Bus encoding algorithm to reduce crosstalk effects","authors":"M. Daraban, D. Pitica","doi":"10.1109/ISSE.2012.6273165","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273165","url":null,"abstract":"Usually crosstalk problems are resolved by using physical methods like, guard tracing or increasing the distance between adjacent traces, [1]. Even if these methods yield good results, the bus surface is increased on the printed circuit board (PCB). A solution to this problem is to encode the sent information. By using crosstalk avoidance codes (CAC), there can be resolved crosstalk and inter-symbol interference (ISI) problems. CAC are developed by imposing rules regarding which switching pattern can be sent via the parallel data bus. By doing so, there are created forbidden transition channels (FTC). The purpose of the CAC is to enable a high speed transmission on a PCB built by using mainstream technologies without the high speed manufacturing processes.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116506204","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273093
T. Pencheva, B. Gyoch, P. Mashkov
The investigation deals with computer-aided design of antireflection coatings for photo receiving devices based on InGaAs. These types day and night vision detectors are sensitive and operate in spectral region 0.4 μm - 1.7 μm. Wide-band antireflection multilayer structures from two different materials of high and low refractive index transparent in upper mentioned spectral region are designed and analyzed.
{"title":"Day and night vision detectors - Design of antireflection coatings","authors":"T. Pencheva, B. Gyoch, P. Mashkov","doi":"10.1109/ISSE.2012.6273093","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273093","url":null,"abstract":"The investigation deals with computer-aided design of antireflection coatings for photo receiving devices based on InGaAs. These types day and night vision detectors are sensitive and operate in spectral region 0.4 μm - 1.7 μm. Wide-band antireflection multilayer structures from two different materials of high and low refractive index transparent in upper mentioned spectral region are designed and analyzed.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114175317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273120
A. Reithe, M. Munch, K. Wolter
The effects of plasma-treatment on the contact quality of the molybdenum back contact of flexible solar cells interconnected with isotropic conductive adhesives have been studied. The influence of the surface treatment on surface properties like roughness, contact angles and surface energies have been measured and flow characteristics have been analyzed. The contact resistances and microsections have been studied. Pre-treatment might help to increase the spreading of the freshly applied conductive adhesive on a surface, but also enhances the thickness of the polymer layer at the interface. Because the contact geometry largely depends on the dispensing parameter, it was also found that a highly thixotropic adhesive does not show significantly better wetting behavior on the treated surface. The samples without preliminary plasma treatment show better contact resistance in that case.
{"title":"Effect of surface treatment on the conductive adhesive interconnection of flexible solar cells","authors":"A. Reithe, M. Munch, K. Wolter","doi":"10.1109/ISSE.2012.6273120","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273120","url":null,"abstract":"The effects of plasma-treatment on the contact quality of the molybdenum back contact of flexible solar cells interconnected with isotropic conductive adhesives have been studied. The influence of the surface treatment on surface properties like roughness, contact angles and surface energies have been measured and flow characteristics have been analyzed. The contact resistances and microsections have been studied. Pre-treatment might help to increase the spreading of the freshly applied conductive adhesive on a surface, but also enhances the thickness of the polymer layer at the interface. Because the contact geometry largely depends on the dispensing parameter, it was also found that a highly thixotropic adhesive does not show significantly better wetting behavior on the treated surface. The samples without preliminary plasma treatment show better contact resistance in that case.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123091800","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273121
S. Kirsten, J. Uhlemann, M. Braunschweig, K. Wolter
Development of smart medical devices for long-term implantation requires new encapsulation technologies with a special focus on flexible packaging of electronic devices. Biocompatible, high performance polymers seem to be suitable for such applications, however their protective function i.e. suppressing harmful interactions between the human and the foreign body is still unknown. Here, we evaluated this protective function of six polymers with regard to surface properties, water absorption and water solubility. Among all polymers investigated, silicone (low-consistency) showed the best characteristics compared to epoxy resin or polyurethane.
{"title":"Packaging of electronic devices for long-term implantation","authors":"S. Kirsten, J. Uhlemann, M. Braunschweig, K. Wolter","doi":"10.1109/ISSE.2012.6273121","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273121","url":null,"abstract":"Development of smart medical devices for long-term implantation requires new encapsulation technologies with a special focus on flexible packaging of electronic devices. Biocompatible, high performance polymers seem to be suitable for such applications, however their protective function i.e. suppressing harmful interactions between the human and the foreign body is still unknown. Here, we evaluated this protective function of six polymers with regard to surface properties, water absorption and water solubility. Among all polymers investigated, silicone (low-consistency) showed the best characteristics compared to epoxy resin or polyurethane.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124970846","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273126
O. Krammer, T. Garami
In our research, we performed comparative analyses concerning various lead-free SAC (SnAgCu) and micro-alloyed SAC (SnAgCu+Bi+Sb) solder alloys. The mechanical properties of these solder alloys were characterized by measuring the shear strength of 0603 (1.5 × 0.75 mm) size chip resistors' joints. We designed a testboard, which contains fifty pieces of 0603 size resistors. Thirty of them are intended for shear strength measurements and the remaining twenty are intended for cross-sectional analyses. During the experiment, twenty-eight pieces of testboards were soldered (seven with each solder alloy) and twenty-four of them are subjected to Thermal-Shock life time tests with temperature range of +125°C - -40°C up to 2 000 cycles. The shear strength of the solder joints was measured on aged samples to examine their reliability as well. The detailed results are presented in the paper.
{"title":"Reliability investigation of low silver content micro-alloyed SAC solders","authors":"O. Krammer, T. Garami","doi":"10.1109/ISSE.2012.6273126","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273126","url":null,"abstract":"In our research, we performed comparative analyses concerning various lead-free SAC (SnAgCu) and micro-alloyed SAC (SnAgCu+Bi+Sb) solder alloys. The mechanical properties of these solder alloys were characterized by measuring the shear strength of 0603 (1.5 × 0.75 mm) size chip resistors' joints. We designed a testboard, which contains fifty pieces of 0603 size resistors. Thirty of them are intended for shear strength measurements and the remaining twenty are intended for cross-sectional analyses. During the experiment, twenty-eight pieces of testboards were soldered (seven with each solder alloy) and twenty-four of them are subjected to Thermal-Shock life time tests with temperature range of +125°C - -40°C up to 2 000 cycles. The shear strength of the solder joints was measured on aged samples to examine their reliability as well. The detailed results are presented in the paper.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122964829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273169
N. Gutzeit, J. Muller, C. Reinlein, S. Gebhardt
In this paper the challenging manufacturing process of a deformable mirror for the wave front correction of a high energy laser is described. During this process the LTCC membrane as the base component with integrated sensors must endure several postfire processes at temperatures of up to 900°C without any degradation of the sensors' characteristics. In order to optimize the sensors, various combinations of resistor and conductor pastes and different geometries are characterized. The usability and the performance of the sensor elements after temperature treatment are investigated by measuring the resistance and its resistance temperature characteristic.
{"title":"LTCC membranes With integrated heating structures, temperature sensors and strain gauges","authors":"N. Gutzeit, J. Muller, C. Reinlein, S. Gebhardt","doi":"10.1109/ISSE.2012.6273169","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273169","url":null,"abstract":"In this paper the challenging manufacturing process of a deformable mirror for the wave front correction of a high energy laser is described. During this process the LTCC membrane as the base component with integrated sensors must endure several postfire processes at temperatures of up to 900°C without any degradation of the sensors' characteristics. In order to optimize the sensors, various combinations of resistor and conductor pastes and different geometries are characterized. The usability and the performance of the sensor elements after temperature treatment are investigated by measuring the resistance and its resistance temperature characteristic.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129342539","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273149
D. Demeter, J. Banský
This paper is concerning with a virtual laboratory, which is implemented at the Department of technologies in Electronics and which will be used for distant and blended e-Learning of the technologies in electronics, as well as supporting the classical theoretical lectures. The laboratory itself is based on 360° panorama pictures created from every laboratory at our department. We have integrated into the system some basic information about equipment's, such as the name and type of the equipment, the technological procedures for which it can be used, some safety regulations related to working with the equipment and we have attached the user manual for equipment, if we had it available. The technological processes and laboratory exercises are covered by education videos and flash animations created by our colleagues. This system should help our students to get familiar with the laboratory equipment as well as with the technologies and techniques used at our department. This system is mainly designed for students, who have limited access to the laboratories (e.g. persons with some disability) and for the external students. It is also suitable for using in standard education process, where the number of the students is bigger, than the capacity of the laboratories. It should also support the lecturer at the theoretical lectures. In the future, the virtual laboratory will be used by the researchers for remote access of the laboratory equipment.
{"title":"Virtual laboratory for the e-learning education in the electronics technologies","authors":"D. Demeter, J. Banský","doi":"10.1109/ISSE.2012.6273149","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273149","url":null,"abstract":"This paper is concerning with a virtual laboratory, which is implemented at the Department of technologies in Electronics and which will be used for distant and blended e-Learning of the technologies in electronics, as well as supporting the classical theoretical lectures. The laboratory itself is based on 360° panorama pictures created from every laboratory at our department. We have integrated into the system some basic information about equipment's, such as the name and type of the equipment, the technological procedures for which it can be used, some safety regulations related to working with the equipment and we have attached the user manual for equipment, if we had it available. The technological processes and laboratory exercises are covered by education videos and flash animations created by our colleagues. This system should help our students to get familiar with the laboratory equipment as well as with the technologies and techniques used at our department. This system is mainly designed for students, who have limited access to the laboratories (e.g. persons with some disability) and for the external students. It is also suitable for using in standard education process, where the number of the students is bigger, than the capacity of the laboratories. It should also support the lecturer at the theoretical lectures. In the future, the virtual laboratory will be used by the researchers for remote access of the laboratory equipment.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129427671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273127
M. Branzei, I. Plotog, F. Miculescu, G. Vărzaru, P. Svasta, A. Thumm
The continuous trend towards high density and miniaturization of electronic devices involves the use of multiple reflow processes in assembling technologies for second level of interconnections in electronic packaging hierarchy. According to the “4P” Soldering Model concept (4PSMC), considering the Pad-Paste-Pin-Process elements as Key Process Input Variables (KPIV), the solder joints are the result of KPIV synergistically interactions and correlations with consequences over their microstructure. In the paper, taking into consideration the cooling rate influence over intermetallic compounds (IMC) formation and microstructure, there was described the investigations over electrical and mechanical properties of solder joints resulted from multiple reflow Vapor Phase Soldering (VPS) process, in terms of 4PSMC. Maintaining the pad, pin and paste of KPIV as references measurements of solder joints resistances and shear forces were perform as function of VPS process's number for two values of cooling rate, respectively IMC microstructures and stereofractography studies. The results of the studies performed and presented in the paper will be use for improving process control in order to assure the solder joints reliability, to minimize losses on VPS lines, to reduce defects number and rework time.
{"title":"Solder joints properties as function of multiple reflow Vapor Phase Soldering process","authors":"M. Branzei, I. Plotog, F. Miculescu, G. Vărzaru, P. Svasta, A. Thumm","doi":"10.1109/ISSE.2012.6273127","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273127","url":null,"abstract":"The continuous trend towards high density and miniaturization of electronic devices involves the use of multiple reflow processes in assembling technologies for second level of interconnections in electronic packaging hierarchy. According to the “4P” Soldering Model concept (4PSMC), considering the Pad-Paste-Pin-Process elements as Key Process Input Variables (KPIV), the solder joints are the result of KPIV synergistically interactions and correlations with consequences over their microstructure. In the paper, taking into consideration the cooling rate influence over intermetallic compounds (IMC) formation and microstructure, there was described the investigations over electrical and mechanical properties of solder joints resulted from multiple reflow Vapor Phase Soldering (VPS) process, in terms of 4PSMC. Maintaining the pad, pin and paste of KPIV as references measurements of solder joints resistances and shear forces were perform as function of VPS process's number for two values of cooling rate, respectively IMC microstructures and stereofractography studies. The results of the studies performed and presented in the paper will be use for improving process control in order to assure the solder joints reliability, to minimize losses on VPS lines, to reduce defects number and rework time.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128297033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273125
R. Kisiel, Z. Szczepański, P. Firek, J. Grochowski, M. Myśliwiec, M. Guziewicz
This work is devoted attaching technology between SiC structures and DBC substrates for creating SiC devices able to work at temperature up to 350°C. Our current work was concentrated on finding so called “pressure sintering” procedure in air using Ag micro particles. A special test samples with a size corresponding to the dimension of the SiC structures were assembled to DBC substrates with different surface finishing by Ag micro powder sintering. In the first series of experiments DBC substrates with Cu electroplated by Ni (3÷5 μm) and Au (above 1 μm) were used. It was found that by modifying application procedure of Ag micro powder onto DBC substrate with Cu/Ni/Au metallization, it is possible to obtain good adhesion between attached samples. The sintering is performed in air at temperature of 400°C for 40 min and pressure of 10 MPa. In the second series of experiments the SiC structures with Ni/Au metallization were assembled to DBC substrate with Cu/Ni/Au metallization. The adhesion higher than 10 MPa was obtained for such prepared samples.
{"title":"Silver micropowders as SiC die attach material for high temperature applications","authors":"R. Kisiel, Z. Szczepański, P. Firek, J. Grochowski, M. Myśliwiec, M. Guziewicz","doi":"10.1109/ISSE.2012.6273125","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273125","url":null,"abstract":"This work is devoted attaching technology between SiC structures and DBC substrates for creating SiC devices able to work at temperature up to 350°C. Our current work was concentrated on finding so called “pressure sintering” procedure in air using Ag micro particles. A special test samples with a size corresponding to the dimension of the SiC structures were assembled to DBC substrates with different surface finishing by Ag micro powder sintering. In the first series of experiments DBC substrates with Cu electroplated by Ni (3÷5 μm) and Au (above 1 μm) were used. It was found that by modifying application procedure of Ag micro powder onto DBC substrate with Cu/Ni/Au metallization, it is possible to obtain good adhesion between attached samples. The sintering is performed in air at temperature of 400°C for 40 min and pressure of 10 MPa. In the second series of experiments the SiC structures with Ni/Au metallization were assembled to DBC substrate with Cu/Ni/Au metallization. The adhesion higher than 10 MPa was obtained for such prepared samples.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128715226","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273089
Y. Dzhenkov
The article is concerned to an elaboration of an image intensifier power supply. Here is represented the circuit that generate the high voltage needed for the screen. The circuit is represented by a blocking generator, who is followed by a voltage multiplier. In my work I'm trying to create a simple, but reliable model of a power supply that is powered by two standard AA batteries.
{"title":"Image intensifier power supply","authors":"Y. Dzhenkov","doi":"10.1109/ISSE.2012.6273089","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273089","url":null,"abstract":"The article is concerned to an elaboration of an image intensifier power supply. Here is represented the circuit that generate the high voltage needed for the screen. The circuit is represented by a blocking generator, who is followed by a voltage multiplier. In my work I'm trying to create a simple, but reliable model of a power supply that is powered by two standard AA batteries.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128726220","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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