Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273098
A. Bonea, D. Bonfert, I. Busu, P. Svasta
The paper aims to assess how the geometry of the organic thin film transistors (OTFTs) influences their electrical parameters. The transistors have polytriarylamine (PTAA) as semiconductor. Several geometries will be investigated for transistors fabricated in a single batch. These geometries include simple electrodes, inter-digitated electrodes and circular electrodes. The electrical parameters considered are threshold voltage, mobility, ON-OFF ratio, the sub-threshold swing and the contact resistance. All the measurements are performed with a calibrated semiconductor analyzer in accordance to the IEEE 1620 standard. The paper discusses the trade-off between the ease of fabrication and the increase in performance of these devices.
{"title":"Influence of the organic transistors' layout on electrical parameters","authors":"A. Bonea, D. Bonfert, I. Busu, P. Svasta","doi":"10.1109/ISSE.2012.6273098","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273098","url":null,"abstract":"The paper aims to assess how the geometry of the organic thin film transistors (OTFTs) influences their electrical parameters. The transistors have polytriarylamine (PTAA) as semiconductor. Several geometries will be investigated for transistors fabricated in a single batch. These geometries include simple electrodes, inter-digitated electrodes and circular electrodes. The electrical parameters considered are threshold voltage, mobility, ON-OFF ratio, the sub-threshold swing and the contact resistance. All the measurements are performed with a calibrated semiconductor analyzer in accordance to the IEEE 1620 standard. The paper discusses the trade-off between the ease of fabrication and the increase in performance of these devices.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126013180","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273133
M. Bazu, V. Ilian, L. Galateanu, D. Varsescu, A. Pietrikova
For studying the reliability of lead-free SnAgCu solder joints, reliability test were performed on test structures obtained by three variants of PCB surface finishing: Copper, Gold and HASL (Hot Air Solder Levelling), respectively, achieved by an industrial process and, in parallel, by in laboratory (research) conditions. Two types of reliability tests were used: (i) Thermal cycling at -55°C / +125°C / 30 minutes at each step; (ii) Cycling damp heat at -40°C / 85°C and 85%RH. The results clearly show that both the industrial process and the research conditions ensure the higher reliability level for the HASL variant.
{"title":"Reliability testing of lead-free solder joints","authors":"M. Bazu, V. Ilian, L. Galateanu, D. Varsescu, A. Pietrikova","doi":"10.1109/ISSE.2012.6273133","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273133","url":null,"abstract":"For studying the reliability of lead-free SnAgCu solder joints, reliability test were performed on test structures obtained by three variants of PCB surface finishing: Copper, Gold and HASL (Hot Air Solder Levelling), respectively, achieved by an industrial process and, in parallel, by in laboratory (research) conditions. Two types of reliability tests were used: (i) Thermal cycling at -55°C / +125°C / 30 minutes at each step; (ii) Cycling damp heat at -40°C / 85°C and 85%RH. The results clearly show that both the industrial process and the research conditions ensure the higher reliability level for the HASL variant.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127272321","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273134
J. Jirsa, K. Dušek, P. Černek
This article deals with risk analysis of different reflow technologies in electronics assembly. Risk analysis is concerned to reduce the probability of occurrence of particular risks or decrease its influence on project or production. There are plenty of advantages which can be realized from rigorously performed risk management. Reflow process is one part of the surface mount technology (SMT - technology where components are mounted directly onto the surface of printed circuit board). Reflow process in SMT is necessary to heat the solder paste. During the heating process the solder paste become melt and starts wetting components together with contact pads of printed circuit board. The goal of this article is to present and remind some significant hazards of three basic reflow technologies - vapor phase soldering, hot air soldering and infrared technology. After all we try to highlight risks and we present concrete problems for each reflow technology.
{"title":"Risk analysis of reflow technologies in electronics assembly","authors":"J. Jirsa, K. Dušek, P. Černek","doi":"10.1109/ISSE.2012.6273134","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273134","url":null,"abstract":"This article deals with risk analysis of different reflow technologies in electronics assembly. Risk analysis is concerned to reduce the probability of occurrence of particular risks or decrease its influence on project or production. There are plenty of advantages which can be realized from rigorously performed risk management. Reflow process is one part of the surface mount technology (SMT - technology where components are mounted directly onto the surface of printed circuit board). Reflow process in SMT is necessary to heat the solder paste. During the heating process the solder paste become melt and starts wetting components together with contact pads of printed circuit board. The goal of this article is to present and remind some significant hazards of three basic reflow technologies - vapor phase soldering, hot air soldering and infrared technology. After all we try to highlight risks and we present concrete problems for each reflow technology.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130736135","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273171
V. Zavorotnyi, Y. Yakimenko
This paper presents a new wide-range sensor for measuring of the gas flow. The flow meter was developed on the base of the new way of measurement, which makes adaptation of measuring procedure. It extends the measurement range of the sensor without losing of accuracy. The sensor is implemented on the basis of the thin-film MEMS structures and the system on a chip, thus minimizing the number of components and to provide a set of standard digital interfaces. A generic aspect of the sensor is an original closed-loop conditioning approach. Using the thermal delay of the temperature waves as a function of gas flow, self oscillations are excited. This “electro-physical” generator realizes an analog-to-frequency conversion of the measuring value. Besides the feedback scheme should improve the sensor performance. The Sensor is made practically on one microcircuit with digital interface due to use PSoC. That has provided high accuracy and low prime cost of the device as a whole.
{"title":"Wide-range flow meter for air and gases","authors":"V. Zavorotnyi, Y. Yakimenko","doi":"10.1109/ISSE.2012.6273171","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273171","url":null,"abstract":"This paper presents a new wide-range sensor for measuring of the gas flow. The flow meter was developed on the base of the new way of measurement, which makes adaptation of measuring procedure. It extends the measurement range of the sensor without losing of accuracy. The sensor is implemented on the basis of the thin-film MEMS structures and the system on a chip, thus minimizing the number of components and to provide a set of standard digital interfaces. A generic aspect of the sensor is an original closed-loop conditioning approach. Using the thermal delay of the temperature waves as a function of gas flow, self oscillations are excited. This “electro-physical” generator realizes an analog-to-frequency conversion of the measuring value. Besides the feedback scheme should improve the sensor performance. The Sensor is made practically on one microcircuit with digital interface due to use PSoC. That has provided high accuracy and low prime cost of the device as a whole.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127854448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273100
J. Schulze, R. Bauer
The Polymer Thick Film Technology permits a cost efficient production of electronic circuits. The technology permits through a screen printing process the application of different polymer pastes of flexible and rigid substrate. This allows the production of electronic circuits in a short time. After that are develop the functional characteristics of the polymer pastes through a temperature process. Like any technology have this some disadvantages such as low electrical conductivity and limited assembly capability.
{"title":"Influence of curing technologies on the application quality of PTF-conductive pastes","authors":"J. Schulze, R. Bauer","doi":"10.1109/ISSE.2012.6273100","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273100","url":null,"abstract":"The Polymer Thick Film Technology permits a cost efficient production of electronic circuits. The technology permits through a screen printing process the application of different polymer pastes of flexible and rigid substrate. This allows the production of electronic circuits in a short time. After that are develop the functional characteristics of the polymer pastes through a temperature process. Like any technology have this some disadvantages such as low electrical conductivity and limited assembly capability.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129234220","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273161
A. Machulyansky, D. Tatarchuk, Y. Yakimenko
The model of multilayer nanocomposite coatings is discussed. It is shown that by changing the number of layers, as well as the choice of the components of the composite can be provided with the required level of protection of electronic devices from electromagnetic radiation.
{"title":"The layered nanocomposite coatings for protecting electronic devices from electromagnetic radiation","authors":"A. Machulyansky, D. Tatarchuk, Y. Yakimenko","doi":"10.1109/ISSE.2012.6273161","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273161","url":null,"abstract":"The model of multilayer nanocomposite coatings is discussed. It is shown that by changing the number of layers, as well as the choice of the components of the composite can be provided with the required level of protection of electronic devices from electromagnetic radiation.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125487562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273110
A. Maric, N. Blaz, G. Radosavljevic, I. Atassi, L. Zivanov, W. Smetana
This paper deals with material characterization of ferrite LTCC (Low Temperature Co-fired Ceramic) and influence of ambient temperature variation to its complex permeability value. Results of the material characterization (chemical analysis, surface roughness) of commercially available ESL 40011 ferrite tape are presented for the first time. In addition, complex permeability dependence on frequency is determined using previously verified measurement method and developed dispersion model. Complex permeability dependence on ambient temperature variation is also measured in the frequency range up to 1 GHz. Presented results show decrease of complex permeability maximum value with temperature increase from 20°C to 120°C. Cut-back of the useful frequency range of the material is also noticeable in the same temperature range.
{"title":"Complex permeability dependence of commercial LTCC ferritic tape on ambient temperature","authors":"A. Maric, N. Blaz, G. Radosavljevic, I. Atassi, L. Zivanov, W. Smetana","doi":"10.1109/ISSE.2012.6273110","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273110","url":null,"abstract":"This paper deals with material characterization of ferrite LTCC (Low Temperature Co-fired Ceramic) and influence of ambient temperature variation to its complex permeability value. Results of the material characterization (chemical analysis, surface roughness) of commercially available ESL 40011 ferrite tape are presented for the first time. In addition, complex permeability dependence on frequency is determined using previously verified measurement method and developed dispersion model. Complex permeability dependence on ambient temperature variation is also measured in the frequency range up to 1 GHz. Presented results show decrease of complex permeability maximum value with temperature increase from 20°C to 120°C. Cut-back of the useful frequency range of the material is also noticeable in the same temperature range.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123198082","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273090
R. Etz, T. Patarau, S. Daraban, D. Petreus
The demand for electricity production increased in the last ten years leading to large investments and losses in the electricity grids. This forms the basis of decentralized hybrid energy system where the energy is produced in close proximity to the end user. This paper presents a simulation model for intelligent microgrids with distributed generation, also known as Smart Microgrids, focusing on the reduction of the simulation time in order to allow fast development of energy management algorithms. Photovoltaic panels and wind generators will be used as renewable energy primary sources and batteries as storage.
{"title":"Microgrid model for fast development of energy management algorithms","authors":"R. Etz, T. Patarau, S. Daraban, D. Petreus","doi":"10.1109/ISSE.2012.6273090","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273090","url":null,"abstract":"The demand for electricity production increased in the last ten years leading to large investments and losses in the electricity grids. This forms the basis of decentralized hybrid energy system where the energy is produced in close proximity to the end user. This paper presents a simulation model for intelligent microgrids with distributed generation, also known as Smart Microgrids, focusing on the reduction of the simulation time in order to allow fast development of energy management algorithms. Photovoltaic panels and wind generators will be used as renewable energy primary sources and batteries as storage.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121210709","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273150
R. Yordanov, I. Yordanova, J. Ivanov
A system was developed in order to teach the basics of CMOS gate array design to bachelor degree students in electronics engineering at the Faculty of Electronics Engineering and Technology at the Technical University of Sofia. It was based upon the adaptation of a simple accessible CAD product with the goal to emulate the final stages of semi-custom integrated circuit design.
{"title":"Automated design system for gate array-based CMOS integrated circuits","authors":"R. Yordanov, I. Yordanova, J. Ivanov","doi":"10.1109/ISSE.2012.6273150","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273150","url":null,"abstract":"A system was developed in order to teach the basics of CMOS gate array design to bachelor degree students in electronics engineering at the Faculty of Electronics Engineering and Technology at the Technical University of Sofia. It was based upon the adaptation of a simple accessible CAD product with the goal to emulate the final stages of semi-custom integrated circuit design.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122737053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-05-09DOI: 10.1109/ISSE.2012.6273111
I. Atassi, Ernst Bauer, Johann Nicolics, Bernhard Dangl, Lukas Spendlhofer, Dennis Christian Knospe, Florian Faistauer
In this paper a brief selection of state-of-the-art thermoelectric materials is described which are used for thermoelectric power generation. A summary of current advances in the field of thermoelectric (TE) materials which are used for TE power generation is presented. Among them, the class of filled skutterudite is very promising and extensively investigated. Skutterudites offer good power conversion efficiencies, with the high temperature side of the generators reaching up to 600 °C. Higher temperatures result in technological challenges related to thermomechanically induced stress. Additional difficulties at high temperatures can arise with respect to the reliability of the electrical contacts between the TE materials and metal connectors. Some contacting metals (e.g. silver) tend to diffuse into the active thermoelectric legs and thus are unsuitable for various high-temperature TE materials. As a first step towards a cascaded TE heat engine two Bi2Te3 based TE generators have been evaluated with respect to the influence of TE-leg contacting approaches by measuring their figure-of-merit. While the elements of one TE generator were attached by means of vapor phase bonding using a tin based solder, the elements of the second generator were attached with a silver filled epoxy adhesive.
{"title":"Current thermoelectric materials and an evaluation of thermoelectric materials contacting approaches","authors":"I. Atassi, Ernst Bauer, Johann Nicolics, Bernhard Dangl, Lukas Spendlhofer, Dennis Christian Knospe, Florian Faistauer","doi":"10.1109/ISSE.2012.6273111","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273111","url":null,"abstract":"In this paper a brief selection of state-of-the-art thermoelectric materials is described which are used for thermoelectric power generation. A summary of current advances in the field of thermoelectric (TE) materials which are used for TE power generation is presented. Among them, the class of filled skutterudite is very promising and extensively investigated. Skutterudites offer good power conversion efficiencies, with the high temperature side of the generators reaching up to 600 °C. Higher temperatures result in technological challenges related to thermomechanically induced stress. Additional difficulties at high temperatures can arise with respect to the reliability of the electrical contacts between the TE materials and metal connectors. Some contacting metals (e.g. silver) tend to diffuse into the active thermoelectric legs and thus are unsuitable for various high-temperature TE materials. As a first step towards a cascaded TE heat engine two Bi2Te3 based TE generators have been evaluated with respect to the influence of TE-leg contacting approaches by measuring their figure-of-merit. While the elements of one TE generator were attached by means of vapor phase bonding using a tin based solder, the elements of the second generator were attached with a silver filled epoxy adhesive.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131550145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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