Pub Date : 2013-04-29DOI: 10.1109/ASPDAC.2013.6509656
Masaaki Kondo, S. Nguyen, Tomoya Hirao, T. Soga, Hiroshi Sasaki, Koji Inoue
Nowadays, the trend of developing micro-processor with tens of cores brings a promising prospect for embedded systems. Realizing a high performance and low power many-core processor is becoming a primary technical challenge. We are currently developing a many-core processor architecture for embedded systems as a part of a NEDO's project. This paper introduces the many-core architecture called SMYLEref along whit the concept of Virtual Accelerator on Many-core, in which many cores on a chip are utilized as a hardware platform for realizing multiple virtual accelerators. We are developing its prototype system with off-the-shelf FPGA evaluation boards. In this paper, we introduce the architecture of SMYLEref and the detail of the prototype system. In addition, several initial experiments with the prototype system are also presented.
{"title":"SMYLEref: A reference architecture for manycore-processor SoCs","authors":"Masaaki Kondo, S. Nguyen, Tomoya Hirao, T. Soga, Hiroshi Sasaki, Koji Inoue","doi":"10.1109/ASPDAC.2013.6509656","DOIUrl":"https://doi.org/10.1109/ASPDAC.2013.6509656","url":null,"abstract":"Nowadays, the trend of developing micro-processor with tens of cores brings a promising prospect for embedded systems. Realizing a high performance and low power many-core processor is becoming a primary technical challenge. We are currently developing a many-core processor architecture for embedded systems as a part of a NEDO's project. This paper introduces the many-core architecture called SMYLEref along whit the concept of Virtual Accelerator on Many-core, in which many cores on a chip are utilized as a hardware platform for realizing multiple virtual accelerators. We are developing its prototype system with off-the-shelf FPGA evaluation boards. In this paper, we introduce the architecture of SMYLEref and the detail of the prototype system. In addition, several initial experiments with the prototype system are also presented.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129058729","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-29DOI: 10.1109/ASPDAC.2013.6509674
J. Fujikata, M. Noguchi, M. Miura, Masashi Takahashi, Shigeki Takahashi, T. Horikawa, Y. Urino, Takahiro Nakamura, Y. Arakawa
We report on a high speed silicon-waveguide-integrated PIN Ge photodetector of 45 GHz bandwidth, and a high efficiency of 0.3 V·cm silicon optical modulator with a metal-oxide-semiconductor (MOS) junction by applying the low optical loss and high conductivity poly-silicon gate. These OE/EO devices enable low drive voltage of around 1V, which would contribute to a high density optical interposer of the future photonics-electronics convergence system.
{"title":"High performance PIN Ge photodetector and Si optical modulator with MOS junction for photonics-electronics convergence system","authors":"J. Fujikata, M. Noguchi, M. Miura, Masashi Takahashi, Shigeki Takahashi, T. Horikawa, Y. Urino, Takahiro Nakamura, Y. Arakawa","doi":"10.1109/ASPDAC.2013.6509674","DOIUrl":"https://doi.org/10.1109/ASPDAC.2013.6509674","url":null,"abstract":"We report on a high speed silicon-waveguide-integrated PIN Ge photodetector of 45 GHz bandwidth, and a high efficiency of 0.3 V·cm silicon optical modulator with a metal-oxide-semiconductor (MOS) junction by applying the low optical loss and high conductivity poly-silicon gate. These OE/EO devices enable low drive voltage of around 1V, which would contribute to a high density optical interposer of the future photonics-electronics convergence system.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"322 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132483835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-29DOI: 10.1109/ASPDAC.2013.6509576
Kenta Sogo, A. Toya, T. Kikkawa
This paper presents a ring voltage-controlledoscillator (ring-VCO)-based sub-sampling phase locked loop(PLL) CMOS circuit with low phase noise and low jitter. A 2.08 GHz PLL is developed by use of 65 nm CMOS technology. The in-band phase noise is -119.1 dBc/Hz at 1 MHz and the output jitter integrated from 1 kHz to 10 MHz is 0.73 ps (rms) with the power consumpition 20.4 mW. The normalized jitter-power product is -229.7 dB.
{"title":"A ring-VCO-based sub-sampling PLL CMOS circuit with 0.73 ps jitter and 20.4 mW power consumption","authors":"Kenta Sogo, A. Toya, T. Kikkawa","doi":"10.1109/ASPDAC.2013.6509576","DOIUrl":"https://doi.org/10.1109/ASPDAC.2013.6509576","url":null,"abstract":"This paper presents a ring voltage-controlledoscillator (ring-VCO)-based sub-sampling phase locked loop(PLL) CMOS circuit with low phase noise and low jitter. A 2.08 GHz PLL is developed by use of 65 nm CMOS technology. The in-band phase noise is -119.1 dBc/Hz at 1 MHz and the output jitter integrated from 1 kHz to 10 MHz is 0.73 ps (rms) with the power consumpition 20.4 mW. The normalized jitter-power product is -229.7 dB.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"2008 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129040144","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-29DOI: 10.1109/ASPDAC.2013.6509603
Yuko Hara-Azumi, Takuya Azumi, N. Dutt
We present VISA: a novel Variation-aware Instruction Set Architecture synthesis approach that makes effective use of process variation from both software and hardware points of view. To achieve an efficient speedup, VISA selects custom instructions based on statistical static timing analysis (SSTA) for aggressive clocking. Furthermore, with minimum performance overhead, VISA dynamically detects and corrects timing faults resulting from aggressive clocking of the underlying processor. This hybrid software/hardware approach generates significant speedup without degrading the yield. Our experimental results on commonly used ISA synthesis benchmarks demonstrate that VISA achieves significant performance improvement compared with a traditional deterministic worst case-based approach (up to 78.0%) and an existing SSTA-based approach (up to 49.4%).
{"title":"VISA synthesis: Variation-aware Instruction Set Architecture synthesis","authors":"Yuko Hara-Azumi, Takuya Azumi, N. Dutt","doi":"10.1109/ASPDAC.2013.6509603","DOIUrl":"https://doi.org/10.1109/ASPDAC.2013.6509603","url":null,"abstract":"We present VISA: a novel Variation-aware Instruction Set Architecture synthesis approach that makes effective use of process variation from both software and hardware points of view. To achieve an efficient speedup, VISA selects custom instructions based on statistical static timing analysis (SSTA) for aggressive clocking. Furthermore, with minimum performance overhead, VISA dynamically detects and corrects timing faults resulting from aggressive clocking of the underlying processor. This hybrid software/hardware approach generates significant speedup without degrading the yield. Our experimental results on commonly used ISA synthesis benchmarks demonstrate that VISA achieves significant performance improvement compared with a traditional deterministic worst case-based approach (up to 78.0%) and an existing SSTA-based approach (up to 49.4%).","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129149330","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-29DOI: 10.1109/ASPDAC.2013.6509560
Yazhi Huang, Mengying Zhao, C. Xue
The cyber-physical system (CPS) is a desirable computing platform for many industrial and scientific applications. However, the application of CPSs has two challenges: First, CPSs often include a number of sensor nodes. Update of preloaded code on remote sensor nodes powered by batteries is extremely energy-consuming. The code update issue in the energy sensitive CPS must be carefully considered; Second, CPSs are often real-time embedded systems with real-time properties. Worst-Case Execution Time (WCET) is one of the most important metrics in real-time system design. While existing works only consider one of these two challenges at a time, in this paper, a compiler-level optimization, Joint WCET and Update Conscious Compilation (WUCC), is proposed to jointly consider WCET and code update for cyber-physical systems. The novelty of the proposed approach is that the WCET problem and code update problem are considered concurrently such that a balanced solution with minimal WCET and minimal code difference can be achieved. The experimental results show that the proposed technique can minimize WCET and code difference effectively.
{"title":"WUCC: Joint WCET and Update Conscious Compilation for cyber-physical systems","authors":"Yazhi Huang, Mengying Zhao, C. Xue","doi":"10.1109/ASPDAC.2013.6509560","DOIUrl":"https://doi.org/10.1109/ASPDAC.2013.6509560","url":null,"abstract":"The cyber-physical system (CPS) is a desirable computing platform for many industrial and scientific applications. However, the application of CPSs has two challenges: First, CPSs often include a number of sensor nodes. Update of preloaded code on remote sensor nodes powered by batteries is extremely energy-consuming. The code update issue in the energy sensitive CPS must be carefully considered; Second, CPSs are often real-time embedded systems with real-time properties. Worst-Case Execution Time (WCET) is one of the most important metrics in real-time system design. While existing works only consider one of these two challenges at a time, in this paper, a compiler-level optimization, Joint WCET and Update Conscious Compilation (WUCC), is proposed to jointly consider WCET and code update for cyber-physical systems. The novelty of the proposed approach is that the WCET problem and code update problem are considered concurrently such that a balanced solution with minimal WCET and minimal code difference can be achieved. The experimental results show that the proposed technique can minimize WCET and code difference effectively.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131236331","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-29DOI: 10.1109/ASPDAC.2013.6509645
Yang Ge, Yukan Zhang, Qinru Qiu
While the energy harvesting system (EHS) supplies green energy to the embedded system, it also suffers from uncertainty and large variation in harvesting rate. This constraint can be remedied by using efficient energy storage. Hybrid Electrical Energy Storage (HEES) system is proposed recently as a cost effective approach with high power conversion efficiency and low self-discharge. In this paper, we propose a fast heuristic algorithm to improve the efficiency of charge allocation and replacement in an EHS/HEES equipped embedded system. The goal of our algorithm is to minimize the energy overhead on the DC-DC converter while satisfying the task deadline constraints of the embedded workload and maximizing the energy stored in the HEES system. We first provide an approximated but accurate power consumption model of the DC-DC converter. Based on this model, the optimal operating point of the system can be analytically solved. Integrated with the dynamic reconfiguration of the HEES bank, our algorithm provides energy efficiency improvement and runtime overhead reduction compared to previous approaches.
{"title":"Improving energy efficiency for energy harvesting embedded systems","authors":"Yang Ge, Yukan Zhang, Qinru Qiu","doi":"10.1109/ASPDAC.2013.6509645","DOIUrl":"https://doi.org/10.1109/ASPDAC.2013.6509645","url":null,"abstract":"While the energy harvesting system (EHS) supplies green energy to the embedded system, it also suffers from uncertainty and large variation in harvesting rate. This constraint can be remedied by using efficient energy storage. Hybrid Electrical Energy Storage (HEES) system is proposed recently as a cost effective approach with high power conversion efficiency and low self-discharge. In this paper, we propose a fast heuristic algorithm to improve the efficiency of charge allocation and replacement in an EHS/HEES equipped embedded system. The goal of our algorithm is to minimize the energy overhead on the DC-DC converter while satisfying the task deadline constraints of the embedded workload and maximizing the energy stored in the HEES system. We first provide an approximated but accurate power consumption model of the DC-DC converter. Based on this model, the optimal operating point of the system can be analytically solved. Integrated with the dynamic reconfiguration of the HEES bank, our algorithm provides energy efficiency improvement and runtime overhead reduction compared to previous approaches.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128389324","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-29DOI: 10.1109/ASPDAC.2013.6509659
Y. Matsumoto, H. Uchida, M. Hagimoto, Yasumori Hibi, S. Torii, Masamichi Izumida
Through Architecture-Algorithm co-design for Video Mining Applications we designed a scalable Manycore processor consists of clustered heterogeneous cores with stream processing capabilities, and zero-overhead inter-process communication through FIFO with a hardware-software mechanism. For achieving high-performance and low-power consumption, especially so as to reduce memory access required for Video Mining Applications, each application is partitioned to exploit both task and data parallelism, and programmed as a distributed stream processing with relatively large local register-file based on Kahn Process Network model.
{"title":"Manycore processor for video mining applications","authors":"Y. Matsumoto, H. Uchida, M. Hagimoto, Yasumori Hibi, S. Torii, Masamichi Izumida","doi":"10.1109/ASPDAC.2013.6509659","DOIUrl":"https://doi.org/10.1109/ASPDAC.2013.6509659","url":null,"abstract":"Through Architecture-Algorithm co-design for Video Mining Applications we designed a scalable Manycore processor consists of clustered heterogeneous cores with stream processing capabilities, and zero-overhead inter-process communication through FIFO with a hardware-software mechanism. For achieving high-performance and low-power consumption, especially so as to reduce memory access required for Video Mining Applications, each application is partitioned to exploit both task and data parallelism, and programmed as a distributed stream processing with relatively large local register-file based on Kahn Process Network model.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131195563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-29DOI: 10.1109/ASPDAC.2013.6509551
Joohee Kim, Joungho Kim
In order to guarantee signal integrity of a TSV-based channel in 3D IC design, the modeling and measurements are conducted for electrical characterization of the TSV-based channel including TSVs and RDLs with various performance metrics such as insertion loss, noise coupling and eye diagrams. Based on the modeling and measurements of the fabricated TSV channels, design guide for the signal integrity of the channel is proposed.
{"title":"Signal integrity modeling and measurement of TSV in 3D IC","authors":"Joohee Kim, Joungho Kim","doi":"10.1109/ASPDAC.2013.6509551","DOIUrl":"https://doi.org/10.1109/ASPDAC.2013.6509551","url":null,"abstract":"In order to guarantee signal integrity of a TSV-based channel in 3D IC design, the modeling and measurements are conducted for electrical characterization of the TSV-based channel including TSVs and RDLs with various performance metrics such as insertion loss, noise coupling and eye diagrams. Based on the modeling and measurements of the fabricated TSV channels, design guide for the signal integrity of the channel is proposed.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132648810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-29DOI: 10.1109/ASPDAC.2013.6509678
Yuan-Ying Chang, Yoshi Shih-Chieh Huang, N. Vijaykrishnan, C. King
3D IC is a promising technology to meet the demands of high throughput, high scalability, and low power consumption for future generation integrated circuits. One way to implement the 3D IC is to interconnect layers of two-dimensional (2D) IC with Through-Silicon Via (TSV), which shortens the signal lengths. Unfortunately, while TSVs are bundled together as a cluster, the crosstalk coupling noise may lead to transmission errors. As a result, the working frequency of TSVs has to be lowered to avoid the errors, leading to narrower bandwidth that TSVs can provide. In this paper, we first derive the crosstalk noise model from the perspective of 3D chip and then propose ShieldUS, a runtime data-to-TSVs remapping strategy. With ShieldUS, the transition patterns of data over TSVs are observed at runtime, and relatively stable bits will be mapped to the TSVs which act as shields to protect the other bits which have more fluctuations. We evaluate the performance of ShieldUS with address lines from real benchmark traces and data lines of different similarities. The results show that ShieldUS is accurate and flexible. We further study dynamic shielding and our design of Interval Equilibration Unit (IEU) can intelligently select suitable parameters for dynamic shielding, which makes dynamic shielding practical and does not need to predefine parameters. This also improves the practicability of ShieldUS.
{"title":"ShieldUS: A novel design of dynamic shielding for eliminating 3D TSV crosstalk coupling noise","authors":"Yuan-Ying Chang, Yoshi Shih-Chieh Huang, N. Vijaykrishnan, C. King","doi":"10.1109/ASPDAC.2013.6509678","DOIUrl":"https://doi.org/10.1109/ASPDAC.2013.6509678","url":null,"abstract":"3D IC is a promising technology to meet the demands of high throughput, high scalability, and low power consumption for future generation integrated circuits. One way to implement the 3D IC is to interconnect layers of two-dimensional (2D) IC with Through-Silicon Via (TSV), which shortens the signal lengths. Unfortunately, while TSVs are bundled together as a cluster, the crosstalk coupling noise may lead to transmission errors. As a result, the working frequency of TSVs has to be lowered to avoid the errors, leading to narrower bandwidth that TSVs can provide. In this paper, we first derive the crosstalk noise model from the perspective of 3D chip and then propose ShieldUS, a runtime data-to-TSVs remapping strategy. With ShieldUS, the transition patterns of data over TSVs are observed at runtime, and relatively stable bits will be mapped to the TSVs which act as shields to protect the other bits which have more fluctuations. We evaluate the performance of ShieldUS with address lines from real benchmark traces and data lines of different similarities. The results show that ShieldUS is accurate and flexible. We further study dynamic shielding and our design of Interval Equilibration Unit (IEU) can intelligently select suitable parameters for dynamic shielding, which makes dynamic shielding practical and does not need to predefine parameters. This also improves the practicability of ShieldUS.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129802038","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-29DOI: 10.1109/ASPDAC.2013.6509644
Jiun-Li Lin, Po-Hsun Wu, Tsung-Yi Ho
Mobility is the key device parameter to affect circuit performance in flexible thin-film transistor (TFT) technologies, and it is very sensitive to the change of mechanical strain and temperature. However, existing algorithms only consider the impact of mechanical strain in cell placement of flexible TFT circuit. Without taking temperature into consideration, mobility may be dramatically decreased which leads to circuit performance degradation. This paper presents the first work to reduce the mobility influence caused by the change of both mechanical strain and temperature. Experimental results show that the proposed algorithms can effectively reduce the chip temperature and the influence caused by mobility variation.
{"title":"A novel cell placement algorithm for flexible TFT circuit with mechanical strain and temperature consideration","authors":"Jiun-Li Lin, Po-Hsun Wu, Tsung-Yi Ho","doi":"10.1109/ASPDAC.2013.6509644","DOIUrl":"https://doi.org/10.1109/ASPDAC.2013.6509644","url":null,"abstract":"Mobility is the key device parameter to affect circuit performance in flexible thin-film transistor (TFT) technologies, and it is very sensitive to the change of mechanical strain and temperature. However, existing algorithms only consider the impact of mechanical strain in cell placement of flexible TFT circuit. Without taking temperature into consideration, mobility may be dramatically decreased which leads to circuit performance degradation. This paper presents the first work to reduce the mobility influence caused by the change of both mechanical strain and temperature. Experimental results show that the proposed algorithms can effectively reduce the chip temperature and the influence caused by mobility variation.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125222228","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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