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2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)最新文献

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Numerical simulations in virtual anatomical models: The devil is in the details 虚拟解剖模型的数值模拟:细节决定成败
Pub Date : 2015-05-26 DOI: 10.1109/APEMC.2015.7175297
Marie-Christine Gosselin, E. Neufeld, Davnah Payne, N. Kuster
Virtual anatomical models are increasingly used for a number of applications, ranging from (non)-ionizing radiation assessment to medical treatment and implant development. Accordingly, the number of available models has been increasing rapidly during recent years, and dosimetric studies for engineering and medical purposes are blooming. Here, we discuss an example of passive implant safety assessment to demonstrate how numerical simulations results can vary with the quality and detail of particular anatomical models.
虚拟解剖模型越来越多地用于许多应用,从(非)电离辐射评估到医疗和植入物开发。因此,近年来可用模型的数量迅速增加,用于工程和医学目的的剂量学研究正在蓬勃发展。在这里,我们讨论一个被动种植体安全性评估的例子,以说明数值模拟结果如何随特定解剖模型的质量和细节而变化。
{"title":"Numerical simulations in virtual anatomical models: The devil is in the details","authors":"Marie-Christine Gosselin, E. Neufeld, Davnah Payne, N. Kuster","doi":"10.1109/APEMC.2015.7175297","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175297","url":null,"abstract":"Virtual anatomical models are increasingly used for a number of applications, ranging from (non)-ionizing radiation assessment to medical treatment and implant development. Accordingly, the number of available models has been increasing rapidly during recent years, and dosimetric studies for engineering and medical purposes are blooming. Here, we discuss an example of passive implant safety assessment to demonstrate how numerical simulations results can vary with the quality and detail of particular anatomical models.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"259 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132789342","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
FDTD computations of lightning-induced voltages in the presence of nearby buildings 附近有建筑物时雷击电压的时域有限差分计算
Pub Date : 2015-05-26 DOI: 10.1109/APEMC.2015.7175273
T. H. Thang, Y. Baba, V. Rakov, A. Piantini
In this paper, we have computed lightning-induced voltages on distribution lines in the presence of nearby buildings using the 3D finite-difference time-domain (FDTD) method. In the simulations, four-conductor lines with surge arresters and pole transformers are considered. It appears that the presence of nearby buildings cause reduction of lighting induced voltages, as expected. The observed trend is in general agreement with that reported from the small-scale experiment by Piantini et al. (2007).
本文采用三维时域有限差分法(FDTD)计算了附近有建筑物时配电线路的雷击感应电压。在仿真中,考虑了带避雷器和极变压器的四导体线路。正如预期的那样,附近建筑物的存在导致了照明感应电压的降低。观察到的趋势与Piantini等人(2007)的小规模实验报告大致一致。
{"title":"FDTD computations of lightning-induced voltages in the presence of nearby buildings","authors":"T. H. Thang, Y. Baba, V. Rakov, A. Piantini","doi":"10.1109/APEMC.2015.7175273","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175273","url":null,"abstract":"In this paper, we have computed lightning-induced voltages on distribution lines in the presence of nearby buildings using the 3D finite-difference time-domain (FDTD) method. In the simulations, four-conductor lines with surge arresters and pole transformers are considered. It appears that the presence of nearby buildings cause reduction of lighting induced voltages, as expected. The observed trend is in general agreement with that reported from the small-scale experiment by Piantini et al. (2007).","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114150638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Ferrite thin film noise suppressor suitable for flexible printed circuit 适用于柔性印刷电路的铁氧体薄膜噪声抑制器
Pub Date : 2015-05-26 DOI: 10.1109/APEMC.2015.7175341
K. Kondo, H. Ono, S. Yoshida
Conducted and radiated noise suppression effects attained by the ferrite-plated thin film of 3 μm in thickness were evaluated using the mock samples of ferrite-plated flexible printed circuits (FPCs), in order to confirm a feasibility of its application to FPCs as a novel thin film noise suppressor. Transmission loss power ratio i.e. conducted noise suppression effect was evaluated from the measured S-parameters using the flexible microstrip line of 70 mm in length up to 6 GHz. The transmission loss power ratio attained by the ferrite film increased with increasing frequency, reaching approximately 4 dB attenuation enhancement at 6 GHz. This was almost the same as the commercially-available composite-type noise suppression sheet (NSS) of 50 μm in thickness. Radiated noise suppression effect was evaluated from 0.7 GHz to 5 GHz using the radiation suppression ratio, which was defined as the transmission parameter S21 from the flexible open circuit of 1 m in length to the receiving antenna 3 m away from the circuit. The radiation suppression ratio suppressed by the ferrite film was approximately 10 dB in average at 0.7 GHz, which was effective up to 5 GHz. This was also equivalent to the composite-type NSS. These experimental results suggest that the ferrite-plated film is an effective noise suppressor for FPC, suppressing the noise currents and radiated emission up to several GHz.
利用柔性印刷电路(fpc)模拟样品,对厚度为3 μm的铁氧体薄膜的传导和辐射噪声抑制效果进行了评价,以证实其作为一种新型薄膜噪声抑制剂应用于柔性印刷电路(fpc)的可行性。利用长度为70 mm的柔性微带线在6 GHz范围内测量的s参数,评估了传输损耗功率比即传导噪声抑制效果。铁氧体膜的传输损耗功率比随频率的增加而增加,在6 GHz时衰减增强约4 dB。这与商用50 μm厚度的复合噪声抑制片(NSS)几乎相同。采用辐射抑制比(定义为长度为1m的柔性开路到距离该电路3m的接收天线的传输参数S21)对0.7 GHz ~ 5 GHz范围内的辐射噪声抑制效果进行了评价。在0.7 GHz频段,铁氧体膜的辐射抑制比平均约为10 dB,在5 GHz频段有效。这也相当于复合型NSS。实验结果表明,镀铁氧体薄膜是一种有效的FPC噪声抑制剂,可抑制噪声电流和高达几GHz的辐射发射。
{"title":"Ferrite thin film noise suppressor suitable for flexible printed circuit","authors":"K. Kondo, H. Ono, S. Yoshida","doi":"10.1109/APEMC.2015.7175341","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175341","url":null,"abstract":"Conducted and radiated noise suppression effects attained by the ferrite-plated thin film of 3 μm in thickness were evaluated using the mock samples of ferrite-plated flexible printed circuits (FPCs), in order to confirm a feasibility of its application to FPCs as a novel thin film noise suppressor. Transmission loss power ratio i.e. conducted noise suppression effect was evaluated from the measured S-parameters using the flexible microstrip line of 70 mm in length up to 6 GHz. The transmission loss power ratio attained by the ferrite film increased with increasing frequency, reaching approximately 4 dB attenuation enhancement at 6 GHz. This was almost the same as the commercially-available composite-type noise suppression sheet (NSS) of 50 μm in thickness. Radiated noise suppression effect was evaluated from 0.7 GHz to 5 GHz using the radiation suppression ratio, which was defined as the transmission parameter S21 from the flexible open circuit of 1 m in length to the receiving antenna 3 m away from the circuit. The radiation suppression ratio suppressed by the ferrite film was approximately 10 dB in average at 0.7 GHz, which was effective up to 5 GHz. This was also equivalent to the composite-type NSS. These experimental results suggest that the ferrite-plated film is an effective noise suppressor for FPC, suppressing the noise currents and radiated emission up to several GHz.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"407 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114938413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Spatially-resolved near-field diagnosis of differential signaling performance for wireless device RFI/EMC applications 无线设备RFI/EMC应用中差分信号性能的空间分辨近场诊断
Pub Date : 2015-05-26 DOI: 10.1109/APEMC.2015.7175386
Kai-Syuan Chen, Yu-Hao Liu, T. Horng
This paper presents a method to spatially diagnose amplitude and phase imbalances of high-frequency/high-speed differential signaling on a wireless device with a high resolution near-field scanning system. The principle of measuring the complex-valued magnetic near fields with vector network analyzer (VNA) is discussed. Then the measured complex-valued magnetic near fields over several differential circuits are used to study the radio-frequency interference (RFI) and electromagnetic compatibility (EMC) issues related to these circuits in a wireless device that is under a working state.
本文提出了一种高分辨率近场扫描无线设备高频/高速差分信号幅相不平衡的空间诊断方法。讨论了用矢量网络分析仪(VNA)测量复值磁场的原理。在此基础上,利用实测的几种差分电路上的复值磁场,研究了无线设备在工作状态下与这些电路相关的射频干扰(RFI)和电磁兼容(EMC)问题。
{"title":"Spatially-resolved near-field diagnosis of differential signaling performance for wireless device RFI/EMC applications","authors":"Kai-Syuan Chen, Yu-Hao Liu, T. Horng","doi":"10.1109/APEMC.2015.7175386","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175386","url":null,"abstract":"This paper presents a method to spatially diagnose amplitude and phase imbalances of high-frequency/high-speed differential signaling on a wireless device with a high resolution near-field scanning system. The principle of measuring the complex-valued magnetic near fields with vector network analyzer (VNA) is discussed. Then the measured complex-valued magnetic near fields over several differential circuits are used to study the radio-frequency interference (RFI) and electromagnetic compatibility (EMC) issues related to these circuits in a wireless device that is under a working state.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114766832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A novel metal ground plane design methodology for optimizing MIMO antenna isolation 一种优化MIMO天线隔离的新型金属接地平面设计方法
Pub Date : 2015-05-26 DOI: 10.1109/APEMC.2015.7175305
L. Ji, Yu-feng Shih, Yi-shang Huang
Based on the electric platform designs such as All-in-one (AIO) PC, laptop and tablet PC, this article propose a quickly procedure to optimize the isolation of MIMO antennas even though the antenna structure is unknown. With two 50ohm loads as feeding sources, a simplified procedure to optimize the central slotted ground plan was introduced to achieve minimal isolation. Taking a 2.45GHz PIFA antenna system for example, similar trends between real case and simulation were observed, so the feasibility of this proposed method was verified and work well.
本文以一体机、笔记本电脑、平板电脑等电子平台设计为基础,提出了在天线结构未知的情况下,快速优化MIMO天线隔离的方法。采用两个50欧姆负载作为馈电源,采用简化的程序来优化中央开槽接地平面,以实现最小的隔离。以2.45GHz PIFA天线系统为例,仿真结果与实际情况吻合,验证了该方法的可行性。
{"title":"A novel metal ground plane design methodology for optimizing MIMO antenna isolation","authors":"L. Ji, Yu-feng Shih, Yi-shang Huang","doi":"10.1109/APEMC.2015.7175305","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175305","url":null,"abstract":"Based on the electric platform designs such as All-in-one (AIO) PC, laptop and tablet PC, this article propose a quickly procedure to optimize the isolation of MIMO antennas even though the antenna structure is unknown. With two 50ohm loads as feeding sources, a simplified procedure to optimize the central slotted ground plan was introduced to achieve minimal isolation. Taking a 2.45GHz PIFA antenna system for example, similar trends between real case and simulation were observed, so the feasibility of this proposed method was verified and work well.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"3 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133169201","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The effects of shape anisotropy of the magnetic particles in a composite on RF power absorption 复合材料中磁性颗粒形状各向异性对射频功率吸收的影响
Pub Date : 2015-05-26 DOI: 10.1109/APEMC.2015.7175385
Baekil Nam, Jinu Kim, Joonsik Lee, Ki Hyeon Kim
The shape anisotropy of the magnetic particles in a composite film for EMI applications plays a key role in their performance. For a few types of the particles such as wires and hollow fibers, permeabilities of the particles and in-line attenuation of the composite were evaluated by simulations. With the change of the shape anisotropy by aspect ratio or hollow ratio, power absorption could be controlled in frequency. In experiments, Ni/FeCo magnetic hollow fibbers were fabricated by electroless plating and power loss of the composite filled with the fibbers was evaluated.
电磁干扰复合膜中磁性颗粒的形状各向异性对其性能起着关键作用。对金属丝和中空纤维等几种类型的颗粒进行了渗透性能和复合材料的在线衰减性能模拟。通过长宽比或空心比改变材料的形状各向异性,可以实现对功率吸收的频率控制。实验采用化学镀法制备了Ni/FeCo磁性中空纤维,并对其填充复合材料的功率损耗进行了评价。
{"title":"The effects of shape anisotropy of the magnetic particles in a composite on RF power absorption","authors":"Baekil Nam, Jinu Kim, Joonsik Lee, Ki Hyeon Kim","doi":"10.1109/APEMC.2015.7175385","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175385","url":null,"abstract":"The shape anisotropy of the magnetic particles in a composite film for EMI applications plays a key role in their performance. For a few types of the particles such as wires and hollow fibers, permeabilities of the particles and in-line attenuation of the composite were evaluated by simulations. With the change of the shape anisotropy by aspect ratio or hollow ratio, power absorption could be controlled in frequency. In experiments, Ni/FeCo magnetic hollow fibbers were fabricated by electroless plating and power loss of the composite filled with the fibbers was evaluated.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130574132","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Signal integrity design of bump-less interconnection for high-speed signaling in 2.5D and 3D IC 2.5D和3D IC中高速信令无碰撞互连的信号完整性设计
Pub Date : 2015-05-26 DOI: 10.1109/APEMC.2015.7175392
Hyunsuk Lee, Heegon Kim, Sumin Choi, Dong-Hyun Kim, Kyungjun Cho, Joungho Kim
With the advent of 2.5D and 3D IC, micro bumps has been highlighted as the core technology for realization of 2.5D and 3D IC. However, due to the difficulties about fabrication of reliable and cost-effective micro bumps, resulting in decrease in the final chip yield. In this paper, we propose a bump-less interconnection for high-speed signaling in 2.5D and 3D IC. In the proposed interconnection, high speed signal is transmitted via coupling pads instead of micro bumps. Signal integrity of the proposed interconnection is analyzed by simulation in the frequency- and time-domain. For a more detailed analysis, the proposed interconnection and the interconnection with the micro bumps are compared. In addition, because the silicon, organic and glass interposer have been widely employed for the 2.5D and 3D IC packaging, signal integrity of the proposed interconnection on three types of the interposer is compared and analyzed.
随着2.5D和3D集成电路的出现,微凸点已成为实现2.5D和3D集成电路的核心技术,但由于难以制造可靠且具有成本效益的微凸点,导致最终芯片良率下降。在本文中,我们提出了一种用于2.5D和3D IC中高速信号的无碰撞互连。在所提出的互连中,高速信号通过耦合垫而不是微碰撞传输。通过频域和时域仿真分析了所提互连的信号完整性。为了进行更详细的分析,将所提出的互连与带有微凸起的互连进行了比较。此外,由于硅、有机和玻璃中间层已广泛应用于2.5D和3D IC封装,因此对三种中间层上所提出的互连信号完整性进行了比较和分析。
{"title":"Signal integrity design of bump-less interconnection for high-speed signaling in 2.5D and 3D IC","authors":"Hyunsuk Lee, Heegon Kim, Sumin Choi, Dong-Hyun Kim, Kyungjun Cho, Joungho Kim","doi":"10.1109/APEMC.2015.7175392","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175392","url":null,"abstract":"With the advent of 2.5D and 3D IC, micro bumps has been highlighted as the core technology for realization of 2.5D and 3D IC. However, due to the difficulties about fabrication of reliable and cost-effective micro bumps, resulting in decrease in the final chip yield. In this paper, we propose a bump-less interconnection for high-speed signaling in 2.5D and 3D IC. In the proposed interconnection, high speed signal is transmitted via coupling pads instead of micro bumps. Signal integrity of the proposed interconnection is analyzed by simulation in the frequency- and time-domain. For a more detailed analysis, the proposed interconnection and the interconnection with the micro bumps are compared. In addition, because the silicon, organic and glass interposer have been widely employed for the 2.5D and 3D IC packaging, signal integrity of the proposed interconnection on three types of the interposer is compared and analyzed.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127156757","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Mixed type branch line coupler designs 混合式支路耦合器设计
Pub Date : 2015-05-26 DOI: 10.1109/APEMC.2015.7175287
Ssu-Jung Wu, Jan-Dong Tseng, Yu-Hui Shih, Kuang-Hao Lin
A mixed type branch line coupler combining T-type and pi-type equivalent circuits and keeping main lines characteristic impedance at 50Ω is reported. The new branch line coupler contains only capacitors and open stubs. Two prototypes of two and three branches are designed, simulated and measured. The size reduction reached 40% comparing with the original circuits. The simulated and experimental results show a good agreement within the frequency of interest.
报道了一种t型和pi型等效电路相结合,保持主线特性阻抗为50Ω的混合型支路耦合器。新的支路耦合器只包含电容和开路存根。设计了两支路和三支路样机,并进行了仿真和测量。与原电路相比,尺寸减小了40%。仿真结果与实验结果吻合较好,在目标频率范围内。
{"title":"Mixed type branch line coupler designs","authors":"Ssu-Jung Wu, Jan-Dong Tseng, Yu-Hui Shih, Kuang-Hao Lin","doi":"10.1109/APEMC.2015.7175287","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175287","url":null,"abstract":"A mixed type branch line coupler combining T-type and pi-type equivalent circuits and keeping main lines characteristic impedance at 50Ω is reported. The new branch line coupler contains only capacitors and open stubs. Two prototypes of two and three branches are designed, simulated and measured. The size reduction reached 40% comparing with the original circuits. The simulated and experimental results show a good agreement within the frequency of interest.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128878083","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Improvement of radiated emission measurement reproducibility with VHF-LISN obtained from final results of international inter-laboratory comparison on termination control of power line 电力线终端控制国际实验室间比较的最终结果表明VHF-LISN辐射发射测量再现性的提高
Pub Date : 2015-05-26 DOI: 10.1109/APEMC.2015.7175243
S. Okuyama, N. Kuwabara, K. Osabe, H. Muramatsu
At present, power supply impedance of radiated emission measurement site is not specified in any testing standards. In measurement of radiated emission from desktop equipment, noise emitted from power line of the EUT is a factor that worsens site correlations because the noise varies with the impedance between power line and the ground. Under such circumstances, VCCI developed VHF-LISN to stabilize power supply facilities for the purpose of improving the reproducibility of radiated emission measurement. To assess its effectiveness, an international inter-laboratory comparison program was carried out, provided with EUTs and termination control devices including the VHF-LISN to ensure identical setup across sites. Until February 2014, this international program was promoted at 16 sites in 9 countries. From the final results, we conclude that the VHF-LISN is the best device to improve the reproducibility of radiated emission measurement.
目前,在任何测试标准中都没有规定辐射发射测点的电源阻抗。在台式设备的辐射发射测量中,由于噪声随电力线与地之间的阻抗变化而变化,因此EUT电力线发出的噪声是使场地相关性恶化的一个因素。在这种情况下,VCCI开发了VHF-LISN来稳定供电设施,以提高辐射发射测量的再现性。为了评估其有效性,开展了一项国际实验室间比较计划,提供了eut和终端控制设备,包括VHF-LISN,以确保各站点的设置相同。截至2014年2月,该国际项目已在9个国家的16个地点推广。结果表明,VHF-LISN是提高辐射发射测量再现性的最佳装置。
{"title":"Improvement of radiated emission measurement reproducibility with VHF-LISN obtained from final results of international inter-laboratory comparison on termination control of power line","authors":"S. Okuyama, N. Kuwabara, K. Osabe, H. Muramatsu","doi":"10.1109/APEMC.2015.7175243","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175243","url":null,"abstract":"At present, power supply impedance of radiated emission measurement site is not specified in any testing standards. In measurement of radiated emission from desktop equipment, noise emitted from power line of the EUT is a factor that worsens site correlations because the noise varies with the impedance between power line and the ground. Under such circumstances, VCCI developed VHF-LISN to stabilize power supply facilities for the purpose of improving the reproducibility of radiated emission measurement. To assess its effectiveness, an international inter-laboratory comparison program was carried out, provided with EUTs and termination control devices including the VHF-LISN to ensure identical setup across sites. Until February 2014, this international program was promoted at 16 sites in 9 countries. From the final results, we conclude that the VHF-LISN is the best device to improve the reproducibility of radiated emission measurement.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129180809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Development of high power transient electromagnetic field sensors 大功率瞬变电磁场传感器的研制
Pub Date : 2015-05-26 DOI: 10.1109/APEMC.2015.7175246
Yang Chao, Meng Cui, Chen Rong-mei, Li Xin
An electric field sensor D-dot followed by a magnetic field sensor B-dot are introduced. The principles and configuration are introduced first, and the paper will give out the calibration results. Using the two probe sensor measurement system, the original signal and integrated signal are compared. According to the measurement results, it is believed that two sensor can be improved further.
介绍了电场传感器d点和磁场传感器b点。本文首先介绍了其原理和结构,并给出了标定结果。利用双探头传感器测量系统,对原始信号和集成信号进行了比较。根据测量结果,认为两种传感器可以进一步改进。
{"title":"Development of high power transient electromagnetic field sensors","authors":"Yang Chao, Meng Cui, Chen Rong-mei, Li Xin","doi":"10.1109/APEMC.2015.7175246","DOIUrl":"https://doi.org/10.1109/APEMC.2015.7175246","url":null,"abstract":"An electric field sensor D-dot followed by a magnetic field sensor B-dot are introduced. The principles and configuration are introduced first, and the paper will give out the calibration results. Using the two probe sensor measurement system, the original signal and integrated signal are compared. According to the measurement results, it is believed that two sensor can be improved further.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129884521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
期刊
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)
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