Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718238
G. Engel, B. J. Mirowsky
Keeping up and finding the way to keep up is an almost insurmountable challenge for the engineer, industry and academia in today's environment. The timely finding, sifting through and determination of required knowledge, as well as the conveyance of that knowledge from the industrial needer to the educator to the professional doer defies the inertia and resources of industrial and academic institutions and the engineer. IEEE has developed a system with "short circuit" paths for passing s and knowledge, requirements between industry, academia and the engineer. The system provides for self assessment guidance, in and out of the field, and is a viable means channeling in lifelong learning. The name of the system is ESAP, or THE ENGINEERING SKILLS ASSESSMENT PROGRAM. The price of this system is the time of the volunteers who are needed to produce the compendiums of duties, tasks, skills and knowledge, along with a minimal amount of travel and meeting costs.
{"title":"The Engineering Skills Assessment Program (ESAP) A Professional Development Tool","authors":"G. Engel, B. J. Mirowsky","doi":"10.1109/ELECTR.1991.718238","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718238","url":null,"abstract":"Keeping up and finding the way to keep up is an almost insurmountable challenge for the engineer, industry and academia in today's environment. The timely finding, sifting through and determination of required knowledge, as well as the conveyance of that knowledge from the industrial needer to the educator to the professional doer defies the inertia and resources of industrial and academic institutions and the engineer. IEEE has developed a system with \"short circuit\" paths for passing s and knowledge, requirements between industry, academia and the engineer. The system provides for self assessment guidance, in and out of the field, and is a viable means channeling in lifelong learning. The name of the system is ESAP, or THE ENGINEERING SKILLS ASSESSMENT PROGRAM. The price of this system is the time of the volunteers who are needed to produce the compendiums of duties, tasks, skills and knowledge, along with a minimal amount of travel and meeting costs.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129490729","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718228
P. Stein
Methods and techniques commonly used in statistical process control of manufacturing are briefly shown to be directly applicable to improvement and control of measurements. When those measurements are part of a control system and are themselves controlled in this way, considerable improvements in system performance, productivity, and quality are possible.
{"title":"Statistical Control Of Electronic Measurements","authors":"P. Stein","doi":"10.1109/ELECTR.1991.718228","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718228","url":null,"abstract":"Methods and techniques commonly used in statistical process control of manufacturing are briefly shown to be directly applicable to improvement and control of measurements. When those measurements are part of a control system and are themselves controlled in this way, considerable improvements in system performance, productivity, and quality are possible.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114253629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718229
D.D. Lynch
The '90's look bright for automotive microwave sub-systems. There are a large number of emerging automotive microwave applications. Microwaves offer significant advantages in weather and road grime, range, target insensitivity and safety. Cost is the major challenge which must be worked. There are many interesting technical challenges which can be overcome by careful analysis and design as well as modern signal processing. There are numerous development programs underway.
{"title":"Automotive Microwave Technology","authors":"D.D. Lynch","doi":"10.1109/ELECTR.1991.718229","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718229","url":null,"abstract":"The '90's look bright for automotive microwave sub-systems. There are a large number of emerging automotive microwave applications. Microwaves offer significant advantages in weather and road grime, range, target insensitivity and safety. Cost is the major challenge which must be worked. There are many interesting technical challenges which can be overcome by careful analysis and design as well as modern signal processing. There are numerous development programs underway.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115881105","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718191
B.G. Wenniger
This paper describes how to interface to the 'third generation FlF0s;" the clocked FIFOs, in order to achieve reliable operation at 70 MHz. A brief history of integrated circuit FlFOs is presented, followed by a discussion of the advantages and disadvantages of each. The features of the Cypress clocked FIFOs are described and their benefits to the designers of high performance systems are explained. A design is presented that illustrates how to achieve maximum performance.
{"title":"Using the CY7C44X and CY7C45X FIFOs at 70 MHz","authors":"B.G. Wenniger","doi":"10.1109/ELECTR.1991.718191","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718191","url":null,"abstract":"This paper describes how to interface to the 'third generation FlF0s;\" the clocked FIFOs, in order to achieve reliable operation at 70 MHz. A brief history of integrated circuit FlFOs is presented, followed by a discussion of the advantages and disadvantages of each. The features of the Cypress clocked FIFOs are described and their benefits to the designers of high performance systems are explained. A design is presented that illustrates how to achieve maximum performance.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115533416","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718216
L. S. Buchoff
The number of soldered joints per circuit is rapidly increasing, especially on surface mounted boards. As a result, defective solder joints are becoming the dominant cause of board failures. Also, there is a move to closer spacing of connections which leads to solder bridging and difficulty of flux removal and joint inspection. These, coupled with other solder disadvantages, have led the military and industrial companies to look for alternative component connection methods. Because of the high cost of components and the circuit substrates it is mandatory to be able to replace defective parts easily.
{"title":"Advanced Non-Soldering Interconnection","authors":"L. S. Buchoff","doi":"10.1109/ELECTR.1991.718216","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718216","url":null,"abstract":"The number of soldered joints per circuit is rapidly increasing, especially on surface mounted boards. As a result, defective solder joints are becoming the dominant cause of board failures. Also, there is a move to closer spacing of connections which leads to solder bridging and difficulty of flux removal and joint inspection. These, coupled with other solder disadvantages, have led the military and industrial companies to look for alternative component connection methods. Because of the high cost of components and the circuit substrates it is mandatory to be able to replace defective parts easily.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115224767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718234
K. Owyang
Actel Corporation's ACT 2 family of Field Programmable Gate Arrays (FPGA) is a significant advancement in density and performance for programmable logic devices. This latest generation of FPGAs provides design solutions for system-level integration that have not been previously available in the FPGA marketplace. Upon introduction, the A1280, the first and largest member of the ACT 2 family, found system-level applications in the consumer electronics industry at Videonics Corporation. The application of the A1280 in the Videonics Video Equalizer is described in this paper.
{"title":"Next Generation FPGA's Provide New System-Level Integration Solutions","authors":"K. Owyang","doi":"10.1109/ELECTR.1991.718234","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718234","url":null,"abstract":"Actel Corporation's ACT 2 family of Field Programmable Gate Arrays (FPGA) is a significant advancement in density and performance for programmable logic devices. This latest generation of FPGAs provides design solutions for system-level integration that have not been previously available in the FPGA marketplace. Upon introduction, the A1280, the first and largest member of the ACT 2 family, found system-level applications in the consumer electronics industry at Videonics Corporation. The application of the A1280 in the Videonics Video Equalizer is described in this paper.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123750553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1991-04-16DOI: 10.1109/ELECTR.1991.718203
J. Jahns
Micro-optics is an emerging field of technology that is interesting for optical interconnections in electronic or optical computers. We discuss the fabrication of diffractive micro-optical elements and the integration of three-dimensional photonic systems on single substrates using planarized structures.
{"title":"Integrated Micro-Optics For Optical Computing","authors":"J. Jahns","doi":"10.1109/ELECTR.1991.718203","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718203","url":null,"abstract":"Micro-optics is an emerging field of technology that is interesting for optical interconnections in electronic or optical computers. We discuss the fabrication of diffractive micro-optical elements and the integration of three-dimensional photonic systems on single substrates using planarized structures.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"92 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123167869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：